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IP4352CX24
9-channel SD memory card interface filter with ESD protection to IEC 61000-4-2 level 4
Rev. 02 -- 3 May 2010 Product data sheet
1. Product profile
1.1 General description
The IP4352CX24 is a diode array designed to provide protection to downstream components against ElectroStatic Discharge (ESD) voltages as high as 15 kV. The IP4352CX24 integrates 9 pairs of rail-to-rail diodes, 15 resistors and 12 Zener diodes in a single Wafer-Level Chip-Scale Package (WLCSP) using monolithic silicon semiconductor technology. These features make the IP4352CX24 ideal for applications requiring miniaturized components, such as mobile phone handsets, cordless telephones and personal digital devices.
1.2 Features and benefits
Pb-free, RoHS compliant, free of halogen and antimony (Dark Green compliant) All SD memory card channels have integrated ESD protection EMI and RF filters ESD protection up to 15 kV at output terminals on 9 channels Integrated EMI and RF filters with pull-up resistors on 5 channels Integrated EMI and RF filters on 4 channels SD card power supply protection WLCSP with 0.4 mm pitch Write protection with integrated card detect biasing resistor Supports electrical card detection Also available with different filter behavior and the same footprint as IP4350CX24
1.3 Applications
SD memory card interfaces in cellular and PCS mobile handsets DECT handsets Digital still and video cameras Media players Card readers
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
2. Pinning information
2.1 Pinning
bump A1 index area 1 A B C D E 2 3 4 5
001aaj785
transparent top view, solder balls facing down
Fig 1. Table 1. Pin A1 A2 A3 A4 A5 B1 B2 B3 B4 B5 C1 C2 C3 C4 C5 D1 D2 D3 D4 D5 E1
Pin configuration IP4352CX24 Pinning Description DATA2: data line 2 DATA3: data line 3 GND_H: ground 1 SDDATA2: secure digital data 2 SDDATA3: secure digital data 3 CD: card detect CMD: command not connected SDCD: secure digital card detect SDCMD: secure digital command DAT3_PD: data 3 pull-down WP: write protect DAT3_PU: data 3 pull-up SDWP: secure digital write protect VSD: supply voltage WP+CD: write protect and card detect CLK: clock GND_C: ground 2 SDWP+CD: secure digital write protect and card detect SDCLK: secure digital clock DATA1: data line 1
IP4352CX24_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 3 May 2010
2 of 13
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
Pinning ...continued Description DATA0: data line 0 GND_C: ground 3 SDDATA1: secure digital data 1 SDDATA0: secure digital data 0
Table 1. Pin E2 E3 E4 E5
3. Ordering information
Table 2. Ordering information Package Name IP4352CX24/LF WLCSP24 Description wafer level chip-size package; 24 bumps (5 x 5 - B3) Version IP4352CX24 Type number
4. Functional diagram
VSD DAT3_PU
R11 R12 R13 R14 R15 R1
CLK
R2
SDCLK SDCMD
R3
CMD DATA0
R4
SDDATA0 SDDATA1
R5
DATA1 DATA2
R6
SDDATA2 SDDATA3
R7
DATA3 CD
R8
SDCD SDWP
R9
WP WP+CD
R21
SDWP+CD
DAT3_PD
GND_H
GND_C
001aaj750
Fig 2.
Schematic diagram IP4352CX24
IP4352CX24_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 3 May 2010
3 of 13
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
5. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VI VESD Parameter input voltage electrostatic discharge voltage IEC 61000-4-2 level 4; output pins A4, A5, B4, B5, C4, C5, D4, D5, E4, E5; pins A3, D3 and E3 connected to ground contact discharge air discharge IEC 61000-4-2 level 1; all other pins; pins A3, D3 and E3 connected to ground contact discharge air discharge Pch Ptot Tstg Treflow(peak) Tamb
[1]
[1]
Conditions
Min -0.5
Max +5.0
Unit V
-8 -15
+8 +15
kV kV
-2 -2 -55 -30
+2 +2 25 100 260 +85
kV kV mW mW C C
channel power dissipation total power dissipation storage temperature peak reflow temperature ambient temperature
continuous power; Tamb = 70 C continuous power; Tamb = 70 C 10 s maximum
+150 C
Device is qualified with 1000 pulses of 15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge).
6. Characteristics
Table 4. Channel characteristics Tamb = 25 C; unless otherwise specified. Symbol Parameter Rs(ch) channel series resistance Conditions R1 to R9 20 % R11 to R14 30 % R15 30 % R21 30 % Cch channel capacitance Vbias(DC) = 0 V; f = 1 MHz; pin DAT3_PU = 0 V; pin DAT3_PD = 0 V; pin VSD = 0 V SD card to I/O interface pins DAT3_PD, DAT3_PU and VSD VBR ILR
[1]
[1] [1]
Min 32 35 10.5 329
Typ 40 50 15 470
Max 48 65 19.5 611
Unit k k k
6 -
30 -
20 100
pF pF V nA
breakdown voltage reverse leakage current
Guaranteed by design.
II = 1 mA per channel; VI = 3 V
IP4352CX24_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 3 May 2010
4 of 13
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
Table 5. Frequency response Tamb = 25 C; unless otherwise specified. Symbol Parameter il insertion loss Conditions all channels; Rgen = 50 ; RL = 50 f < 400 MHz 400 MHz < f < 800 MHz 800 MHz < f < 2.5 GHz 2.5 GHz < f < 6 GHz 9 13 28 32 9 dB dB dB dB Min Typ Max Unit
Table 6. Time domain response Measured using source with 0 V to 3 V steps and 20 % to 70 % LOW-to-HIGH limits; Tamb = 25 C; unless otherwise specified. Symbol Parameter tr tf rise time fall time Conditions RL = 20 pF || 100 k RL = 40 pF || 100 k RL = 20 pF || 100 k RL = 40 pF || 100 k
[1] Performed on all high speed lines (channels including R1 to R9, see Figure 2).
Min -
Typ 3.2 4.4 3.3 5.5
Max Unit 3.7 6 4.3 7.5 ns ns ns ns
High speed Rgen = 50 ; tr = tf = 2 ns[1]
7. Application information
7.1 Insertion loss
The insertion loss was measured with a test PCB utilizing laser-drilled micro-via holes which connect the PCB ground plane to the ground pins. The configuration for measuring insertion loss in a 50 system is shown in Figure 3.
IN
50
DUT
OUT
50
TEST BOARD
Vgen 001aai755
Fig 3.
Frequency response measurement configuration
The frequency response curves measured on pins A1 and A4, E1 and E4 and C2 and C4 at frequencies up to 3 GHz are shown in Figure 4.
IP4352CX24_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 3 May 2010
5 of 13
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
0 S21 (dB) -20
001aaj787
(1) (2)
-40
(3)
-60
-80
1
10
102
103 f (MHz)
104
(1) Pin A1 to A4. (2) Pin E1 to E4. (3) Pin C2 to C4.
Fig 4.
Measured insertion loss magnitudes
7.2 Crosstalk
The crosstalk between adjacent channels within the IP4352CX24 for different channel pairs was measured in a 50 NetWork Analyzer (NWA) system. The configuration for measuring crosstalk in a 50 system is shown in Figure 5.
IN_1
50
DUT
OUT_2 OUT_1
50 50
IN_2
50
TEST BOARD
Vgen 001aai756
Fig 5.
Crosstalk measurement configuration
The crosstalk measured for five different pairs of channels is shown in Figure 6. In all cases, all unused connections are terminated with 50 to ground.
IP4352CX24_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 3 May 2010
6 of 13
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
-10 ct (dB) -30
001aaj788
-50
(1) (2) (3)
-70
1
10
102
103 f (MHz)
104
(1) Pins A1 and B4. (2) Pins A1 and E4. (3) Pins A2 and B5.
Fig 6.
Measured crosstalk between different channels
IP4352CX24_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 3 May 2010
7 of 13
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
8. Package outline
WLCSP24: wafer level chip-size package; 24 bumps (5 x 5 - B3)
D
bump A1 index area A2 E A
A1
detail X e1 e b
E e D e1
C
B
A European projection 1 2 3 4 5 X
wlcsp24_5x5-b3_po
Fig 7. Table 7. Symbol A A1 A2 b D E e e1
Package outline IP4352CX24 (WLCSP24) Dimensions for Figure 7 Min 0.56 0.18 0.38 0.21 1.96 1.97 0.35 Typ 0.61 0.20 0.41 0.26 2.01 2.02 0.40 1.6 Max 0.66 0.22 0.44 0.31 2.06 2.07 0.45 Unit mm mm mm mm mm mm mm mm
IP4352CX24_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 3 May 2010
8 of 13
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
9. Design and assembly recommendations
9.1 PCB design guidelines
For optimum performance it is recommended to use a Non-Solder Mask PCB Design (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance. For this case, refer to Table 8 for the recommended PCB design parameters.
Table 8. Parameter PCB pad diameter Micro-via diameter Solder mask aperture diameter Copper thickness Copper finish PCB material Recommended PCB design parameters Value or specification 200 m 100 m (0.004 inch) 370 m 20 m to 40 m AuNi FR4
9.2 PCB assembly guidelines for Pb-free soldering
Table 9. Parameter Solder screen aperture diameter Solder screen thickness Solder paste: Pb-free Solder to flux ratio Solder reflow profile Assembly recommendations Value or specification 330 m 100 m (0.004 inch) SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %) 50 : 50 see Figure 8
T (C) Treflow(peak) 250 230 217 cooling rate
pre-heat
t1
t2 t3 t4 t5
t (s)
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 8.
IP4352CX24_2
Pb-free solder reflow profile
All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 3 May 2010
9 of 13
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
Characteristics Parameter time 1 time 2 time 3 time 4 time 5 rate of change of temperature cooling rate pre-heat Conditions soak time time during T 250 C time during T 230 C time during T > 217 C Min 230 60 10 30 2.5 Typ Max 260 180 30 50 150 540 -6 4.0 Unit C s s s s s C/s C/s
Table 10. Symbol t1 t2 t3 t4 t5 dT/dt
Treflow(peak) peak reflow temperature
10. Abbreviations
Table 11. Acronym DECT DUT EMI ESD FR4 NSMD PCB PCS RoHS WLCSP Abbreviations Description Digital Enhanced Cordless Telecommunications Device Under Test ElectroMagnetic Interference ElectroStatic Discharge Flame Retard 4 Non-Solder Mask PCB Design Printed-Circuit Board Personal Communication System Restriction of Hazardous Substances Wafer-Level Chip-Scale Package
11. Revision history
Table 12. Revision history Release date 20100503 Data sheet status Product data sheet Change notice Supersedes IP4352CX24_1 Document ID IP4352CX24_2 Modifications:
* * * * *
Features, Applications and Legal information updated. Figure 2: Zener diode symbol added. Figure 7: Package outline changed. Table 6: updated. Section 9: Soldering information changed. Product data sheet -
IP4352CX24_1
20090813
IP4352CX24_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 3 May 2010
10 of 13
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
12. Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
(c) NXP B.V. 2010. All rights reserved.
12.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
IP4352CX24_2
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Product data sheet
Rev. 02 -- 3 May 2010
11 of 13
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications.
Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4352CX24_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 3 May 2010
12 of 13
NXP Semiconductors
IP4352CX24
9-channel SD memory card interface filter with ESD protection
14. Contents
1 1.1 1.2 1.3 2 2.1 3 4 5 6 7 7.1 7.2 8 9 9.1 9.2 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Design and assembly recommendations . . . . 9 PCB design guidelines . . . . . . . . . . . . . . . . . . . 9 PCB assembly guidelines for Pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 May 2010 Document identifier: IP4352CX24_2

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