 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Gas Discharge Tube (GDT) Products CG/CG2 Series CG/CG2 Series Description (R) Littelfuse highly reliable CG/CG2 Series GDTs provide a high degree of surge protection in a small size ideal for board level circuit protection. GDTs function as switches which dissipate a minimum amount of energy and therefore handle currents that far surpass other types of transient voltage protection. Their gas-filled, rugged ceramic metal construction make them well suited to adverse environments. The CG/CG2 series comes in a variety of forms including surface mount, core, straight and shaped leads, to serve a variety of mounting methods. AGENCY FILE NUMBER Agency Approvals AGENCY (R) E128662 E320116 The CG Series (75-110V) is ideal for protection of test and communication equipment and other devices in which low voltage limits and extremely low arc voltages are required. The CG2 Series (145V-1000V) is ideal for protecting equipment where higher voltage limits and holdover voltages are necessary. Features (R) 2 Electrode GDT Graphical Symbol * Rugged Ceramic-Metal construction * Low Capacitance (<1.5pf) * Meets REA PE-80 * Available in surface mount, and a variety of lead options options Applications * Communication lines and equipment * CATV equipment * Test equipment * Data lines * Power supplies * * * * Instrumentation circuits Medical electronics ADSL equipment Telecom SLIC protection (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. 27 Revised: November 10, 2009 CG/CG2 Series Gas Discharge Tube (GDT) Products CG/CG2 Series Electrical Characteristics Device Specifications (at 25C) DC Breakdown in Volts (@100V/s) Life Ratings Surge Life (@500A 10/1000s) Impulse Breakdown in Volts (@100V/s) Impulse Breakdown In Volts (@1 Kv/sec) Insulation CapaciArc Resistance tance Voltage (@1MHz) (on state Voltage) @1Amp Min Nominal Nominal AC DC Max Impulse AC Dischage Holdover Impulse Discharge Discharge Current Voltage2 Discharge (9 cycle Current Current Current (8/20s) (10x1sec @50-60Hz) @50Hz) (1 Application @ 10/350s) Part Number &* &* &* 61 &* &* &* &* &* &* &* &* &* &* &* MIN TYP MAX MAX MIN MAX TYP TYP VKRWV #N$ $ $ DW 9 9 SI 9 VKRWV VKRWV #N$ $ 9 DW 9 9 N$ &* 61 &* 61 &* 61 &* 61 &* 61 $ N$ &* 61 &* 61 NOTES: 1. Tested to UL1449 Third Edition 2. Reference REA PE-80, 0.2A. Tested to ITU-T Rec K.12 and REA PE 80 < 150 mSec. 3. Leaded devices = 5x[5(+) or 5 (-)] applications 20kA 8/20Sec. (75 to 600 volt devices.) MS and Core devices = 10x[5(+) and 5(-)] applications 10kA 8/20S (800 to 1000 volt devices.) Product Characteristics LS, Axial: Device: Nickel Plated 2-5 Microns Lead Wires: Tin Plated 17 12.5 Microns .5 Construction: Ceramic Insulator Core: Device: Tin Plated 17 12.5 Microns. .5 Construction: Ceramic Insulator MS: Device: Dull Tin Plated 7-9 Microns Construction: Ceramic Insulator LF Logo, Voltage and date code; Black in positive print Glow to arc transition current Glow Voltage Storage and Operational Temperature Maximum Follow On Current1 < 0.5Amps 60-160 Volts -40 to +90 230 Volts r.m.s, 200 Amps. (800V and 1000V devices tested to UL1449 3rd edition) Materials Product Marking CG/CG2 Series 28 Revised: November 10, 2009 (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. Gas Discharge Tube (GDT) Products CG/CG2 Series Device Dimensions Leaded 'L' Type Straight Axial Devices PROFILE VIEW 0.81DIA. TYP. [0.032] 8.10DIA. MAX. [0.319] Leaded 'LS' Type Shaped Lead Devices PROFILE VIEW 6.07 0.3 [0.239 0.012] TOP VIEW TOP VIEW 8.10 Max. [0.319 DIA Max.] 8.40 0.3 [0.331 0.012] 6.07 0.15 [0.239 0.006] 0.004 62 2 2 Surfaces 9.85 0.30 [0.388 0.012] 11.15 0.30 [0.439 0.012] 8.4 0.3 [0.331 0.012] 0.40 0.03 [0.0157 0.0012] 0.80 [0.032] Core Devices SOLDER PAD LAYOUT 9.85 [0.388] TOP VIEW 8.10 Max. [0.032 Max.] PROFILE VIEW SEMI-PROFILE VIEW 8.60 [0.339] 6.07 0.15 [0.239 0.0059] 5.89 [0.232] 8.10 Max. 1.80 [0.071] 11.65 [0.459] 0.47 0.1 [0.019 0.0039] 'MS' Type Devices TOP VIEW 8.30 0.1 [0.327 0.0039] 4 0.2 [0.157 0.0079] PROFILE VIEW SEMI-PROFILE VIEW 5.58 [0.220] 6.05 0.2 [0.238 0.0079] o8.300.1 R5.29 [R0.208] [0 2 9] 0. 7 .00 30 0 9. 6 6 .3 0.47 0.1 [0.019 0.0039] SOLDER PAD LAYOUT 2.29 [0.090] 8.71 [0.343] 5.89 [0.232] (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. 29 Revised: November 10, 2009 CG/CG2 Series Gas Discharge Tube (GDT) Products CG/CG2 Series Soldering Parameters - Reflow Soldering (Surface Mount Devices) Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (Min to Max) (ts) Average ramp up rate (Liquidus Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb - Free assembly 150C TP Ramp-up tP Critical Zone TL to TP 60 - 180 secs 3C/second max 5C/second max 217C 60 - 150 seconds 260+0/-5 C 10 - 30 seconds 6C/second max 8 minutes Max. 260C Temperature 200C TL TS(max) Preheat tL Ramp-down TS(min) tS 25 time to peak temperature (t 25C to peak) Time Peak Temperature (TP) Time within 5C of actual peak Temperature (tp) Ramp-down Rate Time 25C to peak Temperature (TP) Do not exceed Soldering Parameters - Wave Soldering (Thru-Hole Devices) 300 Recommended Process Parameters: Wave Parameter Preheat: (Depends on Flux Activation Temperature) (Typical Industry Recommendation) Temperature (C) - Measured on bottom side of board 280 260 240 220 200 180 160 140 120 100 80 60 40 20 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 10 20 30 40 50 60 70 80 90 0 0 Lead-Free Recommendation Temperature Minimum: Temperature Maximum: Preheat Time: Solder Pot Temperature: Solder Dwell Time: 100 C 150 C 60-180 seconds 280 C Maximum 2-5 seconds Time (Seconds) Preheat Time Dwell Time Cooling Time Soldering Parameters - Hand Soldering Solder Iron Temperature: 350 C +/- 5C Heating Time: 5 seconds max. CG/CG2 Series 30 Revised: November 10, 2009 (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. Gas Discharge Tube (GDT) Products CG/CG2 Series Packaging Dimensions For 'L' Type Axial Lead Items <1.2 Max. Lead Bend 254.0 - 356.0 [10.0 - 14.0] <0.8 Max 52.4 [2.063] 22.8 [0.898] 0.0 15] Direction of Feed 6.4 [0.252] 5.0 Pitch [0.197] Core and 'MS' Type Items 275.0 [10.83] 10x4 0.1 = 40 0.2 [10 x 0.157 0.004 = 1.575 0.008] 0.4 0.05 [0.016 0.002] 1.75 0.1 [0.069 0.004] 1.5 DIA. MAX. [0.059] 4 0.1 [0.157 0.004] 76.0 [2.99] 100.0 [3.94] 25.0 [0.98] 8.5 0.1 [0.335 0.004] 7.5 0.1 [0.295 0.004] 16 +0.3 / -0.1 [0.630 +0.012 / -0.004] 1.5 DIA. MAX. [0.059] 17.7 [0.697] Direction of Feed 8.6 0.1 [0.339 0.004] 12 0.1 [0.472 0.004] For 'LS' Type Shaped Lead Items 10x4 0.1 = 40 0.2 [10x.157 0.004 = 1.575 0.008] 0.5 0.05 [0.020 0.002] 1.9 [0.075] 1.75 0.1 [0.069 0.004] 1.5 DIA. MAX. [0.059] 4 0.1 [0.157 0.004] 275.0 [10.82] 100.0 [3.93] 76.0 [2.99] 25.0 [0.98] 11.5 0.1 [0.453 0.004] 24 +0.3 / -0.1 [0.945 +0.019 / -0.004] 25.7 [1.01] Direction of Feed 11.75 0.1 [0.463 0.004] 8 0.1 [0.315 0.004] 0.5 0.01 [0.020 0.004] 9 0.1 [0.354 0.004] 1.5 DIA. MAX. [0.059] 16 0.1 [0.630 0.004] (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. 31 Revised: November 10, 2009 CG/CG2 Series Gas Discharge Tube (GDT) Products CG/CG2 Series Part Numbering System and Ordering Information CG2 XXX XX * XX Series CG -- for 75, 90, or 110V CG2 -- for 145V to 1000V Examples: CG75 -- A non-leaded 75V device CG2230L -- A leaded 230V device CG2800LTR -- A leaded 800V device, tape-and-reel Notes: CG/CG2 devices with other breakdown voltages in the 75-1000 V range are available upon request. (per EIA standard RS-296-D) Breakdown Voltage 75 90 110 145 230 250 300 350 470 600 800 1000 Lead Option Code (Blank) = No Leads / Core L = Straight Leads LS = Shaped Leads MS = Surface Mount Option Code* SN = denotes different DC Breakover Voltage Limit. Please refer to Electrical Characteristics table for additional information. Packaging Option Code (Blank) = No Leads / Core, Bulk Bag - 400 pcs L(Blank) = Straight Lead, Tray - 50 pcs LTR = Straight Lead, Tape & Reel per EIA RS-296-E - 500 per reel LTE = Straight Lead, Tape & Reel per IEC 60286-1 - 500 per reel LSTR = Shaped Lead (see LS dimensions), Tape & Reel - 500 per reel CG/CG2 Series 32 Revised: November 10, 2009 (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. |
Price & Availability of CG2300
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |