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Freescale Semiconductor Data Sheet
MC33696 Rev. 12, 02/2010
MC33696
PLL Tuned UHF Transceiver for Data Transfer Applications
1
Overview
GNDSUBD
The MC33696 is a highly integrated transceiver designed for low-voltage applications. It includes a programmable PLL for multi-channel applications, an RSSI circuit, a strobe oscillator that periodically wakes up the receiver while a data manager checks the content of incoming messages. A configuration switching feature allows automatic changing of the configuration between two programmable settings without the need of an MCU.
LQFP32
QFN32
STROBE
SWITCH
VCC2IN
2
Features
RSSIOUT VCC2RF RFIN GNDLNA VCC2VCO GNDPA1 RFOUT GNDPA2 1 2 3 4 5 6 7 8
32
31
30
29
28
27
26
General: * 304 MHz, 315 MHz, 426 MHz, 434 MHz, 868 MHz, and 915 MHz ISM bands * Choice of temperature ranges: -- -40C to +85C -- -20C to +85C * OOK and FSK transmission and reception * * * * 20 kbps maximum data rate using Manchester coding 2.1 V to 3.6 V or 5 V supply voltage Programmable via SPI 6 kHz PLL frequency step
25 24 23 22 21 20 19 18 17
GNDIO
VCCIN
GND
NC
SEB SCLK MOSI MISO CONFB DATACLK RSSIC GNDDIG
10
11
12
13
14
VCC2OUT
VCCDIG2
VCCDIG
XTAL0UT
RBGAP
XTALIN
15
9
(c) Freescale Semiconductor, Inc., 2006-2010. All rights reserved.
VCCINOUT
GND
16
Features
* *
*
Frequency hopping capability with PLL toggle time below 30 s Current consumption: -- 13.5 mA in TX mode -- 10.3 mA in RX mode -- Less then 1 mA in RX mode with strobe ratio = 1/10 -- 260 nA standby and 24 A off currents Configuration switching -- allows fast switching of two register banks
Receiver: * -106.5 dBm sensitivity, up to -108 dBm in FSK 2.4 kbps * Digital and analog RSSI (received signal strength indicator) * Automatic wakeup function (strobe oscillator) * * * * Embedded data processor with programmable word recognition Image cancelling mixer 380 kHz IF filter bandwidth Fast wakeup time
Transmitter: * Up to 7.25 dBm output power * Programmable output power * FSK done by PLL programming Ordering information
Temperature Range -40C to +85C -20C to +85C QFN Package MC33696FCE/R2 MC33696FCAE/R2 LQFP Package MC33696FJE/R2 MC33696FJAE/R2
MC33696 Data Sheet, Rev. 12 2 Freescale Semiconductor
Pre Regulator VCCIN
RSSI_8BITS
VCCINOUT
Freescale Semiconductor
Analog Test ANALOG_SIGNALS Logarithmic Amplifier RSSI 4 Bits A/D Strobe Oscillator V&I Reference Voltage Regulator VCC2OUT VCC2IN RBGAP STROBE TEST_CONTROL ACCLNA PMA + I/Q Image Reject 1.5 MHz, BW 400 kHz AGC AGC_CONTROL FM-to-AM Converter DATA_RATE AGC_CONTROL FM_AM WTCH_TESTOUT State Machine IF Amplifier Detector Analog Data Filter and Slicer Rx Data Manager SPI MOSI MISO SCLK SEB RSSIC BAND IF_REF_CLOCK PFD XCO Clock Generator DATACLK DIG_CLOCK XTALOUT XTALIN VCCDIG Fractional Divider FREQUENCY_12BITS MODULATION Tx Data Manager Voltage Regulator VCCDIG2 CONFB GND GND GNDDIG GNDIO GNDSUBD GNDSUBA /2 VCO SLOPE_&_POWER_CONTROL
RSSIOUT_TESTIN
SWITCH_TESTOUT
VCC2RF
RFIN
LNA +I/Q Mixers
GNDLNA
GAIN_SET
VCC2VC0
MC33696 Data Sheet, Rev. 12
BAND
/2 or Buffer
VCC2RF
RFOUT
PA
GNDPA1
GNDPA2
Features
3
Pin Functions
Figure 1. Block Diagram
3
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Pin Functions
Table 1. Pin Functions
Name RSSIOUT VCC2RF RFIN GNDLNA VCC2VCO GNDPA1 RFOUT GNDPA2 XTALIN XTALOUT VCCINOUT VCC2OUT VCCDIG VCCDIG2 RBGAP GND GNDDIG RSSIC DATACLK CONFB MISO MOSI SCLK SEB GNDIO VCCIN NC STROBE GNDSUBD VCC2IN SWITCH GND RSSI analog output 2.1 V to 2.7 V internal supply for LNA RF input Ground for LNA (low noise amplifier) 2.1 V to 2.7 V internal supply for VCO PA ground RF output PA ground Crystal oscillator input Crystal oscillator output 2.1 V to 3.6 V power supply/regulator output 2.1 V to 2.7 V voltage regulator output for analog and RF modules 2.1 V to 3.6 V power supply for voltage limiter 1.5 V voltage limiter output for digital module Reference voltage load resistance General ground Digital module ground RSSI control input Data clock output to microcontroller Configuration mode selection input Digital interface I/O Digital interface I/O Digital interface clock I/O Digital interface enable input Digital I/O ground 2.1 V to 3.6 V or 5.5 V input No connection Strobe oscillator capacitor or external control input Ground 2.1 V to 2.7 V power supply for analog modules for decoupling capacitor RF switch control output General ground Description
MC33696 Data Sheet, Rev. 12 4 Freescale Semiconductor
Maximum Ratings
4
Maximum Ratings
Table 2. Maximum Ratings
Parameter Symbol VCCIN VCC VCC2 -- VCCPA VCCIO -- -- -- TS TJ Value VGND-0.3 to 5.5 VGND-0.3 to 3.6 VGND-0.3 to 2.7 VGND-0.3 to VCC2 VGND-0.3 to VCC+2 VGND-0.3 to VCC+0.3 2000 200 260 -65 to +150 150 Unit V V V V V V V V C C C
Supply voltage on pin: VCCIN Supply voltage on pins: VCCINOUT, VCCDIG Supply voltage on pins: VCC2IN, VCC2RF, VCC2VCO Voltage allowed on each pin (except RFOUT and digital pins) Voltage allowed on pin: RFOUT Voltage allowed on digital pins: SEB, SCLK, MISO, MOSI, CONFB, DATACLK, RSSIC, STROBE ESD HBM voltage capability on each pin1 ESD MM voltage capability on each pin2 Solder heat resistance test (10 s) Storage temperature Junction temperature NOTES: 1 Human body model, AEC-Q100-002 rev. C. 2 Machine model, AEC-Q100-003 rev. C.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 5
Power Supply
5
Power Supply
Table 3. Supply Voltage Range Versus Ambient Temperature
Temperature Range1 Parameter Symbol -40C to +85C -20C to +85C 2.1 to 3.6 4.5 to 5.5 3.0 to 3.6 V V V VCC3V VCC5V VCCPA 2.7 to 3.6 4.5 to 5.5 3.0 to 3.6 Unit
Supply voltage on VCCIN, VCCINOUT, VCCDIG for 3 V operation Supply voltage on VCCIN for 5 V operation Supply voltage on VCCPA for 3 V or 5 V operation NOTES: 1 -40C to +85C: MC33696FCE/FJE. -20C to +85C: MC33696FCAE/FJAE.
The circuit can be supplied from a 3 V voltage regulator or battery cell by connecting VCCIN, VCCINOUT, and VCCDIG (See Figure 43 or Figure 44). It is also possible to use a 5 V power supply connected to VCCIN; in this case VCCINOUT and VCCDIG should not be connected to VCCIN (See Figure 45 or Figure 46). The RFOUT pin cannot be biased with a voltage higher than 3.6 V. For 5 V operation, biasing voltage is available on VCCINOUT. An on-chip low drop-out voltage regulator supplies the RF and analog modules (except the strobe oscillator and the low voltage detector, which are directly supplied from VCCINOUT). This voltage regulator is supplied from pin VCCINOUT and its output is connected to VCC2OUT. An external capacitor (C8 = 100 nF) must be inserted between VCC2OUT and GND for stabilization and decoupling. The analog and RF modules must be supplied by VCC2 by externally wiring VCC2OUT to VCC2IN, VCC2RF, and VCC2VCO. A second voltage regulator supplies the digital part. This regulator is powered from pin VCCDIG and its output is connected to VCCDIG2. An external capacitor (C10 = 100 nF) must be inserted between VCCDIG2 and GNDDIG, for decoupling. The supply voltage VCCDIG2 is equal to 1.6 V. In standby mode, this voltage regulator goes into an ultra-low-power mode, but VCCDIG2 = 0.7 x VCCDIG. This enables the internal registers to be supplied, allowing configuration data to be saved.
6
Supply Voltage Monitoring and Reset
At power-on, an internal reset signal (Power-on Reset, POR) is generated when supply voltage is around 1.3 V. All registers are reset. When the LVDE bit is set, the low-voltage detection module is enabled. This block compares the supply voltage on VCCINOUT with a reference level of about 1.8 V. If the voltage on VCCINOUT drops below 1.8 V, status bit LVDS is set. The information in status bit LVDS is latched and reset after a read access.
MC33696 Data Sheet, Rev. 12 6 Freescale Semiconductor
Receiver Functional Description
NOTE If LVDE = 1, the LVD module remains enabled. The circuit cannot be put in standby mode, but remains in LVD mode with a higher quiescent current, due to the monitoring circuitry. LVD function is not accurate in standby mode.
7
Receiver Functional Description
The receiver is based on a superheterodyne architecture with an intermediate frequency IF (see Figure 1). Its input is connected to the RFIN pin. Frequency down conversion is done by a high-side injection I/Q mixer driven by the frequency synthesizer. An integrated poly-phase filter performs rejection of the image frequency. The low intermediate frequency allows integration of the IF filter providing the selectivity. The IF Filter center frequency is tuned by automatic frequency control (AFC) referenced to the crystal oscillator frequency. Sensitivity is met by an overall amplification of approximately 96 dB, distributed over the reception chain, comprising low-noise amplifier (LNA), mixer, post-mixer amplifier, and IF amplifier. Automatic gain control (AGC), on the LNA and the IF amplifier, maintains linearity and prevents internal saturation. Sensitivity can be reduced using four programmable steps on the LNA gain. Amplitude demodulation is achieved by peak detection. Frequency demodulation is achieved in two steps: the IF amplifier AGC is disabled and acts as an amplitude limiter; a filter performs a frequency-to-voltage conversion. The resulting signal is then amplitude demodulated in the same way as in the case of amplitude modulation with an adaptive voltage reference. A low-pass filter improves the signal-to-noise ratio of demodulated data. A data slicer compares demodulated data with a fixed or adaptive voltage reference and provides digital level data. This digital data is available if the integrated data manager is not used. If used, the data manager performs clock recovery and decoding of Manchester coded data. Data and clock are then available on the serial peripheral interface (SPI). The configuration sets the data rate range managed by the data manager and the bandwidth of the low-pass filter. An internal low-frequency oscillator can be used as a strobe oscillator to perform an automatic wakeup sequence. It is also possible to define two different configurations for the receiver (frequency, data rate, data manager, modulation, etc.) that are automatically loaded during wakeup or under MCU control. If the PLL goes out of lock, received data is ignored.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 7
Transmitter Functional Description
8
Transmitter Functional Description
The single-ended power amplifier is connected to the RFOUT pin. In the case of amplitude modulation, coded data sent by the microcontroller unit (MCU) are used for on/off keying (OOK) the RF carrier. Rise and fall times of the RF transmission are controlled to minimize spurious emission. In the case of frequency modulation, coded data sent by the MCU are used for frequency shift keying (FSK) the RF carrier. RF output power can be reduced using four programmable steps. Out-of-lock detection prevents any out-of-band emission, by stopping the transmission. The logic output SWITCH enables control of an external RF switch for isolating the two RF pins. Its output toggles when the circuit changes from receive to transmit, and vice versa. This signal can also be used to control an external power amplifier or LNA, or to indicate to the MCU the current state of the MC33696 (RX or TX).
9
9.1
Frequency Planning
Clock Generator
All clocks running in the circuit are derived from the reference frequency provided by the crystal oscillator (frequency fref, period tref). The crystal frequency is chosen in relation to the band in which the MC33696 has to operate. Table 4 shows the value of the CF bits.
Table 4. Crystal Frequency and CF Values Versus Frequency Band
RF Frequency (MHz) 304 315 426 433.92 868.3 916.5 CF1 CF0 LOF1 LOF0 FREF (Crystal Frequency) (MHz) 16.96745 17.58140 23.74913 24.19066 24.16139 25.50261 FIF (IF Frequency) (MHz) 1.414 1.465 1.484 1.512 1.510 1.594 Dataclk Divider 60 60 80 80 80 80 Fdataclk (kHz) 282.791 293.023 296.864 302.383 302.017 318.783 Digclk Divider 30 30 40 40 40 40 Fdigclk (kHz) 565.582 586.047 593.728 604.767 604.035 637.565 Tdigclk (s) 1.77 1.71 1.68 1.65 1.66 1.57
0 0 0 0 1 1
0 0 1 1 1 1
0 1 1 0 0 1
0 0 0 1 1 1
9.2
Intermediate Frequency
The IF filter is controlled by the crystal oscillator to guarantee the frequency over temperature and voltage range. The IF filter center frequency, FIF, can be computed using the crystal frequency fref and the value of the CF bits: * If CF[0] = 0 : FIF = fref/9x1.5/2
MC33696 Data Sheet, Rev. 12 8 Freescale Semiconductor
MCU Interface
*
If CF[0] = 1 : FIF = fref/12x1.5/2
Example 1. Cut-off Frequency Computation
The cut-off frequency given in the parametric section can be computed by scaling to the FIF. Compute the low cut-off frequency of the IF filter for a 16.9683 MHz crystal oscillator. For this reference frequency, FIF = 1.414 MHz. So, the 1.387 MHz1 low cut-off frequency specified for a 1.5 MHz IF frequency becomes 1.387 x 1.414/1.5 = 1.307 MHz.
9.3
Frequency Synthesizer Description
The frequency synthesizer consists of a local oscillator (LO) driven by a fractional N phase locked loop (PLL). The LO is an integrated LC voltage controlled oscillator (VCO) operating at twice the RF frequency (for the 868 MHz frequency band) or four times the RF frequency (for the 434 MHz and 315 MHz frequency bands). This allows the I/Q signals driving the mixer to be generated by division. The fractional divider offers high flexibility in the frequency generation for: * Switching between transmit and receive modes. * Achieving frequency modulation in FSK modulation transmission. * Performing multi-channel links. * Trimming the RF carrier. Frequencies are controlled by means of registers. To allow for user preference, two programming access methods are offered (see Section 18.3, "Frequency Registers"). * * In friendly access, all frequencies are computed internally from the contents of the carrier frequency and deviation frequency registers. In direct access, the user programs direct all three frequency registers.
10
MCU Interface
The MC33696 and the MCU communicate via a serial peripheral interface (SPI). According to the selected mode, the MC33696 or the MCU manages the data transfer. The MC33696's digital interface can be used as a standard SPI (master/slave) or as a simple interface (SPI deselected). In the following case, the interface's pins are used as standard I/O pins. However, the MCU has the highest priority, as it can control the MC33696 by setting CONFB pin to the low level. During an SPI access, the STROBE pin must remain at high level to prevent the MC33696 from entering standby mode. The interface is operated by six I/O pins. * CONFB -- Configuration control input The configuration mode is reached by setting CONFB to low level.
1. Refer to parameter 3.3 found in Section 21.3, "Receiver Parameters." MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 9
MCU Interface
*
*
*
*
*
STROBE -- Wakeup control input The STROBE pin controls the ON/OFF sequence of the MC33696. When STROBE is set to low level, the receiver is off--when STROBE is set to high level, the receiver is on. The current consumption in receive mode can be reduced by strobing the receiver. The periodic wakeup can be done by MCU only or by an internal oscillator thanks to an external capacitor (strobe oscillator must be previously enabled by setting SOE bit to 1). Refer to Section 12.3, "Receiver On/Off Control," for more details. SEB -- Serial interface enable control input When SEB is set high, pins SCLK, MOSI, and MISO are set to high impedance, and the SPI bus is disabled. When SEB is set low, SPI bus is enabled. This allows individual selection in a multiple device system, where all devices are connected via the same bus. The rest of the circuit remains in the current state, enabling fast recovery times, but the power amplifier is disabled to prevent any uncontrolled RF transmission. If the MCU shares the SPI access with the MC33696 only, SEB control by the MCU is optional. If not used, it could be hardwired to 0. SCLK -- Serial clock input/output Synchronizes data movement in and out of the device through its MOSI and MISO lines. The master and slave devices can exchange a byte of information during a sequence of eight clock cycles. Since SCLK is generated by the master device, this line is an input on the slave device. MOSI -- Master output slave input/output In configuration mode, MOSI is an input. In transmission mode, MOSI is an input and receives encoded data from MCU. In receive mode, MOSI is an output. Received data is sent on MOSI (see Table 5). Transmits bytes when master, and receives bytes when slave, with the most significant bit first. When no data are output, SCLK and MOSI force a low level. MISO -- Master input/slave output In configuration mode only, data read from registers is sent to the MCU with the MSB first. There is no master function. Data are valid on falling edges of SCLK. This means that the clock phase and polarity control bits of the microcontroller SPI have to be CPOL = 0 and CPHA = 1 (using Freescale acronyms).
Table 5 summarizes the serial digital interface feature versus the selected mode.
Table 5. Serial Digital Interface Feature versus Selected Mode
Selected Mode Configuration Transmit Receive DME = 1 DME = 0 Standby / LVD MC33696 Digital Interface Use SPI slave, data received on MOSI, SCLK from MCU, MISO is output (SEB=0) SPI deselected, MOSI receives encoded data from MCU (SEB =0) SPI master, data sent on MOSI with clock on SCLK (SEB=0) SPI deselected, received data are directly sent to MOSI (SEB=0) SPI deselected, all I/O are high impedance (SEB =1)
MC33696 Data Sheet, Rev. 12 10 Freescale Semiconductor
State Machine
Refer to Section 11, "State Machine," and to Figure 2 for more details about all the conditions that must be complied with in order to change between two selected modes. The data transfer protocol for each mode is described in the following section.
11
State Machine
This section describes how the MC33696 controller executes sequences of operations, relative to the selected mode. The controller is a finite state machine, clocked at Tdigclk. An overview is presented in Figure 2 (note that some branches refer to other diagrams that provide more detailed information). There are four different modes: configuration, transmit, receive, and standby/LVD. Each mode is exclusive and can be entered in different ways, as follows. * External signal: CONFB for configuration mode * External signal and configuration bits: CONFB, STROBE, TRXE, and/or MODE for all other modes * External signal and internal conditions: see Figure 3 and Figure 12 for information on how to enter standby/LVD mode After a Power-on Reset (POR), the circuit is in standby mode (see Figure 2) and the configuration register contents are set to the reset value. At any time, a low level applied to CONFB forces the finite state machine into configuration mode, whatever the current state. This is not always shown in state diagrams, but must always be considered. Refer to (Section 16, "Power-On Reset and MC33696 Startup") for timing sequence between standy mode and configuration mode.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 11
State Machine
CONFB = 1, and STROBE = 0
Power-on Reset
SPI Deselected SPI Slave SPI Master Refer to Table 5 for pins direction
State 60 Standby/LVD Mode Standby/LVD Mode
CONFB = 0, and STROBE = 1 CONFB = 0, and STROBE = 1
Activate Bank Change, (A to B or B to A) State 1 Configuration Mode Configuration Mode
CONFB = 1, TRXE = 1
State 30 Transmit Mode Transmit Mode
CONFB = 1, TRXE = 1 ... and DME = 0 ... and SOE = 1 ... and SOE = 0 ... and SOE = 1 ... and DME = 1 ... and SOE = 0
Receive Mode
See
Figure3 Figure3
See
Figure4 Figure4
See
Figure11
See
Figure12
Figure 2. State Machine Overview
MC33696 Data Sheet, Rev. 12 12 Freescale Semiconductor
Receive Mode
12
Receive Mode
The receiver is either waiting for an RF transmission or is receiving one. Two different processes are possible, as determined by the values of the DME bit. The transmitter part is kept off. A state diagram describes the sequence of operations in each case. NOTE If the STROBE pin is tied to a high level before switching to receive mode, the receiver does not go through an off or standby state.
12.1 Data Manager Disabled (DME=0)
Data manager disabled means that the SPI is deselected and raw data is sent directly on the MOSI line, while SCLK remains at low level. Two different processes are possible, as determined by the values of the SOE bit.
12.1.1 Data Manager Disabled and Strobe Pin Control
Raw received data is sent directly on the MOSI line. Figure 3 shows the state diagram.
SPI Deselected STROBE = 0
STROBE = 1
State 5 Standby/LVD
STROBE = 1
STROBE = 0
State 5b On Raw Data on MOSI
Figure 3. Receive Mode, DME = 0, SOE = 0
*
*
State 5: The receiver is in standby/LVD mode. For further information, see Section 14, "Standby: LVD Mode." A high level applied to STROBE forces the circuit to state 5b. State 5b: The receiver is kept on by the STROBE pin. Raw data is output on the MOSI line.
For all states: At any time, a low level applied to CONFB forces the state machine to state 1, configuration mode.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 13
Receive Mode
12.1.2 Data Manager Disabled and Strobe Oscillator Enabled
Raw received data is sent directly on the MOSI line. Figure 4 shows the state diagram.
SPI Deselected STROBE = 0 STROBE = 0 STROBE = 1 State 0 Off Off Counter = ROFF[2:0] or STROBE = 1
On Counter = RON[3:0] and STROBE different than 1
State 0b On Raw Data on MOSI
Figure 4. Receive Mode, DME = 0, SOE = 1
*
*
State 0: The receiver is off, but the strobe oscillator and the off counter are running. Forcing the STROBE pin low freezes the strobe oscillator and maintains the system in this state. State 0b: If STROBE pin is set to high level or the off counter reaches the ROFF value, the receiver is on. Raw data is output on the MOSI line.
For all states: At any time, a low level applied to CONFB forces the state machine to state 1, configuration mode.
12.2 Data Manager Enabled (DME=1)
The data manager is enabled. The SPI is master. The MC33696 sends the recovered clock on SCLK and the received data on the MOSI line. Data is valid on falling edges of SCLK. If an even number of bytes is received, the data manager may add an extra byte. The content of this extra byte is random. If the data received do not fill an even number of bytes, the data manager will fill the last byte randomly. Figure 5 shows a typical transfer.
MC33696 Data Sheet, Rev. 12 14 Freescale Semiconductor
Receive Mode
STROBE 1 0 1 0
CONFB *Refer to (Section 10)
SEB 1 0
SCLK 1 (Output) 0 Recovered Clock Updated to I ncoming Signal Data Rate MOSI 1 (Output) 0
D 7 D6 D 5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D 2 D1 D0 D7 D6 D5 D4 D3 D2 D 1 D0
Figure 5. Typical Transfer in Receive mode with Data Manager
12.2.1 Data Manager Functions
In receive mode, Manchester coded data can be processed internally by the data manager. After decoding, the data is available on the digital interface, in SPI format. This minimizes the load on the MCU. The data manager, when enabled (DME = 1), has five purposes: * First ID detection: the received data are compared with the identifier stored in the ID register. * Then the HEADER recognition: the received data is compared with the data stored in the HEADER register. * Clock recovery: the clock is recovered during reception of the preamble and is computed from the shortest received pulse. While this signal is being received, the recovered clock is constantly updated to the data rate of the incoming signal. * Output data and recovered clock on digital interface: see Figure 5. * End-of-message detection: an EOM consists of two consecutive NRZ ones or zeroes. Table 6 details some MC33696 features versus DME values.
Table 6. the MC33696 Features versus DME
DME 0 Digital Interface Use SPI deselected, received data are directly sent to MOSI when CONFB = 1 SPI master, data sent on MOSI with clock on SCLK when CONFB = 1 Data Format Bit stream No clock Data bytes Recovered clock Output MOSI -- MOSI SCLK
1
12.2.2 Manchester Coding Description
The MC33696 data manager is able to decode Manchester-coded messages. For other codings, the data manager should be disabled (DME=0) for raw data to be available on MOSI.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 15
Receive Mode
DME = 0: The data manager is disabled. The SPI is deselected. Raw data is sent directly on the MOSI line, while SCLK remains at the low level. Manchester coding is defined as follows: data is sent during the first half-bit; and the complement of the data is sent during the second half-bit. The signal average value is constant.
0 1 0 0 1 1 0 ORIGINAL DATA MANCHESTER CODED DATA
Figure 6. Example of Manchester Coding
Clock recovery can be extracted from the data stream itself. To achieve correct clock recovery, Manchester-coded data must have a duty cycle between 47% and 53%.
12.2.3 Frame Format
A complete telegram includes the following sequences: a preamble, an identifier (ID), a header, the message, and an end-of-message (EOM).
PREAMBLE ID ID ID ID HEADER DATA ............ EOM
Figure 7. Example of Frame Format
These bit sequences are described below.
12.2.3.1 Preamble
A preamble is required before the first ID detected. It enables: -- In the case of OOK modulation, the AGC to settle, and the data slicer reference voltage to settle if DSREF = 1 -- In the case of FSK modulation, the data slicer reference voltage to settle -- The data manager to start clock recovery No preamble is needed in case of several IDs are sent as shown in Figure 8. The ID field must be greater than two IDs. The first ID will have the same function as the preamble, and the second ID will have the same function as the single ID.
... ID ID ID ID ID ID HEADER DATA ............
Figure 8. Example of Frame with Several IDs, No Preamble Needed
For both cases, the preamble content must be defined carefully, to ensure that it will not be decoded as the ID or the header. Figure 9 defines the different preamble in OOK and FSK modulation.
MC33696 Data Sheet, Rev. 12 16 Freescale Semiconductor
Receive Mode
OOK MODULATION (DSREF = 0) AGC Settling Time Clock Recovery ID 1 NRZ > 200 s (1) 1 Manchester `0' Symbol at Data Rate
OOK MODULATION (DSREF = 1) AGC Settling Time Data Slicer Reference Settling Time Clock Recovery ID 1 NRZ > 200 s (1) At Least 3 Manchester 0 Symbols at Data Rate (2 and 3) Clock Recovery ID At Least 3 Manchester 0 Symbols at Data Rate (2 and 3) 1 Manchester 0 Symbol at Data Rate (3) 1 Manchester 0 Symbol at Data Rate (3)
FSK MODULATION (DSREF = 1) Data Slicer Reference Settling Time
NOTES: 1. The AGC settling time pulse can be split over different pulses as long as the overall duration is at least 200 s. The 200 s pulse may be replaced by : (1 bit @ 2400 bps or 2 bits @ 4800 bps or 4 bits @ 9600 bps or 8 bits @ 19200 bps). 2. Table 14 defines the minimum number of Manchester symbols required for the data slicer operation versus the data and average filter cut-off frequencies. 3. The Manchester 0 symbol can be replaced by a 1.
Figure 9. Preamble Definition
12.2.3.2 ID
When clock recovery is done, the data manager verifies if an ID is received. The ID is used to identify a useful frame to receive. It is also necessary, when the receiver is strobed, to detect an ID in order to stay in run mode and not miss the frame. The ID allows selection of the correct device in an RF transmission, as the content has been loaded previously in the ID register. Its length is variable, defined by the IDL[1:0] bits. The complement of the ID is also recognized as the identifier. It is possible to build a tone to form the detection sequence by programming the ID register with a full sequence of ones or zeroes. Once the ID is detected, a HEADER will be searched to detect the beginning of the useful data to send on the SPI port. See Section 12.2.4, "State Machine in Receive Mode When DME=1" for more details when ID is not detected when SOE=1 or SOE=0.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 17
Receive Mode
12.2.3.3 HEADER
The HEADER defines the beginning of the message, as it is compared with the HEADER register. Its length is variable, defined by the HDL[1:0] bits. The complement of the header is also recognized as the header--in this case, output data is complemented. The header and its complement should not be part of the ID. The ID and the header are sent at the same data rate as data.
12.2.3.4 Data and EOM
The data must follow the header, with no delay. The message is completed with an end-of-message (EOM), consisting of two consecutive NRZ ones or zeroes (i.e., a Manchester code violation). Even in the case of FSK modulation, data must conclude with an EOM, and not simply by stopping the RF transmission.
12.2.4 State Machine in Receive Mode When DME=1
When the strobe oscillator is enabled (SOE = 1), the receiver is continuously cycling on/off. The ID must be recognized for the receiver to stay on. Consequently, the transmitted ID burst must be long enough to include two consecutive receiver-on cycles. When the strobe oscillator is not enabled (SOE = 0), these timing constraints must be respected by the external control applied to pin STROBE. Figure 11 shows the correct detection of an ID when STROBE is controled internally using the strobe oscillator (SOE=1) or externally by the MCU (SOE=0).
RF Signal Preamble ID ID ID ID ID Field Receiver Status ID ID ID Header Data EOM
On On Time
Off Off Time ID Detected
On
Off
SPI Output
Data
Figure 10. Complete Transmission with ID Detection
Two different processes are possible, as determined by the values of the SOE bit.
12.2.4.1 Data Manager Enabled and Strobe Oscillator Enabled
Figure 11 shows the state diagram when the data manager and the strobe oscillator are enabled. In this configuration, the receiver is controlled internally by the strobe oscillator. However, external control via the STROBE pin is still possible, and overrides the strobe oscillator command.
MC33696 Data Sheet, Rev. 12 18 Freescale Semiconductor
Receive Mode
*
*
*
*
State 10: The receiver is off, but the strobe oscillator and the off counter are running. Forcing STROBE pin to the low level maintains the system in this state. State 11: The receiver is waiting for a valid ID. If an ID, or its complement, is detected, the state machine advances to state 12; otherwise, the circuit goes back to state 10 at the end of the RON time, if STROBE 1. State 12: An ID or its complement has been detected. The data manager is now waiting for a header or its complement. If neither a header, nor its complement, has been received before a time-out of 256 bits at data rate, the system returns to state 10. State 13: A header, or its complement, has been received. Data and clock signals are output on the SPI port until EOM indicates the end of the data sequence. If the complement of the header has been received, output data are complemented also.
For all states: At any time, a low level applied to STROBE forces the circuit to state 10, and a low level applied on CONFB forces the state machine to state 1, configuration mode. When an EOM occurs before the current byte is fully shifted out, dummy bits are inserted until the number of shifted bits is a multiple of 8.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 19
Receive Mode
SPI Master STROBE = 0 STROBE = 0 State 10 Off STROBE = 1
Off Counter = ROFF[2:0] or STROBE = 1
On Counter = RON[3:0] and STROBE 1
State 11 On Waiting For a Valid ID
ID Detected
Time Out
State 12 On Waiting for a Valid Header
EOM Received and STROBE = 1
Header Received
State 13 On Output Data and Clock Waiting for End of Message EOM Received and STROBE 1
Figure 11. Receive Mode, DME = 1, SOE = 1
12.2.4.2 Data Manager Enabled and Receiver Controlled by Strobe Pin
Figure 12 shows the state diagram when the data manager is enabled and the strobe oscillator is disabled. In this configuration, the receiver is controlled only externally by the MCU.
MC33696 Data Sheet, Rev. 12 20 Freescale Semiconductor
Receive Mode
SPI Master STROBE = 0 SPI Deselected State 20 Standby/LVD
STROBE = 1
STROBE = 1
STROBE = 0
State 21 On Waiting For a Valid ID
ID Detected
STROBE = 0
State 22 On Waiting for a Valid Header
EOM Received and STROBE = 1
Header Received
State 23 On Output Data and Clock Waiting for End of Message EOM Received and STROBE = 0
Figure 12. Receive Mode, DME = 1, SOE = 0
*
*
*
*
State 20: The receiver is in standby/LVD mode. For further information, see Section 14, "Standby: LVD Mode." A high level applied to STROBE forces the circuit to state 21. State 21: The circuit is waiting for a valid ID. If an ID, or its complement, is detected, the state machine advances to state 22; if not, the state machine will remain in state 21, as long as STROBE is high. State 22: If a header, or its complement, is detected, the state machine advances to state 23. If not, the state machine will remain in state 22, as long as STROBE is high. State 23: A header or its complement has been received; data and clock signals are output on the SPI port until an EOM indicates the end of the data sequence. If the complement of the header has been
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 21
Receive Mode
received, output data are complemented also. When an EOM occurs before the current byte is fully shifted out, dummy bits are inserted until the number of shifted bits is a multiple of 8. For all states: At any time, a low level applied to STROBE puts the circuit into state 20, and a low level applied to CONFB forces the state machine to state 1, configuration mode.
12.2.4.3 Timing Definition
As shown in Figure 13, a settling time is required when entering the on state.
Receiver Status Off On Ton RF Signal Off Toff ID ID ID Setting Time ID ID ID ID ID ID Header Data EOM On
ID Detected
Figure 13. Receiver Usable Window
The goal for the receiver is to recognize at least one ID during Ton time. Many IDs are transmitted during that time. During Ton, the receiver should be able to detect an ID, but as receiver and transmitter are not synchronized, an ID may already be transmitted when Ton time begins. That is the reason why Ton should be sized to receive two IDs: to be sure to recognize one, no matter what the time difference between beginning of transmission of the ID and beginning of run time for the receiver. Ton should also include the setting time of the receiver. Setting time is composed of the crystal oscillator wakeup time1, the PLL lock time2, and setup of all analog parameters3 (AGC and demodulator need some time to settle). Toff should be sized to allow the positioning of an on state during the transmission of the ID field. During the setting time, no reception is possible.
12.3 Receiver On/Off Control
In receive mode, on/off sequencing can be controlled internally using the strobe oscillator, or managed externally by the MCU through the input pin STROBE. If the strobe oscillator is selected (SOE = 1): * Off time is clocked by the strobe oscillator * On time is clocked by the crystal oscillator, enabling accurate control of the on time, and therefore of the current consumption of the whole system
1. Refer to parameter 5.10 found in Section 21.5, "PLL & Crystal Oscillator." 2. Refer to parameter 5.9 found in Section 21.5, "PLL & Crystal Oscillator." 3. Refer to preamble definition found in Figure 9. MC33696 Data Sheet, Rev. 12 22 Freescale Semiconductor
Receive Mode
Each time is defined with the associated value found in the RXONOFF register. * On time = RON[3:0] x 512 x Tdigclk (see Table 19; begins after the crystal oscillator has started) * Off time = receiver off time = N x TStrobe + MIN (TStrobe / 2, receiver on time), with N decoded from ROFF[2:0] (see Table 20) The strobe oscillator is a relaxation oscillator in which an external capacitor C13 is charged by an internal current source (see Figure 46). When the threshold is reached, C13 is discharged and the cycle restarts. The strobe frequency is FStrobe = 1/TStrobe with TStrobe = 106 x C13. In receive mode, setting the STROBE pin to VCCIO at any time forces the circuit on. As VCCIO is above the oscillator threshold voltage, the condition on which the STROBE pin is set to VCCIO is detected internally, and the oscillator pulldown circuitry is disabled. This limits the current consumption. After the STROBE pin is forced to high level, the external driver should pass via a "0" state to discharge the capacitor before going to high impedance state (otherwise, the on time would last a long time after the driver release). When the strobe oscillator is running (i.e., during an off time), forcing the STROBE pin to VGND stops the strobe clock, and therefore keeps the circuit off. Figure 14 shows the associated timings.
STROBE STROBE Clock Off Counter Digital Clock On Counter RON Receiver Status Off Cycling Period Crystal Oscillator Startup On 0 RON Off 0 RON On 0 ROFF-1 ROFF Threshold STROBE SET TO VCCIO tStrobe 0
Figure 14. Receiver On/Off Sequence
12.4 Received Signal Strength Indicator (RSSI)
12.4.1 Module Description
In receive mode, a received signal strength indicator can be activated by setting bit RSSIE. The input signal is measured at two different points in the receiver chain by two different means, as follows. * At the IF filter output, a progressive compression logarithmic amplifier measures the input signal, ranging from the sensitivity level up to -50 dBm.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 23
Receive Mode
*
At the LNA output, the LNA AGC control voltage is used to monitor input signals in the range -50 dBm to -20 dBm.
Therefore, the logarithmic amplifier provides information relative to the in-band signal, whereas the LNA AGC voltage senses the input signal over a wider band. The RSSI information given by the logarithmic amplifier is available in: * * Analog form on pin RSSIOUT Digital form in the four least significant bits of the status register RSSI
The information from the LNA AGC is available in digital form in the four most significant bits of status register RSSI. The whole content of status register RSSI provides 2 4 bits of RSSI information about the incoming signal (see Section 18.6, "RSSI Register"). Figure 15 shows a simplified block diagram of the RSSI function. The quasi peak detector (D1, R1, C1) has a charge time of about 20 s to avoid sensitivity to spikes. R2 controls the decay time constant of about 5 ms to allow efficient smoothing of the OOK modulated signal at low data rates. This time constant is useful in continuous mode when S2 is permanently closed. To allow high-speed RSSI updating in peak pulse measurement, a discharge circuit (S1) is required to reset the measured voltage and to allow new peak detection.
RSSI Register LNA AGC Out IF Filter Output ADC MSB LSB
S2
D1
R1
RSSIOUT C1 R2 S1 C2
Figure 15. RSSI Simplified Block Diagram
S2 is used to sample the RSSI voltage to allow peak pulse measurement (S2 used as sample and hold), or to allow continuous transparent measurement (S2 continuously closed). The 4-bit analog-to-digital convertor (ADC) is based on a flash architecture. The conversion time is 16 x Tdiglck. As a single convertor is used for the two analog signals, the RSSI register content is updated on a 32 x Tdigclk timebase. If RSSIE is reset, the whole RSSI module is switched off, reducing the current consumption. The output buffer connected to RSSIOUT is set to high impedance.
MC33696 Data Sheet, Rev. 12 24 Freescale Semiconductor
Receive Mode
12.4.2 Operation
Two modes of operation are available: sample mode and continuous mode.
12.4.2.1 Sample Mode
Sample mode allows the peak power of a specific pulse in an incoming frame to be measured. The quasi peak detector is reset by closing S1. After 7 x Tdigclk, S1 is released. S2 is closed when RSSIC is set high. On the falling edge of RSSIC, S2 is opened. The voltage on RSSIOUT is sampled and held. The last RSSI conversion results are stored in the RSSI register and no further conversion is done. The RSSI register is updated every 32 x Tdigclk. Therefore, the minimum duration of the high pulse on RSSIC is 32 x Tdigclk.
RSSIC 7 x tdigclk S1 S2 RSSI Register Closed Open Frozen Open Closed Updated Closed Open Frozen
RSSIOUT
Sampled and Hold RSSI Voltage
Peak Detector Reset CONFB MOSI
Sampling
CMD
MISO
RSSI Value
Figure 16. RSSI Operation in Sample Mode
12.4.2.2 Continuous Mode
Continuous mode is used to make a peak measurement on an incoming frame, without having to select a specific pulse to be measured. The quasi peak detector is reset by closing S1. After 7 x Tdigclk, S1 is opened. S2 is closed when RSSIC is set high. As long as RSSIC is kept high, S2 is closed, and RSSIOUT follows the peak value with a decay time constant of 5 ms. The ADC runs continuously, and continually updates the RSSI register. Thus, reading this register gives the most recent conversion value, prior to the register being read. The minimum duration of the high pulse on CONFB is 32 x Tdigclk.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 25
Transmit Mode
RSSIC 5 x tdigclk S1 S2 RSSI Register Closed Open Frozen Updated Frozen Open Closed Updated Frozen
RSSIOUT
Peak Detector Test CONFB MOSI CMD CMD
MISO
RSSI
RSSI
Figure 17. RSSI Operation in Continuous Mode
13
Transmit Mode
13.1 Description
The SPI is deselected. The MC33696 receives the message to transmit on the MOSI line (see Figure 18).
1 STROBE 0 1 CONFB 0 *Refer to (Section 10) SEB 1 0 Data
MOSI 1 (Input) 0
Figure 18. Transfer in Transmit Mode
In OOK modulation (MODU=0), modulation is performed by switching the RF output stage on and off. MOSI = 0: output stage off MOSI = 1: output stage on In FSK modulation (MODU = 1), modulation is performed by switching the RF carrier between two values. MOSI = 0: fcarrier0 corresponding to a logical 0 MOSI = 1: fcarrier1 corresponding to a logical 1
MC33696 Data Sheet, Rev. 12 26 Freescale Semiconductor
Standby: LVD Mode
See the FRM bit description (Figure 26) and Section 18.3, "Frequency Registers," for more details about setting carrier frequencies. See Section 10, "MCU Interface," for more details about setting the level on the SEB pin.
13.2 State Machine
In transmit mode, the state diagram is reduced to only one state: state 30. The circuit is either waiting for a digital telegram to send, or is sending one. In this mode, the circuit can be considered as a simple RF physical interface. The information presented on MOSI is sent directly in RF (according to the selected modulation), with no internal processing. Data transmission is possible only if the PLL is within the lock-in range. Therefore, during transmission, if the PLL switches out of lock-in range, the RF output stage is switched off internally, thereby preventing data from being transmitted in an unwanted band.
14
Standby: LVD Mode
The SPI is deselected. CONFB is set to high level and STROBE to low level in order to enter this mode. Nothing is sent and all incoming data are ignored until CONFB and SEB go low to switch back to configuration mode. Standby/LVD mode allows minimum current consumption to be achieved. Depending upon the value of the LVDE bit, the circuit is in standby mode (state 60) or LVD mode (state 5 and 20). LVDE = 0: The transceiver is in standby; consumption is reduced to leakage current (current state after POR). LVDE = 1: The LVD function is enabled; consumption is in the range of tens of microamperes. The only way to exit this mode is to go back to configuration mode by applying a low level to CONFB and a high level to STROBE.
15
Configuration Mode
15.1 Description
This mode is used to write or read the internal registers of the MC33696. As long as a low level is applied to CONFB and a high level to STROBE (see Figure 2), the MCU is the master node driving the SCLK input, the MOSI line input, and the MISO line output. Whatever the direction, SPI transfers are 8-bit based and always begin with a command byte, which is supplied by the MCU on MOSI. To be considered as a command byte, this byte must come after a falling edge on CONFB. Figure 19 shows the content of the command byte.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 27
Configuration Mode Bit 7 Bit Name N1 Bit 6 N0 Bit 5 A4 Bit 4 A3 Bit 3 A2 Bit 2 A1 Bit 1 A0 Bit 0 R/W
Figure 19. Command Byte
Bits N[1:0] specify the number of accessed registers, as defined in Table 7.
Table 7. Number N of Accessed Registers
N[1:0] 00 01 10 11 Number N of Accessed Registers 1 2 4 8
Bits A[4:0] specify the address of the first register to access. This address is then incremented internally by N after each data byte transfer. R/W specifies the type of operation: 0 = Read 1 = Write Thus, this bit is associated with the presence of information on MOSI (when writing) or MISO (when reading). Figure 20 and Figure 21 show write and read operations in a typical SPI transfer. In both cases, the SPI is a slave. A received byte is considered internally on the eighth falling edge of SCLK. Consequently, the last received bits, which do not form a complete byte, are lost. Refer to Section 21.9, "Digital Interface Timing," to view the timing definition for SPI communication. If several SPI accesses are done, a high and low level is applied to CONFB, and so on. By applying a high level to STROBE, the MC33696 never enters standby mode. If there is no way to configure the level on STROBE, the time interval between two SPI accesses must be less than one digital clock period Tdigclk. NOTE A low level applied to CONFB and a high level to STROBE do not affect the configuration register contents. See Section 10, "MCU Interface," for more details about setting the level on the SEB pin.
MC33696 Data Sheet, Rev. 12 28 Freescale Semiconductor
Configuration Mode
1 STROBE 0 SEB 1 0 CONFB 1 0 SCLK 1 (Input) 0 MOSI 1 (Input) 0 MISO 1 (Output) 0 N1 N0 A4 A3 A2 A1 A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
Figure 20. Write Operation in Configuration Mode (N[1:0] = 01)
STROBE 1 0
SEB 1 0 CONFB 1 0 SCLK 1 (Input) 0 MOSI 1 (Input) 0 MISO 1 (Output) 0 N1 N0 A4 A3 A2 A1 A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
Figure 21. Read Operation in Configuration Mode (N[1:0] = 01)
15.2 State Machine
The configuration mode is selected by the microcontroller unit (MCU) to write to the internal registers (to configure the system) or to read them. In this mode, the SPI is a slave. The analog parts (receiver and transmitter) remain in the state (on, off) they were in prior to entering configuration mode, until a new configuration changes them. In configuration mode, data can be neither sent nor received. As long as a low level is applied to CONFB, the circuit stays in State 1, the only state in this mode. Figure 22 describe the valid sequence for enabling a correct transition from Standby/LVD mode to configuration mode. SPI startup time corresponds to the addition of the crystal oscillator lock time (parameter 5.10) and the PLL lock time (parameter 5.9).
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 29
Power-On Reset and MC33696 Startup
STROBE CONFB SPI Startup Time SEB
Figure 22. Valid Sequence from Standby/LVD Mode to Configuration Mode
Figure 23 describes the sequence for enabling a correct transition from receive mode to configuration mode. 1. MC33696 is in receive mode. 2. CONFB is forced to low level during one digital period Tdigclk in order to reset the state machine only. 3. CONFB is set to high level during the time length of an ID.
1 2 3
STROBE CONFB SEB SCLK MOSI
Figure 23. Valid Sequence from Receive Mode to Configuration Mode
16
Power-On Reset and MC33696 Startup
The startup sequence can be divided into three stages as defined in Figure 24: 1. The power supply is applied to the MC33696 and an external pullup resistor on CONFB is required to enter standby mode. SEB can be either set to low level if the SPI access is not shared with another external MCU, or connected to an external pullup resistor (see Section 10, "MCU Interface"). During this stage and during the ramp-up of the power supply, signals from the MCU connected to the MC33696 are undefined. That is why the MC33696 must start in standby mode. NOTE Along with the ramp-up of power supply, one of these two conditions must be complied with: -- Power supply of the MC33696 must rise in 1 ms from 0 V to 3 V. -- The level on STROBE pin is lower than 0.75 V until the power supply reaches 3 V.
MC33696 Data Sheet, Rev. 12 30 Freescale Semiconductor
Configuration Switching
Proposed solutions to verify these conditions are : -- If the receiver does not wake periodically and it is only controlled by the STROBE pin (strobe oscillator disable SOE = 0), an external pulldown resistor on STROBE is required (see Figure 43 for a 3 V application schematic). -- If the receiver wakes periodically (strobe oscillator enable SOE = 1), the state of the MCU pins must be defined first and then a power supply must be applied to the MC33696. A transistor can be used to control the power supply on the VCCIN pin of the MC33696. This transistor will be driven by an MCU I/O (see Figure 44 for a 3 V application schematic in strobe oscillator mode). 2. A high level is applied on STROBE in order to wake the MC33696 and enter transmit/receive mode. The duration of this state should be greater than the sum of lock time parameter 5.9 and 5.10. Refer to Section 15, "Configuration Mode." 3. CONFB and SEB must be forced to low level to enter configuration mode. Register values are writen into the internal registers of the MC33696. Refer to Section 15, "Configuration Mode," and to Figure 45.
1
VCC STROBE 3V 0 1 0 0
2
3
*Refer to (Section 10) SEB 1
CONFB 1 0 1 SCLK 0 MOSI 1 0 MISO 1 0
N1N0 A4 A3 A2 A1 A0 R/W
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0
Figure 24. Startup sequence
17
Configuration Switching
This feature allows for defining two different configurations using two different banks, and for switching them automatically during wakeup when using a strobe oscillator, or by means of the strobe pin actuation by the MCU. This automatic feature may be used only in receiver mode; however, if one of the register banks is related to a transmitter configuration, it may be accessed directly by programing some bits to define the active bank, thus allowing fast switching between receiver mode and transmitter mode, or between any different possible configurations.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 31
Configuration Switching
17.1 Bit Definition
Two sets of configuration registers are available. They are grouped in two different banks: Bank A and Bank B. Two bits are used to define which bank represents the state of the component.
Bit Name BANKA BANKB BANKA X 0 1 Direction R/W R/W Location Bank A Bank B
BANKB Actions 0 Bank A is active (TX or RX) 1 Bank B is active (TX or RX) 1 Bank A and Bank B are active and will be used one after the other (RX only)
At any time, it is possible to know which is the active bank by reading the status bit BANKS.
Bit Name BANKS Direction R Location Comment A&B Bank status: indicates which register bank is active. This bit, available in Bank A and Bank B, returns the same value.
MC33696 Data Sheet, Rev. 12 32 Freescale Semiconductor
Configuration Switching
17.1.1 Direct Switch Control
The conditions to enter direct switch control are: * Strobe pin = VCC * SOE bit = 0 By simply writing BANKA and BANKB, the active bank will be defined:
BANKA X 0 1 BANKB 0 Bank A is active (TX or RX) 1 Bank B is active (TX or RX) 1 Not allowed in direct switch control
The defined bank is active after exiting the configuration mode, in other words, CONFB line goes high. The direct switch control should be used when: * One or both banks are in transmitter configuration (MODE = 1) * When the strobe oscillator cannot be used to define the switch timing (for example, not periodic) * When strobe pin use is not possible (no sleep mode between the two configurations) * No automatic switching is required and MCU SPI access is possible
17.1.2 Strobe Pin Switch Control
The conditions to enter strobe pin switch control are: * Strobe pin: controlled by MCU I/O port * SOE bit = 0 By simply writing BANKA and BANKB, the active banks will be defined.
BANKA X 0 1 BANKB 0 Bank A is active (TX or RX) 1 Bank B is active (TX or RX) 1 Bank A and Bank B are both active, configuration will toggle at each wakeup; not allowed with MODE = 1
The strobe pin will control the off/on state of the MC33696. The various available sequences are described in the following subsections.
17.1.2.1 BANKA = X, BANKB = 0
State A Strobe Pin OFF State A OFF
If strobe pin is 1, configuration is defined by Bank A, BANKS = 1. If strobe pin is 0, MC33696 configuration is OFF. If a message is received during State A, current state remains State A up to end of message.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 33
Configuration Switching
17.1.2.2 BANKA = 0, BANKB = 1
State B Strobe Pin OFF State B OFF
If strobe pin is 1, configuration is defined by Bank B, BANKS = 0. If strobe pin is 0, MC33696 configuration is OFF. If a message is received during State B, current state remains State B up to end of message.
17.1.2.3 BANKA = 1, BANK B = 1
State A Strobe Pin Banks Bit OFF State B OFF State A
If strobe pin is 1, configuration is defined by BANKS. BANKS is toggled at each falling edge of the strobe pin. If strobe pin is 0, MC33696 configuration is OFF. If a message is received during state A or state B, current state remains the same up to end of message. If a read or write access is done using SPI, the next sequence will begin with state A whatever was the active state before SPI access by MCU.
17.1.3 Strobe Oscillator Switch Control
The conditions to enter strobe oscillator switch control are: * Strobe pin connected to an external capacitor to define timing (see Section 12.3, "Receiver On/Off Control") * Strobe pin can also be connected to the MCU I/O port * SOE bit = 1 By simply writing BANKA and BANKB, the active banks will be defined.
BANKA X 0 1 BANKB 0 Bank A is active (TX or RX) 1 Bank B is active (TX or RX) 1 Bank A and Bank B are both active, configuration will toggle at each wakeup; not allowed with MODE = 1
The MCU can override strobe oscillator control by controlling the strobe pin level. If MCU I/O port is in high impedance, the strobe oscillator will control the OFF/ON state of the MC33696. The various available sequences are described in the following subsections.
MC33696 Data Sheet, Rev. 12 34 Freescale Semiconductor
Configuration Switching
17.1.3.1 BANKA = X, BANKB = 0
State A OFF State A OFF State A
If strobe pin is 1, configuration is defined by Bank A, BANKS = 1. If strobe pin is 0, MC33696 configuration is OFF. If a message is received during State A, current state remains State A up to end of message.
17.1.3.2 BANKA = 0, BANKB = 1
State B OFF State B OFF State B
If strobe pin is 1, configuration is defined by Bank B, BANKS = 0. If strobe pin is 0, MC33696 configuration is OFF. If a message is received during State B, current state remains State B up to end of message.
17.1.3.3 BANKA = 1, BANK B = 1
State A Banks Bit State B OFF StateA StateB OFF
BANKS toggles at the end of each state A or state B. If strobe is forced to 1, configuration is frozen according to BANKS value. If a read or write access is done using SPI, the next sequence will begin with state A in whatever was the active state before SPI access by MCU.
A Strobe Banks 1 Z B OFF A B OFF A B OFF A B
For all available sequences: * State A and State B are defined by Bank A and Bank B. * State A duration, TonA is defined by Bank A RON[3-0]. * State B duration, TonB is defined by Bank B RON[3-0]. * OFF duration, TonB is defined by Bank A ROFF[2-0]. * If strobe pin is 1, the state is ON and defined by BANKS at that time. It remains this state up to the release of strobe and end of message if a message is being received. * If a message is being received during State A or B, current state remains State A or B up to end of message.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 35
Register Description
* *
If strobe pin is 0 the state is OFF. If strobe pin is released from 0 while state is OFF, the initial OFF period is completed.
The change of duration of one state (due to the STROBE pin level or a message being received) has no influence on the timing of the following states (A, B, or OFF).
18
Register Description
This section discusses the internal registers, which are composed of two classes of bits. * Configuration and command bits allow the MC33696 to operate in a suitable configuration. * Status bits report the current state of the system. All registers can be accessed by the SPI. These registers are described below. At power-on, the POR resets all registers to a known value (in the shaded rows in the following tables). This defines the MC33696's default configuration.
18.1 Configuration Registers (Description Bank A only)
Figure 25 describes configuration register 1, CONFIG1.
Bit 7 Bit Name Reset Value Access LOF1 1 R/W Bit 6 LOF0 0 R/W Bit 5 CF1 0 R/W Bit 4 CF0 1 R/W Bit 3 RESET 0 R/W Bit 2 SL 0 R/W Bit 1 LVDE 0 R/W Bit 0 CLKE 1 R/W Addr $00
Figure 25. CONFIG1 Register Table 8. LOF[1:0] and CF[1:0] Setting Versus Carrier Frequency
Carrier Frequency 304 MHz 315 MHz 426 MHz 434 MHz 868 MHz 915 MHz LOF1 0 1 0 0 0 1 LOF0 0 0 1 1 1 1 CF1 0 0 0 0 1 1 CF0 0 0 1 1 1 1
RESET is a global reset. The bit is cleared internally, after use. 0 = no action 1 = reset all registers and counters SL (Switch Level) selects the active level of the SWITCH output pin.
MC33696 Data Sheet, Rev. 12 36 Freescale Semiconductor
Register Description
Table 9. Active Level of SWITCH Output Pin
SL 0 Transceiver Function Receiving Transmitting 1 Transmitting Receiving Level on SWITCH Low High Low High
LVDE (Low Voltage Detection Enable) enables the low voltage detection function. 0 = disabled 1 = enabled NOTE This bit is cleared by POR. In the event of a complete loss of the supply voltage, LVD is disabled at power-up, but the information is not lost as the status bit LVDS is set by POR. CLKE (Clock Enable) controls the DATACLK output buffer. 0 = DATACLK remains low 1 = DATACLK outputs Fdataclk Figure 26 describes configuration register 2, CONFIG2.
Bit 7 Bit Name Reset Value Access DSREF 0 R/W Bit 6 FRM 0 R/W Bit 5 MODU 0 R/W Bit 4 DR1 1 R/W Bit 3 DR0 0 R/W Bit 2 TRXE 0 R/W Bit 1 DME 0 R/W Bit 0 SOE 0 R/W Addr $01
Figure 26. CONFIG2 Register
DSREF (Data Slicer Reference) selects the data slicer reference. 0 = Fixed reference (cannot be used in FSK) 1 = Adaptive reference (recommended for maximum sensitivity in OOK and FSK) In the case of FSK modulation (MODU = 1), DSREF must be set. FRM (Frequency Register Manager) enables either a user friendly access to one frequency register or a direct access to the two frequency registers. 0 = The carrier frequency and the FSK deviation are defined by the F register 1 = The local oscillator frequency and the two carrier frequencies are defined by two frequency registers, F and FT. MODU (Modulation) sets the data modulation type. 0 = On/Off Keying (OOK) modulation 1 = Frequency Shift Keying (FSK) modulation DR[1:0] (Data Rate) configure the receiver blocks operating in base band.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 37
Register Description
* * *
Low-pass data filter Low-pass average filter generating the data slicer reference, if DSREF is set Data manager
Table 10. Base Band Parameter Configuration
DR1 0 0 1 1 DR0 0 1 0 1 Data Filter Cut-off Frequency 6 kHz 12 kHz 24 kHz 48 kHz Average Filter Cut-off Frequency 0.5 kHz 1 kHz 2 kHz 4 kHz Data Manager Data Rate Range 2-2.8 kBd 4-5.6 kBd 8-10.6 kBd 16-22.4 kBd
If the data manager is disabled, the incoming signal data rate must be lower than or equal to the data manager maximum data rate. TRXE (Transceiver Enable) enables the whole transceiver. This bit must be set to high level if MCU wakes the MC33696 to enter receive or transmit mode. 0 = standby mode 1 = other modes can be activated DME (Data Manager Enable) enables the data manager. 0 = disabled 1 = enabled SOE (Strobe Oscillator Enable) enables the strobe oscillator. 0 = disabled 1 = enabled Figure 27 describes configuration register 3, CONFIG3.
Bit 7 Bit Name Reset Value Access AFF1 0 R/W Bit 6 AFF0 0 R/W Bit 5 OLS 1 R Bit 4 LVDS 1 R Bit 3 ILA1 0 R/W Bit 2 ILA0 0 R/W Bit 1 OLA1 0 R/W Bit 0 OLA0 0 R/W Addr $02
Figure 27. CONFIG3 Register
OLS (Out of Lock Status) indicates the current status of the PLL. 0 = The PLL is in lock-in range 1 = The PLL is out of lock-in range LVDS (Low Voltage Detection Status) indicates that a low voltage event has occurred when LVDE = 1. This bit is read-only and is cleared after a read access. 0 = No low voltage detected 1 = Low voltage detected ILA[1:0] (Input Level Attenuation) define the RF input level attenuation.
MC33696 Data Sheet, Rev. 12 38 Freescale Semiconductor
Register Description
Table 11. RF Input Level Attenuation
ILA1 0 0 1 1 ILA0 0 1 0 1 RF Input Level Attenuation 0 dB 8 dB 16 dB 30 dB See Parameter Number 2.5 2.6 2.7 2.8
Values in Table 11 assume the LNA gain is not reduced by the AGC. OLA[1:0] (Output Level Attenuation) define the RF output level attenuation.
Table 12. RF Output Level Attenuation
OLA1 0 0 1 1 OLA0 0 1 0 1 RF Output Level Attenuation 0 dB 8 dB 16 dB 25 dB See Parameter Number 4.2 4.3 4.4 4.5
AFF[1:0] (Average Filter Frequency) define the average filter cut-off frequency if the AFFC bit is set.
Table 13. Average Filter Cut-off Frequency
AFF1 0 0 1 1 AFF0 0 1 0 1 Average Filter Cut-off Frequency 0.5 kHz 1 kHz 2 kHz 4 kHz
If AFFC is reset, the average filter frequency is directly defined by bits DR[1:0], as shown in Table 10. If AFFC is set, AFF[1:0] allow the overall receiver sensitivity to be improved by reducing the average filter cut-off frequency. The typical preamble duration of three Manchester zeroes or ones at the data rate must then be increased, as shown in Table 14.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 39
Register Description
Table 14. Minimum Number of Manchester Symbols in Preamble versus DR[1:0] and AFF[1:0]
DR[1:0] 00 00 01 AFF[1:0] 10 11 3 -- -- -- 01 6 3 -- -- 10 12 6 3 -- 11 24 12 6 3
18.2 Command Register
Figure 28 describes the Command register, COMMAND.
Bit 7 Bit Name Reset Value Access AFFC 0 R/W Bit 6 IFLA 0 R/W Bit 5 MODE 0 R/W Bit 4 RSSIE 0 R/W Bit 3 EDD 1 R/W Bit 2 RAGC 0 R/W Bit 1 FAGC 0 R/W Bit 0 BANKS 1 R Addr $03
Figure 28. COMMAND Register
AFFC (Average Filter Frequency Control) enables direct control of the average filter cut-off frequency. 0 = Average filter cut-off frequency is defined by DR[1:0] 1 = Average filter cut-off frequency is defined by AFF[1:0] IFLA (IF Level Attenuation) controls the maximum gain of the IF amplifier in OOK modulation. 0 = No effect 1 = Decreases by 20 dB (typical) the maximum gain of the IF amplifier, in OOK modulation only The reduction in gain can be observed if the IF amplifier AGC system is disabled (by setting RAGC = 1). MODE selects the mode. 0 = Receive mode 1 = Transmit mode RSSIE (RSSI Enable) enables the RSSI function. 0 = Disabled 1 = Enabled EDD (Envelop Detector Decay) controls the envelop detector decay. 0 = Slow decay for minimum ripple 1 = Fast decay RAGC (Reset Automatic Gain Control) resets both receiver internal AGCs. 0 = No action
MC33696 Data Sheet, Rev. 12 40 Freescale Semiconductor
Register Description
1 = Sets the gain to its maximum value A first SPI access allows RAGC to be set; a second SPI access is required to reset it. FAGC (Freeze Automatic Gain Control) freezes both receiver AGC levels. 0 = No action 1= Holds the gain at its current value BANKS indicates which register bank is active. This bit, available in Bank A and Bank B, returns the same value. 0 = Bank B 1 = Bank A
18.3 Frequency Registers
Figure 29 and Figure 30 define the Frequency registers, F and FT.
Bit 15 Bit Name Reset Value Access FSK3 0 R/W Bit 7 Bit Name Reset Value Access F7 0 R/W Bit 14 FSK2 1 R/W Bit 6 F6 0 R/W Bit 13 FSK1 0 R/W Bit 5 F5 0 R/W Bit 12 FSK0 0 R/W Bit 4 F4 0 R/W Bit 11 F11 1 R/W Bit 3 F3 0 R/W Bit 10 F10 0 R/W Bit 2 F2 0 R/W Bit 9 F9 0 R/W Bit 1 F1 0 R/W Bit 8 F8 0 R/W Bit 0 F0 0 R/W $05 Addr $04
Figure 29. F Register
Bit 23 Bit Name Reset Value Access FTA11 0 R/W Bit 15 Bit Name Reset Value Access FTA3 0 R/W Bit 7 Bit Name Reset Value Access FTB7 0 R/W Bit 22 FTA10 1 R/W Bit 14 FTA2 0 R/W Bit 6 FTB6 0 R/W Bit 21 FTA9 1 R/W Bit 13 FTA1 0 R/W Bit 5 FTB5 0 R/W Bit 20 FTA8 1 R/W Bit 12 FTA0 0 R/W Bit 4 FTB4 0 R/W Bit 19 FTA7 0 R/W Bit 11 FTB11 0 R/W Bit 3 FTB3 0 R/W Bit 18 FTA6 0 R/W Bit 10 FTB10 1 R/W Bit 2 FTB2 0 R/W Bit 17 FTA5 0 R/W Bit 9 FTB9 1 R/W Bit 1 FTB1 0 R/W Bit 16 FTA4 0 R/W Bit 8 FTB8 1 R/W Bit 0 FTB0 1 R/W $08 $07 Addr $06
Figure 30. FT Register
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 41
Register Description
How these registers are used is determined by the FRM bit, which is described below. FRM = 0 (User Friendly Access) Whatever type of modulation is used (OOK or FSK), bits F[11:0] define the carrier frequency Fcarrier. The local oscillator frequency FLO is then set automatically to Fcarrier + FIF (with FIF = intermediate frequency). In addition, * * in the case of OOK modulation (MODU = 0): -- FSK[3:0], FTA[11:0], and FTB[11:0] are not used. in the case of FSK modulation (MODU = 1): -- FSK[3:0] sets the frequency deviation Df as defined in Table 15.
Table 15. Frequency Deviation Definition
CF[1:0] 00, 01 11 Frequency Deviation f Fref x(FSK[3:0]+1)/ 2048 Frefx(FSK[3:0]+1)/ 1024
Table 16 gives a numerical example in the 434 MHz band (CF[1:0] = 01).
Table 16. Frequency Numerical Example (434 MHz Band)
FSK[3:0] 0000 0001 0010 ... 1111 Frequency Deviation f 12 kHz 24 kHz 36 kHz ... 192 kHz
Then, two frequencies are calculated internally, as follows. -- Fcarrier0 = F[11:0] - f to transmit a logical 0 -- Fcarrier1 = F[11:0] + f to transmit a logical 1 FTA[11:0] and FTB[11:0] are not used FRM = 1 (Direct Access) Whatever type of modulation is used (OOK or FSK), F[11:0] defines the receiver local oscillator frequency FLO, and, * if OOK modulation is used (MODU = 0): -- FTA[11:0] define the carrier frequency Fcarrier -- FTB[11:0] are not used * if FSK modulation is used (MODU = 1): -- FTA[11:0] define the carrier frequency Fcarrier0 to transmit a logical 0 -- FTB[11:0] define the carrier frequency Fcarrier1 to transmit a logical 1
MC33696 Data Sheet, Rev. 12 42 Freescale Semiconductor
Register Description
Table 17 defines the value to be binary coded in the frequency registers F[11;0], FTA/B[11:0], versus the desired frequency value F (in Hz).
Table 17. Frequency Register Value versus Frequency Value F
CF[1:0] 00, 01 11 Frequency Register Value (2 x F/Fref-35) x 2048 (F/Fref-35) x 2048
Conversely, Table 18 gives the desired frequency F and the frequency resolution versus the value of the frequency registers F[11;0].
Table 18. Frequency Value F versus Frequency Register Value
CF[1:0] 00, 01 11 Frequency (Hz) (35 + F[11;0]/2048)xFref/2 (35 + F[11;0]/2048)xFref Frequency Resolution (Hz) Fref/4096 Fref/2048
18.4 Receiver On/Off Duration Register
Figure 31 describes the receiver on/off duration register, RXONOFF.
Bit 7 Bit Name Reset Value Access BANKA 0 R/W Bit 6 RON3 1 R/W Bit 5 RON2 1 R/W Bit 4 RON1 1 R/W Bit 3 RON0 1 R/W Bit 2 ROFF2 1 R/W Bit 1 ROFF1 1 R/W Bit 0 ROFF0 1 R/W Addr $09
Figure 31. RXONOFF Register
BANKA defines the register bank selected, as described in Section 17, "Configuration Switching." RON[3:0] (Receiver On) define the receiver on time (after crystal oscillator startup) as described in Section 12.3, "Receiver On/Off Control."
Table 19. Receiver On Time Definition
RON[3:0] 0000 0001 0010 ... 1111 Receiver On Time: N x 512 x Tdigclk Forbidden value 1 2 ... 15
ROFF[2:0] (Receiver Off) define the receiver off time as described in Section 12.3, "Receiver On/Off Control."
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 43
Register Description
Table 20. Receiver Off Time Definition
ROFF[2:0] 000 001 010 011 100 101 110 111 Receiver Off Time: N x TStrobe 1 2 4 8 12 16 32 63
18.5 ID and Header Registers
Figure 32 defines the ID register, ID.
Bit 7 Bit Name Reset Value Access IDL1 1 R/W Bit 6 IDL0 1 R/W Bit 5 ID5 0 R/W Bit 4 ID4 0 R/W Bit 3 ID3 0 R/W Bit 2 ID2 0 R/W Bit 1 ID1 0 R/W Bit 0 ID0 0 R/W Addr $0A
Figure 32. ID Register
IDL[1:0] (Identifier Length) sets the length of the identifier, as shown on Table 21.
Table 21. ID Length Selection
IDL1 0 0 1 1 IDL0 0 1 0 1 ID Length 2 bits 4 bits 5 bits 6 bits
ID[5:0] (Identifier) sets the identifier. The ID is Manchester coded. Its LSB corresponds to the register's LSB, whatever the specified length. Figure 33 defines the Header register, HEADER.
Bit 7 Bit Name Reset Value Access HDL1 1 R/W Bit 6 HDL0 0 R/W Bit 5 HD5 0 R/W Bit 4 HD4 0 R/W Bit 3 HD3 0 R/W Bit 2 HD2 0 R/W Bit 1 HD1 0 R/W Bit 0 HD0 0 R/W Addr $0B
Figure 33. HEADER Register
HDL[1:0] (Header Length) sets the length of the header, as shown on Table 22.
MC33696 Data Sheet, Rev. 12 44 Freescale Semiconductor
Bank Access and Register Mapping
Table 22. Header Length Selection
HDL1 0 0 1 1 HDL0 0 1 0 1 HD Length 1 bits 2 bits 4 bits 6 bits
HD[5:0] (Header) sets the header. The header is Manchester coded. Its LSB corresponds to the register's LSB, whatever the specified length.
18.6 RSSI Register
Figure 34 describes the RSSI Result register, RSSI.
Bit 7 Bit Name Reset Value Access RSSI7 0 R Bit 6 RSSI6 0 R Bit 5 RSSI5 0 R Bit 4 RSSI4 0 R Bit 3 RSSI3 0 R Bit 2 RSSI2 0 R Bit 1 RSSI1 0 R Bit 0 RSSI0 0 R Addr $0C
Figure 34. RSSI Register
Bits RSSI[7:4] contain the result of the analog-to-digital conversion of the signal measured at the LNA output. Bits RSSI[3:0] contain the result of the analog-to-digital conversion of the signal measured at the IF filter output.
19
Bank Access and Register Mapping
Registers are physically mapped following a byte organization. The possible address space is 32 bytes. The base address is specified in the command byte. This is then incremented internally to address each register, up to the number of registers specified by N[1:0], also specified by this command byte. All registers can then be scanned, whatever the type of transmission (read or write); however, writing to read-only bits or registers has no effect. When the last implemented address is reached, the internal address counter automatically loops back to the first mapped address ($00). At any time, it is possible to write or read the content of any register of Bank A and Bank B. Register access is defined as follows: R/W Bit can be read and written. R Bit can be read. Write has no effect on bit value. RR Bit can be read. Read or write resets the value. R [A] Bit can be read. This returns the same value as Bank A. RR [A] Bit can be read. This returns the same value as Bank A. Read or write resets the value.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 45
Bank Access and Register Mapping
Table 23. Access to Specific Bits
Bit RESET OLS LDVS SOE RSSIx Bank A A, B A, B A, B A, B Byte CONFIG1 CONFIG3 CONFIG3 CONFIG2 RSSI Access R/W R-R[A] RR-RR[A} R/W-R[A} R-R[A} Available in BANKA. Bit value is the real time status of the PLL, BANKA, and BANKB access reflect the same value. Bit value is the latched value of the low-voltage detector. Read or write from any bank resets value. SOE can be modified in BANKA. Access from BANKB reflects BANKA value. RSSI value is directly read from RSSI converter. Reflected value is the same whatever the active byte. Comment
MC33696 Data Sheet, Rev. 12 46 Freescale Semiconductor
Freescale Semiconductor MC33696 Data Sheet, Rev. 12 47
00h CONFIG1-A Bit 7 Bit Name Reset Value 0= 1= LOF1 1 R/W 304-434 315-916 Bit 7 Bit Name Reset Value 0= 1= DSREF 0 R/W Fixed Adaptive Bit 7 Bit Name Reset Value 0= 1= AFF1 0 R/W 0.5-1 kHz 2-4 kHz Bit 7 Bit Name Reset Value 0= 1= 04h F1-A Bit 7 Bit Name Reset Value 05h F2-A Bit 7 Bit Name Reset Value F7 0 R/W FSK3 0 R/W AFFC 0 R/W AFFx OFF
91 h Bit 6 LOF0 0 R/W 304-315 434-916 10 h Bit 6 FRM 0 R/W Friendly Direct 30 h Bit 6 AFF0 0 R/W 0.5-2 kHz 1-4 kHz 9h Bit 6 IFLA 0 R/W No Bit 5 MODE 0 R/W RX TX Bit 5 FSK1 0 R/W Bit 5 F5 0 R/W Bit 4 RSSIE 0 R/W No Yes Bit 4 FSK0 0 R/W Bit 4 F4 0 R/W Bit 3 EDD 1 R/W Bit 2 RAGC 0 R/W Bit 1 FAGC 0 R/W No Yes Bit 1 F9 0 R/W Bit 1 F1 0 R/W Bit 0 BANKS 1 R B Bank A Bank Bit 0 F8 0 R/W Bit 5 OLS 1 R RAS Bit 4 LVDS 1 RR RAS Bit 3 ILA1 0 R/W 0-8 dB Bit 2 ILA0 0 R/W 0-14 dB Bit 1 OLA1 0 R/W 0-8 dB Bit 0 OLA0 0 R/W 0-14 dB Bit 5 MODU 0 R/W OOK FSK Bit 4 DR1 1 R/W 2.4-4.8 9.6-19.2 Bit 3 DR0 0 R/W 2.4-9.6 4.8-19.2 Bit 2 TRXE 0 R/W Standby Enable Bit 1 DME 0 R/W No Yes Bit 0 SOE 0 R/W No Yes Bit 5 CF1 0 R/W 315-434 868 Bit 4 CF0 1 R/W 314 434-868 Bit 3 RESET 0 R/W No Yes Bit 2 SL 0 R/W T/R R/T Bit 1 LVDE 0 R/W No Yes Bit 0 CLKE 1 R/W No Yes
0Dh CONFIG1-B Bit 7 Bit Name Reset Value 0= 1= LOF1 1 R/W 304-434 315-916 Bit 7 Bit Name Reset Value 0= 1= DSREF 0 R/W Fixed Adaptive Bit 7 Bit Name Reset Value 0= 1= AFF1 0 R/W 0.5-1 kHz 2-4 kHz Bit 7 Bit Name Reset Value 0= 1= 11h F1-B Bit 3 F11 1 R/W Bit 3 F3 0 R/W Bit 2 F10 0 R/W Bit 2 F1 0 R/W Bit 7 Bit Name Reset Value 12h F2-B Bit 0 F0 0 R/W Bit Name Reset Value Bit 7 F7 0 R/W FSK3 0 R/W AFFC 0 R/W AFFx OFF
91 h Bit 6 LOF0 0 R/W 304-315 434-916 10 h Bit 6 FRM 0 R/W Friendly Direct 30 h Bit 6 AFF0 0 R/W 0.5-2 kHz 1-4 kHz 9h Bit 6 IFLA 0 R/W No Bit 5 MODE 0 R/W RX TX Bit 5 FSK1 0 R/W Bit 5 F5 0 R/W Bit 4 RSSIE 0 R/W No Yes Bit 4 FSK0 0 R/W Bit 4 F4 0 R/W Bit 3 EDD 1 R/W Bit 2 RAGC 0 R/W Bit 1 FAGC 0 R/W No Yes Bit 1 F9 0 R/W Bit 1 F1 0 R/W Bit 0 BANKS 1 R[A] B Bank A Bank Bit 5 OLS 1 R[A] RAS Bit 4 LVDS 1 RR[A] RAS Bit 3 ILA1 0 R/W 0-8 dB Bit 2 ILA0 0 R/W 0-14 dB Bit 1 OLA1 0 R/W 0-8 dB Bit 0 OLA0-- 0 R/W 0-14 dB Bit 5 MODU 0 R/W OOK FSK Bit 4 DR1 1 R/W 2.4-4.8 9.6-19.2 Bit 3 DR0 0 R/W 2.4-9.6 4.8-19.2 Bit 2 TRXE 0 R/W Standby Enable Bit 1 DME 0 R/W No Yes Bit 0 SOE 0 R[A] No Yes Bit 5 CF1 0 R/W 315-434 868 Bit 4 CF0 1 R/W 314 434-868 Bit 3 -- 0 R -- -- Bit 2 SL 0 R/W T/R R/T Bit 1 LVDE 0 R/W No Yes Bit 0 CLKE 1 R/W No Yes
01h CONFIG2-A
0Eh CONFIG2-B
02h CONFIG3-A
0Fh CONFIG3-B
Unlocked Low V
14-24 dB 8-24 dB
14-24 dB 8-24 dB
Unlocked Low V
14-24 dB 8-24 dB
14-24 dB 8-24 dB
03h COMMAND-A
10h COMMAND-B
Slow dec. No Fast dec. Yes
Slow dec. No Fast dec. Yes Bit 3 F11 1 R/W Bit 3 F3 0 R/W Bit 2 F10 0 R/W Bit 2 F1 0 R/W
AFFx ON -20 dB 48 h Bit 6 FSK2 1 R/W 0h Bit 6 F6 0 R/W
AFFx ON -20 dB 4800 h Bit 6 FSK2 1 R/W 0h Bit 6 F6 0 R/W
Bank Access and Register Mapping
Bit 0 F8 0 R/W Bit 0 F0 0 R/W
Bank A Registers
Bank B Registers
Figure 35. Bank Registers
Bank Access and Register Mapping
06h FT1-A Bit 7 Bit Name Reset Value 07h FT2-A Bit 7 Bit Name Reset Value 08h FT3-A Bit 7 Bit Name Reset Value 09h RXONOFF-A Bit 7 Bit Name Reset Value 0Ah ID-A Bit 7 Bit Name Reset Value 0Bh HEADER-A Bit 7 Bit Name Reset Value 0Ch RSSI-A Bit 7 Bit Name Reset Value RSSI7 0 R HDL1 1 R/W IDL1 1 R/W BANKA 0 R/W FTB7 0 R/W FTA3 0 R/W FTA11 0 R/W
700701 h Bit 6 FTA10 1 R/W 7h Bit 6 FTA2 0 R/W 1h Bit 6 FTB6 0 R/W 75 h Bit 6 RON3 1 R/W C0 h Bit 6 IDL0 1 R/W 80 h Bit 6 HDL0 0 R/W 80 h Bit 6 RSSI6 0 R Bit 5 RSSI5 0 R Bit 4 RSSI4 0 R Bank A Registers Bit 3 RSSI3 0 R Bit 2 RSSI2 0 R Bit 1 RSSI1 0 R Bit 0 RSSI0 0 R Bit 5 HD5 0 R/W Bit 4 HD4 0 R/W Bit 3 HD3 0 R/W Bit 2 HD2 0 R/W Bit 1 HD1 0 R/W Bit 0 HD0 0 R/W Bit 5 ID5 0 R/W Bit 4 ID4 0 R/W Bit 3 ID3 0 R/W Bit 2 ID2 0 R/W Bit 1 ID1 0 R/W Bit 0 ID0 0 R/W Bit 5 RON2 1 R/W Bit 4 RON1 1 R/W Bit 3 RON0 1 R/W Bit 2 ROFF2 1 R/W Bit 1 ROFF1 1 R/W Bit 0 ROFF0 1 R/W Bit 5 FTB5 0 R/W Bit 4 FTB4 0 R/W Bit 3 FTB3 0 R/W Bit 2 FTB2 0 R/W Bit 1 FTB1 0 R/W Bit 0 FTB0 1 R/W Bit 5 FTA1 0 R/W Bit 4 FTA0 0 R/W Bit 3 FTB11 0 R/W Bit 2 FTB10 1 R/W Bit 1 FTB9 1 R/W Bit 0 FTB8 1 R/W Bit 5 FTA9 1 R/W Bit 4 FTA8 1 R/W Bit 3 FTA7 0 R/W Bit 2 FTA6 0 R/W Bit 1 FTA5 0 R/W Bit 0 FTA4 0 R/W
13h FT1-B Bit 7 Bit Name Reset Value 14h FT2-B Bit 7 Bit Name Reset Value 15h FT3-B Bit 7 Bit Name Reset Value 16h RXONOFF-B Bit 7 Bit Name Reset Value 17h ID-B Bit 7 Bit Name Reset Value 18h HEADER-B Bit 7 Bit Name Reset Value 19h RSSI-B Bit 7 Bit Name Reset Value RSSI7 0 R[A] HDL1 1 R/W IDL1 1 R/W BANKB 0 R/W FTB7 0 R/W FTA3 0 R/W FTA11 0 R/W
700701 h Bit 6 FTA10 1 R/W 7h Bit 6 FTA2 0 R/W 1h Bit 6 FTB6 0 R/W 75 h Bit 6 RON3 1 R/W C0 h Bit 6 IDL0 1 R/W 80 h Bit 6 HDL0 0 R/W 80 h Bit 6 RSSI6 0 R[A] Bit 5 RSSI5 0 R[A] Bit 4 RSSI4 0 R[A] Bank B Registers Bit 3 RSSI3 0 R[A] Bit 2 RSSI2 0 R[A] Bit 1 RSSI1 0 R[A] Bit 0 RSSI0 0 R[A] Bit 5 HD5 0 R/W Bit 4 HD4 0 R/W Bit 3 HD3 0 R/W Bit 2 HD2 0 R/W Bit 1 HD1 0 R/W Bit 0 HD0 0 R/W Bit 5 ID5 0 R/W Bit 4 ID4 0 R/W Bit 3 ID3 0 R/W Bit 2 ID2 0 R/W Bit 1 ID1 0 R/W Bit 0 ID0 0 R/W Bit 5 RON2 1 R/W Bit 4 RON1 1 R/W Bit 3 RON0 1 R/W Bit 2 ROFF2 1 R/W Bit 1 ROFF1 1 R/W Bit 0 ROFF0 1 R/W Bit 5 FTB5 0 R/W Bit 4 FTB4 0 R/W Bit 3 FTB3 0 R/W Bit 2 FTB2 0 R/W Bit 1 FTB1 0 R/W Bit 0 FTB0 1 R/W Bit 5 FTA1 0 R/W Bit 4 FTA0 0 R/W Bit 3 FTB11 0 R/W Bit 2 FTB10 1 R/W Bit 1 FTB9 1 R/W Bit 0 FTB8 1 R/W Bit 5 FTA9 1 R/W Bit 4 FTA8 1 R/W Bit 3 FTA7 0 R/W Bit 2 FTA6 0 R/W Bit 1 FTA5 0 R/W Bit 0 FTA4 0 R/W
48 MC33696 Data Sheet, Rev. 12 Freescale Semiconductor
Figure 35. Bank Registers (continued)
Transition Time
20
Transition Time
Table 24. Transition Time Definition
Transition State x -> y Crystal Oscillator Startup Time, Parameter 5.10 Receiver Receiver Preamble On-to-Off Time, Parameter 1.12 Time1
Table 24 details the different times that must be considered for a given transition in the state machine, once the logic conditions for that transition are met.
PLL Timing
Standby to SPI running, state 60 -> 1 Standby to receiver running, states 5 -> 5b, 20 -> 21 Off to receiver running, states 0 -> 0b, 10 -> 11 Configuration to receiver running, states 1 -> (0b, 5b, 11, 21) Configuration to transmitter mode, state 1 -> 30
Lock time parameter 5.9 Lock time parameter 5.9 0 or lock time parameter 5.1 or lock time parameter 5.9 2

Receiver running to configuration mode, state (0b, 5b, 11, 12, 13, 21, 22, 23) -> 1, Transmitter mode to configuration mode, state 30 -> 1 Receiver running to standby mode, state 5b -> 5, (21, 22, 23) -> 20 Receiver running to off mode, state 0b -> 0, (11, 12, 13) -> 10
0 or lock time parameter 5.1 or lock time parameter 5.9 2 When CONFB=0, the transition from receive mode to configuration mode is immediate. When CONFB=0, the transition from transmit mode to configuration mode is immediate.
NOTES: 1 See Section 12.2.3, "Frame Format." 2 Depending on the PLL status before entering configuration mode. For example, the transition time from standby to receiver running (FSK modulation, 19.2 kBd, AFFC = 0, data manager enabled) is: 0.6 ms + 50 s + (3 + 1)/19.2k = 970 s.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 49
Electrical Characteristics
21
Electrical Characteristics
21.1 General Parameters
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 47, Figure 48, Figure 51, Figure 53 through Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Parameter 1.2 Supply current in receive mode 1.3 Test Conditions Comments Receiver on Strobe oscillator only Limits Unit Min -- -- -- -- -- -- -- -- 2.4 -- -- 1.4 2.4 Typ 10.3 24 13.5 6.1 260 800 35 100 2.6 VCC-0.1 0.7 x VCCDIG 1.6 -- Max 13 50 17.5 8 700 1200 50 -- 2.8 -- -- 1.8 -- mA A mA mA nA nA A s V V V V V
1.4 Supply current in transmit mode Continuous wave (CW) OLA[1:0}=00 1.5 No power output
1.6 Supply current in standby mode -40C TA 25C 1.8 1.9 Supply current in LVD mode 1.12 Receiver on-to-off time 1.13 VCC2 voltage regulator output 1.14 1.15 VCCDIG2 voltage regulator output 1.16 1.19 Voltage on VCC (Preregulator output) TA = 85C LVDE = 1 Supply current reduced to 10% 2.7 V < VCC 2.1 V VCC 2.7 V Circuit in standby mode (VCCDIG = 3 V) Circuit in all other modes Receive mode with VCCIN=5V
21.2 Receiver: RF Parameters
RF parameters assume a matching network between test equipment and the D.U.T, and apply to all bands unless otherwise specified.
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 47, Figure 48, Figure 51, Figure 53 through Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Limits Parameter Test Conditions, Comments Max (FCE, FJE) -99 Max (FCAE, FJAE) -97 Unit
Min --
Typ -104
2.2 OOK sensitivity at 315 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, PER = 0.1
dBm
MC33696 Data Sheet, Rev. 12 50 Freescale Semiconductor
Electrical Characteristics Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 47, Figure 48, Figure 51, Figure 53 through Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Limits Parameter Test Conditions, Comments Max (FCE, FJE) -98 -98 -98 -102 Max (FCAE, FJAE) -96 -96 -96 -100 Unit
Min -- -- -- --
Typ -103.5 -103 -103 -106.5
2.40 OOK sensitivity at 434 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, PER = 0.1 2.41 OOK sensitivity at 868 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, PER = 0.1 2.42 OOK sensitivity at 916 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, PER = 0.1 2.24 FSK sensitivity at 315 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, DFcarrier = 64 kHz, PER = 0.1 DME = 1, DSREF = 1, DR = 4.8 kbps, DFcarrier = 64 kHz, PER = 0.1 DME = 1, DSREF = 1, DR = 4.8 kbps, DFcarrier = 64 kHz, PER = 0.1 DME = 1, DSREF = 1, DR = 4.8 kbps, DFcarrier = 64 kHz, PER = 0.1 DME = 0
dBm dBm dBm dBm
2.50 FSK sensitivity at 434 MHz
--
-105.5
-101
-99
dBm
2.51 FSK sensitivity at 868 MHz
--
-104.5
-100
-98
dBm
2.52 FSK sensitivity at 916 MHz
--
-105.4
-102
-100
dBm
2.35 Sensitivity improvement in RAW mode 2.36 Duty Cycle for Manchester coded data 2.37 Data Rate1 2.38 FSK deviation range 2.5 Sensitivity reduction 2.6 2.7 2.8 2.9 In-band jammer desensitization 2.60 2.11 Out-of-band jammer desensitization 2.12 2.13 RFIN parallel resistance
-- 47 2 32
0.6 -- -- 64 0 8 16 30 -4 -6 37 40 300
-- 53 22.6 170 -- -- -- -- -- -- -- -- --
-- 53 22.6 170 -- -- -- -- -- -- -- -- --
dB % kbps kHz dB dB dB dB dBc dBc dBc dBc
ILA[1:0] = 00 ILA[1:0] = 01 ILA[1:0] = 10 ILA[1:0] = 11 Sensitivity reduced by 3 dB CW jammer at Fcarrier 50 kHz/OOK Sensitivity reduced by 3 dB CW jammer at Fcarrier 50 kHz/FSK Sensitivity reduced by 3dB CW jammer at Fcarrier 1 MHz Sensitivity reduced by 3dB CW jammer at Fcarrier 2 MHz Receive mode
-- -- -- -- -- -- -- -- --
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 51
Electrical Characteristics Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 47, Figure 48, Figure 51, Figure 53 through Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Limits Parameter Test Conditions, Comments Max (FCE, FJE) -- -- -- -- -- -- Max (FCAE, FJAE) -- -- -- -- -- -- Unit
Min 1300 -- -25 -10 20 15
Typ -- 1.2 -- -- 36 20
2.14 RFIN parallel resistance 2.15 RFIN parallel capacitance
Transmit mode Receive and transmit modes
pF dBm dBm dB dB
2.17 Maximum detectable signal, Modulation depth: 99%, OOK level measured on a NRZ `1' 2.25 Maximum detectable signal, Fcarrier = 64kHz FSK 2.18 Image frequency rejection 2.19 304-434 MHz 868-915 MHz
NOTES: 1 See Table 10 for additional information.
OOK Sensitivity Variation vs Temperature (Ref : 3V, 25C, 4800bps) 1.4 1.2 Sensitivity Variation (dB) 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -40C 315 MHz 434 MHz 868 MHz 916 MHz
25C Temperature (C)
85C
Figure 36. OOK Sensitivity Variation Versus Temperature
MC33696 Data Sheet, Rev. 12 52 Freescale Semiconductor
Electrical Characteristics
OOK Sensitivity Variation vs Voltage (Ref : 3V, 25C, 4800bps) 0.2 0.1 Sensitivity Variation (dB) 0 -0.1 -0.2 -0.3 -0.4 -0.5 2.1 V 315 MHz 434 MHz 868 MHz 916 MHz
2.4 V
Voltage (V)
3V
3.6 V
Figure 37. OOK Sensitivity Variation Versus Voltage
FSK Sensitivity Variation vs Temperature (Ref : 3V, 25C, +/-64kHz, 4800 bps ) 1.4 1.2 1 Sensitivity Variation (dB) 0.8 0.6 0.4 0.2 0 315 MHz 434 MHz 868 MHz 916 MHz
-0.2 -0.4 -0.6 -40C
25C Temperature (C)
85C
Figure 38. FSK Sensitivity Variation Versus Temperature
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 53
Electrical Characteristics
FSK Sensitivity Variation vs Voltage (Ref : 3V, 25C, +/-64kHz, 4800bps ) 0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 2.1 V
315 MHz 434 MHz 868 MHz 916 MHz
Sensitivity Variaition (dB)
2.4 V
Voltage (V)
3V
3.6 V
Figure 39. FSK Sensitivity Variation Versus Voltage
Sensitivity Variation Versus Data Rate (Ref : 25C, 3V, 434MHz , OOK, 4800bps) 5 4 Sensitivity Variation (dB) 3 2 1 0 -1 -2 -3 2400
4800 Data Rate (bps)
9600
19200
Figure 40. OOK Sensitivity Variation Versus Data Rate
MC33696 Data Sheet, Rev. 12 54 Freescale Semiconductor
Electrical Characteristics
Sensitivity Variation vs Data Rate (Ref : 25C, 3V, 434MHz , FSK +/-64kHz, 4800bps) 5 4 Sensitivity Variation (dB) 3 2 1 0 -1 -2 -3 2400
4800 Data Rate (bps)
9600
19200
Figure 41. FSK Sensitivity Variation Versus Data Rate
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 55
Electrical Characteristics
Sensitivity Variation Versus Frequency Deviation (Ref : 25C, 3V, 434MHz, FSK +/-64kHz, 4800bps)
2,0
1,5
Sensitivity Variation (dB)
1,0
0,5
0,0
-0,5
-1,0 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170
Frequency Deviation (kHz)
Figure 42. FSK Sensitivity Variation Versus Frequency Deviation
21.3 Receiver Parameters
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematics Figure 47, Figure 48, Figure 53 through Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Parameter Test Conditions Comments Limits Unit Min Typ Max
Receiver: IF filter, IF Amplifier, FM-to-AM Converter and Envelope Detector 3.1 IF center frequency 3.2 IF bandwidth at -3dB 3.3 IF cut-off low frequency at -3 dB Refer to Section 9, "Frequency Planning". 3.4 IF cut-off high frequency at -3 dB 3.12 Recovery time from strong signal OOK modulation, 2.4 kbps, FAGC = 0, input signal from -50 dBm to -100 dBm -- -- -- 1.635 -- 1.5 380 -- -- 15 -- -- 1.387 -- -- MHz kHz MHz MHz ms
MC33696 Data Sheet, Rev. 12 56 Freescale Semiconductor
Electrical Characteristics Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematics Figure 47, Figure 48, Figure 53 through Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Parameter Test Conditions Comments Limits Unit Min Typ Max
Receiver: Analog and Digital RSSI 3.51 Analog RSSI output signal for Input signal @-108 dBm 3.52 Analog RSSI output signal for Input signal @-100 dBm 3.53 Analog RSSI output signal for Input signal @-70 dBm 3.54 Analog RSSI output signal for Input signal @-28 dBm 3.55 Digital RSSI Registers for Input signal @-108 dBm 3.56 Digital RSSI Registers for Input signal @-100 dBm 3.57 Digital RSSI Registers for Input signal @-70 dBm 3.58 Digital RSSI Registers for Input signal @-28 dBm 3.59 Digital RSSI Registers for Input signal @-70 dBm 3.6 Digital RSSI Registers for Input signal @-50 dBm 3.61 Digital RSSI Registers for Input signal @-24 dBm RSSI [4:7] RSSI [0:3] Measured on RSSIOUT 380 420 850 1000 0 0 9 13 0 4 13 -- -- -- -- -- -- -- -- -- -- -- 650 700 1200 1300 2 3 13 16 2 8 15 mV mV mV mV
21.4 Transmitter: RF Parameters
RF parameters assume a matching network between test equipment and the D.U.T, and apply to all bands unless otherwise specified.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 57
Electrical Characteristics Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 51, Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Limits Parameter Test Conditions Comments Min (FCE, FJE) 4 3.5 2.3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- OLA[1:0] = 00, RX mode OLA[1:0] = 00, RX mode OLA[1:0] = 00, RX mode OLA[1:0] = 00, RX mode -- -- -- -- -- Min (FCAE, FJAE) 2 1.5 0.3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Unit Typ 7.25 6.8 5.7 5.8 0 6 12 25 -33 -32 -50 -54 -41 -49 -53 -58 -54 -57 -56 -57 3 2500 2100 1300 1200 310 Max 11 10 10 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- dBm dBm dBm dBm dB dB dB dB dBc dBc dBc dBc dBc dBc dBc dBc dBm dBm dBm dBm s
4.1 Output power at 315 MHz 4.16 Output power at 434 MHz 4.2 Output power at 868 MHz 4.25 Output power at 916 MHz 4.20 Output power attenuation 4.3 4.4 4.5 4.10 Harmonic 2 level at 315 MHz 4.17 Harmonic 2 level at 434 MHz 4.11 Harmonic 2 level at 868 MHz 4.20 Harmonic 2 level at 916 MHz 4.12 Harmonic 3 level at 315 MHz 4.18 Harmonic 3 level at 434 MHz 4.13 Harmonic 3 level at 868 MHz 4.21 Harmonic 3 level at 916 MHz
OLA[1:0] = 00, VCC = 3.0 V, TA = 25C OLA[1:0] = 00, VCC = 3.0 V, TA = 25C OLA[1:0] = 00, VCC = 3.0 V, TA = 25C OLA[1:0] = 00, VCC = 3.0 V, TA = 25C OLA[1:0] = 00 OLA[1:0] = 01 OLA[1:0] = 10 OLA[1:0] = 11 OLA[1:0] = 00 OLA[1:0] = 00 OLA[1:0] = 00 OLA[1:0] = 00 OLA[1:0] = 00 OLA[1:0] = 00 OLA[1:0] = 00 OLA[1:0] = 00
4.30 Spurious level at 315 MHz Fref OLA[1:0] = 00 4.14 Spurious level at 434 MHz Fref OLA[1:0] = 00 4.15 Spurious level at 868 MHz Fref OLA[1:0] = 00 4.31 Spurious level at 916 MHz Fref OLA[1:0] = 00 4.6 Output rise/fall time 4.7 RFOUT parallel resistance at 315 MHz 4.71 RFOUT parallel resistance at 434 MHz 4.72 RFOUT parallel resistance at 868 MHz 4.73 RFOUT parallel resistance at 916 MHz
4.8 RFOUT optimum load resistance OLA[1:0] = 00, TX mode at 315 MHz
MC33696 Data Sheet, Rev. 12 58 Freescale Semiconductor
Electrical Characteristics Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 51, Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Limits Parameter Test Conditions Comments Min (FCE, FJE) -- -- -- -- Min (FCAE, FJAE) -- -- -- -- Unit Typ 310 310 310 1 Max -- -- -- -- pF
4.81 RFOUT optimum load resistance OLA[1:0] = 00, TX mode at 434 MHz 4.82 RFOUT optimum load resistance OLA[1:0] = 00, TX mode at 868 MHz 4.83 RFOUT optimum load resistance OLA[1:0] = 00, TX mode at 916 MHz 4.9 RFOUT parallel capacitance Receive and transmit modes
Output Power Variation vs Temperature (Ref : 25C, 3V) 0.6 0.5 Output Power Variation (dB) 0.4 0.3 0.2 0.1 0 315 MHz 434 MHz 868 MHz 916 MHz
-0.1 -0.2 -0.3 -40C
25C Temperature (C)
85C
Figure 43. Output Power Versus Temperature
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 59
Electrical Characteristics
Output Power Variation vs Voltage (Ref : 3V, 25C) 0.4 0.2 Output Power Variation (dB) 0 -0.2 -0.4 -0.6 -0.8 -1 2.1 V
315 MHz 434 MHz 868 MHz 916 MHz
2.4 V Voltage (V)
3V
3.6 V
Figure 44. Output Power Versus Supply Voltage
21.5 PLL & Crystal Oscillator
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 47 to Figure 54 through Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25 C. Parameter 5.9 PLL lock time 5.1 Toggle time between 2 frequencies 5.21 Occupied bandwidth @ 99% 5.22 5.23 5.24 5.10 Crystal oscillator startup time 5.8 Crystal series resistance Test Conditions Comments RF frequency 25kHz RF frequency step <1.5MHz, RF frequency 25kHz OOK 1.2 kbps OOK 19.2 kbps FSK 128 kHz, 1.2 kbps FSK 128 kHz, 19.2 kbps Limits Unit Min -- -- -- -- -- -- -- -- Typ 50 30 58 248 160 278 0.6 -- Max 100 -- -- -- -- -- 1.2 120 s s kHz kHz kHz kHz ms
Examples of crystal characteristics are given in Table 25.
MC33696 Data Sheet, Rev. 12 60 Freescale Semiconductor
Electrical Characteristics
Table 25. Typical Crystal Reference and Characteristics
Reference & Type 315 MHz LN-G102-1183 NX5032GA NDK 17.5814 8 25 434 MHz LN-G102-1182 NX5032GA NDK 24.19066 8 15 868 MHz EXS00A-01654 NX5032GA NDK 24.16139 8 <70
Parameter Frequency Load capacitance ESR
Unit MHz pF
21.6 Strobe Oscillator (SOE = 1)
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 48 through Figure 46, Figure 50), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Parameter 6.1 Period range 6.2 External capacitor C3 6.3 Sourced/sink current 6.4 High threshold voltage 6.5 Low threshold voltage 6.6 Overall timing accuracy With 1% resistor R13 & 5% capacitor C3, 3 sigma variations With 1% resistor R13 Test Conditions Comments TStrobe = 106.C3 Limits Unit Min 0.1 0.1 -- -- -- -14.2 Typ -- -- 1 1 0.5 -- Max -- 10 -- -- -- 15.8 ms nF A V V %
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 61
Electrical Characteristics
21.7 Digital Input: CONFB, MOSI, SCLK, SEB, STROBE, RSSIC
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 47 to Figure 54 through Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Parameter 7.7 Input low voltage 7.8 Input high voltage 7.9 Input hysteresis 7.10 Input low voltage 7.11 Input high voltage 7.12 Input hysteresis 7.5 Sink current 7.6 Configuration, receive, transmit modes standby or LVD modes CONFB, STROBE
2
Test Conditions Comments MOSI, SCLK, SEB, RSSIC(1)
Limits Unit Min -- 0.8 x VCC2 0.1 x VCC2 -- 0.8 x VCCDIG2 0.1 x VCCDIG2 1 0.5 Typ -- -- -- -- -- -- -- -- Max 0.4 x VCC2 -- -- 0.4 x VCCDIG2 -- -- 100 10 V V V V V V nA nA
NOTES: 1 Input levels of those pins are referenced to V CC2 which depends upon VCC (see Section 5, "Power Supply"). 2 Input levels of those pins are referenced to VCCDIG2 which depends upon the circuit state (see Section 5, "Power Supply").
21.8 Digital Output
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 47 to Figure 54 through Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Parameter Test Conditions Comments Limits Unit Min Typ Max
Digital Output: DATACLK, LVD, MISO, MOSI, SCLK 8.1 Output low voltage 8.2 Output high voltage 8.3 Fall and rise time From 10% to 90% of the output swing, CLOAD = 10pF |ILOAD| = 50 A -- 0.8 x VCCIO -- -- -- 80 0.2 x VCCIO -- 150 V V ns
Digital Output: SWITCH (VCC = 3V) 8.4 Output low voltage 8.5 Output high voltage |ILOAD| = 50 A -- 0.8 x VCC -- -- 0.2 x VCC -- V V
MC33696 Data Sheet, Rev. 12 62 Freescale Semiconductor
Electrical Characteristics
21.9 Digital Interface Timing
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 47 to Figure 54 through Figure 54), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25C. Parameter 9.2 SCLK period 9.8 Configuration enable time 9.3 Enable lead time 9.4 Enable lag time 9.5 Sequential transfer delay 9.6 Data hold time 9.7 Data setup time 9.9 9.10 Data setup time Receive mode, DME = 1, from SCLK to MOSI Configuration mode, from SCLK to MISO Configuration mode, from SCLK to MOSI Configuration mode, from SCLK to MOSI Crystal oscillator is running. 3x Test Conditions Comments Limits Unit Min 1 20 Tdigclk1 100 100 3 x Tdigclk1 -- 120 100 Typ -- -- -- -- -- -- -- -- -- Max -- -- -- -- --2 -- 100 -- -- s s s ns ns s ns ns ns
NOTES: 1 See Section 9.1, "Clock Generator" for T digclk values. 2 The digital interface can be used in SPI burst protocol, i.e., with a continuous clock on SCLK port. For example, one (or more) read access followed by one (or more) write access and so on. In this case and for a practical use, the pulse required on CONFB between accesses must be higher than 100 ns only if STROBE signal is always set to high level.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 63
Application Schematics
STROBE
CONFB
9.8
SEB
9.3 9.4 9.5
SCLK
9.2 9.10 9.9
MOSI
9.7
MISO
Figure 45. Digital Interface Timing Diagram in Configuration Mode
SEB
CONFB
STROBE
9.3
SCLK (input) MOSI (output)
9.6
Figure 46. Digital Interface Timing Diagram in Receive Mode (DME = 1)
22
Application Schematics
Examples of application schematics are proposed for different uses: Receiver, Transmitter, Transceiver. Note: The external pullup resistor set on SEB pin (R2) is not mandatory. Instead of R2, an external pulldown resistor of 10 k may be connected between SEB pin and ground.
22.1 Receiver Schematics
Figure 43 and Figure 44 show the application schematic in receive mode for 3 V operation.
MC33696 Data Sheet, Rev. 12 64 Freescale Semiconductor
Application Schematics
Figure 45 and Figure 46 show the application schematic in receive mode for 5 V operation.
22.1.1 Receiver Schematics in 3 V Operation--MCU Controls Wakeup
24 RSSIOUT 25 VCC C12 100pF VCC2 SWITCH C11 100nF 26 34 R4 10k
STROBE
MICROCONTROLLER
3V GND
VCC 31 30 28 29 32 27 26 25
VCC
GND
STROBE
LVD
VCC2IN
C1 100nF VCC2 L1 C2 1nF
GNDSUBD
SWITCH
GNDIO
VCCIN
R2 10k SEB SCLK MOSI 24 23 22 21 20 19 18 17
R3 10k 27 31 29 32 30 28 33 SEB SCLK MOSI MISO CONFB DATACLK RSSIC
1 2 3
RSSIOUT VCC2RF RFIN GNDLNA VCC2VCO GNDPA1 RFOUT
C3
C4
VCC2
4 5 6 7 8
U16 MC33696
MISO CONFB DATACLK RSSIC
C5 100pF
VCCINO UT
VCC2OUT
XTALOUT
VCCDIG
RBGAP 15 C10 100nF
XTALIN
GNDPA2
VCCDIG 2
GNDDIG GND 16 VCC
9
10
11
12
13
C7 1nF X7 C8 100nF
VCC2 C9 100nF R1 470k 1%
C6 6.8pF
Figure 47. MC33696 Application Schematic (3 V)
The ON/OFF sequencing in receive mode is controlled by driving a low or high level by the MCU on STROBE pin.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 65
14
Application Schematics
22.1.2 Receiver Schematics in 3V Operation--Strobe Oscillator Mode
C13 1nF VCC RSSIOUT
STROBE
MICROCONTROLLER
C12 100pF VCC2 SWITCH
3V C11 100nF GND
VCC 30 27 32 31 28 26 29 25
VCC
GND
LVD
STROBE
SW ITCH
C1 100nF VCC2 L1 C2 1nF
1 2 3
GNDSUBD
VCC2IN
GNDIO
VCCIN
R2 10k SEB SCLK MOSI 24 23 22 21 20 19 18 17
R3 10k SEB SCLK MOSI MISO CONFB DATACLK RSSIC
RSSIOUT VCC2RF RFIN GNDLNA VCC2VCO GNDPA1 RFOUT
C3
C4
VCC2
4 5 6 7 8
U1 MC33696
MISO CONFB DATACLK RSSIC
C5 100pF
VCCINOUT
XT ALOUT
VCC2OUT
VCCDIG
RBGAP 15 C10 100nF
XTALIN
GNDPA2
VCCDIG2
GNDDIG GND 16 VCC
9
10
11
12
13
C7 1nF X4 C8 100 nF
VCC2 C9 100nF R1 470k 1%
C6 6.8pF
Figure 48. MC33696 Application Schematic in Strobe mode (3 V)
The ON/OFF sequencing in receive mode is controlled internally. The STROBE pin from the MCU has to be configured in high impedance and wakeup mode is available when SOE bit is enabled.
MC33696 Data Sheet, Rev. 12 66 Freescale Semiconductor
14
Application Schematics
22.1.3 Receiver Schematics in 5 V Operation--MCU Controls Wakeup
24 RSSIOUT
25 VCC C12 100pF VCC2 SWITCH C11 100nF 26 34 R5 10k
STROBE
MICROCONTROLLER
5V GND
VCC 30 31 32 29 28 27 26 25
VCC
GND
LVD
STROBE
VCC2IN
C1 100nF VCC2 L1 C2 1nF
1 2 3
GNDSUBD
SWITCH
GNDIO
VCCIN
R2 10k SEB SCLK MOSI 24 23 22 21 20 19 18 17
R3 10k 27 31 29 32 30 28 33 SEB SCLK MOSI MISO CONFB DATACLK RSSIC
RSSIOUT VCC2RF RFIN GNDLNA VCC2VCO GNDPA1 RFOUT
C3
C4
VCC2
4 5 6 7 8
U1 MC33696
MISO CONFB DATACLK RSSIC
C5 100pF
VCCINOUT
VCC2OUT
XTALOUT
VCCDIG
RBGAP 15 C10 100nF
XTALIN
GNDPA2
VCCDIG2
GNDDIG GND 16
9
10
11
12
13
C7 1nF X8 C8 100nF
VCC2 C9 100nF R1 470k 1%
C6 6.8pF
Figure 49. MC33696 Application Schematic (5 V)
The ON/OFF sequencing in receive mode is controlled by driving a low or high level by the MCU on STROBE pin.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 67
14
Application Schematics
22.1.4 Receiver Schematics in 5 V Operation--Strobe Oscillator Mode
13 C13 1nF VCC C12 100pF VCC2 SWITCH C11 100nF RSSIOUT 14 15 23
STROBE
MICROCONTROLLER
5V GND
VCC 30 32 27 26 31 29 28 25
VCC
GND
LVD
STROBE
SW ITCH
C1 100nF VCC2 L1 C2 1nF
1 2 3
GNDSUBD
VCC2IN
GNDIO
VCCIN
R2 10k SEB SCLK MOSI 24 23 22 21 20 19 18 17
R3 10k 16 20 18 21 19 17 22 SEB SCLK MOSI MISO CONFB DATACLK RSSIC
RSSIOUT VCC2RF RFIN GNDLNA VCC2VCO GNDPA1 RFOUT
C3
C4
VCC2
4 5 6 7 8
U17 MC33696
MISO CONFB DATACLK RSSIC
C5 100pF
VCCINOUT
VCC2OUT
XT ALOUT
VCCDIG
RBGAP 15 C10 100nF
XTALIN
GNDPA2
VCCDIG2
GNDDIG GND 16
9
10
11
12
13
C7 1nF X5 C8 100 nF VCC2 C9 100nF R1 470k 1%
C6 6.8pF
Figure 50. MC33696 Application Schematic in Strobe Mode (5 V)
The ON/OFF sequencing in receive mode is controlled internally. The STROBE pin from the MCU has to be configured in high impedance and wake up mode is available when SOE bit is enabled.
MC33696 Data Sheet, Rev. 12 68 Freescale Semiconductor
14
Application Schematics
22.2 Transmitter Schematics
22.2.1 Transmitter Schematics in 3 V Operation
Figure 51 shows the application schematic in transmit mode for 3 V operation.
25 VCC C12 1 00pF VCC2 SWITCH VCC 30 31 28 32 29 27 26 25 VCC C11 100nF 26 34 R4 10k
STROBE
MICROCONTROLLER
3V GND
G ND
LVD
STROBE
VCC C13 100nF C1 100nF VCC2 1 2 3 C2 100pF VCC2 4 5 6 7 C5 C3 C4 1nF 8
GNDSUBD
SWITCH
VCC2IN
GNDIO
VCCIN
R2 10k SEB SCLK MOSI 24 23 22 21 20 19 18 17
R3 10k 27 31 29 32 30 28 SEB SCLK MOSI MISO CONFB DATACLK
RSSIOUT VCC2RF RFIN GNDLNA VCC2VCO GNDPA1 RFOUT
C14 100pF L2 L1
U1 MC33696
MISO CONFB DATACLK RSSIC
VCCINO UT
VCC2OUT
XTALOUT
VCCDIG
X TALIN
RBGAP 15 C10 100nF
GNDPA2
VCCDIG 2
GNDDIG GND 16 VCC
9
10
11
12
13
C7 1nF X9 C6 6.8pF C8 100nF
VCC2 C9 100nF R1 470k 1%
Figure 51. MC33696MC33596 Application Schematic (3 V) in Transmit Mode Only
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 69
14
Application Schematics
22.2.2 Transmitter Schematics in 5 V Operation
Figure 52 shows the application schematic in transmit mode for 5V operation.
24 RSSIOUT 25 26 C11 100nF 34 R4 10k
STROBE
MICROCONTROLLER MICROCONTROLLER
C12 100pF VCC2 SWITCH
5V GND
VCC 31 28 32 30 29 27 26 25
VCC
GND
STROBE
LVD
VCCIN
SWITCH
VCC2IN
VCC C13 100nF C1 1uF 1 VCC2 2 3 C14 100pF VCC2 L2 L1 C5 1nF C2 100pF 4 5 6 7 8
GNDSUBD
GNDIO
R2 10k SEB SCLK MOSI 24 23 22 21 20 19 18 17
R3 10k 27 31 29 32 30 28 33 SEB SCLK MOSI MISO CONFB DATACLK RSSIC
RSSIOUT VCC2RF RFIN GNDLNA VCC2VCO GNDPA1 RFOUT
U12 MC33696
MISO CONFB DATACLK RSSIC
VCCINO UT
VCC2OUT
XT ALOUT
VCCDIG
RBGAP 15
XT ALIN
C3
C4
GNDPA2
VCCDIG 2
GNDDIG GND 16
9
10
11
12
13
14
C7 1nF X12 C8 100nF C6 6.8pF
VCC VCC2 C9 100nF C10 100nF R1 470k 1%
Figure 52. MC33696MC33596 Application Schematic (5 V) in Transmit Mode Only
MC33696 Data Sheet, Rev. 12 70 Freescale Semiconductor
Application Schematics
22.3 Transceiver Schematics
22.3.1 Transceiver Schematics in 3 V Operation
Figure 53 shows the application schematic in transceiver mode for 3 V operation.
24 RSSIOUT
25 VCC C12 100pF VCC2 SWITCH C11 100nF 26 34 R4 10k
STROBE
MICROCONTROLLER
3V GND
VCC 31 30 32 29 28 27 26 25
VCC
GND
STROBE
LVD
VCC2IN
VCC C13 100nF C1 100nF VCC2 1 2 3 VCC2 C15 1nF C2 100pF 4 5 6 7 8
GNDSUBD
SW ITCH
GNDIO
VC CIN
R2 10k SEB SCLK MOSI 24 23 22 21 20 19 18 17
R3 10k 27 31 29 32 30 28 33 SEB SCLK MOSI MISO CONFB DATACLK RSSIC
RSSIOUT VCC 2RF RFIN GND LNA VCC 2VCO GND PA1 RFOUT
C14 100pF L15 L1 C5 1nF
U7 MC33696
MISO CONFB DATACLK RSSIC
VCCINO UT
VCC2OUT
XTALOUT
VCCDIG
RBGAP 15 C10 100nF
XTALIN
C3
C4
GND PA2
VCCDIG 2
GNDDIG GND 16 VCC
9
10
11
12
13
C7 1nF X10 C8 100nF
VCC2 C9 100nF R1 470k 1%
C6 6.8pF
Figure 53. MC33696 Application Schematic (3 V) in Transceiver Mode
The ON/OFF sequencing for the receiver is controlled by driving a low or high level by the MCU on STROBE pin.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 71
14
Application Schematics
22.3.2 Transceiver Schematics in 5 V Operation
Figure 54 shows the application schematic in transceiver mode for 5 V operation.
24 RSSIOUT 25 26 C11 100nF 34 R4 10k
STROBE
MICROCONTROLLER MICROCONTROLLER
C12 100pF VCC2 SWITCH
5V GND
VCC 27 31 30 32 29 28 26 25
VCC
GND
GNDSUBD
STROBE
VCC2IN
LVD
SWITCH
VCC C13 100nF C1 1uF VCC2 1 2 C14 100pF L2 L1 C5 1nF C15 1nF C2 100pF 3 VCC2 4 5 6 7 8
GNDIO
VCCIN
R2 10k SEB SCLK MOSI 24 23 22 21 20 19 18 17
R3 10k 27 31 29 32 30 28 33 SEB SCLK MOSI MISO CONFB DAT ACLK RSSIC
RSSIOUT VCC2RF RFIN GNDLNA VCC2VCO GNDPA1 RFOUT
U11 MC33696
MISO CONFB DATACLK RSSIC
VCCINO UT
VCC2OUT
XTALOUT
XTALIN
RBGAP 15
C3
C4
VCCDIG
GNDPA2
VCCDIG 2
GNDDIG GND 16
9
10
11
12
13
14
C7 1nF X11 C8 100nF VCC2 C9 100nF C10 100nF
VCC
R1 470k 1%
C6 6.8pF
Figure 54. MC33696 Application Schematic (5 V) in Transceiver Mode
The ON/OFF sequencing for the receiver is controlled by driving a low or high level by the MCU on STROBE pin.
MC33696 Data Sheet, Rev. 12 72 Freescale Semiconductor
PCB Design Recommendations
23
PCB Design Recommendations
Pay attention to the following points and recommendations when designing the layout of the PCB. * Ground Plane -- If you can afford a multilayer PCB, use an internal layer for the ground plane, route power supply and digital signals on the last layer, with RF components on the first layer. -- Use at least a double-sided PCB. -- Use a large ground plane on the opposite layer. -- If the ground plane must be cut on the opposite layer for routing some signals, maintain continuity with another ground plane on the opposite layer and a lot of via to minimize parasitic inductance. * Power Supply, Ground Connection and Decoupling -- Connect each ground pin to the ground plane using a separate via for each signal; do not use common vias. -- Place each decoupling capacitor as close to the corresponding VCC pin as possible (no more than 2-3 mm away). -- Locate the VCCDIG2 decoupling capacitor (C10) directly between VCCDIG2 (pin 14) and GND (pin 16). -- GNDPA1 and GNDPA2 inductance to ground should be minimum. If possible, use two via for each pin. * RF Tracks, Matching Network and Other Components -- Minimize any tracks used for routing RF signals. -- Locate crystal X1 and associated capacitors C6 and C7 close to the MC33696. Avoid loops occurring due to component size and tracks. Avoid routing digital signals in this area. -- Use high frequency coils with high Q values for the frequency of operation (minimum of 15). Validate any change of coil source. -- Track between RFOUT and RFIN should be as short as possible to minimize lost in TX mode. NOTE The values indicated for the matching network have been computed and tuned for the MC33696 RF Modules available for MC33696 evaluation. Matching networks should be retuned if any change is made to the PCB (track width, length or place, or PCB thickness, or component value). Never use, as is, a matching network designed for another PCB.
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 73
Case Outline Dimensions
24
Case Outline Dimensions
24.1 LQFP32 Case
MC33696 Data Sheet, Rev. 12 74 Freescale Semiconductor
Case Outline Dimensions
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 75
Case Outline Dimensions
MC33696 Data Sheet, Rev. 12 76 Freescale Semiconductor
Case Outline Dimensions
24.2 QFN32 Case
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 77
Case Outline Dimensions
MC33696 Data Sheet, Rev. 12 78 Freescale Semiconductor
Case Outline Dimensions
MC33696 Data Sheet, Rev. 12 Freescale Semiconductor 79
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Document Number: MC33696 Rev. 12 02/2010

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