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APTGF50DH120T3G Asymmetrical - Bridge NPT IGBT Power Module 13 14 VCES = 1200V IC = 50A @ Tc = 80C Application * AC and DC motor control * Switched Mode Power Supplies Q1 CR1 18 CR3 22 19 23 7 8 Q4 CR2 CR4 4 3 29 15 30 31 32 16 R1 Features * Non Punch Through (NPT) Fast IGBT - Low voltage drop - Low tail current - Switching frequency up to 50 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - RBSOA and SCSOA rated - Symmetrical design * Kelvin emitter for easy drive * Very low stray inductance * High level of integration * Internal thermistor for temperature monitoring Benefits * Outstanding performance at high frequency operation * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Solderable terminals both for power and signal for easy PCB mounting * Low profile * Easy paralleling due to positive TC of VCEsat * RoHS compliant 28 27 26 25 29 30 23 22 20 19 18 16 15 31 32 2 3 4 7 8 10 11 12 14 13 All multiple inputs and outputs must be shorted together Example: 13/14 ; 29/30 ; 22/23 ... Absolute maximum ratings Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current Pulsed Collector Current Gate - Emitter Voltage Maximum Power Dissipation Reverse Bias Safe Operating Area Tc = 25C Tc = 80C Tc = 25C Tc = 25C Tj = 150C Max ratings 1200 70 50 150 20 312 100A @ 1200V Unit V A V W April, 2009 1-7 APTGF50DH120T3G - Rev 0 These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com APTGF50DH120T3G All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics Symbol Characteristic ICES VCE(sat) VGE(th) IGES Symbol Cies Coes Cres Qg Qge Qgc Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Isc Zero Gate Voltage Collector Current Collector Emitter saturation Voltage Gate Threshold Voltage Gate - Emitter Leakage Current Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total gate Charge Gate - Emitter Charge Gate - Collector Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Short Circuit data Test Conditions VGE = 0V Tj = 25C VCE = 1200V Tj = 125C Tj = 25C VGE =15V IC = 50A Tj = 125C VGE = VCE, IC = 1 mA VGE = 20 V, VCE = 0V Test Conditions VGE = 0V VCE = 25V f = 1MHz VGS = 15V VBus = 600V IC = 50A Inductive Switching (25C) VGE = 15V VBus = 600V IC = 50A RG = 5 Inductive Switching (125C) VGE = 15V VBus = 600V IC = 50A RG = 5 VGE = 15V Tj = 125C VBus = 600V IC = 50A Tj = 125C RG = 5 VGE 15V ; VBus = 900V tp 10s ; Tj = 125C Test Conditions VR=1200V IF = 60A IF = 120A IF = 60A IF = 60A VR = 800V di/dt =200A/s Tj = 25C Tj = 125C Tc = 80C Min 1200 Min Typ Max 250 500 3.7 6.5 100 Typ 3450 330 220 330 35 200 35 65 320 30 35 65 360 40 6.9 mJ 3.05 300 A Max Unit A V V nA Unit pF 3.2 4.0 4.5 Dynamic Characteristics Min nC ns ns Diode ratings and characteristics (CR2 & CR3) Symbol Characteristic VRRM Maximum Peak Repetitive Reverse Voltage IRM IF VF trr Qrr Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Typ Max 100 500 60 2.5 3 1.8 265 350 560 2890 3 V Unit V A A April, 2009 2-7 APTGF50DH120T3G - Rev 0 Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Reverse Recovery Time Reverse Recovery Charge ns nC CR1 & CR4 are IGBT protection diodes only www.microsemi.com APTGF50DH120T3G Thermal and package characteristics Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight IGBT Diode 2500 -40 -40 -40 2.5 Min Typ Max 0.4 0.9 150 125 100 4.7 110 Unit C/W V C N.m g RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz To heatsink M4 Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). Symbol R25 R25/R25 B25/85 B/B Characteristic Resistance @ 25C T25 = 298.15 K TC=100C RT = R25 1 1 RT: Thermistor value at T exp B25 / 85 T - T 25 T: Thermistor temperature Min Typ 50 5 3952 4 Max Unit k % K % SP3 Package outline (dimensions in mm) 1 12 See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com www.microsemi.com 3-7 APTGF50DH120T3G - Rev 0 April, 2009 17 28 APTGF50DH120T3G Typical IGBT Performance Curve 160 Ic, Collector Current (A) Output characteristics (VGE=15V) 250s Pulse Test < 0.5% Duty cycle TJ=25C TJ=125C 40 Ic, Collector Current (A) Output Characteristics (VGE=10V) 250s Pulse Test < 0.5% Duty cycle TJ=25C 120 30 80 20 TJ=125C 40 10 0 0 2 4 6 VCE, Collector to Emitter Voltage (V) Transfer Characteristics VGE, Gate to Emitter Voltage (V) 8 0 0 1 2 3 VCE, Collector to Emitter Voltage (V) Gate Charge 18 16 14 12 10 8 6 4 2 0 0 50 100 150 200 250 300 350 Gate Charge (nC) DC Collector Current vs Case Temperature VCE=960V IC = 50A TJ = 25C VCE=600V VCE=240V 4 250 Ic, Collector Current (A) 200 150 100 50 0 0 250s Pulse Test < 0.5% Duty cycle TJ=25C TJ=125C TJ=25C 4 8 12 VGE, Gate to Emitter Voltage (V) Breakdown Voltage vs Junction Temp. 16 Collector to Emitter Breakdown Voltage (Normalized) 1.20 Ic, DC Collector Current (A) 25 50 75 100 125 1.15 1.10 1.05 1.00 0.95 0.90 0.85 0.80 TJ, Junction Temperature (C) 70 60 50 40 30 20 10 0 25 50 75 100 125 TC, Case Temperature (C) 150 www.microsemi.com 4-7 APTGF50DH120T3G - Rev 0 April, 2009 APTGF50DH120T3G Turn-On Delay Time vs Collector Current VCE = 600V RG = 5 VGE = 15V Turn-Off Delay Time vs Collector Current td(off), Turn-Off Delay Time (ns) td(on), Turn-On Delay Time (ns) 45 400 VGE=15V, TJ=125C 40 350 35 300 VGE=15V, TJ=25C VCE = 600V RG = 5 30 250 25 0 25 50 75 100 125 ICE, Collector to Emitter Current (A) Current Rise Time vs Collector Current 180 VCE = 600V RG = 5 200 0 25 50 75 100 125 ICE, Collector to Emitter Current (A) Current Fall Time vs Collector Current 50 tr, Rise Time (ns) tf, Fall Time (ns) 140 40 TJ = 125C 100 VGE=15V 30 TJ = 25C VCE = 600V, VGE = 15V, RG = 5 60 20 0 25 50 75 100 ICE, Collector to Emitter Current (A) 125 20 0 25 50 75 100 ICE, Collector to Emitter Current (A) 125 Eon, Turn-On Energy Loss (mJ) 24 20 16 12 8 4 0 0 VCE = 600V RG = 5 TJ=125C, VGE=15V Eoff, Turn-off Energy Loss (mJ) 28 Turn-On Energy Loss vs Collector Current 8 Turn-Off Energy Loss vs Collector Current VCE = 600V VGE = 15V RG = 5 TJ = 125C 6 4 TJ = 25C TJ=25C, VGE=15V 2 0 0 25 50 75 100 ICE, Collector to Emitter Current (A) 125 25 50 75 100 ICE, Collector to Emitter Current (A) 125 Switching Energy Losses (mJ) Switching Energy Losses vs Gate Resistance 18 Switching Energy Losses (mJ) 16 14 12 10 8 6 4 2 0 0 10 20 30 40 Gate Resistance (Ohms) 50 Eoff, 25A Eon, 25A Eon, 50A Eoff, 50A VCE = 600V VGE = 15V TJ= 125C 8 Switching Energy Losses vs Junction Temp. VCE = 600V VGE = 15V RG = 5 Eon, 50A 6 4 Eoff, 50A Eoff, 25A 0 25 50 75 100 TJ, Junction Temperature (C) 125 www.microsemi.com 5-7 APTGF50DH120T3G - Rev 0 April, 2009 2 Eon, 25A APTGF50DH120T3G Capacitance vs Collector to Emitter Voltage 10000 Cies Reverse Bias Safe Operating Area 120 IC, Collector Current (A) 100 80 60 40 20 0 0 400 800 1200 VCE, Collector to Emitter Voltage (V) C, Capacitance (pF) 1000 Coes 100 0 Cres 10 20 30 40 VCE, Collector to Emitter Voltage (V) 50 0.45 Thermal Impedance (C/W) 0.4 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0.3 0.1 0.05 0.7 0.5 0.9 Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration Single Pulse 0.0001 0.001 0.01 0.1 1 10 0 0.00001 Rectangular Pulse Duration (Seconds) Operating Frequency vs Collector Current 120 100 80 60 40 20 0 10 20 30 40 50 IC, Collector Current (A) 60 Hard switching ZCS ZVS VCE = 600V D = 50% RG = 5 TJ = 125C TC= 75C Fmax, Operating Frequency (kHz) www.microsemi.com 6-7 APTGF50DH120T3G - Rev 0 April, 2009 APTGF50DH120T3G Typical diode Performance Curve Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 1 Thermal Impedance (C/W) 0.8 0.6 0.4 0.2 0.9 0.7 0.5 0.3 0.1 0.05 0.0001 0.001 Single Pulse 0 0.00001 0.01 0.1 1 10 Rectangular Pulse Duration (Seconds) Forward Current vs Forward Voltage trr, Reverse Recovery Time (ns) 150 IF, Forward Current (A) 125 100 75 50 25 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VF, Anode to Cathode Voltage (V) QRR, Reverse Recovery Charge (C) QRR vs. Current Rate Charge 6 5 4 3 2 1 0 30 A TJ=125C VR=800V Trr vs. Current Rate of Charge 400 300 200 60 A TJ=125C VR=800V 120 A TJ=125C TJ=25C 100 0 0 200 400 600 30 A 800 1000 1200 -diF/dt (A/s) IRRM vs. Current Rate of Charge IRRM, Reverse Recovery Current (A) 7 50 40 30 20 10 0 0 200 400 600 800 1000 1200 -diF/dt (A/s) TJ=125C VR=800V 120 A 60 A 30 A 120 A 60 A 0 200 400 600 800 -diF/dt (A/s) 1000 1200 400 Capacitance vs. Reverse Voltage Max. Average Forward Current vs. Case Temp. 100 80 IF(AV) (A) 60 40 20 0 Duty Cycle = 0.5 TJ=175C C, Capacitance (pF) 300 200 0 1 10 100 VR, Reverse Voltage (V) 1000 25 50 75 100 125 150 175 Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 7-7 APTGF50DH120T3G - Rev 0 Case Temperature (C) April, 2009 100 |
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