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| FDMC6675BZ P-Channel PowerTrench(R) MOSFET FDMC6675BZ P-Channel Power Trench(R) MOSFET -30 V, -20 A, 14.4 m Features Max rDS(on) = 14.4 m at VGS = -10 V, ID = -9.5 A Max rDS(on) = 27.0 m at VGS = -4.5 V, ID = -6.9 A HBM ESD protection level of 8 kV typical(note 3) Extended VGSS range (-25 V) for battery applications High performance trench technology for extremely low rDS(on) High power and current handling capability Termination is Lead-free and RoHS Compliant June 2009 General Description The FDMC6675BZ has been designed to minimize losses in load switch applications. Advancements in both silicon and package technologies have been combined to offer the lowest rDS(on) and ESD protection. Application Load Switch in Notebook and Server Notebook Battery Pack Power Management Top Pin 1 S S S G Bottom D D D D D D D D 8 1 5 6 7 4 3 2 G S S S MLP 3.3x3.3 MOSFET Maximum Ratings TA = 25 C unless otherwise noted Symbol VDS VGS Parameter Drain to Source Voltage Gate to Source Voltage Drain Current -Continuous (Package limited) ID -Continuous (Silicon limited) -Continuous -Pulsed PD TJ, TSTG Power Dissipation Power Dissipation TC = 25 C TA = 25 C (Note 1a) TC = 25 C TC = 25 C TA = 25 C (Note 1a) Ratings -30 25 -20 -40 -9.5 -32 36 2.3 -55 to +150 W C A Units V V Operating and Storage Junction Temperature Range Thermal Characteristics RJC RJA Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient (Note 1a) 3.4 53 C/W Package Marking and Ordering Information Device Marking FDMC6675BZ Device FDMC6675BZ Package MLP 3.3X3.3 Reel Size 13 '' Tape Width 12 mm Quantity 3000 units (c)2009 Fairchild Semiconductor Corporation FDMC6675BZ Rev.D1 1 www.fairchildsemi.com FDMC6675BZ P-Channel PowerTrench(R) MOSFET Electrical Characteristics TJ = 25 C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS BVDSS TJ IDSS IGSS Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current ID = -250 A, VGS = 0 V ID = -250 A, referenced to 25 C VDS = -24 V, VGS = 0 V -30 20 -1 TJ = 125 C -100 10 V mV/C A A VGS = 25 V, VDS = 0 V On Characteristics VGS(th) VGS(th) TJ rDS(on) gFS Gate to Source Threshold Voltage Gate to Source Threshold Voltage Temperature Coefficient Static Drain to Source On Resistance Forward Transconductance VGS = VDS, ID = -250 A ID = -250 A, referenced to 25 C VGS = -10 V, ID = -9.5 A VGS = -4.5 V, ID = -6.9 A VGS = -10 V, ID = -9.5 A, TJ = 125 C VDD = -5 V, ID = -9.5 A -1.0 -1.9 -6 10.7 17.4 15.2 28 14.4 27.0 20.5 S m -3.0 V mV/C Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = -15 V, VGS = 0 V, f = 1 MHz 2154 392 349 2865 525 525 pF pF pF Switching Characteristics td(on) tr td(off) tf Qg(TOT) Qgs Qgd Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Total Gate Charge Gate to Source Charge Gate to Drain "Miller" Charge VGS = 0 V to -10 V VGS = 0 V to -5 V VDD = -15 V, ID = -9.5 A VDD = -15 V, ID = -9.5 A, VGS = -10 V, RGEN = 6 11 10 44 26 46 26 6.4 13 20 20 71 42 65 37 ns ns ns ns nC nC nC nC Drain-Source Diode Characteristics VSD trr Qrr Source to Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0 V, IS = -9.5 A VGS = 0 V, IS = -1.6 A IF = -9.5 A, di/dt = 100 A/s (Note 2) (Note 2) 0.89 0.73 24 15 1.3 1.2 38 27 V V ns nC NOTES: 1. RJA is determined with the device mounted on a 1 in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RJC is guaranteed by design while RCA is determined by the user's board design. a. 53 C/W when mounted on a 1 in2 pad of 2 oz copper b.125 C/W when mounted on a minimum pad of 2 oz copper 2. Pulse Test: Pulse Width < 300 s, Duty cycle < 2.0 %. 3. The diode connected between the gate and source servers only as protection against ESD. No gate overvoltage rating is implied. (c)2009 Fairchild Semiconductor Corporation FDMC6675BZ Rev.D1 2 www.fairchildsemi.com FDMC6675BZ P-Channel PowerTrench(R) MOSFET Typical Characteristics TJ = 25 C unless otherwise noted 32 NORMALIZED DRAIN TO SOURCE ON-RESISTANCE 5.0 VGS = -4 V 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 8 VGS = -3.5 V -ID, DRAIN CURRENT (A) VGS = -4.5 V PULSE DURATION = 80 s DUTY CYCLE = 0.5%MAX 24 VGS = -6 V VGS = -10 V VGS = -4 V 16 VGS = -3.5 V VGS = -4.5 V VGS = -6 V VGS = -10 V 8 PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 16 24 32 -VDS, DRAIN TO SOURCE VOLTAGE (V) -ID, DRAIN CURRENT (A) Figure 1. On Region Characteristics Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage 50 SOURCE ON-RESISTANCE (m) 1.6 NORMALIZED DRAIN TO SOURCE ON-RESISTANCE 1.4 1.2 1.0 0.8 0.6 -75 ID = -9.5 A VGS = -10 V PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 40 ID = -9.5 A rDS(on), DRAIN TO 30 TJ = 125 oC 20 10 TJ = 25 oC -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (oC) 0 2 4 6 8 10 -VGS, GATE TO SOURCE VOLTAGE (V) Figure 3. Normalized On Resistance vs Junction Temperature 32 -IS, REVERSE DRAIN CURRENT (A) PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX Figure 4. On-Resistance vs Gate to Source Voltage 100 VGS = 0 V -ID, DRAIN CURRENT (A) 24 VDS = -5 V 10 TJ = 150 oC TJ = 25 oC 16 TJ = 150 oC TJ = 25 oC 8 0.1 TJ = -55 oC TJ = -55 oC 0 0 1 2 3 4 5 -VGS, GATE TO SOURCE VOLTAGE (V) 0.01 0.2 0.4 0.6 0.8 1.0 1.2 -VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 5. Transfer Characteristics Figure 6. Source to Drain Diode Forward Voltage vs Source Current (c)2009 Fairchild Semiconductor Corporation FDMC6675BZ Rev.D1 3 www.fairchildsemi.com FDMC6675BZ P-Channel PowerTrench(R) MOSFET Typical Characteristics TJ = 25 C unless otherwise noted 10 -VGS, GATE TO SOURCE VOLTAGE (V) ID = -9.5 A 5000 8 6 VDD = -15 V CAPACITANCE (pF) VDD = -10 V Ciss 1000 Coss 4 VDD = -20 V 2 0 0 10 20 30 40 50 Qg, GATE CHARGE (nC) f = 1 MHz VGS = 0 V Crss 100 0.1 1 10 30 -VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 7. Gate Charge Characteristics Figure 8. Capacitance vs Drain to Source Voltage 50 -ID, DRAIN CURRENT (A) 50 -IAS, AVALANCHE CURRENT (A) 40 VGS = -10 V TJ = 25 oC 10 TJ = 100 oC TJ = 125 oC 30 20 10 0 25 VGS = -4.5 V Limited by Package RJC = 3.4 C/W o 1 0.001 0.01 0.1 1 10 100 50 75 100 o 125 150 tAV, TIME IN AVALANCHE (ms) TC, CASE TEMPERATURE ( C) Figure 9. Unclamped Inductive Switching Capability Figure 10. Maximum Continuous Drain Current vs Case Temperature 10 -Ig, GATE LEAKAGE CURRENT(A) -4 70 VGS = 0V -ID, DRAIN CURRENT (A) 10 1 ms 10 ms 10 10 10 10 -5 TJ = 150oC -6 1 THIS AREA IS LIMITED BY rDS(on) 100 ms 1s 10 s DC -7 TJ = 25oC 0.1 SINGLE PULSE TJ = MAX RATED RJA = 125 C/W TA = 25 oC o -8 0.01 0.01 10 -9 0.1 1 10 100 0 5 10 15 20 25 30 -VDS, DRAIN to SOURCE VOLTAGE (V) -VGS, GATE TO SOURCE VOLTAGE(V) Figure 11. Forward Bias Safe Operating Area Figure 12. Igss vs Vgss (c)2009 Fairchild Semiconductor Corporation FDMC6675BZ Rev.D1 4 www.fairchildsemi.com FDMC6675BZ P-Channel PowerTrench(R) MOSFET Typical Characteristics TJ = 25 C unless otherwise noted 1000 P(PK), PEAK TRANSIENT POWER (W) VGS = -10 V 100 SINGLE PULSE 10 RJA = 125 C/W TA = 25 C o o 1 0.3 -3 10 10 -2 10 -1 1 t, PULSE WIDTH (sec) 10 100 1000 Figure 13. Single Pulse Maximum Power Dissipation 2 1 NORMALIZED THERMAL IMPEDANCE, ZJA DUTY CYCLE-DESCENDING ORDER 0.1 D = 0.5 0.2 0.1 0.05 0.02 0.01 PDM t1 0.01 SINGLE PULSE RJA = 125 C/W o t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJA x RJA + TA 0.001 -3 10 10 -2 10 -1 1 10 100 1000 t, RECTANGULAR PULSE DURATION (sec) Figure 14. Junction-to-Ambient Transient Thermal Response Curve (c)2009 Fairchild Semiconductor Corporation FDMC6675BZ Rev.D1 5 www.fairchildsemi.com FDMC6675BZ P-Channel PowerTrench(R) MOSFET Dimensional Outline and Pad Layout 0.10 C 3.30 A B 2X 3.30 PIN#1 QUADRANT TOP VIEW 0.8 MAX 0.10 C 0.10 C 2X RECOMMENDED LAND PATTERN (0.203) 0.08 C 0.05 0.00 SEATING PLANE SIDE VIEW PIN #1 IDENT 1 (4X) 0.55 0.45 1.150 2.32 2.22 0.785 4 0.350 R0.150 0.299 2.05 1.95 8 0.65 1.95 5 0.40 (8X) 0.30 0.10 0.05 CAB C BOTTOM VIEW A. DOES NOT CONFORM TO JEDEC REGISTRATION MO-229 B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 D. DRAWING FILE NAME : MLP08XREVA E. LAND PATTERN RECOMMENDATION IS BASED ON FSC DESIGN ONLY (c)2009 Fairchild Semiconductor Corporation FDMC6675BZ Rev.D1 6 www.fairchildsemi.com FDMC6675BZ P-Channel PowerTrench(R) MOSFET TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. Auto-SPMTM F-PFSTM PowerTrench(R) The Power Franchise(R) PowerXSTM Build it NowTM FRFET(R) (R) Global Power ResourceSM Programmable Active DroopTM CorePLUSTM (R) Green FPSTM QFET CorePOWERTM TinyBoostTM QSTM Green FPSTM e-SeriesTM CROSSVOLTTM TinyBuckTM GmaxTM Quiet SeriesTM CTLTM TinyLogic(R) GTOTM Current Transfer LogicTM RapidConfigureTM TINYOPTOTM IntelliMAXTM EcoSPARK(R) TinyPowerTM EfficentMaxTM ISOPLANARTM TM TinyPWMTM MegaBuckTM Saving our world, 1mW /W /kW at a timeTM EZSWITCHTM * TinyWireTM TM* MICROCOUPLERTM SmartMaxTM TriFault DetectTM MicroFETTM SMART STARTTM TRUECURRENTTM* MicroPakTM SPM(R) (R) SerDesTM STEALTHTM MillerDriveTM Fairchild(R) SuperFETTM MotionMaxTM Fairchild Semiconductor(R) SuperSOTTM-3 Motion-SPMTM FACT Quiet SeriesTM SuperSOTTM-6 OPTOLOGIC(R) UHC(R) (R) (R) FACT OPTOPLANAR Ultra FRFETTM SuperSOTTM-8 (R) FAST(R) UniFETTM SupreMOSTM FastvCoreTM VCXTM SyncFETTM FETBenchTM VisualMaxTM Sync-LockTM PDP SPMTM (R) FlashWriter * XSTM (R)* Power-SPMTM FPSTM tm tm *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handing and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative / In Design Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I40 Preliminary First Production No Identification Needed Obsolete Full Production Not In Production (c)2009 Fairchild Semiconductor Corporation FDMC6675BZ Rev.D1 7 www.fairchildsemi.com |
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