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TFA9810
Stereo full-bridge audio amplifier 2 x 12 W
Rev. 03 -- 20 February 2008 Product data sheet
1. General description
The TFA9810 is a two-channel power comparator for high-efficiency class D audio amplifier systems. It contains two full-bridge Bridge-Tied Load (BTL) power stages, drive logic, protection control logic and full differential input comparators. By using this power comparator a compact closed-loop self-oscillating digital amplifier system or open-loop system can be built. The TFA9810 does not require a heat sink and operates using an asymmetrical supply voltage.
2. Features
I I I I I I Stereo full-bridge power comparator for class D audio amplifier applications No external heat sink required Operating voltage range: asymmetrical from 8 V to 20 V Thermally protected Zero dead-time switching Current-limiting (no audible interruptions)
3. Applications
I I I I I I Self-oscillating or open-loop class D audio amplifier applications Flat-panel television sets Flat-panel monitors Multimedia systems Wireless speakers High-end CRT television sets
4. Quick reference data
Table 1. Quick reference data Tamb = 25 C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified Symbol VP Ioff Iq po Parameter supply voltage off-state current quiescent current output power efficiency Condition VP = VDDPx - VSSPx off mode with load, filter and snubbers connected output power 2 x 9 W into 8 ; Po = Po(nom) Min 8 87 Typ 12 110 35 89 Max 20 200 45 Unit V A mA %
NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
Table 1. Quick reference data ...continued Tamb = 25 C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified Symbol Po(RMS) Parameter RMS output power Condition RL = 8 ; VP = 12 V; THD = 10 %; Two channel driven; no heat sink required. VP = 12 V; RL = 8 THD = 10 % THD = 1 % VP = 14 V; RL = 8 ; THD = 10 %; thermally limited VP = 16 V; RL = 8 ; THD = 10 %; thermally limited VP = 12 V; RL = 6 ; THD = 10 %; thermally limited VP = 12 V; RL = 4 ; THD = 10 %; thermally limited Min Typ 9.5 Max Unit W
Po
output power
8.5 6.5 -
9.5 7.5 15
-
W W W
-
15
-
W
-
12
-
W
-
15
-
W
5. Ordering information
Table 2. Ordering information Package Name TFA9810T SO32 Description SO32: plastic small outline package; 32 leads; body width 7.5 mm Version SOT287-1 Type number
TFA9810_3
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
6. Block diagram
TFA9810
27 25 DRIVER HIGH CONTROL LOGIC DRIVER LOW COMPARATOR 1
BOOT1P VDDP1
26 OUT1P
VDDA1 4 IN1P 2 IN1N 3 VSSA1 5
30 VSSP1 29 BOOT1N VDDP1
STABI1
DIAG 10 PROTECTION OVP UVP OCP OTP ODP WP CONTROL LOGIC
DRIVER HIGH 28 OUT1N DRIVER LOW
VSSP1 31 STAB1
TEST 11
SO/OL 6 REFERENCE ENABLE 7 DRIVER HIGH CONTROL LOGIC VDDA2 13 IN2P 15 IN2N 14 VSSA2 12 COMPARATOR 2 STABI2 VDDP2 DRIVER HIGH CONTROL LOGIC DRIVER LOW 21 OUT2N 20 BOOT2N DRIVER LOW 23 OUT2P
22 BOOT2P 24 VDDP2
CDELAY 8
19 VSSP2
VSSP2 18 STAB2
HEATSPREADER 1 16 17 32 9 n.c.
010aaa016
VSSD(HW)
Fig 1.
Block diagram
TFA9810_3
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Product data sheet
Rev. 03 -- 20 February 2008
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
7. Pinning information
7.1 Pinning
VSSD(HW) IN1P IN1N VDDA1 VSSA1 SO/OL ENABLE CDELAY n.c.
1 2 3 4 5 6 7 8 9
32 VSSD(HW) 31 STAB1 30 VSSP1 29 BOOT1N 28 OUT1N 27 BOOT1P 26 OUT1P 25 VDDP1 24 VDDP2 23 OUT2P 22 BOOT2P 21 OUT2N 20 BOOT2N 19 VSSP2 18 STAB2 17 VSSD(HW)
010aaa017
TFA9810
SO32
DIAG 10 TEST 11 VSSA2 12 VDDA2 13 IN2N 14 IN2P 15 VSSD(HW) 16
Fig 2.
Pin configuration
The SO32 package has four corner leads. These leads (1, 16, 17, and 32) are internally connected to the die pad and must be connected to VSSA in the application. Together with the applied copper area on the Printed Circuit Board (PCB) these leads determine the ambient temperature, which affects the thermal resistance of the junction.
7.2 Pin description
Table 3. Symbol VSSD(HW) IN1P IN1N VDDA1 VSSA1 SO/OL ENABLE CDELAY n.c. DIAG TEST VSSA2 VDDA2
TFA9810_3
Pin description Pin 1, 16, 17, 32 2 3 4 5 6 7 8 9 10 11 12 13 Description Negative digital supply voltage and handle wafer Positive input comparator channel 1 Negative input comparator channel 1 Positive analog supply voltage channel 1 Negative analog supply voltage channel 1 SO/OL input enables self-oscillating / open-loop configuration Enable input to switch between SLEEP and OPERATING CDELAY input determines the switch on/off timing Not connected Diagnostic output; open drain Test signal input; for testing purposes only Negative analog supply voltage channel 2 Positive analog supply voltage channel 2
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
Pin description ...continued Pin 14 15 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Description Negative input comparator channel 2 Positive input comparator channel 2 Decoupling of internal 11 V regulator for channel 2 drivers Negative power-supply voltage channel 2 Bootstrap high-side driver negative output channel 2 Negative output channel 2 Bootstrap high-side driver positive output channel 2 Positive output channel 2 Positive supply voltage power channel 2 Positive power supply voltage channel 1 Positive output channel 1 Bootstrap high-side driver positive output channel 1 Negative output channel 1 Bootstrap high-side driver negative output channel 1 Negative supply voltage power channel 1 Decoupling of internal 11 V regulator for channel 1 drivers
Table 3. Symbol IN2N IN2P STAB2 VSSP2 BOOT2N OUT2N BOOT2P OUT2P VDDP2 VDDP1 OUT1P BOOT1P OUT1N BOOT1N VSSP1 STAB1
8. Functional description
8.1 General
The TFA9810 is a dual-switching power comparator. It is the main building block for a stereo high-efficiency Class D audio power amplifier system. It contains two full-bridge BTL power stages, drive logic, protection-control logic and full differential input comparators and references (see Figure 1). By using this power comparator a compact closed-loop self-oscillating digital amplifier system or open-loop system can be built. A second-order low-pass filter converts the Pulse Width Modulation (PWM) output signal into an analog audio signal across the speaker.
8.2 Interfacing
The pins ENABLE and SO/OL control the operating mode of the TFA9810. Both the ENABLE and the SO/OL pins refer to VSSD(HW). When the SO/OL pin is connected to VSSA the TFA9810 is in self-oscillating mode: when the SO/OL pin is floating the TFA9810 is in open-loop mode. The TEST pin needs to be connected to VDDA in both situations.
Table 4. SO/OL connections Configuration Self-oscillating Open-loop
Interfacing SO/OL connected to VSSD(HW) Open
The device has two modes: SLEEP and OPERATING.
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Product data sheet
Rev. 03 -- 20 February 2008
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
In SLEEP mode the TFA9810 is not biased and has a very low supply current. When the TFA9810 is set to OPERATING mode the device is started via the start-up sequence, which provides a pop-free start-up behavior. After start-up the reference voltages STAB are present and the outputs start switching.
Table 5. Start-up Mode SLEEP OPERATING
Interfacing ENABLE [V] ENABLE < 0.8 V ENABLE > 3 V
8.3 Input comparators
The input stages have a differential input and are optimized for low noise and low offset. This results in maximum flexibility in the application.
8.3.1 Operating in self-oscillating configuration
The inputs (IN1P, IN1N, IN2P, IN2N) of the comparators are internally set to a voltage level of 0.5VP, but only during the start-up sequence. In operating mode the inputs are high-ohmic.
8.3.2 Operating in open-loop configuration
No internal voltages are applied to the inputs. The input pins (IN1P, IN1N, IN2P, IN2N) are pulled down to VSSA level by internal resistors.
8.4 Diagnostic
The DIAG output is an open-drain output. The maximum current is 2 mA. Whenever one of the protections is triggered the DIAG output is activated low. The DIAG output refers to VSSD.
8.5 Protections
Overtemperature, overcurrent, overvoltage, undervoltage, overdissipation sensors, and window protection are included in the TFA9810. When one of these sensors exceeds its threshold level either the output power stage is switched off and the outputs (OUT1N, OUT1P, OUT2N, OUT2P) become floating, or the TFA9810 shuts down and starts up immediately.
* OverTemperature Protection (OTP)
If the junction temperature (Tj) exceeds a threshold level of about 150 C then the outputs become floating. The device will start switching again after 5 s and when the temperature is below 150 C. This is thermal limitation without audible interruptions.
* OverCurrent Protection (OCP)
If the output current exceeds the maximum output current threshold level the output becomes floating. The device will start switching again after 5 s. This is current limitation without audible interruptions.
TFA9810_3
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Product data sheet
Rev. 03 -- 20 February 2008
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
* OverVoltage Protection (OVP)
When the supply voltage applied to the TFA9810 exceeds the maximum supply voltage threshold level the device will shut down. The device will restart when the supply voltage is within the operating range.
* UnderVoltage Protection (UVP)
When the supply voltage applied to the TFA9810 falls below the minimum supply voltage threshold level the device will shut down. The device will restart when the supply voltage is within the operating range.
* OverDissipation Protection (ODP)
The ODP in the TFA9810 is a combination of two protections. Exceeding a temperature threshold level of 135 C an internal pre-warning is generated. When an overcurrent is detected during the pre-warning the device will shut down. When the ENABLE pin is high the TFA9810 will restart automatically. The restart sequence (switch-off switch-on) will take 200 ms to 500 ms.
* Window Protection (WP)
During start-up, if one of the outputs is shorted to VSS or VDD the device will not start. This is an effective measure to protect the device against shorts between the outputs (before the filter) and the ground or supply lines. The supply must be switched off prior to removing any short. The WP protects the device against failure during board assembly.
Table 6. Symbol OTP OCP OVP UVP ODP WP Overview protections Condition Tj > 150 C IO > IORM VP > 20 V VP < 8 V Tj > 135 C and IO > IORM OUTX > VDDA - 1 V or OUTX < VSSA + 1 V DIAG LOW LOW LOW LOW LOW LOW Outputs Floating Floating Floating Floating Floating Recovering Automatic, after 5 s and Tj < 150 C Automatic, after 5 s and IO < IORM Restart (switch-off switch-on when VP < 20 V) Restart (switch-off switch-on when VP > 8 V) Restart (switch-off switch-on when Tj < 135 C or IO < IORM)
Protections
TFA9810_3
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
8.6 Start-up sequence
VP
ENABLE
STAB1
CDELAY
V IN x FLOATING PWM OUT x FLOATING PWM
AUDIO AUDIO DIAG
AUDIO
SLEEP
START-UP
OPERATING
FAULT
RESTART
OPERATING
SHUT-DOWN
SLEEP
010aaa018
Fig 3.
Start-up sequence
9. Internal circuitry
1,16, 17, 32 VDDA
22 V
VSSA
010aaa024
Fig 4.
Internal circuitry 0001
TFA9810_3
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
2
135 k 5.5 V
VDDA1
hvp
VSSA
135 k
5.5 V
3
VSSA1
010aaa025
Fig 5.
Internal circuitry 0002
4
22 V
5
010aaa026
Fig 6.
Internal circuitry 0003
VDDA1
VDDA1
50 A
110 k
6
VSSA1
VSSA
010aaa027
Fig 7.
Internal circuitry 0004
TFA9810_3
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
VDDA1
3 k
7
250 nA
VSSA
010aaa028
Fig 8.
Internal circuitry 0005
VDDA1
2 nA
8
200 nA 5 k
DISCHARGE
VSSA1
010aaa029
Fig 9.
Internal circuitry 0006
VDDA1
10
VSSA1
VSSD
010aaa030
Fig 10. Internal circuitry 0007
TFA9810_3
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Product data sheet
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TFA9810
Audio amplifier 2 x 12 W
VDDA1
11
13 k
VSSA1
010aaa031
Fig 11. Internal circuitry 0008
Fig 12. Internal circuitry 0009
14
130 k 5.5 V
VDDA2
hvp
VSSA2
130 k
5.5 V
15
VSSA2
010aaa033
Fig 13. Internal circuitry 0010
VDDA2
100 mA
18
12 V
VSSD
010aaa034
Fig 14. Internal circuitry 0011
TFA9810_3
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
24
23.5 V
19
010aaa035
Fig 15. Internal circuitry 0012
20
12 V
OUT2N
010aaa036
Fig 16. Internal circuitry 0013
VDDP2
21
VSSP2
010aaa037
Fig 17. Internal circuitry 0014
22
12 V
OUT2P
010aaa038
Fig 18. Internal circuitry 0015
TFA9810_3
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
VDDP2
23
VSSP2
010aaa039
Fig 19. Internal circuitry 0016
25
23.5 V
30
010aaa040
Fig 20. Internal circuitry 0017
VDDP1
26
VSSP1
010aaa041
Fig 21. Internal circuitry 0018
Fig 22. Internal circuitry 0019
TFA9810_3
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
VDDP1
28
VSSP1
010aaa043
Fig 23. Internal circuitry 0020
29
12 V
OUT1N
010aaa044
Fig 24. Internal circuitry 0021
VDDA1
100 mA
31
12 V
VSSD
010aaa045
Fig 25. Internal circuitry 0022
10. Limiting values
Table 7. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VP IORM Tj Tstg Tamb Pmax supply voltage repetitive peak output current junction temperature storage temperature ambient temperature maximum power dissipation Conditions asymmetrical Min -0.3 3 -55 -40 Max +23 +150 +150 +85 2.5 Unit V A C C C W
TFA9810_3
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
Table 7. Limiting values ...continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Vx voltage on pin x Conditions DIAG IN1P - IN1N IN2P - IN2N all other pins Vesd electrostatic discharge voltage VINX with respect to other pins all other pins Min VSS - 0.3 -12 -12 VSS - 0.3 -1500 Max +12 +12 +12 VDD + 0.3 +1500 Unit V V V V V
-2000
+2000
V
11. Thermal characteristics
Table 8. Symbol Rth(j-a) Characteristics Parameter thermal resistance from junction to ambient thermal characterization parameter from junction to lead thermal characterization parameter from junction to top of package Conditions SO32. JEDEC test board SO32. Two-layer application board SO32
[1] [1]
Min -
Typ 41 44
Max 44 30
Unit K/W K/W K/W
j-lead
j-top
SO32
[1] [2]
4
8
K/W
[1] [2]
Measured in a JEDEC high K-factor test board (standard EIA/JESD 51-7) in free air with natural convection. Strongly depends on where the measurement is taken on the case.
12. Characteristics
12.1 Static characteristics
Table 9. Static characteristics Tamb = 25 C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified Symbol VP Ioff Iq Parameter supply voltage off-state current quiescent current Conditions VP = VDDPx - VSSPx off mode with load, filter, and snubbers connected with respect to VSSD Min 8 Typ 12 110 35 Max 20 200 45 Unit V A mA Supply voltage
ENABLE input VIL VIH LOW-level input voltage -0.3 3 +0.8 VP V V HIGH-level input voltage with respect to VSSD
TFA9810_3
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
Table 9. Static characteristics ...continued Tamb = 25 C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified Symbol II VIL VIH STABI VSTABI Voffset(i)(eq) Vcm IIB Tprot Vth(ovp) voltage on pin STABI equivalent input offset voltage common mode voltage input bias current protection temperature overvoltage protection threshold voltage undervoltage protection supply voltage overcurrent protection output current output voltage high level low level
[1]
Parameter input current LOW-level input voltage
Conditions VI = 5 V with respect to VSSD
Min 3 10 -
Typ 1 4 11 21.5
Max 20 0.4 4.5 12 1 15 VDDA -1 1 23
Unit A V V V mV V V A C V
SO/OL input HIGH-level input voltage with respect to VSSD with respect to VSS
Comparator full-differential input stage 20 Hz < f < 20 kHz VSSA + 3 150 level internal fixed 20
OverTemperature Protection (OTP) OverVoltage Protection (OVP)
UnderVoltage Protection (UVP) VP(uvp) level internal fixed 7 7.5 8 V
OverCurrent Protection (OCP) IO(ocp)
[1]
3
3.5
-
A
Window Protection (WP) VO VDDA - 1 VSSA + 1 V V
Current limiting concept: in overcurrent condition no interruption of the audio signal in case of impedance drop.
12.2 Dynamic characteristics
Table 10. Dynamic characteristics Tamb = 25 C; VP = 12 V; RL = 8 ; Figure 33 unless otherwise specified. Symbol PWM output tr tf rise time fall time 10 10 ns ns Parameter Conditions Min Typ Max Unit
TFA9810_3
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
Table 10. Dynamic characteristics ...continued Tamb = 25 C; VP = 12 V; RL = 8 ; Figure 33 unless otherwise specified. Symbol tresp Parameter response time Conditions transition PWM output from LOW to HIGH VI = 70 mV VI = 3.3 V transition PWM output from HIGH to LOW VI = 70 mV VI = 3.3 V tw(min) RDSon po minimum pulse width drain-source on-state resistance output power efficiency output power 2 x 9 W into 8 . Po = Po(nom) PWM output
[1]
Min -
Typ 60 50
Max -
Unit ns ns
-
60 50
-
ns ns
87
60 0.28 89
0.35 -
ns %
[2]
[1] [2]
High-side and low-side power switch have the same series resistance. Output power measured across the loudspeaker load. Output power is measured indirectly via RDSon.
12.3 AC characteristics measured in a typical application
Table 11. AC characteristics measured in typical application Tamb = 25 C; VP = 12 V; RL = 8 ; fosc = 550 kHz; Figure 33 unless otherwise specified. Symbol VP Po(RMS) Parameter supply voltage RMS output power Conditions VP = VDDPx - VSSPx RL = 8 ; VP = 12 V; THD = 10 %; Two channel driven; no heat sink required. VP = 12 V; RL = 8 THD = 10 % THD = 1 % VP = 14 V; RL = 8 ; THD = 10 %; thermally limited VP = 16 V; RL = 8 ; THD = 10 %; thermally limited VP = 12 V; RL = 6 ; THD = 10 %; thermally limited VP = 12 V; RL = 4 ; THD = 10 %; thermally limited THD+N po Gv(cl) Vn(o) total harmonic distortion-plus-noise output power efficiency closed-loop voltage gain output noise voltage Po is 1 W; f = 1 kHz; AES17 brick-wall filter Po = 9 W VI = 100 mV (RMS); fi = 1 kHz Inputs shorted; AES17 brick-wall filter 8.5 6.5 87 19 9.5 7.5 12 15 12 15 0.04 89 19.7 150 0.1 21 W W W W W W % % dB V Min 8 Typ 12 9.5 Max 20 Unit V W
Po
output power
TFA9810_3
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
Table 11. AC characteristics measured in typical application ...continued Tamb = 25 C; VP = 12 V; RL = 8 ; fosc = 550 kHz; Figure 33 unless otherwise specified. Symbol S/N SVRR cs
[1]
Parameter signal-to-noise ratio supply voltage ripple rejection channel separation
Conditions Vo = 10 V (RMS); gain 20 dB Vripple = 2 V(p-p); fi= 1 kHz Po = 1 W; fi = 1 kHz
[1]
Min 34 55
Typ 96 45 70
Max -
Unit dB dB dB
Minimum value determined by R5, R10, R17, R22 equalling +1 % and R7, R14, R18, R20 equalling -1 %.
13. Quality specification
In accordance with SNW-FQ-611-E, `if this type is used as an audio amplifier'. The number of the quality specification can be found in the Quality Reference Handbook. The handbook can be ordered using the code 9398 510 63011.
14. Application information
14.1 Output power estimation
For BTL configuration the output power just before clipping can be estimated using Equation 1:
2 RL ----------------------------------------------------- x V P R L + 2 x ( R DSon + R s ) = -------------------------------------------------------------------------------2 x RL
BTL : Po0.5 % Where,
(1)
* * * * *
VP = supply voltage (VDDPx - VSSPx) [V] RL = load resistance [] RDSon = drain-source on-state resistance [] Rs = series resistance [] Po0.5 % = output power at the THD level of 0.5 % [W]
The output power at 10 % THD can be estimated by using Equation 2:
P o10 % = 1.25 x P o0.5 %
(2)
Figure 26 and Figure 27 below show the estimated output power at THD = 0.5 % and THD = 10 % as a function of the BLT supply voltage for different load impedances.
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Product data sheet
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TFA9810
Audio amplifier 2 x 12 W
25 Po (W) 20
(2)
010aaa019
(3)
15
(1)
10
5
0 8 12 16 VP (V) 20
(1) RL = 4 (2) RL = 6 (3) RL = 8
Fig 26. BTL output power as function of supply voltage: THD = 0.5 %. 3 A
30 Po (W) 20
(1) (2)
010aaa020
(3)
10
0 8 12 16 VP (V) 20
(1) RL = 4 (2) RL = 6 (3) RL = 8
Fig 27. BTL output power as function of supply voltage: THD = 10 %. 3 A
14.2 Output current limiting
The peak output current is internally limited above a level of 3 A minimum. During normal operation the output current should not exceed this threshold level of 3 A, otherwise the output signal will be distorted. The peak output current in BTL can be estimated using Equation 3: VP I O max ----------------------------------------------------- 3 A R L + 2 x ( R DSon + R s ) Where: (3)
* VP = supply voltage (VDDPx - VSSPx) [V].
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Product data sheet
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
* RL = load resistance []. * RDSon = drain-source on-state resistance []. * Rs = series resistance [].
Example: A 4 speaker in BTL configuration can be used up to a supply voltage of 12 V without running into current limiting. Current limiting (clipping) will avoid audio holes, but it causes a sound distortion similar to voltage clipping.
14.3 Speaker configuration and impedance
For a flat-frequency response (second-order Butterworth filter) it is necessary to change the low-pass filter components LLC and CLC according to the speaker configuration and impedance. Table 12 shows the practical required values:
Table 12. BTL Filter component values Impedance [] 4 6 8 LLC [F] 10 16 22 CLC [nF] 1500 1000 680
Configuration
14.4 Differential input
For a high common-mode rejection ratio and a maximum of flexibility in the application, the audio inputs of the application are fully differential. The input configuration for a differential-input application is illustrated in Figure 28.
OUT1P
+ AUDIO DSP VSS -
IN1P IN1N
OUT1N
010aaa021
Fig 28. Input configuration for differential input
14.5 Single-ended input
When using an audio source with a single-ended `out', it is important to connect the IN1N from the application board to the VSS/GND of the audio source (e.g. Audio DSP). The input configuration for single-ended `in' application is illustrated in Figure 29.
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TFA9810
Audio amplifier 2 x 12 W
OUT1P
+ AUDIO DSP - IN1P IN1N
OUT1N
010aaa022
Fig 29. Input configuration for single-ended input
14.6 Curves measured in a typical application
+30 Gv (dB) +25
010aaa197
+20
(1) (2)
+15
+10 10-2
10-1
1
10 fi (Hz)
102
VP = 12 V, Vi = 100 mV (1) OUT1 (2) OUT2
Fig 30. Gain as a function of frequency
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NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
10 THD+N (%) 1
010aaa195
10-1
(2) (1)
10-2 10
102
103
104 fi (Hz)
105
VP = 12 V, RL = 8 , Po = 1 W (1) OUT1 (2) OUT2
Fig 31. Total harmonic distortion + noise as a function of frequency
10 THD+N (%) 1
010aaa196
10-1
(1) (2)
10-2 10-2
10-1
1 Po (W)
10
VP = 12 V, RL = 8 , fi = 1 kHz (1) OUT1 (2) OUT2
Fig 32. Total harmonic distortion as a function of output power
14.7 Typical application diagram TFA9810
The typical application diagram with the TFA9810 supplied from an asymmetrical supply is shown in Figure 33.
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Product data sheet
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Product data sheet Rev. 03 -- 20 February 2008
(c) NXP B.V. 2008. All rights reserved. TFA9810_3
NXP Semiconductors
1
VP J1 C32 220 F C33 100 nF
12 V
12 V
R3 10 L1 BEAD C1 220 F C3 100 nF C31 100 nF C4 100 nF C5 100 nF L2 BEAD C2 220 F
12 V
2
SW1
ENABLE
GND OUT1-
GND GND VDDA1 4
R6 10 k C8 220 pF R31 IN1P 10 k C11 47 pF R11 R32 IN1N 10 k C15 330 nF
1 2 IN1
J2
C6 1 F
R5 100 k R7 10 k
VDDA2
GND n.c VDDP1 9 25
GND VDDP2 24 26 OUT1P
C9 220 nF
13
OUT1+
L3 22 H
2
2
J3
27
BOOT1P
C7 1 F
R10 GND 10 k
C10 220 pF
R27 10
C27 470 pF
C12 680 nF
3
29
BOOT1N
C14 220 nF R28 10 C28 470 pF
GND
10 k R14 100 k
C13 GND 680 nF
J4
CDELAY SO/OL
28 8 6 31
OUT1N OUT1- STABI1
C16 1F L4 22 H
1 OUT1
GND
OUT1+ GND ENABLE OUT2- DIAG VDDA2
C18 1 F R17 100 k R18 10 k R19 10 k C21 220 pF C24 220 pF
TFA9810
7 10 11, TEST 23 18
GND
STABI2
C17 1F
Snubber network (Optional)
OUT2+ OUT2P
GND
L5 22 H
2
J6
1 2 IN2
J5
R33 IN2P 10 k C22 68 pF R34 IN2N
15
22
BOOT2P
C19 220 nF
R29 10
C29 470 pF
C20 680 nF
20
BOOT2N
C25 220 nF R30 10 C30 470 pF
GND
C26 1 F
C23 GND 680 nF
Audio amplifier 2 x 12 W
R22 GND 10 k
R23
14
10 k R26 100 k 10 k J7
21 12 1 16 17 32 30 19
OUT2N OUT2-
L6 22 H
1 OUT2
TFA9810
5
R100 22
GND OUT2+
VSSA1 VSSA2 VSSD VSSD VSSD VSSDVSSP1 VSSP2 GND
010aaa023
23 of 29
Fig 33. Typical application diagram TFA9810
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Product data sheet Rev. 03 -- 20 February 2008
(c) NXP B.V. 2008. All rights reserved. TFA9810_3
NXP Semiconductors
1
VP J1 C32 220 F C33 100 nF
12 V
12 V
R3 10 L1 BEAD C1 220 F C3 100 nF C31 100 nF C4 100 nF C5 100 nF L2 BEAD C2 220 F
12 V
2
SW1
ENABLE
GND OUT1-
GND GND VDDA1 4
R6 10 k C8 220 pF R31 IN1P 10 k C11 47 pF R11 R32 IN1N 10 k
1 2 IN1
J2
C6 1 F
R5 100 k R7 10 k
VDDA2
GND n.c VDDP1 9 25
GND VDDP2 24 26 OUT1P
C9 220 nF
13
OUT1+
L3 22 H
2
2
J3
27
BOOT1P
C7 1 F
R10 GND 10 k
C10 220 pF
R27 10
C27 470 pF
C12 680 nF
3
29
BOOT1N
C14 220 nF R28 10 C28 470 pF
GND
10 k R14 100 k
C13 GND 680 nF
J4
STAB1
C15 4.7 F R35 200 k
28 8 6
OUT1N OUT1-
L4 22 H
1 OUT1
GND
CDELAY SO/OL
OUT1+
31
STAB1
C16 1F
TFA9810
GND OUT2- ENABLE DIAG VDDA2
C18 1 F R17 100 k R18 10 k R19 10 k C21 220 pF C24 220 pF R33 IN2P 10 k C22 68 pF R34 IN2N
GND
7 10 11
18
STAB2
C17 1F
Snubber network (Optional)
OUT2+ 23 OUT2P
GND
L5 22 H
2
J6
1 2 IN2
J5
15
22
BOOT2P
C19 220 nF
R29 10
C29 470 pF
C20 680 nF
20
BOOT2N
C25 220 nF R30 10 C30 470 pF
GND
C26 1 F
C23 GND 680 nF
Audio amplifier 2 x 12 W
R22 GND 10 k
R23
14
10 k R26 100 k 10 k J7
21 12 1 16 17 32 30 19
OUT2N OUT2-
L6 22 H
1 OUT2
TFA9810
5
R100 22
GND OUT2+
VSSA1 VSSA2 VSSD VSSD VSSD VSSDVSSP1 VSSP2 GND
010aaa431
24 of 29
Fig 34. Typical application diagram TFA9810 with externally adjusted switch-on time
NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
14.8 Typical application: bill of materials
Table 13. Item 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 2 5 2 4 4 4 1 4 1 1 1 3 2 2 2 4 Typical application: bill of materials Quantity Reference C1, C2. C3, C4, C5, C31, C33. C16, C17. C6, C7, C18, C26 C8, C10, C21, C24. C9, C14, C19, C25. C11 C12, C13, C20, C23. C15 C22. C32 J1, J3, J6. J2, J5. J4, J7 L1, L2. L3, L4, L5, L6. Part 220 F/35 V 100 nF/50 V 1 F/50 V 1 F/25 V 220 pF/25 V 220 nF/25 V 47 pF/25 V 680 nF/25 V 330 nF/25 V 68 pF/25 V 1000 F/25 V Screw terminal CINCH Jumper BEAD 22 H Description General purpose 85 C, diameter 8 mm SMD 0805 X7R SMD 1206 X7R MKT SMD 0402 NP0 SMD 0805 X7R SMD 0402 NP0 MKT SMD 0805 X7R SMD 0402 NP0 CE12-02R Two pins CINCH Closed on demo board only SMD 1206 Wurth Elektronik DC < 0.5 10 MHz > 80 8RDY TOKO A7040HN-220M, 11RHBP TOKO A7503CY-220M or Sagami 7311NA-220M 17 18 5 4 R3 R5, R14, R17, R26. 10 / 0.25 W / 5 % 100 k / 0.1 W / 1 % for 20 dB 200 k / 0.1 W / 1 % for 26 dB 19 12 R6, R7, R10, R11, R18, 10 k / 0.1 W / 1 % R19, R22, R23, R31, R32, R33, R34. SW1 U1 PCB switch TFA9810T SMD 0603 SMD 1206 SMD 0603
20 21
1 1
Secme 090320901 SOT287-1 (SO32) NXP Semiconductors
14.9 Snubber network
Table 14. Item 1 2 4 4 Snubber network: bill of materials Part Footprint SMD 0805 X7R SMD 1206 C27, C28, C29, C30 470 pF, 25 V R27, R28, R29, R30 10 / 0.25 W / 5% Quantity Reference
15. Test information
General Quality Specification for General Applications, Power management and RF Power. Document SNW-FQ-611 refers.
TFA9810_3 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 20 February 2008
25 of 29
NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
16. Package outline
SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
D
E
A X
c y HE vM A
Z 32 17
Q A2 A1 pin 1 index Lp 1 e bp 16 wM L detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 0.02 0.01 c 0.27 0.18 0.011 0.007 D (1) 20.7 20.3 0.81 0.80 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 0.419 0.394 L 1.4 Lp 1.1 0.4 Q 1.2 1.0 0.047 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.95 0.55
0.012 0.096 0.004 0.089
0.043 0.055 0.016
0.037 0.004 0.022
8o o 0
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT287-1 REFERENCES IEC JEDEC MO-119 JEITA EUROPEAN PROJECTION
ISSUE DATE 00-08-17 03-02-19
Fig 35. Package outline SOT287-1 (SO23)
TFA9810_3 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 20 February 2008
26 of 29
NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
17. Revision history
Table 15. Revision history Release date 20080220 Data sheet status Product data sheet Change notice Supersedes TFA9810_2 Document ID TFA9810_3 Modifications: TFA9810_2 TFA9810_1
* *
Figure 33 has been updated. Figure 34 has been added. Preliminary data sheet Preliminary data sheet TFA9810_1 -
20070831 20070815
TFA9810_3
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 20 February 2008
27 of 29
NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
18. Legal information
18.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
18.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
TFA9810_3
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 20 February 2008
28 of 29
NXP Semiconductors
TFA9810
Audio amplifier 2 x 12 W
20. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.3.1 8.3.2 8.4 8.5 8.6 9 10 11 12 12.1 12.2 12.3 13 14 14.1 14.2 14.3 14.4 14.5 14.6 14.7 14.8 14.9 15 16 17 18 18.1 18.2 18.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Interfacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Input comparators. . . . . . . . . . . . . . . . . . . . . . . 6 Operating in self-oscillating configuration . . . . . 6 Operating in open-loop configuration . . . . . . . . 6 Diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Start-up sequence . . . . . . . . . . . . . . . . . . . . . . 8 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14 Thermal characteristics. . . . . . . . . . . . . . . . . . 15 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15 Static characteristics. . . . . . . . . . . . . . . . . . . . 15 Dynamic characteristics . . . . . . . . . . . . . . . . . 16 AC characteristics measured in a typical application. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Quality specification . . . . . . . . . . . . . . . . . . . . 18 Application information. . . . . . . . . . . . . . . . . . 18 Output power estimation. . . . . . . . . . . . . . . . . 18 Output current limiting. . . . . . . . . . . . . . . . . . . 19 Speaker configuration and impedance . . . . . . 20 Differential input . . . . . . . . . . . . . . . . . . . . . . . 20 Single-ended input . . . . . . . . . . . . . . . . . . . . . 20 Curves measured in a typical application . . . . 21 Typical application diagram TFA9810 . . . . . . . 22 Typical application: bill of materials. . . . . . . . . 25 Snubber network. . . . . . . . . . . . . . . . . . . . . . . 25 Test information . . . . . . . . . . . . . . . . . . . . . . . . 25 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27 Legal information. . . . . . . . . . . . . . . . . . . . . . . 28 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 18.4 19 20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Contact information . . . . . . . . . . . . . . . . . . . . 28 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 February 2008 Document identifier: TFA9810_3

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