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High Performance Regulators for PCs
Switching Regulator with MOSFET for DDR-SDRAM Cores
BD95500MUV
No.10030ECT21
Description BD95500MUV is a switching regulator with high output current (up to 6A) which can achieve low output voltage (0.7V to 5.0V) from a wide input voltage range (3V to 20V). High efficiency for the switching regulator can be realized by 3 TM utilizing an internal N-MOSFET power transistor. A new technology called H Reg is a Rohm proprietary control method to realize ultra high transient response against load change. SLLM (Simple Light Load Mode) technology is also integrated to improve efficiency in light load mode, providing high efficiency over a wide load range. For protection and ease of use, the soft start function, variable frequency function, short circuit protection function with timer latch, over voltage protection function, and power good function are all built in. This switching regulator is specially designed for sets of various kinds. Features 1) Integrated low ON resistance N-MOSFET (TYP. 50m) 3 TM 2) H Reg DC/DC converter controller 3) Adjustable Simple Light Load Mode (SLLM), and forced continuous mode 4) Thermal Shut Down (TSD), Under Voltage LockOut (UVLO), Adjustable Over Current Protection (OCP), Over Voltage Protection (OVP), Short Circuit Protection(SCP) built-in 5) Soft start function to minimize rush current during startup 6) Adjustable switching frequency (f=200KHz1000KHz) 7) Built-in output discharge function 8) VQFN040V6060 Package 9) Tracking Function 10) Integrated boot strap diode 11) Power Good function Applications Mobile PC, Desktop PC, LCD-TV, Digital Components, etc
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1/20
2010.05 - Rev.C
BD95500MUV
Maximum Absolute Ratings (Ta=25) Parameter Input Voltage 1 Input Voltage 2 Input Voltage 3 BOOT Voltage BOOT-SW Voltage LG Voltage REF Voltage Output Voltage ILIM/SS/FS/MODE Voltage VREG Voltage EN Input Voltage Output Current (Average) Power Dissipation 1 Power Dissipation 2 Power Dissipation 3 Power Dissipation 4 Operating Temperature Range Storage Temperature Range Junction Temperature Symbol VCC VDD VIN BOOT BOOT-SW LG REF VOUT/Is+/IsILIM/SS/FS/MODE VREG EN Isw Pd1 Pd2 Pd3 Pd4 Topr Tstg Tjmax Ratings 7 *1 7
*1
Technical Note
Unit V V V V V V V V V V V A W W W W
24 *1 30 7 VDD VCC VCC VCC VCC 7 6 0.54 *2 1.00 *3 3.77 *4 4.66
*5
-10+100 -55+150 +150
*1 Not to exceed Pd, ASO, and Tjmax=150. *2 Reduced by 4.3mW for each increase in Ta of 1 over 25 (when don't mounted on a heat radiation board ) *3 Reduced by 8.0mW for increase in Ta of 1 over 25. (when mounted on a board 70.0mmx70mmx1.6mm Glass-epoxy PCB which has 1 layer. (Copper foil area : 0mm2)) *4 Reduced by 30.1mW for increase in Ta of 1 over 25. (when mounted on a board 70.0mmx70mmx1.6mm Glass-epoxy PCB which has 4 layers. (1st and 4th copper foil area : 20.2mm2, 2nd and 3rd copper foil area : 5505mm2)) *5 Reduced by 37.3mW for increase in Ta of 1 over 25. (when mounted on a board 70.0mmx70mmx1.6mm Glass-epoxy PCB which has 4 layers. (All copper foil area : 5505mm2))
Operating Conditions (Ta=25) Parameter Input Voltage 1 Input Voltage 2 Input Voltage 3 BOOT Voltage SW Voltage BOOT-SW Voltage MODE Input Voltage EN Input Voltage Output Adjustable Voltage Is Input Voltage MIN ON Time Symbol VCC VDD VIN BOOT SW BOOT-SW MODE EN REF Is+/IsTonmin Ratings MIN 4.5 4.5 3.0 4.5 -0.7 4.5 0 0 0.7 0.7 MAX 5.5 5.5 20 25 20 5.5 5.5 5.5 2.0 2.7 200 Unit V V V V V V V V V V nsec
*This product should not be used in a radioactive environment.
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2/20
2010.05 - Rev.C
BD95500MUV
Technical Note
Electrical characteristics (Unless otherwise noted, Ta=25, VCC=5V, VDD=5V, EN / MODE=5V, VIN=12V, REF=1.8V, RFS=68k Limit Parameter Symbol Unit Condition Min. Typ. Max. [Whole Device] VCC Bias Current Icc 1200 2000 A VIN Bias Current Iin 100 200 A VCC Standby Current Iccstb 0 10 A EN0V VIN Standby Current Iinstb 0 10 A EN0V EN Low Voltage Enlow GND 0.8 V EN High Voltage Enhigh 2.3 5.5 V EN Bias Current Ien 7 10 A Ireg=0 to 500uA, VREG Voltage Vreg 2.475 2.500 2.525 V Ta=-10 to 100* [Under Voltage Locked Out ] VCC Threshold Voltage Vcc_UVLO 4.1 4.3 4.5 V VCC:Sweep up VCC Hysteresis Voltage dVcc_UVLO 100 160 220 mV VCC:Sweep down VIN Threshold Voltage Vin_UVLO 2.4 2.6 2.8 V VIN:Sweep up VIN Hysteresis dVin_UVLO 100 160 220 mV VIN:Sweep down VREG Threshold Voltage Vreg_UVLO 2.0 2.2 2.4 V VREG:Sweep up VREG Hysteresis Voltage dVreg_UVLO 100 160 220 mV VREG:Sweep down 3 TM [H REG Control Block] ON Time Ton 400 500 600 nsec MAX ON Time Tonmax 3 6.0 sec MIN OFF Time Toffmin 450 550 nsec [FET Block] High Side ON Resistance HGhon 50 80 m Low Side ON Resistance HGlon 50 80 m [SCP Block] SCP Start up Voltage Vscp REFx0.60 REFx0.70 REFx0.80 V Delay Time Tscp 1.0 2.0 ms [OVP Block] OVP Detect Voltage Vovp REFx1.16 REFx1.2 REFx1.24 V [Soft Start Block] Charge Current Iss 2 4 6 A Discharge Current Idis 0.5 1.0 2.0 A Standby Voltage Vss_stb 50 mV [Over Current Protection Block] ILIM=0.5V , Current Limit Threshold 1 Ilim1 40 50 60 mV Ta=-10 to 100 Current Limit Threshold2 Ilim2 160 200 240 mV ILIM=2.0V [Vout Setting] VOUT Offset Voltage 1 Voutoff1 REF-10m REF REF+10m V Ta=-10 to 100 VOUT Bias Current Ivout -100 0 100 nA REF Bias Current Iref -100 0 100 nA Is+ Input Current IIs+ -1 0 1 A Is+=1.8V Is- Input Current IIs-1 0 1 A Is-=1.8V [MODE Block] SLLM Threshold VthSLLM VCC-0.5 VCC V Forced Continuous Mode VthCONT GND 0.5 V Input Impedance RMODE 400 k [Power Good Block] VOUT Power Good Low Voltage VoutPL REFx0.85 REFx0.90 REFx0.95 V VOUT Power Good High Voltage VoutPH REFx1.05 REFx1.10 REFx1.15 V
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3/20
2010.05 - Rev.C
BD95500MUV
Reference Data
2.500
Technical Note
4.30 4.25
2.70 2.65
2.498
Sweep up
4.20
Sweep up
2.60 VIN[V] 2.55 2.50
VREG[V]
VCC[V]
2.496 2.494
4.15 4.10
Sweep down
2.45 2.40
-10 10 30 50 Ta( ) 70 90
Sweep down
2.492
4.05 4.00
-10 10 30 50 Ta( ) 70 90
2.490
-10
10
30
50 Ta( )
70
90
Fig.1 Ta vs VREG
2.20 2.15 2.10
Fig.2 Ta vs UVLO (VCC)
2.20
2.8
Fig.3 Ta vs UVLO (VIN)
Sweep up
2.15 2.10 VREG[V]
Sweep up
2.4 2.0 VREG(V) 1.6 1.2 0.8 0.4 0.0
VREG[V]
2.05
2.05 Sweep down 2.00 1.95 1.90
Sweep down
2.00 1.95 1.90 -10 10 30 50 Ta( ) 70 90
Left: 100 Middle: 25 Right: -10
0 1.5 3 4.5 Vcc(V) 6
-10
10
30
50 Ta( )
70
90
Fig.4 Ta vs UVLO (VREG)
Fig.5 Ta vs EN Threshold
Fig.6 Vcc vs VREG
3 2
54
400
52
360
frequency[kHz]
Io=2A
VOUT-REF [mV]
1 0 -1
48 Is [mV] 50
320 Io=0A 280
-2
240 ILIM=0.5V
-3 -10
10
30
50 Ta ()
70
90
46 -10
200
10 30 50 Ta ( ) 70 90
0
5
10 15 VIN(V)
20
25
Fig.7 Ta vs VOUT Offset
100
Fig.8 Ta vs Current Limit Threshold
100 100 SLLM
Fig.9 VIN vs f
80
SLLM
80
80
SLLM
60
[%]
60 Forced Continuous [%] Forced Continuous [%]
60 Forced Continuous
40
40
40
20
20
20
0 0.001
0.01
0.1 Io(mA)
1
10
0 0.001
0.01
0.1 Io(mA)
1
10
0 0.001
0.01
0.1 Io(mA)
1
10
Fig.10 Io vs Efficiency (VIN=7V, VOUT=1.5V)
Fig.11 Io vs Efficiency (VIN=12V, VOUT=1.5V)
Fig.12 Io vs Efficiency (VIN=19V, VOUT=1.5V)
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4/20
2010.05 - Rev.C
BD95500MUV
Reference Data
Technical Note
VOUT
VOUT HG/LG
VOUT HG/LG
HG/LG
IOUT
IOUT
IOUT
Fig.13 Transient Response (VIN=7V)
Fig.14 Transient Response (VIN=12V)
VOUT HG/LG
Fig.15 Transient Response (VIN=19V)
VOUT HG/LG
VOUT
HG/LG
IOUT
IOUT
IOUT
Fig.16 Transient Response (VIN=7V)
Fig.17 Transient Response (VIN=12V)
Fig.18 Transient Response (VIN=19V)
VOUT IL HG/LG
VOUT IL HG/LG
VOUT IL HG/LG
Fig.19 SLLM Mode (IOUT=0A)
Fig.20 SLLM Mode (IOUT=0.4A)
Fig.21 SLLM Mode (IOUT=1A)
IL IL
IL
HG/LG/SW HG/LG/SW
HG/LG/SW
Fig.22 Continuous Mode (Io=0A)
Fig.23 Continuous Mode (Io=4A)
Fig.24 OCP Status (Io=5A)
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5/20
2010.05 - Rev.C
BD95500MUV
Reference Data
Technical Note
VIN
VIN EN SS VOUT
HG/LG
HG/LG
VOUT
VOUT
PGOOD
Fig.25 VIN change (519V)
Fig.26 VIN change (195V)
Fig.27 EN wake up
1.52
500
Continuous
1.51 Output Voltage [V
60 50
400 Frequency [kHz
Continuous
300
Tc []
40 30 20
SLLM
1.50
Continuous SLLM SLLM
200
1.49
100
10 0
1.48 0.001
0.01
0.1 Iout [A]
1
10
0 0.001
0.01
0.1 Iout [A]
1
10
0
1
2
3 Io [A]
4
5
6
Fig.28 IOUT vs VOUT Block Diagram
VDD VIN
Fig.29 IOUT vs f
Fig.30 IOUT vs Tc
Vcc
5 37
VINS
7
VREG
9
SS VDD
EN
39
Reference Block
VREG VIN
UVLO 2.5V SS Soft Start
31 | 36 38
BOOT
2.5VReg
VIN C IN 3.3V 20V
REF x 1.2 REF x 0.85 SS x 0.85 V OUT SCP
OVP
Vcc
Delay
V OUT
REF
10
H 3 Reg TM Controller Block Power Good
SS
R S
Q
SLLM/
Driver Circuit
22 | 29
SW
V OUT
C OUT
14
1
PGOOD V OUT
11
VDD MODE
5V
EN/UVLO
UVLO ILIM SCP TSD
ILIM
Current Limit
15 | 21
PGND
Thermal Protection
TSD
x 0.1
30
PGND
3
CE
6
8
40
2
4
13
GND
FS
MODE
N.C.
ILIM
Is+
12
Is -
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6/20
2010.05 - Rev.C
BD95500MUV
Pin Configuration
PGND SW SW SW SW SW SW SW SW PGND
Technical Note
30
VIN VIN VIN VIN VIN VIN
29
28
27
26
25
24
23
22
21 20 PGND 19 PGND 18 PGND 17 PGND 16 PGND 15 PGND 14 VDD 13 12
Is+ Is-
31 32 33 34 35 36
VINS 37 BOOT 38 EN 39 MODE 40
11 VOUT 1 2 3
CE
4
ILIM
5
6
7
8
FS
9
10
PGOOD N.C.
VCC GND VREG
SS/ REF TRACK
*Connect the bottom side (FIN) to the ground terminal
Pin Function Table PIN No. PIN name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15-21 22-29 30 31-36 37 38 39 40 bottom PGOOD N.C. CE ILIM VCC GND VREG FS SS/TRACK REF VOUT IsIs+ VDD PGND SW PGND VIN VINS BOOT EN MODE FIN Ceramic Capacitor Reactive Pin Current Limit Setting Pin
PIN function Power Good Output Pin(+/-10% Window) -
Power Supply Input pin (Control Block) Sense GND IC Reference Voltage (2.5V/500uA) Switching Frequency Adjustable Pin (30k100k) Soft Start Setting Pin (w/ Capacitor)/Tracking Voltage Input Pin Vo Setting Pin Output Voltage Sense Pin Current Sense Pin Current Sense Pin + FET Driver Power Supply Pin (5V Input) Power GND Pin High Side FET Source Pin Power GND Pin Battery Voltage Input pin (3.3~20V Input) Battery Voltage Sense pin HG Driver Power Supply Pin Enable Input pin (IC ON when High) Control Mode Adjustment Pin Low: Continuous High: SLLM Substrate connection
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7/20
2010.05 - Rev.C
BD95500MUV
Technical Note
Pin Descriptions VCC (5 Pin) This is the power supply pin for IC internal circuits, except the FET driver. The input supply voltage range is 4.5V to 5.5V. It is recommended that a 10/0.1uF C-R filter be put in this pin from VDD rail. EN (39 Pin) When EN pin voltage is at least 2.3V, the status of this switching regulator becomes active. Conversely, the status switches off when EN pin voltage goes lower than 0.8V and circuit current becomes 0A. VDD (14 Pin) This is the power supply pin to drive the LOW side FET and for Boot-strap diode. It is recommended that a 1~10F bypass capacitor be established to compensate for rush current during the FET ON/OFF transition. VREG (7 Pin) This is the reference voltage output pin. The voltage is 2.5V, with 500uA current ability. It is recommended that a 0.22~1F capacitor (X5R or X7R) be established between VREG and GND (6 Pin). When REF is not adjusted from the external voltage supply, the REF voltage can be adjusted using the external resistor divider of VREG. REF (10 Pin) This is the output voltage adjustment pin by resistor divider network from VREG pin (0.7~2.0V). It is also very convenient for synchronizing external voltage supply. The IC controls the output voltage (REFVOUT). ILIM (4 Pin) BD95500MUV detects the voltage between Is+ pin and Is- pin and limits the output current (OCP). Voltage equivalent to 1/10 of the ILIM voltage is the voltage drop of external current sense resistor. A very low current sense resistor or inductor DCR can also be used for this platform. SS/TRACK (9 Pin) This is the adjustment pin to set the soft start time. SS voltage is low during standby status. When EN is ON, the soft start time can be determined by the SS charge current and capacitor between SS-GND. Until SS reaches REF voltage, the output voltage is equivalent to SS voltage. And also this pin enables to operate tracking function. The output voltage keeps track of a power supply rail by connecting 10k resistance between the power supply rail and SS/TRACK pin. VINS (37 Pin) The duty cycle is determined by input voltage and controls output voltage. In other words, the output voltage is affected by input voltage. Therefore, when VINS voltage fluctuates, the output voltage becomes also unstable. Since the VINS line is also the input voltage of the switching regulator, stability depends on the impedance of the voltage supply. It is recommended to establish a bypass capacitor or CR filter suitable for the actual application. FS (8 Pin) This is the pin to adjust the switching frequency with the resistor. It is recommended that a resistor be established to GND (6 pin).The frequency range is from 200kHz to 1000kHz. Is+ (13 pin), Is- (12 pin) These pins are connected to both sides of the current sense resistor to detect output current. The voltage drop between Is+ and Is- is compared with the voltage equivalent to 1/10 of ILIM voltage. When this voltage drop hits the specified voltage level, the output voltage is OFF. Since the maximum input voltage is 2.7V, set the output voltage by the resistance division value in case the output voltage is 2.7V or more. BOOT (38 pin) This is the voltage supply to drive the high side FET and a Diode for BOOT strap function is built in. The maximum absolute ratings are 30V (from GND) and 7V (from SW). BOOT voltage swings between (VIN+Vcc) and Vcc during active operation. PGOOD (1 pin) This pin is output pin for Power Good. It is open drain pin and recommended to connect to other power supply through the pull-up resistance (about 100k). CE (3 pin) This pin is for the ceramic capacitor. It is useful to utilize low ESR capacitor for output capacitor. MODE (40 pin) TM This is the control mode changeable pin. The status is Low : continuous mode, the status is High : SLLM . VOUT (11 pin) This is the monitor pin for output voltage. This IC controls the voltage in the status of REFVOUT. When output voltage is required 2V or more, set the output voltage by the resistance division value. SW (22-29 pin) This is connected pin for coil. SW voltage swings between VIN and GND. It is recommended to connect by heavy and short pattern to coil. VIN (31-36 pin) This is input power supply pin. Recommend input voltage is 3.3V to 20V. Connect the input capacitor against PGND directly. PGND (15-21, 30 pin) This is power ground pin. It is recommended to connect by heavy and short pattern. Connect in reverse side of IC when connecting to GND (6 pin).
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8/20
2010.05 - Rev.C
BD95500MUV
Technical Note
Explanation of Operation 3 TM The BD95500MUV is a switching regulator controller incorporating ROHM's proprietary H Reg CONTROLLA control system. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the tON time interval. Thus, it serves to improve the regulator's transient response. Activating the Light Load Mode will also exercise Simple Light Load Mode (SLLM) control when the load is light, to further increase efficiency. H3RegTM control (Normal operation) VOUT REF When VOUT falls to a threshold voltage (REF), the drop is detected, activating the H3RegTM CONTROLLA system. REF VIN 1 f
HG
TON=
x
[sec](1)
LG
HG output is determined by the formula above.
(VOUT drops due to a rapid load change) VOUT REF When VOUT drops due to a rapid load change, and the voltage remains below VREF after the programmed tON time interval has elapsed, the system quickly restores VOUT by extending the tON time, improving the transient response.
Io HG
tON+
LG
VIN
HG
VIN
REF
H Reg CONTROLLA
3
TM
R S
Q
SLLM SLLM
Driver Circuit
LG SW
VOUT
VOUT
PGND
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9/20
2010.05 - Rev.C
BD95500MUV
Timing Chart Soft Start Function EN TSS SS
Technical Note
Soft start is exercised with the EN pin set high. Current control takes effect at startup, enabling a moderate output voltage "ramping start." Soft start timing and incoming current are calculated with formulas (2) and (3) below. Soft start time Tss= REFxCss 4A(typ) [sec] (2)
VOUT
Rush current IIN IIN (ON)= CoxVOUT Tss [A] (3)
(Css: Soft start capacitor; Co: Output capacitor) Soft Stop Function Soft stop is exercised with the EN pin set low. Current control takes effect at startup, enabling a moderate output voltage. Soft start timing and incoming current are calculated with formulas (4) below. TSS(OFF) 1.2V SS 0.1V
Spontaneous Discharge (It is determined by load and output capacitor)
EN
Soft stop time TSS (OFF) = (REF+2VBE)xCss 1A (typ) [sec] (4)
VSS= 1.2[V] (typ) Tdelay = CSS 1A(typ) [sec] (5)
VOUT Tdelay
Timer Latch Type Short Circuit Protection REFx0.70 VOUT
1ms
SCP
When output voltage (Is-) falls to REFx0.7 or less, SCP comparator inside IC is exercised. If the status of High is continued 1ms or more (programmed time inside IC), the IC goes OFF. It can be restored either by reconnecting the EN pin or disabling UVLO.
EN/UVLO
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10/20
2010.05 - Rev.C
BD95500MUV
Output Over Voltage Protection REFx1.2
Technical Note
VOUT
When output rise to or above REFx1.2, output over voltage protection is exercised, and low side FET goes up maximum for reducing output. LG=High, HG=Low . When output falls, it returns to the standard mode.
HG
LG
Switching Over current protection circuit tON HG tON tMAX tON During the normal operation, when VOUT becomes less than REF Voltage, HG becomes High during the time tON (P9). However, when inductor current exceeds ILIMIT threshold, HG becomes OFF. After MAX ON TIME, HG becomes ON again if the output voltage is lower than the specific voltage level and IL is lower than ILIMIT level.
LG ILIMIT IL
Synchronous operation with external power supply
3.3V (External Power Supply)
These power supply sequences are realized to connect SS pin to other power supply output through the resistance (10k).
1.5 V (BD95500 Output 1)
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11/20
2010.05 - Rev.C
BD95500MUV
External Component Selection 1. Inductor (L) selection
Technical Note
IL
VIN
The inductor value is a major influence on the output ripple current. As formula (5) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. (VIN-VOUT)xVOUT [A](4) IL= LxVINxf The proper output ripple current setting is about 30% of maximum output current.
HG SW
IL VOUT L Co
IL=0.3xIOUTmax. [A](5) L= (VIN-VOUT)xVOUT LxVINxf [H](6)
LG PGND
Output Ripple Current
(IL: output ripple current; f: switch frequency)
Passing a current larger than the inductor's rated current will cause magnetic saturation in the inductor and decrease system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed the inductor rated current value. To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance. 2. Output Capacitor (CO) Selection
VIN
HG SW L LG PGND VOUT ESR ESL Co
When determining the proper output capacitor, be sure to factor in the equivalent series resistance and equivalent series inductance required to set the output ripple voltage 20mV or more. In selecting the limit of inductor, be sure to allow enough margin for output voltage. Output ripple voltage is determined as in formula (7) below. VOUT=ILxESR + ESLxIL / TON(7) (IL: Output ripple current; ESR: CO equivalent series resistance, ESL: equivalent series inductance)
Output Capacitor Please give due consideration to the conditions in formula (8) below for output capacity, bear in mind that output rise time must be established within the soft start time frame. Co TSSx(Limit-IOUT) VOUT (8) Tss: Soft start time (See formula (2) in P10) Limit: Over current detection (See formula (10)(11) in P13)
Note: Improper capacitor may cause startup malfunctions 3. Input Capacitor (Cin) Selection
VIN Cin HG SW L LG PGND Co VOUT
The input capacitor selected must have low enough ESR resistance to fully support large ripple output, in order to prevent extreme over current. The formula for ripple current IRMS is given in (9) below. VIN (VIN-VOUT) VIN IOUT 2
IRMS=IOUTx
[A](9)
Where VIN=2xVOUT, IRMS= Input Capacitor
A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency.
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12/20
2010.05 - Rev.C
BD95500MUV
4. Setting Detection Resistance
VIN
Technical Note
The over current protection function detects the output ripple current peak value. This parameter (setting value) is determined as in formula (10) below.
L IL R VOUT Co
HG SW
ILMIT=
VILIMx0.1 R
[A](10)
(VILIM: ILIM voltage, R: Detection resistance)
LG PGND Is+ IsCurrent limit
VIN IL SW L RL VOUT Co
HG
When the over current protection is detected by DCR of coil L, this parameter (setting value) is determined as in formula (11) below. ILMIT=VILIMx0.1x (RL= rxC L [A](11)
LG PGND
r
C
Is+ IsCurrent limit
L ) rxC (VILIM:ILIM voltage, RL: the DCR value of coil)
IL ILIMIT
detect point
As soon as the voltage drop between Is+ and Is- generated by the inductor current becomes specific threshold, the gate voltage of the high side MOSFET becomes low. Since the peak voltage of the inductor ripple current is detected, this operation can sense high current ripple operation caused by inductance saturated rated current and lead to high reliable systems.
t
0
VIN
HG SW L IL LG PGND Is+ IsCurrent limit R2 R2 R1 R1 R VOUT Co
When the output voltage is 2.7V or more, use the resistance for setting output voltage like left figure, for Is+ and Is-. According to the setting value above, ILIMIT setting current is in proportion to the divided ratio. ILMIT= R1+R2 R1 x VLIMITx0.1 R [A](12)
(VILIM: ILIM voltage R: Detection resistance)
VOUT
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13/20
2010.05 - Rev.C
BD95500MUV
5.Setting frequency
3000 2500 2000 TON [nsec] 1500 1000 500
Technical Note
VIN=5V 7V 12V 16V 19V
The On Time (tON) at steady state is determined by resistance value connected to FS pin. But actually SW rising time and falling time come up due to influence of the external MOSFET gate capacity or switching speed and tON is increased. The frequency is determined by the following formula after tON, input current and the REF voltage are fixed. REF F= VINxtON (13)
REF=1.8V
150 200
0 0 50 100 RFS [k]
1200 1000 800 600 400 200 0 0 50 100 Resistance [k] 150 200
Consequently, total frequency becomes lower than the formula above. TON is also influenced by Dead Time around the output current 0A area in continuous mode. This frequency becomes lower than setting frequency. It is recommended to check the steady frequency in large current area (at the point where the coil current doesn't back up).
6. Setting standard voltage (REF) VIN It is available to synchronize setting the reference voltage (REF) with outside supply voltage [V] by using outside power supply voltage.
Frequency [kHz
VIN=5V 7V 12V 16V 19V
REF
H3RegTM CONTROLLA
R S
Q
Outside voltage
VOUT VREG R1 REF H3RegTM CONTROLLA R S Q
VIN It is available to set the reference voltage (REF) by the resistance division value from VREG in case it is not set REF from an external power supply. R2 REF= R1+R2 xVREG [V](14)
R2
VOUT
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14/20
2010.05 - Rev.C
BD95500MUV
Technical Note
7. Setting output voltage This IC is operated that output voltage is REFVOUT. And it is operated that output voltage is feed back to FB pin in case the output voltage is 0.7V to 2.0V. VIN VIN
REF
H3RegTM CONTROLLA
R S
Q
SLLM SLLM
Driver Circuit
Output voltage
VOUT
In case the output voltage range is 0.7V to 2.0V. It is operated that the resistance division value of the output voltage is feed back to VOUT pin in case the output voltage is more than 2.0V. R1+R2 output voltage R2 And then the frequency is also in proportion to the divided ratio. R2 R1+R2 REF VINxtON VIN xREF [V](15)
F=
x
(16) VIN
REF
H3RegTM CONTROLLA
R S
Q
SLLM SLLM
Driver Circuit
Output voltage
VOUT
R1
In case the output voltage is more than 2.0V.
R2
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15/20
2010.05 - Rev.C
BD95500MUV
I/O Equivalent Circuit 1pin (PGOOD) 3pin (CE)
VCC
Technical Note
4pin (ILIM)
VCC
7pin (VREG)
VCC
8pin (FS)
VCC
9pin (SS/TRACK)
VCC VCC
10pin (REF)
VCC
11pin (VOUT)
VCC
12pin (Is-)
VCC
13pin (Is+)
VCC
22-29pin (SW)
VIN
31-36pin (VIN)
SW PGND
37pin (VINS)
38pin (BOOT)
VDD
39pin (EN)
40pin (MODE)
VCC
SW
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16/20
2010.05 - Rev.C
BD95500MUV
Evaluation Board Circuit (Frequency=300kHz Continuous/SLLM Circuit Example)
SW L1
Technical Note
R14 C10 28 27 26 29 25 24 30 23 VIN (5V) C8 22 21
C9
+
R13
VOUT (3.3V/6A) GND_VOUT
PGND
SW
SW
SW
SW
PGND
SW
SW
SW
SW
D1
C14
R20
R20
C14
31 C15 C11 C16 32 33 34 35 R15 36 37
VIN VIN VIN VIN VIN VIN VIN_S BOOT
PGND PGND PGND
20 19 18
Q1 R11
R12 IPULSE C7 GND_VDD
GND_VIN
BD95500MUV
PGND 17 PGND PGND VDD Is+ Is16 15 14 13 12 11 R19 SS R18 R7 C5 R10 R19 C6
VQFN040V6060
VDD
EN
C12 C13
38 39 40
PGOOD
EN MOD E
VREG
VCC
GND
ILIM
CE
FS
7
SW2
10
4
3
5
6
8
1
2
9
VDD
MODE
SS
REF
VOUT
NC
R2
C1
C3
R5
VDD(5V)
R3
1 3 6
5
C2
VREG R6 R8 R9
C4
REF
ILIM
R4
PGOOD
Evaluation Board Parts List Value Company Part No U1 D1 L1 Q1 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 1k 1k 100k 4.3uH 0 0 100k 150k 68k 100k 150k 100k 10 10 ROHM ROHM Sumida ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM
Part name BD95500MUV RB051L-40 CDEP105NP-4R3MC-88 MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series MCR03 Series
Part No R17 R18 R19 R20 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16
Value 100k 1k 10k 12k 0.1uF 100pF 0.47uF 1000pF 1000pF 10uF 220uF 10uF 0.1uF 10uF 0.1uF 0.1uF 100pF 10uF 0.1uF
Company ROHM ROHM ROHM ROHM MURATA MURATA MURATA MURATA MURATA MURATA MURATA SANYO or something MURATA MURATA KYOSERA or something MURATA MURATA MURATA KYOSERA or something MURATA
Part name MCR03 Series MCR03 Series MCR03 Series MCR03 Series GRM18 Series GRM18 Series GRM18 Series GRM18 Series GRM18 Series GRM21 Series GRM18 Series functional high polymer GRM21 Series GRM18 Series CM316B106M25A GRM18 Series GRM18 Series GRM18 Series CM316B106M25A GRM18 Series
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17/20
2010.05 - Rev.C
BD95500MUV
Technical Note
Operation Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. (3) Power supply lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. (4) GND voltage The potential of GND pin must be minimum potential in all operating conditions. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. (6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. (7) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (9) Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD ON Temp. [] BD95500MUV 175 (typ.) Hysteresis Temp. [] 15 (typ.)
(10) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC.
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18/20
2010.05 - Rev.C
BD95500MUV
Technical Note
(11) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Resistor Pin A Pin A
P+ N P P+ N N P+ N P P+ N E
Transistor (NPN) Pin B
C B E B C
Pin B
N
P substrate Parasitic element
GND
Parasitic element Parasitic element
P substrate
GND GND
Parasitic element Other adjacent elements
GND
Example of IC structure (12) Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. Power Dissipation VQFN040V6060
5.0 4.66W 4.5 4.0 3.5 Power Dissipation: Pd [W] 3.0 2.5 2.0 1.5 1.0 0.5 0 1.00W 0.54W
3.77W
0
25
50
75
100
125
150
Ambient Temperature :Ta []
IC unit time j-a=231.5/W 2 1 layer (Substrate surface copper foil area : 0mm ) j-a=125.0/W 4nd layer (Substrate surface and bottom copper foil area : 20.2mm2 2 and 3rd copper foil area : 5505mm2) j-a=33.2/W 4 layer (all layers copper foil area : 5505mm2) j-a=26.8/W
www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved.
19/20
2010.05 - Rev.C
BD95500MUV
Ordering part number
Technical Note
B
D
9
Part No.
5
5
0
0
M
U
V
-
E
2
Part No.
Package MUV : VQFN040V6060
Packaging and forming specification E2: Embossed tape and reel
VQFN040V6060
6.00.1
6.00.1

Tape Quantity Direction of feed Embossed carrier tape 2000pcs E2
The direction is the 1pin of product is at the upper left when you hold
1PIN MARK
1.0MAX
S
+0.03 0.02 -0.02 (0.22)
( reel on the left hand and you pull out the tape on the right hand
)
0.08 S C0.2
1
3.70.1
10
0.40.1
40
11
31
20 30 21
0.75
0.5
+0.05 0.25 -0.04
3.70.1
1pin
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
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20/20
2010.05 - Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
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