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FEATURES AND SPECIFICATIONS Molex's offers the complete range of SODIMM sockets solutions for the Notebook PC markets The demand for faster performing notebook PC has provided a major challenge to notebook PC system designers. High speed and long battery life becomes a must for power user on the road. To deliver a product that is both fast and efficient in power management, one of the few key considerations is the power consumption of the memory module/socket. The 200 circuits DDR/DDR2 SODIMM socket provides such a solution for notebook PC designers. Due to its' small form factor, it enables notebook PC designer to use smaller chassis. This allows for the development of smaller and lighter notebook PC. Though both the DDR (2.5 volt) and DDR2 (1.8 volt) version of the SODIMM socket are almost identical, the differentiating factor is the location of the voltage key. This prevents the wrong type of memory module from mating with the socket. DDR2 is the next-generation DDR memory technology. It is faster, higher bandwidth, lower power consumption and better thermal management. Molex is an active member of JEDEC work group which defines standards for the memory industry. The DDR/DDR2 SODIMM Socket accepts modules that meet the JEDEC MO-224 outline. It comes in Lead Free plating and is RoHS compliant.
0.60mm (.024") Pitch DDR / DDR 2 SODIMM Connectors 48212 Reverse Mount 48213 Standard Mount
Features * Low profile * Standard & Reverse version * Plastic latches with metal support constrain movements of the plastic latches * High Temperature Thermoplastic housing * Tape & Reel packing
Benefits * Provide 4.0mm & 5.2mm Height * Flexible of PCB layout design * User will not over bend the latch when they released module * Capable of lead free solder processing temperatures * For customer auto pick & place assembly process.
SPECIIFICATIONS Reference Information Packaging: Embossed Tape & Reel UL File No.: CSA File No.: Mates With: JEDEC Standard Memory Modules Designed In: mm Electrical Voltage: 50 AC Current: 0.50A. Contact Resistance: 30 milliohms max. Dielectric Withstanding Voltage: 200V AC Insulation Resistance: 100 Megohms min. Mechanical Contact retention force: 2.45N (0.55 lb) Durability: 30 cycles Physical Housing: Liquid Crystal Polymer, Glass-filled) Contact: Phosphor Bronze (CuSN) Plating: Contact Area -- 0.13m (5 ") Gold (Au) Solder Tail Area -- Gold (Au) Flash. Underplating -- Nickel (Ni) PCB Thickness: 1.6mm Operating Temperature: -40C to 85 C
MARKETS AND APPLICATIONS
0.60mm (.024") Pitch DDR / DDR 2 SODIMM Connectors 48212 Reverse Mount 48213 Standard Mount
* Notebook Industry
ORDERING INFORMATION
Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX amerinfo@molex.com
Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com
Asia Pacific South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com
European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com
Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550
Visit our Web site at http://www.molex.com
Order No. SNG-064 (c)2006, Molex

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