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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL DIGIT LED DISPLAY (0.39 lnch)
Pb
Lead-Free Parts
LDD435/62-XX-PF
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LDD435/62-XX-PF A 16 - Feb. - 2009
DCC
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD435/62-XX-PF Page 1/8
Package Dimensions
23.8 (0.93") PIN18 PIN10
6.5 (0.256")
11.0 (0.39")
DIG.1
DIG.2
18.8 (0.74")
15.24 (0.6")
PIN1 PIN9 r 1.5 (0.059")
LDD435/62-XX-PF LIGITEK
r TYP0.45 2.54*8=20.32
4.80.5
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD435/62-XX-PF Page 2/8
Internal Circuit Diagram
LDD4352-XX-PF
14 DIG.1 A BCDEFG DP A DIG.2 BCDEFG DP 13
16 15 3 2 1 18 17 4
11 10 8 6 5 12 7 9
LDD4362-XX-PF
14 DIG.1 A BCDEFG DP A DIG.2 BCDEFG DP 13
16 15 3 2 1 18 17 4
11 10 8 6 5 12 7 9
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD435/62-XX-PF Page 3/8
Electrical Connection
PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
LDD4352-XX-PF Anode DIG1 Anode DIG1 Anode DIG1 Anode DIG1 Anode DIG2 Anode DIG2 Anode DIG2 Anode DIG2 Anode DIG2 Anode DIG2 Anode DIG2 Anode DIG2 E D C DP E D G C DP B A F
PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
LDD4362-XX-PF Cathode DIG1 Cathode DIG1 Cathode DIG1 Cathode DIG1 Cathode DIG2 Cathode DIG2 Cathode DIG2 Cathode DIG2 Cathode DIG2 Cathode DIG2 Cathode DIG2 Cathode DIG2 E D C DP E D G C DP B A F
Common Cathode Dig.2 Common Cathode Dig.1 Anode DIG1 Anode DIG1 Anode DIG1 Anode DIG1 B A G F
Common Anode Dig.2 Common Anode Dig.1 Cathode DIG1 Cathode DIG1 Cathode DIG1 Cathode DIG1 B A G F
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD435/62-XX-PF Page 4/8
Absolute Maximum Ratings at Ta=25 J
Ratings UNIT G Forward Current Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Reverse Current Per Any Chip Operating Temperature Storage Temperature IF IFP 30 120 mA mA
Parameter
Symbol
PD Ir Topr Tstg
100 10 -25 ~ +85
mW
g A J J
-25 ~ +85
Part Selection And Application Information(Ratings at 25J )
common cathode or anode
Common Cathode
GaP
LDD4362-XX-PF
CHIP
PART NO
Material
LDD4352-XX-PF
Emitted
f P (nm)
f
(nm)
Min.
Electrical Vf(v) Typ. Max. Iv(mcd) Min. Typ. IV-M
Green
565 Common Anode
30
1.7
2.1
2.6
1.75
3.05
2:1
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD435/62-XX-PF Page 5/8
Test Condition For Each Parameter
Parameter Forward Voltage Per Chip Luminous Intensity Per Chip
Peak Emission Wavelength
Symbol Vf Iv
f P
Unit volt mcd nm nm
Test Condition If=20mA If=10mA If=20mA If=20mA Vr=5V
Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio
f
Ir IV-M
g A
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD435/62-XX-PF Page 6/8
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.5
1000
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10 1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100
Relative Intensity@20mA Normalize @25J
Forward Voltage@20mA Normalize @25J
1.2
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
Relative Intensity@20mA
1.0
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. DD435/62-XX-PF Page 4/5
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case)
Temp(C) 260C3sec Max
260X
5 /sec max
120X
2 /sec max Preheat
25X 0X
50
100
150
Time(sec)
60 Seconds Max
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD435/62-XX-PF Page 8/8
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 J O 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 J O 5J 2.Dwell time=5 O 1sec
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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