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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LUE53131/S5-PF
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LUE53131/S5-PF A 13 - Feb. - 2007
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUE53131/S5-PF Page 1/5
Package Dimensions
5.0 5.8
7.65
8.65
1.5MAX
25.0MIN
0.5 TYP
2.54TYP + -
1.0MIN
Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Directivity Radiation
0 -30 30
-60
60
100% 75% 50%
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUE53131/S5-PF Page 2/5
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol UE Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 50 90 120 10 2000 -40 ~ +85 -40 ~ +100 mA mA mW UNIT
A V
Static Electricity or power surge will the Use of anti-electrosatic * glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded.
Typical Electrical & Optical Characteristics (Ta=25 )
PART NO
MATERIAL Emitted
COLOR Lens
Forward Dominant Spectral voltage wave halfwidth @ 20mA(V) length nm
Luminous intensity @20mA(mcd)
Dnm
Viewing angle 2 1/2 (deg)
Min. Max. Min. Typ. 620 17 1.7 2.6 1500 2700 30
LUE53131/S5-PF AlGaInP
Orange Pink Transparent
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUE53131/S5-PF Page 3/5
Typical Electro-Optical Characteristics Curve
UE CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
Relative Intensity Normalize @20mA
2.5 2.0 1.5 1.0 0.5 0
100
10
1.0 0.1 1.0 2.0 3.0 4.0 5.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Relative Intensity @20mA Normalize @25
Forward Voltage@20mA Normaliz @25
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0 -40
1.1 1.0 0.9
0.8 -40 -20 0 20 40 60 80 100
-20
0
20
40
60
80
100
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity @20mA
0.5
0 550 600 650 700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUE53131/S5-PF Page 4/5
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile Dip Soldering Preheat: 120C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)
Temp( C) 260 C3sec Max
260
5 /sec max
120
2 /sec max Preheat 60 Seconds Max
25 0 0
50
100
150
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUE53131/S5-PF Page 5/5
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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