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MBR2535CTL SWITCHMODEt Power Rectifier Features and Benefits * * * * * * Low Forward Voltage Low Power Loss/High Efficiency High Surge Capacity 150C Operating Junction Temperature 25 A Total (12.5 A Per Diode Leg) Pb-Free Packages are Available* http://onsemi.com SCHOTTKY BARRIER RECTIFIER 25 AMPERES, 35 VOLTS 1 2, 4 3 Applications * Power Supply - Output Rectification * Power Management * Instrumentation Mechanical Characteristics * * * * * * Case: Epoxy, Molded Epoxy Meets UL 94, V-0 @ 0.125 in Weight: 1.9 Grams (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead Temperatures for Soldering Purposes: 260C Max. for 10 Seconds ESD Rating: Human Body Model 3B Machine Model C 4 1 2 TO-220AB CASE 221A STYLE 6 3 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MARKING DIAGRAMS AYWW B2535L AKA AYWW B2535LG AKA A = Assembly Location Y = Year WW = Work Week B2535L = Device Code G = Pb-Free Package AKA = Polarity Designator ORDERING INFORMATION Device MBR2535CTL MBR2535CTLG Package TO-220 TO-220 (Pb-Free) Shipping 50 Units/Rail 50 Units/Rail (c) Semiconductor Components Industries, LLC, 2008 May, 2008 - Rev. 5 1 Publication Order Number: MBR2535CTL/D MBR2535CTL MAXIMUM RATINGS (Per Leg) Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (TC = 142C per Diode) (TC = 142C per Device) Peak Repetitive Forward Current, per Leg (Sq Wave, 20 kHz, TC = 139C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) Storage Temperature Range Operating Junction Temperature (Note 1) Voltage Rate of Change (Rated VR) Symbol VRRM VRWM VR IF(AV) Value 35 Unit V A 12.5 25 25 150 1.0 -65 to +150 -65 to +150 10,000 A A A C C V/ms IFRM IFSM IRRM Tstg TJ dv/dt Controlled Avalanche Energy Waval 20 mJ Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RqJA. THERMAL CHARACTERISTICS Characteristic Maximum Thermal Resistance, Junction-to-Case Maximum Thermal Resistance, Junction-to-Ambient Conditions Min. Pad Min. Pad Symbol RqJC RqJA Max 2.0 75.0 Unit C/W ELECTRICAL CHARACTERISTICS Characteristic Instantaneous Forward Voltage (Note 2) (iF = 25 Amps, Tj = 25C) (iF = 12.5 Amps, Tj = 25C) (iF = 12.5 Amps, Tj = 125C) Instantaneous Reverse Current (Note 2) (Rated dc Voltage, Tj = 25C) (Rated dc Voltage, Tj = 125C) 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. Symbol vF Min - - - - - Typical 0.51 0.41 0.33 0.8 300 Max 0.55 0.47 0.41 5.0 500 Unit V iR mA http://onsemi.com 2 MBR2535CTL IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) 100 150C 10 100 10 150C 1.0 125C 125C 1.0 25C 25C 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Forward Voltage 1,000 IR, REVERSE CURRENT (mA) TJ = 125C IF(AV), AVERAGE FORWARD CURRENT (A) 22 20 18 16 14 12 10 8.0 6.0 4.0 2.0 0 Figure 2. Maximum Forward Voltage dc 100 10 TJ = 100C Square Wave 1.0 TJ = 25C 0.1 0 5.0 10 15 20 25 30 35 120 125 130 135 140 145 150 155 VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (C) Figure 3. Typical Reverse Current, Per Leg 20 18 16 14 12 10 8.0 6.0 4.0 2.0 0 RqJA = 75C/W No Heatsink 0 25 50 dc Square Wave 75 100 125 150 175 Square Wave dc RqJA = 16C/W PF(AV), AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) 16 14 12 10 8.0 6.0 4.0 2.0 0 Figure 4. Current Derating, Case, Per Leg TJ = 150C Square Wave dc 0 2.0 4.0 6.0 8.0 10 12 14 16 18 20 22 24 26 IF(AV), AVERAGE FORWARD CURRENT (A) TA, AMBIENT TEMPERATURE (C) Figure 5. Current Derating, Ambient, Per Leg Figure 6. Forward Power Dissipation http://onsemi.com 3 MBR2535CTL PACKAGE DIMENSIONS TO-220 CASE 221A-09 ISSUE AF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.161 0.095 0.105 0.110 0.155 0.014 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 ----0.080 ANODE CATHODE ANODE CATHODE MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 4.09 2.42 2.66 2.80 3.93 0.36 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 ----2.04 -T- B 4 SEATING PLANE F T C S Q 123 A U K H Z L V G D N R J STYLE 6: PIN 1. 2. 3. 4. SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 4 MBR2535CTL/D |
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