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SD2931-10 RF power transistors HF/VHF/UHF N-channel MOSFETs Features Gold metallization Excellent thermal stability Common source configuration POUT = 150 W min. with 14 dB gain @ 175 MHz Thermally enhanced packaging for lower junction temperatures Description The SD2931-10 is a gold metallized N-channel MOS field-effect RF power transistor. Being electrically identical to the standard SD2931 MOSFET, it is intended for use in 50 V dc large signal applications up to 230 MHz. The SD2931-10 is mechanical compatible to the SD2931 but offers in addition a better thermal capability (25 % lower thermal resistance), representing the best-in-class transistors for ISM applications, where reliability and ruggedness are critical factors. M174 Epoxy sealed Figure 1. Pin connection 4 1 3 1. Drain 2. Source 2 3. Gate 4. Source Table 1. Device summary Marking SD2931-10 Package M174 Packaging Plastic tray Order code SD2931-10 March 2008 Rev 6 1/16 www.st.com 16 Contents SD2931-10 Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 1.2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 2.2 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 4 5 6 7 8 Impedance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/16 SD2931-10 Electrical data 1 1.1 Electrical data Maximum ratings Table 2. Symbol V(BR)DSS(1) VDGR VGS ID PDISS TJ TSTG 1. TJ = 150C Absolute maximum ratings (TCASE = 25 C) Parameter Drain source voltage Drain-gate voltage (RGS = 1 M) Gate-source voltage Drain current Power dissipation Max. operating junction temperature Storage temperature Value 125 125 20 20 389 200 -65 to +150 Unit V V V A W C C 1.2 Thermal data Table 3. Symbol RthJC Thermal data Parameter Junction - case thermal resistance Value 0.45 Unit C/W 3/16 Electrical characteristics (TCASE = +25 C) SD2931-10 2 2.1 Electrical characteristics (TCASE = +25 C) Static Table 4. Symbol V(BR)DSS IDSS IGSS VGS(Q) (1) Static (per side) Test conditions VGS = 0 V VGS = 0 V VGS = 20 V VDS = 10 V VGS = 10 V VDS = 10 V VGS = 0 V VGS = 0 V VGS = 0 V IDS = 100 mA VDS = 50 V VDS = 0 V ID = 250 mA ID = 10 A ID = 5 A VDS = 50 V VDS = 50 V VDS = 50 V f = 1 MHz f = 1 MHz f = 1 MHz 5 6 480 190 18 Min 125 50 250 See table below 3.0 Typ Max Unit V A nA V V mho pF pF pF VDS(ON) GFS CISS COSS CRSS 1. VGS(Q) sorted with alpha/numeric code marked on unit. 2.2 Dynamic Table 5. Symbol POUT GPS nD VDD = 50 V Dynamic Test conditions IDQ = 250 mA f = 175 MHz Min 150 14 55 10:1 15 65 Typ Max Unit W dB % VSWR VDD = 50 V IDQ = 250 mA POUT = 150 W f = 175 MHz VDD = 50 V IDQ = 250 mA POUT = 150 W f = 175 MHz VDD = 50 V IDQ = 250 mA POUT = 150 W f = 175 MHz Load mismatch All phase angles Table 6. A B C D E F G H J VGS sorts 2.0 - 2.1 2.1 - 2.2 2.2 - 2.3 2.3 - 2.4 2.4 - 2.5 2.5 - 2.6 2.6 - 2.7 2.7 - 2.8 2.8 - 2.9 K L M N P Q R S 2.9 - 3.0 3.0 - 3.1 3.1 - 3.2 3.2 - 3.3 3.3 - 3.4 3.4 - 3.5 3.5 - 3.6 3.6 - 3.7 4/16 SD2931-10 Impedance data 3 Impedance data Figure 2. Impedance data D ZDL Typical Input Impedance Typical Drain Load Impedance G Zin S Table 7. Impedance data Freq 30 MHz 175 MHz ZIN () 1.7 - j 5.7 1.2 - j 2.0 ZDL () 6.8 + j 0.9 2.0 + j 2.4 5/16 Typical performance SD2931-10 4 Figure 3. 10000 Typical performance Capacitance vs drain-source voltage Figure 4. Drain current vs gate voltage 20 Tc=-20 C ID, DRAIN CURRENT (A) C, CAPACITANCE (pF) f =1MHz 15 Tc=+25 C 1000 Ciss 10 VDS = 10 V Coss Tc=+80 C 100 5 Crss 10 0 10 20 30 40 50 0 2 2.5 3 3.5 4 4.5 5 5.5 6 VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE (V) Figure 5. VGS, GATE-SOURCE VOLTAGE (NORMALIZED) Gate-source voltage vs case temperature Figure 6. Maximum thermal resistance vs case temperature 1.12 1.08 1.04 1 0.96 0.92 0.88 Id =.25A Id =.1A Id =4A Id =2A Id =1A Id =9A Id =10A Id =11A Id =7A Id =5A 0.6 RTH(j-c) (C/W) 0.56 0.52 0.48 Vds= 10 V 0.84 0.8 -25 0 25 0.44 25 35 45 55 65 75 85 100 50 75 Tc, CASE TEMPERATURE (C) Tc, CASE TEMPERATURE (C) Figure 7. 100 Safe operating area Ids(A) 10 (1) 1 1 10 100 1000 Vds(V) (1) Current in this area may be limited by Rds(on) 6/16 SD2931-10 Typical performance 175 MHz 5 Figure 8. 270 Typical performance 175 MHz Output power vs input power Figure 9. 270 Output power vs input power Pout, OUTPUT POWER (W) Pout, OUTPUT POWER (W) 240 210 180 150 120 90 60 30 0 0 5 10 15 Vdd= 50V Vdd= 40V 240 210 180 150 120 90 60 30 0 0 5 10 15 Vdd= 50V Idq= 250mA f= 175MHz Tc =-20 C Tc =+25 C Tc =+80 C f= 175MHz Idq= 250mA 20 25 Pin, INPUT POWER (W) 20 25 Pin, INPUT POWER(W) Figure 10. Power gain vs output power 18 Figure 11. Efficiency vs output power 80 70 60 50 40 30 20 0 50 100 150 200 250 Gp, POWER GAIN (dB) 14 12 10 8 6 0 50 100 150 200 250 Vdd=50V Idq=250mA f=175Mhz Nd, EFFICIENCY (%) 16 Vdd=50V Idq=250mA f=175Mhz Pout, OUTPUT POWER (W) Pout, OUTPUT POWER (W) Figure 12. Output power vs supply voltage 270 240 Pin =10W Figure 13. Drain current vs gate-source voltage 20 Tc=-20 C Pout,OUTPUT POWER(W) ID, DRAIN CURRENT (A) 210 180 150 Pin =2.5W 120 90 60 30 0 24 28 32 36 40 44 48 52 Idq= 250mA f= 175MHz Pin =5W 15 Tc=+25 C 10 Tc=+80 C 5 0 2 2.5 3 3.5 4 4.5 5 5.5 6 Vdd,DRAIN VOLTAGE(V) VGS, GATE-SOURCE VOLTAGE (V) 7/16 Test circuit SD2931-10 6 Test circuit Figure 14. 175 MHz test circuit schematic (production test circuit) Note: All dimensions in inches REF. 1021579C Table 8. Component part list Description 4:1 transformer, 25 ohm flexible coax .090 OD 6" long 1:4 transformer, 25 ohm semi-rigid coax .141 OD 6" long Toroid X 2, 0.5" OD .312" ID 850 2 turns VK200 Shield bead, 1" OD 0.5" ID 850 3 turns 1/4 wave choke, 50 ohm semi-rigid coax .141 OD 12" Long 0.62" woven fiberglass, 1 oz. copper, 2 sides, r = 2.55 470 ohm 1 W chip resistor 360 ohm 1/2 W resistor 20 Kohm 10 turn potentiometer 560 ohm 1 W resistor 470 pF ATC chip cap 43 pF ATC chip cap Arco 404, 12-65 pF Arco 423, 16-100 pF Component T1 T2 FB1 FB2, FB3 FB4 L1 PCB R1, R3 R2 R4 R5 C1, C11 C2 C3, C8, C9 C4 8/16 SD2931-10 Table 8. Component part list (continued) Description 120 pF ATC chip cap 0.01 F ATC chip cap 30 pF ATC chip cap 91 pF ATC chip cap 1200 pF ATC chip cap 0.01 F / 500 V chip cap 10 F 63 V electrolytic capacitor Test circuit Component C5 C6 C7 C10 C12, C15 C13, C14,C16, C17 C18 Figure 15. 175 MHz test circuit photomaster 6.4 inches 4 inches 9/16 Test circuit Figure 16. 175 MHz test circuit SD2931-10 10/16 SD2931-10 Typical performance 30 MHz 7 Typical performance 30 MHz Figure 18. Power gain vs output power Figure 17. Output power vs input power 250 Pout, OUTPUT POWER (W) 30 PG, POWER GAIN (dB) Vdd = 50 V 200 150 100 50 0 0 0.1 0.2 0.3 0.4 0.5 29 28 27 26 25 24 0 40 80 120 160 200 Vdd = 40 V f = 30 MHz IDQ = 250 mA f = 30 MHz VDD = 50 V IDQ = 250 mA Pin, INPUT POWER (W) Pout, OUTPUT POWER (W) Figure 19. Efficiency vs output power 70 60 Figure 20. Output power vs supply voltage 200 Pin=.31 W Pin=.22 W Efficiency (%) 50 150 Pout(W) 40 30 20 10 0 0 40 80 120 160 200 f = 30 MHz VDD = 50 V IDQ = 250 mA 100 Pin=.13 W f = 30 MHz IDQ = 250 mA 50 0 24 28 32 36 40 44 48 52 Pout, OUTPUT POWER (W) VDD(V) Figure 21. Output power vs gate voltage Pout, OUTPUT POWER (W) 200 T= +25 C 150 T= -20 C 100 T= +80 C VDD = 50 V IDQ = 250 mA f = 30 MHz Pin = Constant 0 1 2 3 4 5 6 50 0 VGS GATE-SOURCE VOLTAGE (V) 11/16 Test circuit 30 MHz SD2931-10 8 Test circuit 30 MHz Figure 22. 30 MHz test circuit schematic (engineering test circuit) Figure 23. 30 MHz test circuit component part list Symbol T1 T2 FB1 FB2 FB3 RFC1 PCB R1, R3 R2 Description 9:1 transformer, 25 flexible coax with extra shield .090 OD 15" long 1:4 transformer, 50 flexible coax .225 OD 15" long Toroid 1.7" OD .30" ID 220 4 turns Surface mount EMI shield bead Toroid 1.7" OD .300" ID 220 3 turns Toroid 0.5" OD 0.30" ID 125 4 turns 12 awg wire 0.62" Woven Fiberglass, 1 oz. Copper, 2 Sides, r = 2.55 1 K 1 W chip resistor 680 3 W wirewound resistor C1,C4,C6,C7,C8,C 9, 0.1 F ATC chip cap C11,C12,C13 C2,C3 C5 C10 C14 750 pF ATC chip cap 470 pF ATC chip cap 10 F 63 V electrolytic capacitor 100 F 63 V electrolytic capacitor 12/16 SD2931-10 Package mechanical data 9 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 13/16 Package mechanical data Table 9. Dim. Min A B C D E F G H I J K L M 25.53 3.05 24.64 12.57 0.08 2.11 3.81 6.22 18.28 3.18 24.89 12.83 0.18 3.00 4.45 7.11 26.67 3.30 1.005 0.120 0.970 0.495 0.003 0.083 0.150 5.56 3.18 6.48 18.54 0.245 0.720 0.125 Typ Max 5.584 Min 0.219 0.125 Typ SD2931-10 M174 (0.500 DIA 4/L N/HERM W/FLG) mechanical data mm. Inch Max 0.230 0.255 0.730 0.980 0.505 0.007 0.118 0.175 0.280 1.050 0.130 Figure 24. Package dimensions Controlling Dimension: Inches 1011000D 14/16 SD2931-10 Revision history 10 Revision history Table 10. Date 09-Sep-2004 17-Jun-2004 04-Mar-2008 Document revision history Revision 4 5 6 Updated Table 5: Dynamic on page 4 Updated Table 4: Static (per side), Table 5: Dynamic and Table 6: VGS sorts on page 4 Changes 15/16 SD2931-10 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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