 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Parts LG-150SRF/9UG-CT DATA SHEET DOC. NO : REV. DATE : : QW0905-LG-150SRF/9UG-CT A 03 - Aug - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SRF/9UG-CT Page 1/11 Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with infrared and vapor phase reflow solder process. Descriptions: 1. The LG-150SRF/9UG SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: COLOR PART NO MATERIAL AlGaInP AlGaInP Emitted Red Green Water Clear Lens LG-150SRF/9UG-CT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SRF/9UG-CT Page 2/11 Package Dimensions Cathode Mark 2 1 1.1 0.5 Resin 0.6 3.2 DIE2 DIE1 2.0 Soldering Terminal 0.6 4 1.6 2 1 3 0.4 PCB 0.6 0.6 9UG 4 3 SRF Note : 1.All dimension are in millimeter tolerance is O 0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 0.7 0.4 0.7 0.8 1.8 0.8 Note : The tolerances unless mentioned is O 0.1mm,AngleO 0.5. Unit=mm. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SRF/9UG-CT Page 3/11 Absolute Maximum Ratings at Ta=25 J Ratings Parameter Power Dissipation Peak Forward Current Duty 1/10@10KHz Forward Current Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature Symbol SRF PD IFP IF Ir ESD Topr Tstg Tsol 72 90 30 10 2000 -40 ~ +85 -40 ~ +90 Max 260J for 5 sec Max 9UG 78 60 30 10 mW mA mA UNIT g A V J J Typical Electrical & Optical Characteristics (Ta=25 J ) Items Luminous Intensity Symbol SRF Min. 20 20 Typ. 40 40 642 575 630 574 20 20 ------140 140 Max. UNIT ---mcd ---------------------2.4 V nm nm nm CONDITION IF=20mA Iv 9UG SRF ---- Peak Wavelength f P 9UG ---SRF ---- IF=20mA Dominant Wavelength fD 9UG ---SRF ---9UG ---SRF 1.5 IF=20mA Spectral Line Half-Width f IF=20mA Forward Voltage VF 9UG 1.7 IF=20mA 2.6 ------deg IF=20mA 2c 1/2 Viewing Angle SRF ---9UG ---- Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SRF/9UG-CT Page 4/11 Typical Electro-Optical Characteristics Curve SRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.0 Forward Current(mA) 100 10 Relative Intensity Normalize @20mA 1.0 2.0 3.0 4.0 5.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000 1.0 0.1 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25J 100 Forward Voltage@20mA Normalize @25J 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 Ambient Temperature(J ) Ambient Temperature(J ) Fig.5 Relative Intensity vs. Wavelength 1.0 Fig.6 Directive Radiation Relative Intensity@20mA 0.5 0.0 550 600 650 700 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SRF/9UG-CT Page 5/11 Typical Electro-Optical Characteristics Curve 9UG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.0 Forward Current(mA) Relative Intensity Normalize @20mA 2.0 3.0 4.0 5.0 100 2.5 2.0 1.5 1.0 0.5 0 10 1.0 0.1 1.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Relative Intensity @20mA Normalize @25J Forward Voltage@20mA Normaliz @25J 1.2 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 -20 0 20 40 60 80 100 Ambient Temperature(J ) Ambient Temperature(J ) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity @20mA 1.0 0.5 0 500 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SRF/9UG-CT Page 6/11 Carrier Tape Dimensions 4.00.2 2.0 1.5 0.23 1.75 3.50.2 5.3 Polarity 8.00.3 3.38 4.00.2 1.76 1.36 Note : The tolerances unless mentioned is O 0.1mm,Angle O 0.5. Unit=mm. E Packing Specifications Label Aluminum Moist-Proof bag Label Part No. LG-150SRF/9UG-CT Description 8.0mm tape,7"reel Quantity/Reel 3000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SRF/9UG-CT Page 7/11 Label Explanation uOqlu*~N/|-1/2 LIGITEK LED LIGITEK ELECTRONICS CO., LTD. Pb BIN Q : Red Chip Luminous Intensity BIN N : Green Chip Luminous Intensity HUE 29 : Red Chip Dominant Wavelength PART NO. : LG-150SRF/9UG-CT LOT NO. : GSI-670107 Q'TY(PCS) : 3000 PCS BIN/HUE : Q/29-N/9 VF:1.6 - 2.4 VF:1.8 - 2.6 HUE 9 : Green Chip Dominant Wavelength 1.8 - 2.6 : Forward Voltage Reel Dimensions 2.0O 0.5 0.8 0.6 0.4 0.2 178O 1.5 6.0O 1.0 0.4 r 13.5O 1.0 0.2 0.6 0.8 9.0O 1.0 12.0O 1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SRF/9UG-CT Page 8/11 Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SRF/9UG-CT Recommended Soldering Conditions 1. Hand Solder Basic spec is O Page 9/11 280J 3 sec one time only. 2. Wave Solder Soldering heat Max. 260J 245O 5J within 5 sec Preheat 120 ~ 150J 120 ~ 180 sec 3-1. LEAD Reflow Solder Temp. (J ) 240 Rising +5J /sec Cooling -5J /sec 150 120 Preheat 60 ~ 120 sec 5sec Time 3-2 PB-Free Reflow Solder 1~5 C/sec 260 C MaX. 10sec.Max Preheat 180~200 C 1~5 C/sec Above 220 C 60 sec.Max. 120 sec.Max. Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SRF/9UG-CT Reliability Test: Page 11/11 Classification Test Item Test Condition 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reference Standard MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test Endurance Test Low Temperature Storage Test 1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=1000hrs O 2hrs MIL-STD-202F:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 JO 5J &-40JO 5J (10min) (10min) 2.total 10 cycles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 Solderability Test 1.T.Sol=235 JO 5J 2.Immersion time 2 O 0.5sec 3.Coverage U 95% of the dipped surface Environmental Test Temperature Cycling 1.105J ~ 25 J ~ - 55J ~ 25J 30mins 5mins 30mins 5mins 2.10 Cyeles IR Reflow 1.T=260 C Max. 10sec.Max. 2. 6 Min MIL-STD-750D:2031.2 J-STD-020 |
Price & Availability of LG-150SRF-9UG-CT
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |