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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
TAPE AND REEL TYPE LED LAMPS
LDGM4341/TRS-X
DATA SHEET
DOC. NO : REV DATE :
QW0905-LDGM4341/TRS-X A
: 29 - Sep - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDGM4341/TRS-X Page 1/5
Package Dimensions
P2
H
H2 H1 L W0
W2
W1 W3
D
P1 P
F
-+
T
5.0
14.2
6.8
1.5 MAX 25.0MIN 0.5 TYP 1.0MIN
2.54TYP
Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDGM4341/TRS-X Page 2/5
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol DGM Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 100 120 50 150 -20 ~ +80 -30 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT
g A V J J
Typical Electrical & Optical Characteristics (Ta=25 J )
PART NO
MATERIAL Emitted
COLOR Lens
Green Transparent
Luminous Peak Dominant Spectral Forward voltage intensity wave wave halfwidth @20mA(V) @20mA(mcd) length length f nm f Pnm f Dnm
Viewing angle 2c 1/2 (deg)
Typ. Max. Min. Typ. 518 525 36 3.5 4.0 550 1040 88
LDGM4341/TRS-X
InGaN/GaN Green
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDGM4341/TRS-X E Dimensions Symbol Information SYMBOL ITEMS
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection
Page3/5 SPECIFICATIONS Minimum Maximum mm
3.8 2.3
-------
OPTION SYMBOL CODE
------------------
inch
0.15 0.09
-------
mm
4.2 3.0 2.0 18.5 22.5 26.5 23.5 20.9 25.0 25.5 20.0 19.4 22.0 21.5 19.0 27.5 36 11.0 13.0 5.8 7.7 1.42 9.75 15.5 4.0 19.0
inch
0.17 0.12 0.08 0.73 0.89 1.04 0.93 0.82 0.98 1.0 0.79 0.76 0.88 0.85 0.76 1.08 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75
D F H
Feed Hole To Bottom Of Component
TRS-1 TRS-2 TRS-3 TRS-5 TRS-6 TRS-7 TRS-8 TRS-9 TRS-10 TRS-11 TRS-12 TRS-13 TRS-14
-------------------------------------------------------------
H1
17.5 21.5 25.5 22.5 19.9 24.0 24.5 19.0 18.0 21.0 20.5 18.0 26.5
-------
0.69 0.85 1.0 0.89 0.78 0.94 0.96 0.75 0.72 0.84 0.81 0.72 1.04
-------
Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
H2 L P P1 P2 T W0 W1 W2 W3
W0 12.4 4.4 5.1
-------
0.49 0.17 0.2
-------
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK: TRS=Tape And Reel Straight Leads
E Dimensions Symbol Information
Specification Description Symbol minimum mm
Reel Diameter Core Diameter Hub Recess Inside Diameter Arbor Hole Diameter Overall Reel Thickness Iside Reel Flange Thickness
E Package Dimensions
maxmum mm 380 102 88.0 38.1 57.2 50.0 inch 14.96 4.02 3.46 1.5 2.25 1.97
D3 MARKING D2 D1
inch 3.08 1.37 1.13 0.54
-------
D D1 D2 D3 T2 T1
78.2 34.9 28.6 13.8
-------
D T1 T2
30.0
1.18
Package
LDGM4341/TRS-X
Quantity/Reel
1000PCS
Order Increments
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDGM4341/TRS-X Page 4/5
Typical Electro-Optical Characteristics Curve
DGM CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Forward Current(mA)
100 10 1.0 0.1 1.0 2.0 3.0 4.0 5.0
Relative Intensity Normalize @20mA
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA Normalize @25J
-40 -20 0 20 40 60 80 100
Forward Voltage@20mA Normalize @25J
1.1 1.0
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
0.9 0.8
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 450 500 550 600
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDGM4341/TRS-X Page 5/5
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 J O 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2
Solderability Test
1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec

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