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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND REEL TYPE LED LAMPS LUY3333/P1/TRS-6N DATA SHEET DOC. NO : REV. DATE : : QW0905- LUY3333/P1/TRS-6N A 27 - Dec - 2004 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3333/P1/TRS-6N Page 1/5 Package Dimensions P2 G H H2 H1 L W0 W2 W1 W3 D P1 P F T + - LUY3333/P1 5.0 5.9 7.6 8.6 12.8O 0.5 1.5MAX 25.0MIN 1/4 0.5 TYP 1.0MIN 2.54TYP Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3333/P1/TRS-6N Page 2/5 Absolute Maximum Ratings at Ta=25 J Ratings Parameter Symbol UY Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 50 90 120 10 2000 -40 ~ +85 -40 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT g A V J J Typical Electrical & Optical Characteristics (Ta=25 J ) PART NO MATERIAL Emitted COLOR Lens Water Clear Luminous Dominant Spectral Forward voltage intensity halfwidth wave length f nm @20mA(V) @20mA(mcd) f Dnm Min. Max. Min. Typ. Viewing angle 2c 1/2 (deg) LUY3333/P1/TRS-6N AlGaInP Yellow 595 15 1.7 2.6 1500 2700 20 Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3333/P1/TRS-6N E Dimension Symbol Information OPTION SYMBOL CODE ------- Page 3/5 SPECIFICATIONS Minimum inch mm 3.8 2.3 ------- SYMBOL ITEMS Maximum mm inch 4.2 3.0 2.0 20.9 36 11.0 0.17 0.12 0.08 0.82 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75 Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection Feed Hole To Bottom Of Component Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width D F 0.15 0.09 ------- ------- ------- H H1 H2 L P P1 P2 T TRS-6N ------- 19.9 ------- 0.78 ------- ------------- W0 12.4 4.4 5.1 ------- 0.49 0.17 0.2 ------- 13.0 5.8 7.7 1.42 9.75 15.5 4.0 19 ------- ------- ------- ------- W0 W1 W2 W3 8.5 14.5 0 17.5 0.33 0.57 0 0.69 ------- ------- ------- REMARK:TRS=Tape And Reel Straight Leads E Dimensions Symbol Information Description Reel Diameter Core Diameter Hub Recess Inside Diameter Arbor Hole Diameter Overall Reel Thickness Iside Reel Flange Thickness E Package Dimensions Symbol D D1 D2 D3 T2 T1 Specification minimum maxmum mm 78.2 34.9 28.6 13.8 30.0 inch 3.08 1.37 1.13 0.54 1.18 mm 380 102 88.0 38.1 57.2 50.0 inch 14.96 4.02 3.46 1.5 2.25 1.97 D3 MARKING D D2 D1 Package LUY3333/P1/TRS-6N Quantity/Reel 1000PCS T1 T2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3333/P1/TRS-6N Page4/5 Typical Electro-Optical Characteristics Curve UY CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.0 Forward Current(mA) 100 Relative Intensity Normalize @20mA 5.0 2.5 2.0 1.5 1.0 0.5 0 10 1.0 0.1 1.0 2.0 3.0 4.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Relative Intensity @20mA Normalize @25J -40 -20 0 20 40 60 80 100 Forward Voltage@20mA Normaliz @25J 1.2 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 Ambient Temperature(J ) Ambient Temperature(J ) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directivity Radiation Relative Intensity @20mA 1.0 0X -30X 30X 0.5 -60X 60X 0 500 550 600 650 100% 75% 50% 25% 0 25% 50% 75% 100% Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3333/P1/TRS-6N Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles 5J The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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