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Data Sheet June 24, 2008
Austin MicrolynxTM II SIP Non-isolated Power Modules: 2.4Vdc - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A Output Current
RoHS Compliant
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z versions) Compliant to ROHS EU Directive 2002/95/EC with lead solder exemption (non-Z versions) Flexible output voltage sequencing EZTM SEQUENCE Delivers up to 6A output current High efficiency - 96% at 3.3V full load (VIN = 5.0V)
EZ-SEQUENCETM
Applications
Distributed power architectures Intermediate bus voltage applications Telecommunications equipment Servers and storage applications Networking equipment Enterprise Networks Latest generation IC's (DSP, FPGA, ASIC) and Microprocessor powered applications
Small size and low profile: 25.4 mm x 12.7mm x 6.68 mm (1.00 in x 0. 5 in x 0.263 in) Low output ripple and noise High Reliability: Calculated MTBF = 12.8M hours at 25 C Full-load Programmable Output voltage Line Regulation: 0.3% (typical) Load Regulation: 0.4% (typical) Temperature Regulation: 0.4 % (typical) Remote On/Off Output overcurrent protection (non-latching) Wide operating temperature range (-40C to 85C) UL* 60950-1Recognized, CSA C22.2 No. 60950-1-03 Certified, and VDE 0805:2001-12 (EN60950-1) Licensed ISO** 9001 and ISO 14001 certified manufacturing facilities
o
Description
Austin MicroLynx II SIP power modules are non-isolated dc-dc converters that can deliver up to 6A of output current with full load efficiency of 96.0% at 3.3V output. These modules provide a precisely regulated output voltage programmable via an external resistor from 0.75Vdc to 3.63Vdc over a wide range of input voltage (VIN = 2.4 - TM TM 5.5Vdc). Austin MicroLynx II has a sequencing feature, EZ-SEQUENCE that enable designers to implement various types of output voltage sequencing when powering multiple modules on board. Their open-frame construction and small footprint enable designers to develop cost- and space-efficient solutions. In addition to sequencing, standard features include remote On/Off, programmable output voltage and over current protection.
* UL is a registered trademark of Underwriters Laboratories, Inc.

TM
CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards
Document No: DS04-024 ver. 1.22 PDF name: microlynx_II_sip_ds.pdf
Data Sheet June 24, 2008
Austin MicroLynxTM II SIPNon-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3. 63Vdc Output; 6A output current
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Input Voltage Continuous Sequencing voltage Operating Ambient Temperature (see Thermal Considerations section) Storage Temperature All Tstg -55 125 C All All Vseq TA -0.3 -40 VIN,max 85 Vdc C Device All Symbol VIN Min -0.3 Max 5.8 Unit Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Operating Input Voltage Maximum Input Current (VIN= VIN, min to VIN, max, IO=IO, max ) Input No Load Current (VIN = VIN, nom, Io = 0, module enabled) Input Stand-by Current (VIN = VIN, nom, module disabled) Inrush Transient Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1H source impedance; VIN, min to VIN, max, IO= IOmax ; See Test configuration section) Input Ripple Rejection (120Hz) All All All It 35 30
2
Device Vo,set 3.63 All VO,set = 0.75 Vdc VO,set = 3.3Vdc All
Symbol VIN IIN,max
Min 2.4
Typ
Max 5.5 6.0
Unit Vdc Adc
IIN,No load IIN,No load IIN,stand-by
20 45 0.6
mA mA mA
0.04
As mAp-p dB
2
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of a complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fastacting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data sheet for further information.
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Electrical Specifications (continued)
Parameter Output Voltage Set-point (VIN=IN, min, IO=IO, max, TA=25C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range Selected by an external resistor Output Regulation Line (VIN=VIN, min to VIN, max) Load (IO=IO, min to IO, max) Temperature (Tref=TA, min to TA, max) Output Ripple and Noise on nominal output (VIN=VIN, nom and IO=IO, min to IO, max Cout = 1F ceramic//10Ftantalum capacitors) RMS (5Hz to 20MHz bandwidth) Peak-to-Peak (5Hz to 20MHz bandwidth) External Capacitance ESR 1 m ESR 10 m Output Current Output Current Limit Inception (Hiccup Mode ) (VO= 90% of VO, set) Output Short-Circuit Current (VO250mV) ( Hiccup Mode ) Efficiency VIN= VIN, nom, TA=25C IO=IO, max , VO= VO,set VO, set = 0.75Vdc VO, set = 1.2Vdc VO,set = 1.5Vdc VO,set = 1.8Vdc VO,set = 2.5Vdc VO,set = 3.3Vdc Switching Frequency Dynamic Load Response (dIo/dt=2.5A/s; VIN = VIN, nom; TA=25C) Load Change from Io= 50% to 100% of Io,max; 1F ceramic// 10 F tantalum Peak Deviation Settling Time (Vo<10% peak deviation) (dIo/dt=2.5A/s; VIN = VIN, nom; TA=25C) Load Change from Io= 100% to 50%of Io,max: 1F ceramic// 10 F tantalum Peak Deviation Settling Time (Vo<10% peak deviation) All ts 25 s All All ts Vpk 25 130 s mV All Vpk 130 mV All fsw 81.0 87.0 89.0 90.0 93.0 96.0 300 % % % % % % kHz All IO, s/c 2 Adc All All All All CO, max CO, max Io IO, lim 0 220 1000 3000 6 F F Adc % Io All All 10 40 15 50 mVrms mVpk-pk All All All 0.3 0.4 0.4 % VO, set % VO, set % VO, set All VO 0.7525 3.63 Vdc All VO, set -3.0 +3.0 % VO, set Device All Symbol VO, set Min -2.0 Typ Max +2.0 Unit % VO, set
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Electrical Specifications (continued)
Parameter Dynamic Load Response (dIo/dt=2.5A/s; V VIN = VIN, nom; TA=25C) Load Change from Io= 50% to 100% of Io,max; Co = 2x150 F polymer capacitors Peak Deviation Settling Time (Vo<10% peak deviation) (dIo/dt=2.5A/s; VIN = VIN, nom; TA=25C) Load Change from Io= 100% to 50%of Io,max: Co = 2x150 F polymer capacitors Peak Deviation Settling Time (Vo<10% peak deviation) All All ts Vpk 50 50 s mV All Vpk 50 mV Device Symbol Min Typ Max Unit
All
ts
50
s
General Specifications
Parameter Calculated MTBF (IO=IO, max, TA=25C) per Telecordia SR-332 Issue 1: Method 1 Case 3 Weight 2.8 (0.1) g (oz.) Min Typ 12,841,800 Max Unit Hours
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information.
Parameter On/Off Signal interface Device code with Suffix "4" - Positive logic (On/Off is open collector/drain logic input; Signal referenced to GND - See feature description section) Input High Voltage (Module ON) Input High Current Input Low Voltage (Module OFF) Input Low Current Device Code with no suffix - Negative Logic (On/OFF pin is open collector/drain logic input with external pull-up resistor; signal referenced to GND) Input High Voltage (Module OFF) Input High Current Input Low Voltage (Module ON) Input low Current Turn-On Delay and Rise Times (IO=IO, max , VIN = VIN, nom, TA = 25 C, ) Case 1: On/Off input is set to Logic Low (Module ON) and then input power is applied (delay from instant at which VIN =VIN, min until Vo=10% of Vo,set) Case 2: Input power is applied for at least one second and then the On/Off input is set to logic Low (delay from instant at which Von/Off=0.3V until Vo=10% of Vo, set) Output voltage Rise time (time for Vo to rise from 10% of Vo,set to 90% of Vo, set) Output voltage overshoot - Startup IO= IO, max; VIN = 2.4 to 5.5Vdc, TA = 25 C Sequencing Delay time Delay from VIN, min to application of voltage on SEQ pin Tracking Accuracy (Power-Up: 2V/ms) (Power-Down: 1V/ms) (VIN, min to VIN, max; IO, min to IO, max VSEQ < Vo) Overtemperature Protection (See Thermal Consideration section) Input Undervoltage Lockout Turn-on Threshold Turn-off Threshold All All 2.2 2.0 V V All All All All TsEQ-delay |VSEQ -Vo | |VSEQ -Vo | Tref 10 100 200 150 200 400 msec mV mV C
o o
Device
Symbol
Min
Typ
Max
Unit
All All All All
VIH IIH VIL IIL
-0.2
0.2
VIN, max 10 0.3 1
V A V mA
All All All All
VIH IIH VIL IIL
1.5 -0.2
0.2
VIN,max 1 0.3 10
Vdc mA Vdc A
All
Tdelay
3.9
msec
All
Tdelay
3.9
msec
All
Trise
4.2
8.5 1
msec % VO, set
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Characteristic Curves
The following figures provide typical characteristics for the Austin MicroLynxTM II SIP modules at 25C.
91 88
98 95
EFFICIENCY, (%)
EFFICIENCY, (%)
85 82 79 76 73
92 89 86 83 80 77 74 0 1 2 3 4 5 6
VIN=2.4V VIN=5V VIN=5.5V
VIN=2.4V VIN=5V VIN=5.5V
70 0 1 2 3 4 5 6
OUTPUT CURRENT, IO (A)
OUTPUT CURRENT, IO (A)
Figure 1. Converter Efficiency versus Output Current (Vout = 0.75Vdc).
94 91
Figure 4. Converter Efficiency versus Output Current (Vout = 1.8Vdc).
98 95
EFFICIENCY, (%)
EFFICIENCY, (%)
88 85 82 79 76 73 70 0 1 2 3 4 5 6
92 89 86 83 VIN=3V 80 77 74 0 1 2 3 4 5 6 VIN=5V VIN=5.5V
VIN=2.4V VIN=5V VIN=5.5V
OUTPUT CURRENT, IO (A)
OUTPUT CURRENT, IO (A)
Figure 2. Converter Efficiency versus Output Current (Vout = 1.2Vdc).
94 91 88
Figure 5. Converter Efficiency versus Output Current (Vout = 2.5Vdc).
98 95
EFFICIENCY, (%)
85 82 79 76 73 70 0 1 2 3 4 5 6
EFFICIENCY, (%)
92 89 86 83 80 77 74 0 1 2 3 4 5 6 VIN=4.5V VIN=5V VIN=5.5V
VIN=2.4V VIN=5V VIN=5.5V
OUTPUT CURRENT, IO (A)
OUTPUT CURRENT, IO (A)
Figure 3. Converter Efficiency versus Output Current (Vout = 1.5Vdc).
Figure 6. Converter Efficiency versus Output Current (Vout = 3.3Vdc).
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Characteristic Curves (continued)
The following figures provide typical characteristics for the MicroLynxTM II SIP modules at 25C.
7 6 Io =6 A Io =3 A 5 Io =0 A 4 3 2 1 0 1 1.75 2 .5 3 .2 5 4 4 .75 5.5
OUTPUT CURRENT, OUTPUT VOLTAGE
INPUT CURRENT, IIN (A)
Figure 7. Input voltage vs. Input Current (Vout =2.5Vdc).
INPUT VOLTAGE, VIN (V)
IO (A) (2A/div)
VO (V) (100mV/div)
Figure 10. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 3.3Vdc).
OUTPUT CURRENT, OUTPUT VOLTAGE VO (V) (100mV/div)
TIME, t (5 s/div)
OUTPUT VOLTAGE
VO (V) (20mV/div)
IO (A) (2A/div)
TIME, t (2s/div)
TIME, t (5 s/div)
Figure 8. Typical Output Ripple and Noise (Vin = 5.0V dc, Vo = 0.75 Vdc, Io=6A).
Figure 11. Transient Response to Dynamic Load Change from 100% to 50% of full load (Vo = 3.3 Vdc).
OUTPUT CURRENT, OUTPUT VOLTAGE VO (V) (100mV/div) IO (A) (2A/div)
OUTPUT VOLTAGE
VO (V) (20mV/div)
TIME, t (2s/div)
TIME, t (10s/div)
Figure 9. Typical Output Ripple and Noise (Vin = 5.0V dc, Vo = 3.3 Vdc, Io=6A).
Figure 12. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 3.3 Vdc, Cext = 2x150 F Polymer Capacitors).
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Characteristic Curves (continued)
The following figures provide typical characteristics for the Austin MicroLynxTM II SIP modules at 25C.
OUTPUT CURRENT, OUTPUTVOLTAGE IO (A) (2A/div) VO (V) (100mV/div)
OUTPUT VOLTAGE, INPUT VOLTAGE
Vo (V) (1V/div)
VIN (V) (2V/div)
TIME, t (10s/div)
TIME, t (2 ms/div)
Figure 13. Transient Response to Dynamic Load Change from 100% of 50% full load (Vo = 3.3Vdc, Cext = 2x150 F Polymer Capacitors).
VOn/off (V) (2V/div) On/Off VOLTAGE
Figure 16. Typical Start-Up with application of Vin (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A).
On/Off VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT, VOn/off (V) (2V/div) IO (A) (5A/div) VOV) (1V/div)
OUTPUT VOLTAGE
VOV) (1V/div)
TIME, t (2 ms/div)
Figure 14. Typical Start-Up Using Remote On/Off (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A).
On/Off VOLTAGE VOn/off (V) (2V/div)
Figure 17 Typical Start-Up Using Remote On/Off with Prebias (Vin = 3.3Vdc, Vo = 1.8Vdc, Io = 1.0A, Vbias =1.0Vdc).
OUTPUT VOLTAGE
VOV) (1V/div)
TIME, t (2 ms/div)
TIME, t (5ms/div)
Figure 15. Typical Start-Up Using Remote On/Off with
Low-ESR external capacitors (7x150uF Polymer) (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A, Co = 1050F).
Figure 18. Output short circuit Current (Vin = 5.0Vdc, Vo = 0.75Vdc).
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Characteristic Curves (continued)
The following figures provide thermal derating curves for the Austin MicroLynxTM II SIP modules.
7.5 8
OUTPUT CURRENT, Io (A)
6.0
OUTPUT CURRENT, Io (A)
6
4.5 NC 3.0 0.5m/s (100 LFM ) 1.5 1.0m/s (200 LFM ) 0.0 20 30 40 50 60 70
O
5 NC 3 0.5m/s (100 LFM ) 2 1.0m/s (200 LFM ) 0 20 30 40 50 60 70
O
80
90
80
90
AMBIENT TEMPERATURE, TA C
AMBIENT TEMPERATURE, TA C
Figure 19. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0, Vo=3.3Vdc).
7.5
Figure 22. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 3.3dc, Vo=0.75 Vdc).
OUTPUT CURRENT, Io (A)
6.0
4.5 NC 3.0 0.5m/s (100 LFM ) 1.5 1.0m/s (200 LFM ) 0.0 20 30 40 50 60 70
O
80
90
AMBIENT TEMPERATURE, TA C
Figure 20. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0Vdc, Vo=0.75 Vdc).
7.5
OUTPUT CURRENT, Io (A)
6.0
4.5 NC 3.0 0.5m/s (100 LFM ) 1.5 1.0m/s (200 LFM ) 0.0 20 30 40 50 60 70
O
80
90
AMBIENT TEMPERATURE, TA C
Figure 21. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 3.3Vdc, Vo=2.5 Vdc).
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Test Configurations
TO OSCILLOSCOPE LTEST 1H VIN(+) CURRENT PROBE
Design Considerations
Input Filtering
The Austin MicroLynx II SIP module should be connected to a low-impedance source. A highly inductive source can affect the stability of the module. An input capacitance must be placed directly adjacent to the input pin of the module, to minimize input ripple voltage and ensure module stability. To minimize input voltage ripple, low-ESR polymer and ceramic capacitors are recommended at the input of the module. Figure 26 shows the input ripple voltage (mVp-p) for various outputs with 1x150 F polymer capacitors (Panasonic p/n: EEFUE0J151R, Sanyo p/n: 6TPE150M) in parallel with 1 x 47 F ceramic capacitor (Panasonic p/n: ECJ-5YB0J476M, Taiyo- Yuden p/n: CEJMK432BJ476MMT) at full load. Figure 27 shows the input ripple with 2x150 F polymer capacitors in parallel with 2 x 47 F ceramic capacitor at full load.
120
TM
BATTERY
CS 1000F Electrolytic E.S.R.<0.1 @ 20C 100kHz
CIN 2x100F Tantalum COM
NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 1H. Capacitor CS offsets possible battery impedance. Measure current as shown above.
Figure 23. Input Reflected Ripple Current Test Setup.
COPPER STRIP VO (+) 1uF COM . 10uF SCOPE RESISTIVE LOAD
Input Ripple Voltage (mVp-p)
100 80 60 40 Vin = 3.3V 20 Vin = 5.0V 0 0 1 2 3 4
GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
Figure 24. Output Ripple and Noise Test Setup.
Rdistribution
Rcontact VIN(+) VO
Rcontact
Rdistribution
VIN
VO
RLOAD
Output Voltage (Vdc) Figure 26. Input ripple voltage for various output with 1x150 F polymer and 1x47 F ceramic capacitors at the input (80% of Io,max).
120
Rdistribution
Rcontact COM COM
Rcontact
Rdistribution
Input Ripple Voltage (mVp-p)
100 80 60 40 20 0 0 1 2 3 4 Vin = 3.3V Vin = 5.0V
NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
Figure 25. Output Voltage and Efficiency Test Setup.
VO. IO Efficiency = VIN. IIN x 100 %
Output Voltage (Vdc) Figure 27. Input ripple voltage for various output with 2x150 F polymer and 2x47 F ceramic capacitors at the input (80% of Io,max).
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Design Considerations (continued)
Output Filtering
The Austin MicroLynx II SIP module is designed for low output ripple voltage and will meet the maximum output ripple specification with 1 F ceramic and 10 F tantalum capacitors at the output of the module. However, additional output filtering may be required by the system designer for a number of reasons. First, there may be a need to further reduce the output ripple and noise of the module. Second, the dynamic response characteristics may need to be customized to a particular load step change. To reduce the output ripple and improve the dynamic response to a step load change, additional capacitance at the output can be used. Low ESR polymer and ceramic capacitors are recommended to improve the dynamic response of the module. For stable operation of the module, limit the capacitance to less than the maximum output capacitance as specified in the electrical specification table.
TM
Safety Considerations
For safety agency approval the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standards, i.e., UL 60950-1, CSA C22.2 No. 60950-1-03, and VDE 0850:2001-12 (EN60950-1) Licensed. For the converter output to be considered meeting the requirements of safety extra-low voltage (SELV), the input must meet SELV requirements. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a fastacting fuse with a maximum rating of 6A in the positive input lead.
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Feature Description
Remote On/Off
The Austin Lynx II SIP power modules feature an On/Off pin for remote On/Off operation. Two On/Off logic options are available in the Austin LynxTM II series modules. Positive Logic On/Off signal, device code suffix "4", turns the module ON during a logic High on the On/Off pin and turns the module OFF during a logic Low. Negative logic On/Off signal, no device code suffix, turns the module OFF during logic High on the On/Off pin and turns the module ON during logic Low. For positive logic modules, the circuit configuration for using the On/Off pin is shown in Figure 28. The On/Off pin is an open collector/drain logic input signal (Von/Off) that is referenced to ground. During a logic-high (On/Off pin is pulled high internal to the module) when the transistor Q1 is in the Off state, the power module is ON. Maximum allowable leakage current of the transistor when Von/off = VIN,max is 10A. Applying a logic-low when the transistor Q1 is turned-On, the power module is OFF. During this state VOn/Off must be less than 0.3V. When not using positive logic On/off pin, leave the pin unconnected or tie to VIN.
TM
VIN+ Rpull-up I ON/OFF ON/OFF + VON/OFF
MODULE
PWM Enable R1 Q2 R2 CSS
Q1
GND
_
Figure 29. Circuit configuration for using negative logic On/OFF.
Overcurrent Protection
To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. The unit operates normally once the output current is brought back into its specified range. The typical average output current during hiccup is 2A.
VIN+ R2 ON/OFF VON/OFF + R1 Q2
MODULE
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit, module operation is disabled. The module will begin to operate at an input voltage above the undervoltage lockout turn-on threshold.
I ON/OFF
PWM Enable R3 Q1 Q3 R4 CSS
Overtemperature Protection
To provide over temperature protection in a fault condition, the unit relies upon the thermal protection feature of the controller IC. The unit will shutdown if the o thermal reference point Tref, exceeds 150 C (typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module will automatically restart after it cools down.
GND
_
Figure 28. Circuit configuration for using positive logic On/OFF. For negative logic On/Off devices, the circuit configuration is shown is Figure 29. The On/Off pin is pulled high with an external pull-up resistor (typical Rpull-up = 5k, +/- 5%). When transistor Q1 is in the Off state, logic High is applied to the On/Off pin and the power module is Off. The minimum On/off voltage for logic High on the On/Off pin is 1.5Vdc. To turn the module ON, logic Low is applied to the On/Off pin by turning ON Q1. When not using the negative logic On/Off, leave the pin unconnected or tie to GND.
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Feature Descriptions (continued)
Output Voltage Programming
The output voltage of the Austin MicroLynx II SIP can be programmed to any voltage from 0.75 Vdc to 3.3 Vdc by connecting a single resistor (shown as Rtrim in Figure 30) between the TRIM and GND pins of the module. Without an external resistor between TRIM pin and the ground, the output voltage of the module is 0.7525 Vdc. To calculate the value of the resistor Rtrim for a particular output voltage Vo, use the following equation:
TM
electrical specification. The POL Programming Tool, available at www.lineagepower.com under the Design Tools section, helps determine the required external trim resistor needed for a specific output voltage.
Voltage Margining
Output voltage margining can be implemented in the TM Austin MicroLynx II modules by connecting a resistor, Rmargin-up, from the Trim pin to the ground pin for margining-up the output voltage and by connecting a resistor, Rmargin-down, from the Trim pin to the Output pin for margining-down. Figure 31 shows the circuit configuration for output voltage margining. The POL Programming Tool, available at www.lineagepower.com under the Design Tools section, also calculates the values of Rmargin-up and Rmargin-down for a specific output voltage and % margin. Please consult your local Lineage Power technical representative for additional details.
Vo Rmargin-down
21070 Rtrim = - 5110 Vo - 0.7525
For example, to program the output voltage of the Austin TM MicroLynx II module to 1.8 Vdc, Rtrim is calculated is follows:
21070 - 5110 Rtrim = 1.8 - 0.7525
Rtrim = 15.004k
V IN(+) V O(+)
Vout
Austin Lynx or Lynx II Series Q2
ON/OFF TRIM R trim GND LOAD
Trim Rmargin-up Rtrim
Q1
Figure 30. Circuit configuration to program output voltage using an external resistor. Table 1 provides Rtrim values required for some common output voltages.
GND
Figure 31. Circuit Configuration for margining Output voltage.
Table 1
VO, set (V) 0.7525 1.2 1.5 1.8 2.5 3.3 Rtrim (K) Open 41.973 23.077 15.004 6.947 3.160
By using a 1% tolerance trim resistor, set point tolerance of 2% is achieved as specified in the
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Feature Descriptions (continued)
Voltage Sequencing
Austin MicroLynxTM II series of modules include a sequencing feature, EZ-SEQUENCETM that enables users to implement various types of output voltage sequencing in their applications. This is accomplished via an additional sequencing pin. When not using the sequencing feature, either tie the SEQ pin to VIN or leave it unconnected. When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the set-point voltage. The SEQ voltage must be set higher than the set-point voltage of the module. The output voltage follows the voltage on the SEQ pin on a one-to-one volt basis. By connecting multiple modules together, customers can get multiple modules to track their output voltages to the voltage applied on the SEQ pin. For proper voltage sequencing, first, input voltage is applied to the module. The On/Off pin of the module is left unconnected (or tied to GND for negative logic modules or tied to VIN for positive logic modules) so that the module is ON by default. After applying input voltage to the module, a minimum of 10msec delay is required before applying voltage on the SEQ pin. During this time, potential of 50mV ( 10 mV) is maintained on the SEQ pin. After 10msec delay, an analog voltage is applied to the SEQ pin and the output voltage of the module will track this voltage on a one-to-one volt bases until output reaches the set-point voltage. To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. Output voltage of the modules tracks the voltages below their set-point voltages on a one-to-one basis. A valid input voltage must be maintained until the tracking and output voltages reach ground potential to ensure a controlled shutdown of the modules. When using the EZ-SEQUENCETM feature to control start-up of the module, pre-bias immunity feature during start-up is disabled. The pre-bias immunity feature of the module relies on the module being in the diode-mode TM during start-up. When using the EZ-SEQUENCE feature, modules goes through an internal set-up time of 10msec, and will be in synchronous rectification mode when voltage at the SEQ pin is applied. This will result in sinking current in the module if pre-bias voltage is present at the output of the module. When pre-bias immunity during start-up is required, the EZ-SEQUENCETM feature must be disabled. For additional guidelines on using EZTM TM SEQUENCE feature of Austin MicroLynx II , contact Lineage Power technical representative for preliminary application note on output voltage sequencing using Austin Lynx II series.
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Thermal Considerations
Power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The test set-up is shown in Figure 33. Note that the airflow is parallel to the long axis of the module as shown in figure 32. The derating data applies to airflow in either direction of the module's long axis.
Wind Tunnel PWBs 25.4_ (1.0)
Power Module
76.2_ (3.0)
x
Air Flow
7.24_ (0.285)
Probe Location for measuring airflow and ambient temperature
Air flow
Figure 33. Thermal Test Set-up.
Heat Transfer via Convection
Top View
Tref
Increased airflow over the module enhances the heat transfer via convection. Thermal derating curves showing the maximum output current that can be delivered by various module versus local ambient temperature (TA) for natural convection and up to 1m/s (200 ft./min) are shown in the Characteristics Curves section.
Bottom View
Figure 32. Tref Temperature measurement location. The thermal reference point, Tref 1 used in the specifications of thermal derating curves is shown in Figure 32. For reliable operation this temperature should o not exceed 125 C. The output power of the module should not exceed the rated power of the module (Vo,set x Io,max). Please refer to the Application Note "Thermal Characterization Process For Open-Frame BoardMounted Power Modules" for a detailed discussion of thermal aspects including maximum device temperatures.
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Post solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Board Mounted Power Modules: Soldering and Cleaning Application Note.
Through-Hole Lead-Free Soldering Information
The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHScompliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power technical representative for more details.
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Mechanical Outline
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.)
Top View
Side View
Bottom View
PIN 1 2 3 A 4 5 FUNCTION Vo Trim GND SEQ VIN On/Off
LINEAGE POWER
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Recommended Pad Layout
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.)
PIN 1 2 3 A 4 5
FUNCTION Vo Trim GND SEQ VIN On/Off
Through-Hole Pad Layout - Back view
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Data Sheet June 24, 2008
Austin MicroLynxTM II SIP Non-isolated Power Modules: 2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features. Table 2. Device Codes Device Code ATH006A0X ATH006A0XZ ATH006A0X4 ATH006A0X4Z Input Voltage 2.4 - 5.5Vdc 2.4 - 5.5Vdc 2.4 - 5.5Vdc 2.4 - 5.5Vdc Output Voltage 0.75 - 3.63Vdc 0.75 - 3.63Vdc 0.75 - 3.63Vdc 0.75 - 3.63Vdc Output Current 6A 6A 6A 6A Efficiency 3.3V@ 6A 96.0% 96.0% 96.0% 96.0% Connector Type SIP SIP SIP SIP Comcodes 108989018 CC109104717 108989026 CC109104725
-Z refers to RoHS-compliant versions.
Asia-Pacific Headquarters Tel: +65 6416 4283 Europe, Middle-East and Africa Headquarters Tel: +49 89 6089 286 India Headquarters Tel: +91 80 28411633
World Wide Headquarters Lineage Power Corporation 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 (Outside U.S.A.: +1-972-284-2626) www.lineagepower.com e-mail: techsupport1@lineagepower.com
Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. (c) 2008 Lineage Power Corporation, (Mesquite, Texas) All International Rights Reserved.
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Document No: DS04-024 ver. 1.22 PDF name: microlynx_II_sip_ds.pdf

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