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CMOS LDO Regulator Series for Portable Equipments
CMOS LDO Regulators with Auto Power Saving Function
BHPB1WHFV Series
No.09020EAT05
Description The BHPB1WHFV regulator series can respond to changes in output current by switching to a state in which regulator characteristics are ideal. The regulators cut power consumption by lowering their own current consumption to approximately 2 A when the application is operating in the standby state. During normal-current operation it will automatically switch to high-speed operating mode. The IC's soft start function reduce the rush current that flows to the output capacitors during startup. The HVSOF5 package, which features excellent heat dissipation, contributes to space-saving application designs.
Features 1) Automatic switching between low-consumption and high-speed modes 2) Built-in rush current prevention circuit 3) Low-voltage 1.7 V operation 4) High accuracy output voltage: 1% 5) Circuit current during low-consumption operation: 2 A 6) Stable with a ceramic capacitor (0.47 F) 7) Built-in temperature and overcurrent protection circuits 8) Built-in output discharge during standby operation function 9) Ultra-small HVSOF5 power package
Applications Battery-driven portable devices, etc.
Product lineup 150 mA BHPB1WHFV Series Product name 1.2 1.5 BHPB1WHFV
1.8
2.5
2.8
2.9
3.0
3.1
3.3
Package HVSOF5
Model name: BHPB1W a b
Symbol 12 a 15 18 25 28 b
Description Output voltage (V) 1.2 V (Typ.) 1.5 V (Typ.) 1.8 V (Typ.) 2.5 V (Typ.) 2.8 V (Typ.) Package HFV: HVSOF5 Output voltage specification Output voltage (V) 29 30 31 33 2.9 V (Typ.) 3.0 V (Typ.) 3.1 V (Typ.) 3.3 V (Typ.)
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1/9
2009.04 - Rev.A
BHPB1WHFV Series
Absolute maximum ratings (Ta = 25C) Parameter Symbol Power supply voltage Power dissipation Operating temperature range Storage temperature range Junction temperature VMAX Pd Topr Tslg Tjmax Limits -0.3 to +6.5 410 *1 -40 to +85 -55 to +125 125 Unit V mW C C C
Technical Note
*1: Reduced by 4.1 mW/C over 25C, when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm)
Recommended operating ranges (not to exceed Pd) Parameter Symbol Limits Power supply voltage Output MAX current VIN IMAX 1.7 to 5.5 0 to 150
Unit V mA
Recommended operating conditions Parameter Symbol Input capacitor Output capacitor CIN CO
Min. 0.33 0.33
*2 *2
Typ. 0.47 0.47
Max. - -
Unit F F
Conditions The use of ceramic capacitors is recommended. The use of ceramic capacitors is recommended.
*2: Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias characteristic. And also make sure that the capacitor value can not change as time progresses.
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2/9
2009.04 - Rev.A
BHPB1WHFV Series
Technical Note
Electrical characteristics (Unless otherwise specified, Ta = 25C, VIN = VOUT + 1.0 V, STBY = 1.5 V, SEL = 0 V, CIN = 0.47 F, CO = 0.47 F) Limit PARAMETER Symbol Unit Conditions MIN. TYP. MAX. Regulator Output voltage (high-speed mode) Output voltage (low-consumption mode) Circuit current (high-speed mode) Circuit current (low-consumption mode) Circuit current (STBY) Ripple rejection ratio (high-speed mode) Dropout voltage 1 *1 Dropout voltage 2 *1 Dropout voltage 3 *1 Line regulation 1 (high-speed mode) Line regulation 2 (low-consumption mode) Load regulation Mode switch Current threshold (low-consumption mode) Current threshold (high-speed mode) Over Current Protection 1 Limit Current Short current Stand-by block STBY pin sink current STBY control voltage ON OFF ISTB VSTBH VSTBL RDCG RSEL VSELH VSELL 1.5 -0.3 1.5 0.5 1.5 -0.3 2 2.2 1.0 4 VIN 0.3 3.0 2.0 VIN 0.3 A STBY=1.5V V V k STBY=0V M V V Fixed high speed mode Automatic switch mode VOUT1 VOUT2 ICC1 ICC2 ISTBY RR1 VSAT1 VSAT2 VSAT3 VDL1 VDL2 VDLO
VOUT1x0.99 VOUT1-0.025 VOUT2x0.97 VOUT2x0.967
20 2 60 100 210 315 2 2 10
VOUT1x1.01 VOUT1+0.025 VOUT2x1.038 VOUT2x1.043
V V V V
VOUT2.5V,IOUT=0.1mA,SEL=1.5V VOUT1.8V,IOUT=0.1mA,SEL=1.5V VOUT2.5V,IOUT=0.1mA,SEL=0V VOUT1.8V,IOUT=0.1mA,SEL=0V
42 -
40 4 1.0 200 400 600 20 20 40
A IOUT=0mA, VIN pin monitor,SEL=1.5V A IOUT=0mA, VIN pin monitor, SEL=0V A STBY=0V VRR=-20dBv, fRR=1kHz, dB IOUT=10mA, SEL=1.5V mV VIN=VOUTx0.98,IOUT=50mA mV VIN=VOUTx0.98,IOUT=100mA mV VIN=VOUTx0.98,IOUT=150mA mV VIN=VOUT+1V to 5.5V,IOUT=10mA mV VIN=VOUT+1V to 5.5V,IOUT=100A mV IOUT=10mA to 100mA
ITH1 ITH2
0.09 -
0.3 1.2
2.2
mA SEL=0V IOUT=3mA0mA sweep mA SEL=0V IOUT=0mA3mA sweep
ILMAX ISHORT
160 20
300 50
500 100
mA Vo=VOUTx0.90 mA Vo=0V
Discharge resistance at standby SEL PIN Pull-down resistance of SEL pin SEL control voltage ON OFF
* Note: This IC is not designed to be radiation-resistant.
*3: Except at VOUT 1.5 V.
Electrical characteristics of each output voltage Output Voltage Parameter Min. 1.2 V 1.5 V 1.8 V VOUT Max. output current 70 150 50 150 75 150
Typ. 120 - 100 - 143 -
Max. - - - - - -
Unit
Conditions VCC = 1.7 V VCC = 2.0 V VCC = 1.8 V VCC = 2.2 V VCC = VOUT + 0.3 V VCC = VOUT + 0.6 V
mA
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3/9
2009.04 - Rev.A
BHPB1WHFV Series
Typical characteristics
4.0 3.5
4.0 3.5 4.0 3.5
Technical Note
Output Volt age VOUT [V]
3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 1
Output Volt age VOUT [V]
3.0 2.5 2.0 1.5 1.0 0.5 0.0
Out put Volt age VOUT [V]
3.0 2.5 2.0 1.5 1.0 0.5 0.0
IO = 10 mA
2 3 4 5
IO = 10 mA
0 1 2 3 4 5
IO = 10 mA
0 1
I nput Voltage V IN [ V]
Input Volt age VIN [V]
Input Voltage VIN [V]
2
3
4
5
Fig. 1 Output Voltage vs Input Voltage (BH12PB1WHFV)
70 60 GND Current IGND [A] 50 40 30
3.5
Fig. 2 Output Voltage vs Input Voltage (BH30PB1WHFV)
IO = no load
Input Output Voltage difference VSAT [mV]
Fig. 3 Output Voltage vs Input Voltage (BH33PB1WHFV)
40 0
IO = no load
Output Volt age VOUT [ V]
3.0 2.5 2.0 1.5 1.0 0.5 0.0
IO = no load
30 0
20 0
SEL = 1.5 V
20 10 0 0 1 2 3 4 Input Voltage VIN [V] 5
SEL = 1.5 V
SEL = 1.5 V
10 0
SEL = 0 V
SEL = 0 V
0 100 200 300 400
SEL = 0 V
0 0 50 10 0 15 0
Output Current I OUT [mA]
Output Current IOUT [mA]
Fig.4 GND Current vs Input Voltage (BH12PB1WHFV)
3.5 3.0 Output Voltage VOUT [ V] Output Voltage VOUT [ V] 2.5 2.0 1.5 1.0 0.5 0.0 0 100 200 300 Output Current IOUT [mA] 400 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0
(BH33PB1WHFV) Input Voltage
Fig.6 GND Current vs Input Voltage (BH33PB1WHFV)
3.5 3.0
Output Volt age VOUT [ V] 100 200 300 Output Current IOUT [mA] 400
2.5 2.0 1.5 1.0 0.5 0.0 0 100 200 300 400
Output Current I OUT [mA]
Fig. 7 Output Voltage vs Outout Current (BH12PB1WHFV)
Input Output Voltage dif ference VOUT [mV]
3.5 3.0
400
Fig.8 Output Voltage vs Output Current (BH30PB1WHFV)
Input Output Voltage difference VSAT [ mV]
400
(BH30PB1WHFV) Output Current (BH33PB1WHFV)
Output Voltage V OUT [V]
300
300
2.5 2.0 1.5 1.0 0.5 0.0 0 100 200 300 400
200
200
100
100
0 0 50 100 150
0 0 50 100 150
Out put Current IOUT [mA]
Out put Current IOUT [mA]
Output Current I OUT [mA]
Fig. 10 Dropout voltage vs Output Current (BH18PB1WHFV)
Fig. 11 Dropout voltage vs Output Current (BH30PB1WHFV)
Fig. 12 Dropout voltage vs Output Current (BH33PB1WHFV)
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4/9
2009.04 - Rev.A
BHPB1WHFV Series
Technical Note
3.2
4
6
Standby Pin Sink Current ISTBY[A]
5
Output Voltage VOUT[V]
Output Voltage VOUT[V]
3.1
3
4
3.0
2
3
2
2.9
1
1
2.8 -50 -25 0
Temp[]
25
50
75
100
0 0.0 0.5
0
VSTBY[V]
1.0
1.5
2.0
0.0
1.0
2.0
VSTBY[V]
3.0
4.0
5.0
Fig. 13 Output Voltage vs Temperature (BH30PB1WHFV)
80 70
80 70
Fig. 14 Standby Pin Threshold (BH30PB1WHFV)
Fig. 15 Standby Pin Sink Current (BH30PB1WHFV)
Ripple Rejection R.R.[dB]
60 50 40 30 20 10
Ripple Rejection R.R.[dB]
SEL
60 50 40 30 20 10
SEL = 0 V 1.5
1 V / div
VOUT Co = 0.47 F IO = 10 mA
100 1k 10 k 100 k 1M
50 mV / div
Co = 0.47 F IO = 10 mA
100 1k 10 k 100 k 1M
IO = no load
10 ms / div
Frequency f[Hz]
Frequency f[Hz]
Fig. 16 Ripple Rejection (BH12PB1WHFV)
Fig. 17 Ripple Rejection (BH30PB1WHFV)
Fig. 18 Output Voltage Waveform During SEL Switching (BH30PB1WHFV)
IOUT = 0 mA 10 mA
IOUT = 1 mA 30 mA
IOUT = 1 mA 100
50 mV / div VOUT SEL = 0 V
(power-saving operation)
50 mV / div VOUT VOUT
100 mV / div
100 s / div
SEL = 1.5 V
200 s / div
200 s / div
Fig. 19 Load Response (Co = 1.0 F) (BH30PB1WHFV)
Fig. 20 Load Response (Co = 1.0 F) (BH30PB1WHFV)
100 m
Fig. 21 Load Response (Co = 1.0 F) (BH30PB1WHFV)
1 V / div STBY STBY 1 V / div Startup time Trise [sec]
Trise [sec]
10 m
Rss = 10 k, IO = no load
1 V / div Co = 0.47 F
VOUT Co = 2.2 F Co = 1 F Co = 0.47 F
1.0 m
VOUT
Co = 10 F 200 s / div
1 V / div 10 ms / div
1.0 0.01
0.1
1.0
Frequency f[Hz] Slow start capacitance Css (F)
Fig. 22 Output Voltage Rise Time (BH30PB1WHFV)
Fig. 23 Output Voltage Fall Time (BH30PB1WHFV)
Fig. 24 Soft Start Rise Time (BH30PB1WHFV)
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5/9
2009.04 - Rev.A
BHPB1WHFV Series
Block diagram, recommended circuit diagram, and pin assignment table BHPB1WHFV PIN No. 1 2 3 4 5 Symbol STBY GND VIN VOUT SEL Ground Power supply input Voltage output Function
Technical Note
Output voltage on/off control(High: ON, Low: OFF)
Mode switching (High: Fix in high-speed mode Low: Automatic low-consumption mode switching)
VIN
3
Cin
+
CH1
VOLTAGE
GND
REFERENCE
THERMAL & OVER CURRENT PROTECTION
VOUT 4 Co
2
+
SOFFT START
CH2
DISCHARGE
STBY
CURRENT
Cin ... 0.47 F Co ... 0.47 F
5 SEL
(
) ( Css
Rss
MONITOR
1
CONTROL BLOCK
)
Fig. 25 Auto Power-saving Function The IC incorporates a built-in auto power-saving function that continuously monitors the output current and switches automatically between a low current consumption regulator and a high-speed operation regulator. This function reduces the regulator's own current consumption to approximately 1/10 or lower of normal levels when the output current falls below approximately 300 A. To operate only the high-speed operation regulator without using the auto power-saving function, fix the SEL pin to high.
GND current IGND [ A]
30
Measurement conditions
High-speed mode
20
BH12PB1WHFV VCC = 2.2 V
10
Low-consumption mode
VSEL = open, VSTBY = 1.5 V
2 2.5 3
0 0 0.5 1 1.5
Output currentIOUT [mA]
Fig. 26 Auto Power-Saving Function (Example) Power Dissipation (Pd) 1. Power Dissipation (Pd) Power dissipation calculations include estimates of power dissipation characteristics and internal IC power consumption, and should be treated as guidelines. In the event that the IC is used in an environment where this power dissipation is exceeded, the attendant rise in the junction temperature will trigger the thermal shutdown circuit, reducing the current capacity and otherwise degrading the IC's design performance. Allow for sufficient margins so that this power dissipation is not exceeded during IC operation.
2. Power Dissipation/Heat Reduction (Pd) HVSOF5
0.6
410 mW
0.4
Calculating the maximum internal IC power consumption (PMAX) PMAX = (VIN - VOUT) IOUT (MAX.) VIN : Input voltage VOUT : Output voltage IOUT (MAX) : Max. output current
Pd[W]
*Circuit design should allow a sufficient margin for the temperature range so that PMAX < Pd.
0.2
0 0 25 50 75 100 125
Ta[]
Fig. 27 HVSOF5 Power Dissipation vs Heat Reduction (Example)
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6/9
2009.04 - Rev.A
BHPB1WHFV Series
Technical Note
Input Output capacitors It is recommended to insert bypass capacitors between input and GND pins, positioning them as close to the pins as possible. These capacitors will be used when the power supply impedance increases or when long wiring paths are used, so they should be checked once the IC has been mounted. Ceramic capacitors generally have temperature and DC bias characteristics. When selecting ceramic capacitors, use X5R or X7R, or better models that offer good temperature and DC bias characteristics and high tolerant voltages. Typical ceramic capacitor characteristics
120 100
100
120
50 V rated voltage
Capacitance rate of change (%)
50 V rated voltage
95
100
Capacitance rate of change (%)
Capacitance rate of change (%)
80 60 40 20 0 0 1 2 3 4
90
80 60 40 20 0 -25 0 25 Temp[]
X7R X5R Y5V
16 V rated voltage
85
10V rated voltage
16 V rated voltage
80
10 V rated voltage
75
70
DC bias Vdc (V)
0
1
DC bias Vdc (V)
2
3
4
50
75
Fig. 28 Capacitance vs Bias (Y5V)
Fig. 29 Capacitance vs Bias (X5R, X7R)
Fig. 30 Capacitance vs Temperature (X5R, X7R, Y5V)
Output capacitors Mounting input capacitor between input pin and GND(as close to pin as possible), and also output capacitor between output pin and GND(as close to pin as possible) is recommended. The input capacitor reduces the output impedance of the voltage supply source connected to the VCC. The higher value the output capacitor goes, the more stable the whole operation becomes. This leads to high load transient response. Please confirm the whole operation on actual application board. Generally, ceramic capacitor has wide range of tolerance, temperature coefficient, and DC bias characteristic. And also its value goes lower as time progresses. Please choose ceramic capacitors after obtaining more detailed data by asking capacitor makers.
100
BHPB1WHFV
10 ESR ()
1
Stable region
0.1
COUT = 0.47 F Ta = +25C
0.01 0 50 100 150 Output Current mA)
Fig. 31 Stable Operation Region (Example) Operation Notes 1. Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 3. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 4.Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. 5. Ground wiring patterns The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating voltage on the power ground line may damage the device.
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2009.04 - Rev.A
BHPB1WHFV Series
Technical Note
6. Overcurrent protection circuit The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to temperatures. 7. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
8. Back Current In applications where the IC may be exposed to back current flow, it is recommended to create a path to dissipate this current by inserting a bypass diode between the VIN and VOUT pins.
Back current
VIN
OUT
STBY
GND
Fig. 32 Example Bypass Diode Connection 9. I/O voltage difference Using the IC in automatic switching mode when the I/O voltage differential becomes saturated (VIN - VOUT < 150 mV) may result in a large output noise level. If the noise level becomes problematic, use the IC with the SEL pin in the high state when the voltage differential is saturated. 10.GND Voltage The potential of GND pin must be minimum potential in all operating conditions. 11. Preventing Rush Current By attaching the Rss and Css time constants to the STBY pin, sudden rises in the regulator output voltage can be prevented, dampening the flow of rush current to the output capacitors. The larger the time constant used, the greater the resulting reduction. However, large time constants also result in longer startup times, so the constant should be selected after considering the conditions in which the IC is to be used.
100
Rss = 10 k IO = no load
Startup time Trise [sec]
10
1.0 m
100 0.01
0.1
1.0
Fig. 33 VOUT Startup Time vs CSS Capacitance (Reference) 12. Regarding input Pin of the IC (Fig.34) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Resistor Pin A Pin A
P
+
Slow start capacitance Css (F) Frequency f[Hz]
Transistor (NPN) Pin B
C B E B P P
+
Pin B
N P P
+
N N
N
Parasitic element
P+
N N
C E
P substrate Parasitic element www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
GND
P substrate Parasitic element
GND GND GND
Parasitic element
Other adjacent elements
Fig.34
8/9
2009.04 - Rev.A
BHPB1WHFV Series
Ordering part number
Technical Note
B
Part No.
H
3
0
P
B
1
W
Shutdown switch W : Includes switch
H
F
V
-
T
R
Output voltage
Series PB1:Auto powersaving type
Package HFV : HVSOF5
Packaging and forming specification TR: Embossed tape and reel
HVSOF5

1.60.05 (0.8)
0.2MAX
Tape Quantity Direction of feed
Embossed carrier tape 3000pcs TR
The direction is the 1pin of product is at the upper right when you hold
1.20.05 (MAX 1.28 include BURR)
1.00.05
(0.05)
(0.3)
1.60.05
5
4
4
5
(0.91)
(0.41)
( reel on the left hand and you pull out the tape on the right hand
1pin
)
123
321
0.130.05 S
0.6MAX
+0.03 0.02 -0.02
0.1 0.5 0.220.05
S 0.08
M
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
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2009.04 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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