View FAN5350UCX_4638082.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
June 2008
FAN5350 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Features
3MHz Fixed-Frequency Operation 16A Typical Quiescent Current 600mA Output Current Capability 2.7V to 5.5V Input Voltage Range 1.82V Fixed Output Voltage Synchronous Operation Power-Save Mode Soft-Start Capability Input Under-Voltage Lockout (UVLO) Thermal Shutdown and Overload Protection 6-Lead 3 x 3mm MLP 5-Bump 1 x 1.37mm WLCSP
Description
The FAN5350 is a step-down switching voltage regulator that delivers a fixed 1.82V from an input voltage supply of 2.7V to 5.5V. Using a proprietary architecture with synchronous rectification, the FAN5350 is capable of delivering 600mA at over 90% efficiency, while maintaining a very high efficiency of over 80% at load currents as low as 1mA. The regulator operates at a nominal fixed frequency of 3MHz at full load, which reduces the value of the external components to 1H for the output inductor and 4.7F for the output capacitor. At moderate and light loads, pulse frequency modulation is used to operate the device in power-save mode with a typical quiescent current of 16A. Even with such a low quiescent current, the part exhibits excellent transient response during large load swings. At higher loads, the system automatically switches to fixed-frequency control, operating at 3MHz. In shutdown mode, the supply current drops below 1A, reducing power consumption. The FAN5350 is available in a 6-lead Molded Leadless Package (MLP) and a 5-bump Wafer Level Chip Scale Package (WLCSP).
Applications
Cell Phones, Smart-Phones Pocket PCs WLAN DC-DC Converter Modules PDA, DSC, PMP, and MP3 Players Portable Hard Disk Drives
Ordering Information
Part Number
FAN5350UCX FAN5350MPX
Operating Temperature Range
-40C to 85C -40C to 85C
Package
WLCSP-5 1x1.37mm MLP-6 3 x 3mm
Eco Status
Green Green
Packing Method
Tape and Reel Tape and Reel
For Fairchild's definition of "green" Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Please refer to tape and reel specifications on www.fairchildsemi.com; http://www.fairchildsemi.com/packaging.
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Typical Applications
4.7F VIN VIN
A1 B2
CIN
A3
PGND
GND SW L1 1H VOUT 4.7F C OUT
1 2 3
6
VIN SW EN
AGND VOUT
4.7F
P1 (GND)
5 4
VIN 4.7F C IN
EN C1
C3
FB
FB
L1 1
COUT
Figure 1. WLCSP (top view)
Figure 2. MLP (top view)
Block Diagram
VIN
Current Limit
EN
Bias
1.8V Reference
+
Modulator Logic Driver SW
FB
-
3MHz OSC
Zero Crossing
GND
Figure 3. Block Diagram
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 2
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Pin Configurations
VIN A1
B2 A3 GND
GND A3 SW FB C3
B2
A1 VIN
SW
EN C1
C3 FB
C1 EN
Figure 4. WLCSP - Bumps Facing Down
Figure 5. WLCSP - Bumps Facing Up
PGND 1 AGND 2 FB 3
P1 (GND)
6 5 4
VIN SW EN
Figure 6. 3x3mm MLP - Leads Facing Down
Pin Definitions
WLCSP
Pin #
A1 A3 C1 C3 B2
Name
VIN GND EN FB SW
Description
Power Supply Input. Ground Pin. Signal and power ground for the part. Enable Pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled when >1.2V. Do not leave this pin floating. Feedback Analog Input. Connect directly to the output capacitor. Switching Node. Connection to the internal PFET switch and NFET synchronous rectifier.
MLP
Pin #
1 2 3 4 5 6
Name
PGND AGND FB EN SW VIN
Description
Power Ground Pin. Power stage ground. Connect PGND and AGND together via the board ground plane. Analog Ground Pin. Signal ground for the part. Feedback Analog Input. Connect directly to the output capacitor. Enable Pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled when >1.2V. Do not leave this pin floating. Switching Node. Connection to the internal PFET switch and NFET synchronous rectifier. Power Supply Input.
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 3
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Symbol
VIN TJ TSTG TL ESD
Parameter
Input Voltage with respect to GND Voltage on any other pin with respect to GND Junction Temperature Storage Temperature Lead Temperature (Soldering 10 Seconds) Human Body Model Electrostatic Discharge Protection Level Charged Device Model Machine Model
Min.
-0.3 -0.3 -40 -65 4.5 1.5 200
Max.
6.0 VIN +150 +150 +260
Unit
V V C C C kV kV V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VCC IOUT L CIN COUT TA TJ Output Current Inductor Input Capacitor
Parameter
Supply Voltage Range
Min.
2.7 0 0.7 3.3 3.3 -40 -40
Typ.
Max.
5.5 600
Unit
V mA H F F C C
1.0 4.7 4.7
3.0 12.0 12.0 +85 +125
Output Capacitor Operating Ambient Temperature Operating Junction Temperature
Thermal Properties
Symbol
JA_WLCSP JA_MLP
Parameter
Junction-to-Ambient Thermal Resistance Junction-to-Ambient Thermal Resistance
(1) (1)
Min.
Typ.
180 49
Max.
Units
C/W C/W
Note: 1. Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 1s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperate TA.
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 4
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Electrical Characteristics
Minimum and maximum values are at VIN = 2.7V to 5.5V, TA = -40C to +85C, CIN = COUT = 4.7F, L = 1H, unless otherwise noted. Typical values are at TA = 25C, VIN =3.6V.
Symbol
Power Supplies IQ I(SD) VUVLO V(ENH) V(ENL) I(EN) Oscillator f0SC
Parameter
Conditions
Device is not switching, EN=VIN Device is switching, EN=VIN VIN = 3.6V, EN = GND Rising Edge Falling Edge
Min.
Typ.
16 18 0.05
Max.
Units
A
Quiescent Current Shutdown Supply Current Under-Voltage Lockout Threshold Enable HIGH-Level Input Voltage Enable LOW-Level Input Voltage Enable Input Leakage Current Oscillator Frequency
25 1.00 2.1 1.95 0.4
A A V V V A MHz V V s m m
1.8 1.75 1.2
EN = VIN or GND 2.5 ILOAD = 0 to 600mA CCM EN = 0 -> 1 VIN = VGS = 3.6V VIN = VGS = 3.6V Open-Loop CCM Only
(2)
0.01 3.0 1.820 1.820
1.00 3.5 1.865 1.856 300
Regulation VO tSS Output Voltage Accuracy Soft-Start PMOS On Resistance NMOS On Resistance PMOS Peak Current Limit Thermal Shutdown Thermal Shutdown Hysteresis 1.775 1.784
Output Driver RDS(on) ILIM TTSD THYS 180 170 650 800 150 20 900
mA C C
Note: 2. The Electrical Characteristics table reflects open-loop data. Refer to Operation Description and Typical Characteristic for closed-loop data.
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 5
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Operation Description
The FAN5350 is a step-down switching voltage regulator that delivers a fixed 1.82V from an input voltage supply of 2.7V to 5.5V. Using a proprietary architecture with synchronous rectification, the FAN5350 is capable of delivering 600mA at over 90% efficiency, while maintaining a light load efficiency of over 80% at load currents as low as 1mA. The regulator operates at a nominal frequency of 3MHz at full load, which reduces the value of the external components to 1H for the output inductor and 4.7F for the output capacitor.
Enable and Soft Start
Maintaining the EN pin LOW keeps the FAN5350 in non-switching mode in which all circuits are off and the part draws ~50nA of current. Increasing EN above its threshold voltage activates the part and starts the softstart cycle. During soft start, the current limit is increased in discrete steps so that the inductor current is increased in a controlled manner. This minimizes any large surge currents on the input and prevents any overshoot of the output voltage.
Control Scheme
The FAN5350 uses a proprietary non-linear, fixedfrequency PWM modulator to deliver a fast load transient response, while maintaining a constant switching frequency over a wide range of operating conditions. The regulator performance is independent of the output capacitor ESR, allowing for the use of ceramic output capacitors. Although this type of operation normally results in a switching frequency that varies with input voltage and load current, an internal frequency loop holds the switching frequency constant over a large range of input voltages and load currents. For very light loads, the FAN5350 operates in discontinuous current (DCM) single-pulse PFM mode, which produces low output ripple compared with other PFM architectures. Transition between PWM and PFM is seamless, with a glitch of less than 14mV at VOUT during the transition between DCM and CCM modes. Combined with exceptional transient response characteristics, the very low quiescent current of the controller (<16A) maintains high efficiency, even at very light loads, while preserving fast transient response for applications requiring very tight output regulation.
Under-Voltage Lockout
When EN is high, the under-voltage lock-out keeps the part from operating until the input supply voltage rises high enough to properly operate. This ensures no misbehavior of the regulator during start-up or shutdown.
Current Limiting
A heavy load or short circuit on the output causes the current in the inductor to increase until a maximum current threshold is reached in the high-side switch. Upon reaching this point, the high-side switch turns off, preventing high currents from causing damage. The peak current limit shown in Figure 16, ILIM(PK) is slightly higher than the open-loop tested current limit, ILIM(OL), in the Electrical Characteristics table. This is primarily due to the effect of propagation delays of the IC current limit comparator.
Thermal Shutdown
When the die temperature increases, due to a high load condition and/or a high ambient temperature, the output switching is disabled until the temperature on the die has fallen sufficiently. The junction temperature at which the thermal shutdown activates is nominally 150C with a 20C hysteresis.
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 6
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Applications Information
Selecting the Inductor
The output inductor must meet both the required inductance and the energy handling capability of the application. The inductor value affects the average current limit, the PWM-to-PFM transition point, the output voltage ripple, and the efficiency. The ripple current (I) of the regulator is: I VOUT VIN - VOUT * L *F VIN SW
(1)
The increased RMS current produces higher losses through the RDS(ON) of the IC MOSFETs as well as the inductor ESR. Increasing the inductor value produces lower RMS currents, but degrades transient response. For a given physical inductor size, increased inductance usually results in an inductor with lower saturation current. Table 1 shows the effects of inductance higher or lower than the recommended 1H on regulator performance.
Output Capacitor
Table 2 suggests 0603 capacitors. 0805 capacitors may further improve performance in that the effective capacitance is higher and ESL is lower than 0603. This improves the transient response and output ripple. Increasing COUT has no effect on loop stability and can therefore be increased to reduce output voltage ripple or to improve transient response. Output voltage ripple, VOUT, is: 1 VOUT = I * + ESR 8*C OUT * FSW (5)
The maximum average load current, IMAX(LOAD) is related to the peak current limit, ILIM(PK) (see figure 17) by the ripple current: I (2) 2 The transition between PFM and PWM operation is determined by the point at which the inductor valley current crosses zero. The regulator DC current when the inductor current crosses zero, IDCM, is: IMAX(LOAD ) = ILIM(PK ) -
IDCM = I 2
(3)
Input Capacitor
The 4.7F ceramic input capacitor should be placed as close as possible between the VIN pin and GND to minimize the parasitic inductance. If a long wire is used to bring power to the IC, additional "bulk" capacitance (electrolytic or tantalum) should be placed between CIN and the power source lead to reduce ringing that can occur between the inductance of the power source leads and CIN.
The FAN5350 is optimized for operation with L=1H, but is stable with inductances ranging from 700nH to 3.0H. The inductor should be rated to maintain at least 80% of its value at ILIM(PK). Efficiency is affected by the inductor DCR and inductance value. Decreasing the inductor value for a given physical size typically decreases the DCR; but since I increases, the RMS current increases, as do the core and skin effect losses.
IRMS = IOUT(DC) 2 + I2 12
(4)
Table 1. Effects of changes in inductor value (from 1H recommended value) on regulator performance
Inductor Value
Increase Decrease
IMAX(LOAD) EQ. 2
Increase Decrease
ILIM(PK)
Decrease Increase
VOUT EQ. 5
Decrease Increase
Transient Response
Degraded Improved
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 7
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
PCB Layout Guidelines
For the bill of materials of the FAN5350 evaluation board, see Table 1. There are only three external components: the inductor and the input and output capacitors. For any buck switcher IC, including the FAN5350, it is always important to place a low-ESR input capacitor very close to the IC, as shown in Figure 7. That ensures good input decoupling, which helps reduce the noise appearing at the output terminals and ensures that the control sections of the IC do not behave erratically due to excessive noise. This reduces switching cycle jitter and ensures good overall performance. It is not considered critical to place either the inductor or the output capacitor very close to the IC. There is some flexibility in moving these two components further away from the IC.
Table 2. FAN5350 Evaluation Board Bill of Materials (optional parts are installed by request only)
Description
1.2H, 1.8A, 55m Inductor 1.3H, 1.2A, 90m 1.5H, 1.3A Capacitor 4.7F, 10%, 6.3V, X5R, 0603 IC DC/DC Regulator in CSP, 5 bumps Load Resistor (Optional)
Qty.
Ref.
Vendor
TOKO
Part Number
1117AS-1R2M MIPSA2520D1R0 CBC3225T15MR GRM39 X5R 475K 6.3 FAN5350UCX
1
L1
FDK Taiyo Yuden
2 1 1
CIN,COUT U1 RLOAD
MURATA Fairchild Any
Feedback Loop
One key advantage of the non-linear architecture is that there is no traditional feedback loop. The loop response to changes in VOUT is essentially instantaneous, which explains its extraordinary transient response. The absence of a traditional, high-gain compensated linear loop means that the FAN5350 is inherently stable over a wide range of LOUT and COUT. LOUT can be reduced further for a given application, provided it is confirmed that the calculated peak current for the required maximum load current is less than the minimum of the closed-loop current limit. The advantage is that this generally leads to improved transient response, since a small inductance allows for a much faster increase in current to cope with any sudden load demand. The inductor can be increased to 2.2H; but, for the same reason, the transient response gets slightly degraded. In that case, increasing the output capacitor to 10F helps significantly. Figure 7. The FAN5350 Evaluation Board PCB (CSP)
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 8
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Typical Performance Characteristics
VIN = 3.6V, TA = 25C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified.
24
1850
DC Output Voltage (mV)
Quiescent Current (A)
22 20 18 16 14 12 10 2.5 3.0 3.5 4.0 4.5
+85C +25C
1840 1830
DCM spreading CCM
1820 1810 1800 1790
-40C
5.0 5.5
0
100
200
300
400
500
600
Battery Voltage (V)
Load Current (m A)
Figure 8. Quiescent Current vs. Battery Voltage
Figure 9. Load Regulation, Increasing Load
600 500
600 500 85C CCM border
Load Current (mA)
300 200 100
Continuous Conduction Mode Hysteresis
Switching mode changes at these borders
Load Current (mA)
400
400 300 200 100
-30C CCM border 85C DCM border
Discontinuous Conduction Mode
0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
-30C DCM border 0 2.5 3.0 3.5
4.0
4.5
5.0
5.5
Battery Voltage (V)
Battery Voltage (V)
Figure 10. Switch Mode Operating Areas
Figure 11. Switch Mode Over Temperature
2.00 1.75
1835
Output Voltage (V)
1.50 1.25 1.00 0.75 0.50 0.25 0
VIN=5.5V
Output Voltage (mV)
VIN=2.7V
1830 1825 1820 1815 1810 1805 1800
VIN=2.7V VIN=3.6V VIN=5.5V
VIN=3.6V
ILOAD=300mA
0
0.1 0.2
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
-40
-20
0
20
40
60
80
Load Current (A)
Ambient Temperature (C)
Figure 12. DC Current Voltage Output Characteristics
Figure 13. Output Voltage vs. Temperature
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 9
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Typical Performance Characteristics (Continued)
VIN = 3.6V, TA = 25C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified.
100 95
V IN=2.5V
100
Power Efficiency (%)
85 80 75 70 65 60 0.001 0.010 0.100 1.000
V IN=3.3V V IN=3.6V V IN=4.2V V IN=5V V IN=5.5V
Power Efficiency (%)
90
V IN=2.7V
95 90 85 80 75 0.001 0.010
-40C +85C +25C
0.100
1.000
Load Current (A)
Load Current (A)
Figure 14. Power Efficiency vs. Load Current
1.3
Figure 15. Power Efficiency Over Temperature Range
250
Current Limit (A)
1.1 1.0 0.9 0.8 0.7 -40 -20 0 20 40 60 80
Shutdown Current (nA)
1.2
VIN=5.5V
200 150 100 50 0 2.5 3.0
+85C
VIN=3.6V
+25C -40C Battery Voltage (V)
3.5 4.0 4.5 5.0 5.5
VIN=2.7V Ambient Temperature (C)
Figure 16. PMOS Current Limit in Closed Loop
Figure 17. Shutdown Supply Current vs. Battery Voltage
3.3 3.2
85dB
250mA Load
Frequency (MHz)
-40C +25C +85C
3.1 3.0 2.9 2.8 2.7
5dB /div
35dB 1Hz 10Hz 100Hz 1kHz 10kHz
2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
Battery Voltage (V)
Figure 18. Power Supply Rejection Ratio in CCM
Figure 19. Switching Frequency in CCM
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 10
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Typical Performance Characteristics (Continued)
VIN = 3.6V, TA = 25C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified.
IL, 0.5A / div. IL, 0.5A / div.
VOUT, 0.5V / div.
VOUT, 0.5V / div.
EN, 5.0V / div. H scale: 20s / div. H scale: 10s / div.
EN, 5.0V / div.
Figure 20. Start-Up, Full Load
Figure 21. Start-Up, No Load
VOUT(ac), 20mV / div.
VOUT(ac), 20mV / div.
ILOAD, 0.5A / div. H scale: 1s / div. H scale: 1s / div.
ILOAD, 0.5A / div.
Figure 22. Fast Load Transient, No Load to Full Load
Figure 23. Fast Load Transient, Full Load to No Load
VSW, 5V / div. VOUT(ac), 20mV / div.
VSW, 5V / div. VOUT(ac), 20mV / div.
ILOAD = 600mA ILOAD = 300mA H scale: 20s / div. H scale: 20s / div.
ILOAD = 50mA ILOAD = 1mA
Figure 24. Fast Load Transient in CCM
Figure 25. Fast Load Transient in DCM
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 11
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Typical Performance Characteristics (Continued)
VIN = 3.6V, TA = 25C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified.
VSW, 5V / div. VOUT, 20mV / div. VSW, 2V / div.
ILOAD = 300mA ILOAD = 20mA H scale: 20s / div. H scale: 2ms / div.
VOUT, 20mV / div. ILOAD, 0.5A / div.
Figure 26. Fast Load Transient DCM - CCM - DCM
Figure 27. Slow Load Transient DCM - CCM - DCM
VOUT(ac), 20mV / div.
VOUT(ac), 20mV / div.
VIN = 3.6V VIN = 3.0V H scale: 10s / div. VIN = 3.0V H scale: 10s / div.
VIN = 3.6V
Figure 28. Line Transient, 600mV, 50mA Load
Figure 29. Line Transient, 600mV, 50mA Load
VOUT(ac), 10mV / div.
ILOAD = 350mA
VIN = 3.6V VIN = 3.0V
ILOAD = 100mA H scale: 5s / div.
Figure 30. Combined Line (600mV) and Load (100mA to 350mA) Transient Response
VSW, 2V / div.
VSW, 2V / div.
IL = 0.2A / div. VOUT(ac), 20mV / div. H scale: 1s / div. H scale: 200ns / div.
IL = 0.1A / div. VOUT(ac), 20mV / div.
Figure 31. Typical Waveforms in DCM, 50mA Load
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3 12
Figure 32. Typical Waveforms in CCM, 150mA Load
www.fairchildsemi.com
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Physical Dimensions
Figure 33. 6-Lead Molded Leadless Package (MLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 13
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
Physical Dimensions (Continued)
BALL A1 INDEX AREA 0.03 C
F
E
A B
(O0.25) Cu PAD A1
F
(0.50) (0.866)
2X
D
(0.433)
0.03 C
(O0.35) SOLDER MASK OPENING
TOP VIEW
0.05 C
2X
0.06 C 0.625 MAX
RECOMMENDED LAND PATTERN (NSMD)
0.3320.018 0.2500.025
E
D
C
SEATING PLANE
SIDE VIEWS
(X)+/-.018
0.50 0.50
F
0.005
CAB
5 X O0.315 +/- .025
C
0.433
B A 123
F
(Y)+/-.018
BOTTOM VIEW
A. NO JEDEC REGISTRATION APPLIES B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 D DATUM C, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E PACKAGE TYPICAL HEIGHT IS 582 MICRONS +/- 43 MICRONS (539-625 MICRONS) F FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. BALL COMPOSITION: Sn95.5Ag3.9Cu0.6 SAC405 ALLOY H. DRAWING FILENAME: MKT-UC005AArev5
Product Specific Dimensions
Product
FAN5350UCX
D
1.370 +/- 0.030
E
1.000 +/- 0.030
X
0.270
Y
0.272
Figure 34. 5-Bump Wafer-Level Chip-Scale Package (WLCSP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 14
FAN5350 -- 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
(c) 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.3
www.fairchildsemi.com 15

▲Up To Search▲

Price & Availability of FAN5350UCX

	To Download FAN5350UCX Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .