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MIC2829
3G/4G HEDGE/LTE PMIC with Six Buck Converters, Eleven LDOs and SIM Card Level Translation
General Description
The MIC2829 is a highly integrated Power Management Integrated Circuit (PMIC) designed for 3G/4G (HEDGE/LTE and WiMAX) USB wireless applications. It is a complete power management solution which provides power to processors, dual standard RF (such as HEDGE/LTE or WiMAX) transceivers and power amplifiers, memory, USB-PHY associated I/O interfaces and other system requirements. The MIC2829 incorporates six DC/DC buck converters, eleven LDOs and digital level shifters for SIM Card support inside a single package. Four of the six integrated DC/DC TM (HLL) buck converters incorporate HyperLight Load technology. Each of these buck regulators operate at high switching speed in PWM mode (4MHz/2.5MHz) and maintain high efficiency in light load conditions. The high speed PWM operation allows the use of very small inductors and capacitors minimizing board area while the HLL mode enables 87% efficiency at 1mA. HyperLight TM technology also has unmatched load transient Load response to support advance portable processor requirements. The remaining two DC/DC buck converters support 100% duty cycle operation and can deliver greater than 96% efficiency. This allows pre-regulation of system LDOs for high efficiency power system partitioning. The MIC2829 has eleven low dropout regulators (LDOs). Five general purpose LDOs provide low dropout, excellent output accuracy of 3% and only require 40A of ground current for each to operate. The remaining six are high performance Low Noise Regulators (LNRs) which provide high PSRR and low output noise for sensitive RF subsystems. Each LNR requires only 20A of ground current to operate. The MIC2829 also has three high speed level shifters for digital SIM Card signal translation and a 50mA SIM power supply. The MIC2829 is available in a 76-pin 5.5mm x 5.5mm LGA and an 85-pin 5.5mm x 5.5mm FBGA package. The operating junction temperature range for both packages is from -40C to +125C. Data sheets and support documentation can be found on Micrel's website at: www.micrel.com.
Features
* Input voltage range: 2.7V to 5.5V Six DC Step-Down Regulators TM * Four HyperLight Load step-down regulators - Low quiescent current - typical 40A - DC1: 4MHz / 1000mA - DC2: 4MHz / 300mA (with voltage scaling) - DC3: 2.5MHz / 600mA - DC4: 4MHz / 600mA (with adjustable delay POR) * Two PWM step-down regulators - DC5 and DC6: Fixed 2MHz / 800mA - 100% duty cycle Eleven Low Dropout Regulators (LDOs) * Five general purpose 200mA LDOs (LDO1-4, LDO11) - LDO3: 38mV dropout at 100mA - LDO2 and LDO4: 80mV dropout at 100mA - LDO1 and LDO11: 115mV dropout at 100mA - Output accuracy 3% - 40A ground current * Six high performance 200mA LNRs (LDO5-10) - High PSRR 70dB at 1kHz - Low noise: 20VRMS - 40mV dropout at 100mA - Output accuracy 3% - 20A ground current * SIM card level translator * SIM card power supply (50mA) * Thermal shutdown and current limit protection * UVLO - under voltage lockout protection * 76-pin 5.5mm x 5.5mm LGA package * 85-pin 5.5mm x 5.5mm FBGA package * -40C to +125C operating junction temperature range
Applications
* * * * * * 4G LTE USB modems 3G/4G (HEDGE/LTE) wireless chipsets WiMAX modems Express card modems UMPC/notebook PC wireless data communications Portable applications
HyperLight Load is a trademark of Micrel, Inc. Micrel Inc. * 2180 Fortune Drive * San Jose, CA 95131 * USA * tel +1 (408) 944-0800 * fax + 1 (408) 474-1000 * http://www.micrel.com
May 2010
M9999-051410-B
Micrel Inc.
MIC2829
Typical Application
VIN
C1 1F C18 1F C23 1F C28 1F
AVIN1 AGND1 AVIN2 AGND2 AVIN3 AGND3 AVIN4 AGND4 ENGLB PVIN1
BYP LDO10 LDO9 ENL910 INLDO910
C9 1F C8 2.2F C10 2.2F C7 0.1F
PVIN6 SW6 FB6 PGND6 ENDC6
C32 1F
L6 2.2H C40 120pF R10 20k R16 20k
DC6
C31 4.7F
DC1
C19 4.7F
L1 2.2H
C20 1F
SW1 FB1 PGND1 PVIN2
DC2
C22 4.7F
L2 2.2H
C21 1F
SW2 FB2 PGND2 ENDC2 VSC2 PVIN3
INLDO8 ENL8 LDO8
C13 2.2F C14 1F
DC3
C24 4.7F
L3 1H
C25 1F
SW3 FB3 PGND3 PVIN4
MIC2829
INLDO7 ENL7 LDO7
C11 2.2F C12 1F
PVIN5 SW5 FB5 PGND5 ENDC5
C29 1F L5 2.2H C39 120pF
DC4
R23 10k
L4 2.2H C27 4.7F
C26 1F
SW4 FB4 PGND4 RESETB SETDLY
DC5
R7 46.4k R8 20k C30 4.7F
C35 1F C34 1F C33 1F C16 1F C17 1F
LDO1 LDO11 INLDO23 LDO2
INLDO6 ENL6 LDO6
C3 2.2F
C2 1F
INLDO45 LDO3 ENL3 LDO4 ENL5 LDO5
C6 2.2F C5 1F
C15 1F C4 1F
ENL4 LSPWR SIMRST SIMCLK SIMIO SIMPWR SUB1 SUB2
C36 1F
C37 1F
RSTIN CLKIN DATA VSLS ENLS
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Ordering Information
Part Number MIC2829-A0YAL MIC2829-B0YAB Output DC1 DC2 DC3 DC4 DC5 DC6 LDO1 LDO2 LDO3 LDO4 LNR5 LNR6 LNR7 LNR8 LNR9 LNR10 LDO11
(1)
Marking Code MIC2829-A0 MIC2829-B0 Output Voltage (A0 Option) 1.2V 1.0V / 1.2V 3.0V 1.8V ADJ ADJ 3.3V 2.5V 2.8V 2.85V 2.8V 2.5V 1.8V 1.5V 1.2V 1.2V 2.8V
Junction Temperature Range -40C to +125C -40C to +125C Output Voltage (B0 Option) 1.15V 1.0V / 1.2V 3.0V 1.8V ADJ ADJ 3.3V 2.5V 2.8V 2.85V 2.8V 2.5V 1.8V 1.35V 1.2V 1.2V 2.8V
Package 76-Pin 5.5mm x 5.5mm LGA 85-Pin 5.5mm x 5.5mm FBGA
Lead Finish Pb-Free Pb-Free
Note: 1. Contact Micrel Marketing for details.
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Pin Configuration
76-Pin 5.5mm x 5.5mm LGA Package (AL) (Top View)
85-Pin 5.5mm x 5.5mm FBGA Package (AB) (Top View)
Pin Description
Pin # A A1 A2 A3 B1 A4 B2 A5 B3 A6 B4 A7 B5 A8 B6 A9 A10 A11 A12 Pin # B Pin # G Pin name AVIN1 INLDO6 LDO6 LDO4 INLDO45 LDO5 BYP LDO9 INLDO910 LDO10 LDO7 INLDO7 LDO8 INLDO8 LDO3 INLDO23 LDO2 AVIN2 Description Analog supply to chip. All AVIN pins should be tied together. Supply input to LNR6. LNR6 output. LDO4 output. Supply input to LDO4 and LNR5. LNR5 output. Reference bypass pin. Connect a 0.1F capacitor-to-ground. LNR9 output. Supply input to LNR9 and LNR10. LNR10 output. LNR7 output. Supply input to LNR7. LNR8 output. Supply input to LNR8. LDO3 output. Supply input to LDO2 and LDO3. LDO2 output. Analog supply to chip. All AVIN pins should be tied together.
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Pin # A A13 B8 A14 B9 A15 B10 A16 B11 A17 B12 A18 B13 A19 B14 A20 B15 A21 B16 A22 A23 A24 A25 B17 A26 B18 A27 B19 A28 B20 A29 B21 A30 B22 A31 A32 A33 A34 B23 A35 B24 A36 Pin # B B7 Pin # G Pin name SETDLY AGND2 ENL6 ENL7 SUB2 ENL8 RESETB PGND1 FB1 SW1 ENL910 PVIN1 AGND3 PVIN2 ENDC2 SW2 FB2 PGND2 FB3 AVIN3 PGND3 SW3 PVIN3 VSC2 PVIN4 ENLS SW4 FB4 PGND4 LSPWR DATA CLKIN SIMCLK SIMIO AGND4 SIMRST SIMPWR AVIN4 VSLS PVIN5 FB5 SW5 Description Set delay pin for RESETB output (1sec/F). Analog ground. Connect all AGND pins together. Enable LNR6. Do not leave floating. Enable LNR7. Do not leave floating. Guard ring ground connection. Connect to AGND1 and AGND2. Enable LNR8. Do not leave floating. Open drain RESETB output (POR function). Power ground of DC1. Output sense pin of DC1. Switch output of DC1. Enable LNR9 and LNR 10. Do not leave floating. Power input of DC1. Analog ground. Connect all AGND pins together. Power input of DC2. Enable DC2. Do not leave floating. Switch output of DC2. Output sense pin of DC2. Power ground of DC2. Output sense pin of DC3. Analog supply to chip. All AVIN pins should be tied together. Power ground of DC3. Switch output of DC3. Power input of DC3.
MIC2829
Voltage Scaling pin DC2 (High sets 1.2V, Low sets 1.0V). Do not leave floating. Power input of DC4. Enable level shifter. Do not leave floating. Switch output of DC4. Output sense pin of DC4. Power ground of DC4. Power input for level shifter input (1.8V). Digital data for SIM card. Digital input clock for SIM card. Level shifted Clock to SIM card. Level shifted digital input/output to SIM card. Analog ground. Connect all AGND pins together. Level shifted reset to SIM card. Power supply to SIM card Analog supply to chip. All AVIN pins should be tied together. Level shift voltage select for SIM card. Do not leave floating. Power input of DC5. Output sense pin of DC5 (Adjustable regulator). Switch output of DC5.
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Pin # A A37 B26 A38 B27 A39 B28 A40 B29 A41 B30 A42 B31 A43 B32 A44 G1 G2 G3 G4 G5 G6 G7 G8 G9 Pin # B B25 Pin # G Pin name ENDC5 PGND5 RSTIN PGND6 ENDC6 SW6 FB6 PVIN6 ENL3 ENGLB SUB1 ENL5 ENL4 AGND1 LDO11 LDO1 Thermal Via Thermal Via Thermal Via Thermal Via Thermal Via Thermal Via Thermal Via Thermal Via Thermal Via Description Enable DC5. Do not leave floating. Power ground of DC5. Digital reset input for SIM card. Power ground of DC6. Enable DC6. Do not leave floating. Switch output of DC6. Output sense pin of DC6 (Adjustable regulator). Power input of DC6. Enable LDO3. Do not leave floating.
MIC2829
Global enable for DC1, DC3, DC4 and LDO1, LDO2, LDO11. Do not leave floating. Guard ring ground connection. Connect to AGND1 and AGND2. Enable LNR5. Do not leave floating. Enable LDO4. Do not leave floating. Analog ground. Connect all AGND pins together. LDO11 output. LDO1 output. Thermal via. Connect to ground. Thermal via. Connect to ground. Thermal via. Connect to ground. Thermal via. Connect to ground. Thermal via. Connect to ground. Thermal via. Connect to ground. Thermal via. Connect to ground. Thermal via. Connect to ground. Thermal via. Connect to ground.
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MIC2829
Absolute Maximum Ratings(1)
All Power Input Supplies................................-0.3 to 6V All Logic Inputs...................................................-0.3 to 6V All Feedback Inputs ..................... -0.3 to (VAVIN + 0.3V) Ambient Storage Temperature ...............-65C to +150C (3) ESD Rating ................................................. ESD Sensitive ESD Rating (SIMRST, CLK, IO, PWR pins)......8kV to GND
Operating Ratings(2)
Supply and Bias Voltage (VPVIN, VAVIN)............2.7V to 5.5V Supply Voltage (VINLDO) .. ............................1.8V to VAVIN Supply Voltage (VLSPWR) ..............................1.6V to VAVIN All Logic Inputs ...............................................0V to VAVIN All Feedback Inputs ........................................0V to VAVIN Junction Temperature Range (TJ)... ....-40C TJ +125C Thermal Resistance 5.5mm x 5.5mm LGA (JA)..............................38.7C/W 5.5mm x 5.5mm FBGA (JA) ...........................38.7C/W
Electrical Characteristics - General(4)
TA = 25C; AVINX = 4.3V unless otherwise specified. Bold values indicate -40C TJ +125C, unless noted.
Parameter Supply Voltage Range Shutdown Current Enable (ENx) & Voltage Scaling Threshold (VSC2, VSLS) Enable & Voltage Scaling Input Current Over-Temperature Shutdown Threshold Over-Temperature Hysteresis Under-voltage Lockout Auto-Discharge NFET (5) Resistance VAVIN rising When Out_x disabled; IOUT = 3mA. When Out_x disabled; IOUT = 3mA. DC5 & 6 pull down on feedback pin. 2.4 Condition All VAVIN and VPVIN VIN = 5.0V All outputs disabled High Low VIL < 0.2V VIH > 1.1V 150 10 2.55 300 700 2.7 0.2 2 2 Min 2.7 1 1.1 Typ Max 5.5 Unit V A V V A A C C V
Electrical Characteristics - Quiescent Current(6)
TA=25 C, AVINx = PVINx = INLDOx = ENGLB = 4.3V; ENx = 0V ; All IOUT = 0mA unless otherwise noted. Bold values indicate -40C TJ 125C.
Parameter Initial Sequence IQ DC2 Additional IQ DC 5, 6 Additional IQ LDO 3, 4, LSPWR Additional IQ LNR 5 - 10 Additional IQ Condition DC1, 3, 4 Non switching, No loads LDO 1, 2, 11 IOUT = 100A DC2 enabled. ENDC2 = 4.3V VFB > VOUTNOM x 1.2 (Non switching) Per enabled DC. ENDCx = 4.3V VFB > 1.2V; IOUT = 0mA (Non switching) Per enabled LDO. ENLx = 4.3V IOUT =100A Per enabled LNR. ENLx = 4.3V IOUT =100A Min Typ 220 10 945 40 20 Max Unit A A A A A
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MIC2829
Electrical Characteristics - Buck Regulator (DC1 - DC4)
TA=25C, AVINx = VSC2 = ENGLB = ENDC2 = 4.3V, L3 = 1.0H, L1, 2, 4 = 2.2H, COUT = 4.7F, IOUT = 20mA, unless noted. Bold values indicate -40C TJ 125C.
Parameter Condition VOUT = VOUTNOM x 0.9, DC1 Switch Current Limit VOUT = VOUTNOM x 0.9, DC3 & 4 VOUT = VOUTNOM x 0.9, DC2 Output Voltage Accuracy Line Regulation Load Regulation 4.3V AVIN 5.5V, Iout = 20mA 150mA IOUT 400mA ISW1,3 = -100mA NMOS, DC1 & 3 ISW4 = -100mA NMOS, DC4 HLL Buck Switch ON Resistance ISW2 = -100mA NMOS, DC2 ISW3 = +100mA PMOS, DC3 ISW1, 4 = +100mA PMOS, DC1 & 4 ISW2 = +100mA PMOS, DC2 Soft Start Time Scale Transition Time DC2 Frequency DC3 RESETB on DC4 VTH Falling VTH Rising VOL IRESETB SETDLY input on DC4 SETDLY Current Source SETDLY Threshold Voltage VSETDLY = 0V RESETB = High 0.75 1.45 1.241 1.75 A V Low Threshold, % of nominal DC4 output (Flag ON) High Threshold, % of nominal DC4 output (Flag OFF) RESETB logic low voltage; IL = 250A Flag Leakage Current, Flag OFF -1 0.02 0.1 85 96 0.05 +1 % % V A ILOAD = 120mA 2.5 VOUT = 90% DC2 only. Time to reach 90% target. DC1, 2, 4 ILOAD = 120mA Min 1 0.65 0.33 -3 0.4 0.5 0.4 0.45 0.6 0.5 0.6 1.1 600 100 4 MHz s s Typ 1.4 1.5 1.1 3 % %/V % A Max Unit
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MIC2829
Electrical Characteristics - Buck Regulator (DC5, DC6)
TA=25 C, AVINx = ENGLB = ENDC5 = ENDC6 = 4.3V, L = 2.2H, COUT = 2.2F, IOUT = 100mA, unless otherwise noted. Bold values indicate -40C TJ 125C.
Parameter Switch Current Limit FB Voltage Accuracy Line Regulation Load Regulation Soft Start Time DC Switch ON Resistance ISW = -100mA NMOS Switching Frequency FB Pin Input Current 1.6 0.5 2 1 2.4 3.0V AVIN 5V , ILOAD = 100mA 20mA IOUT 300mA VOUT = 90%; ILOAD = 5mA ISW = +100mA PMOS Condition VFB = 0.9 V Min 0.86 0.97 Typ 1.3 1.0 0.12 0.2 100 0.4 1.03 Max Unit A V % % s MHz nA
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Electrical Characteristics - Low Dropout Regulators (LDO1 - LDO4, LDO11)
TA=25 C, AVINx = ENGLB = ENLx = 4.3V, VINLDOx = Vout+1V, COUT = 1F, IOUT = 100A, unless noted. Bold values indicate -40C TJ 125C.
Parameter Supply Voltage Range Current Limit Output Voltage Accuracy LDO2, 4; IOUT = 100mA; Dropout Voltage LDO3; IOUT = 100mA; LDO1, 11; IOUT = 100mA; Line Regulation Load Regulation Output Noise Ripple Rejection Turn On Time VOUT + 1V VINLDO 5.5V 100A IOUT 100mA 100Hz to 100kHz; COUT = 2.2F f = 1kHz, COUT = 2.2F Enable to 90% nominal VOUT Condition Min 1.8 200 -3 80 38 115 0.02 0.4 65 55 25 3 125 100 210 0.2 2 %/V % Vrms dB s mV Typ Max AVIN Unit V mA %
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MIC2829
Electrical Characteristics - Low Noise Regulators (LNR5 - LNR10)
TA=25 C, AVINx = ENx= 4.3V, VINLDOx = Vout+1V, COUT = 2.2F, IOUT = 100A, unless noted. Bold values indicate -40C TJ 125C.
Parameter Supply Voltage Range Current Limit Output Voltage Accuracy Dropout Voltage Line Regulation Load Regulation Output Noise Ripple Rejection Turn On Time LNR5, 6, 7; IOUT = 100mA; LNR8, 9, 10 VOUT + 1V VINLDOx VAVIN 100A IOUT 100mA 100Hz to 100kHz; COUT = 2.2F, CBYP = 0.1F f = 1kHz, COUT = 2.2F, CBYP = 0.1F Enable to 90% nominal VOUT Condition LNR5, 6, 7 LNR8, 9 ,10 Min 1.8 1.7 200 -3 40 N/A 0.02 0.4 20 70 100 0.2 2 3 75 Typ Max AVIN AVIN Unit V mA % mV %/V % Vrms dB s
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Electrical Characteristics - SIM power supply and level translator
TA=25 C, AVINx = ENGLB = ENLS = 4.3V, COUT = 1.0F, IOUT = 100A, unless otherwise noted. Bold values indicate -40C TJ 125C.
Parameter Controller Voltage Input Current Limit (SIMPWR) Output Voltage Accuracy SIMPWR Turn On Time High Input Threshold Low Input Threshold SIMIO (VOH) SIMIO (VOL) SIMRST, SIMCLK (VOH) SIMRST, SIMCLK (VOL) DATA (VOH) DATA (VOL) DATA Pull Up Resistance SIMIO Pull Up Resistance SIMCLK Rise/Fall Time SIMRST, SIMIO Rise/Fall Time RSTIN, CLKIN (Y = VLSPWR) RSTIN, CLKIN (Y = VLSPWR) IOH = 20A, DATA = VLSPWR (X = VSIMPWR) IOL = -1mA, DATA = 0V IOH = 20A, (X = VSIMPWR) IOL = -200A IOH = 20A, SIMIO = VSIMPWR (Y = VLSPWR) IOL = -200A, SIMIO = 0V Between DATA and LSPWR Between SIMIO and SIMPWR CRSTIN, CSMIIO = 30pF (20-80%) CRSTIN, CSMIIO = 30pF (20-80%) 13 6.5 20 10 18 25 0.7*Y 0.4 30 14 0.9*X 0.4 0.2*Y 0.8*X 0.4 3V Output , IOUT = 50mA 1.8V Output, IOUT = 50mA Condition Min 1.62 60 2.7 1.7 3 1.8 500 0.7*Y 3.3 2.0 Typ 1.8 Max 1.98 Unit V mA V s V V V V V V V V k k ns ns
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Notes:
MIC2829
1. Exceeding the absolute maximum rating may damage the device. 2. The device is not guaranteed to function outside its operating rating. 3. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5k in series with 100pF. 4. Specification for packaged product only. 5. All outputs are auto discharged with an internal NMOS when output is disabled. 6. Quiescent current is the total supply current minus any enabled LDO/LNR/LSPWR load current.
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Typical Characteristics
DC1 HLL Buck Efficiency vs. Output Current
100 90 80 EFFICIENCY (%) 70 60 50 40 30 20 10 0 1 10 100 1000 OUTPUT CURRENT (mA) VOUT_NOM = 1.2V L = 2.2H COUT = 4.7F VIN = 5V VIN = 3.6V VIN = 4.3V
DC2 HLL Buck Efficiency vs. Output Current
100 90 80 EFFICIENCY (%)
EFFICIENCY (%) 100
DC3 HLL Buck Efficiency vs. Output Current
90 80 70 60 50 40 30 20 10 0 VIN = 4.3V VOUT_NOM = 3V L = 1.0H COUT = 4.7F VIN = 5V
VIN = 3.6V
70 60 50 40 30 20 10 0 1 10 100 1000 OUTPUT CURRENT (mA) VOUT _NOM = 1V L = 2.2H COUT = 4.7F VIN = 4.3V VIN = 5V
1
10
100
1000
OUTPUT CURRENT (mA)
100 90 80 EFFICIENCY (%) 70 60 50 40 30 20 10 0 1
DC4 HLL Buck Efficiency vs. Output Current
VIN = 4.3V
100 90 80 EFFICIENCY (%)
DC5 PWM Buck Efficiency vs. Output Current
VIN = 3.6V
100 90 80 EFFICIENCY (%) 70 60 50 40 30 20 10 0
DC6 PWM Buck Efficiency vs. Output Current
VIN = 3.6V
70 60 50 40 30 20 10 0 1 VIN = 4.3V 10 VOUT _NOM = 3.3V L = 2.2H C OUT = 4.7F 100 1000 VIN = 5V
VIN = 4.3V VIN = 5V
VIN = 3.6V
VIN = 5V
VOUT_NOM = 1.8V L = 2.2H COUT = 4.7F 10 100 1000
VOUT_NOM = 2V L = 2.2H COUT = 4.7F 1 10 100 1000
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
1.60 1.50 OUTPUT VOLTAGE (V) 1.40 1.30 1.20 1.10 1.00 0.90 0.80 0
DC1 Output Voltage vs. Output Current
1.60 1.50 OUTPUT VOLTAGE (V)
DC2 Output Voltage vs. Output Current
OUTPUT VOLTAGE (V)
VSC2 = VIN
3.50 3.40 3.30 3.20 3.10 3.00 2.90 2.80 2.70 2.60 2.50 0
DC3 Output Voltage vs. Output Current
1.40 1.30 1.20 1.10 1.00 0.90 0.80 0.70 0.60
VPVIN = 5V VOUT_NOM = 1.2V L = 2.2H COUT = 4.7F
VPVIN = 5V VSC2 = 0V VOUT_NOM = 1V / 1.2V L = 2.2H COUT = 4.7F
V PVIN = 5V V OUT_NOM = 3V L = 1H COUT = 4.7F
200
400
600
800
1000
0
50
100
150
200
250
300
100 200 300 400 500 600 700 800 OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
2.20 2.10
DC4 Output Voltage vs. Output Current
3.40 3.38 OUTPUT VOLTAGE (V)
DC5 Output Voltage vs. Output Current
2.10 2.08 OUTPUT VOLTAGE (V) 2.06 2.04 2.02 2.00 1.98 1.96 1.94 1.92 1.90
1000
DC6 Output Voltage vs. Output Current
OUTPUT VOLTAGE (V)
3.36 3.34 3.32 3.30 3.28 3.26 3.24 3.22 3.20 0 200 400
VPVIN = 5V VOUT_NOM = 3.3V L = 2.2H COUT = 4.7F
2.00 1.90 1.80 1.70
V PVIN = 5V
1.60 1.50 1.40 0 200 400
VPVIN = 5V VOUT_NOM = 2V L = 2.2H COUT = 4.7F
V OUT_NOM = 1.8V L = 2.2H COUT = 4.7F
600
800
600
800
0
200
400
600
800
1000
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
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Typical Characteristics (Continued)
1.30 1.28 OUTPUT VOLTAGE (V) 1.26 1.24 1.22 1.20 1.18 1.16 1.14 1.12 1.10 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 INPUT VOLTAGE (V) IOUT = 100mA IOUT = 450mA IOUT = 800mA
Typical HLL Output Voltage vs. Input Voltage
VOUT _NOM = 1.2V L = 2.2H COUT = 4.7F
2.010 2.008 OUTPUT VOLTAGE (V)
Typical PWM Output Voltage vs. Input Voltage
VOUT_NOM = 2V L = 2.2H COUT = 4.7F IOUT = 1mA
2.010 2.008 OUTPUT VOLTAGE (V) 2.006 2.004 2.002 2.000 1.998 1.996 1.994 1.992 1.990
Typical PWM Output Voltage vs. Input Voltage
VOUT_NOM = 2V L = 2.2H COUT = 4.7F IOUT = 800mA
IOUT = 1mA
2.006 2.004 2.002 2.000 1.998 1.996 1.994 1.992 1.990
IOUT = 100mA
IOUT = 350mA
IOUT = 600mA
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
LDO1 Output Voltage vs. Input Voltage
3.34 IOUT = 1mA 3.32
OUTPUT VOLTAGE (V)
LDO2 Output Voltage vs. Input Voltage
2.54 2.52 2.50 2.48 2.46 2.44 2.42 2.40 2.38 2.36 2.34 2.32 2.30 2.7 IOUT = 1mA
2.84 2.82 OUTPUT VOLTAGE (V) 2.80 2.78 2.76 2.74
LDO3 Output Voltage vs. Input Voltage
IOUT = 1mA
IOUT = 100mA
OUTPUT VOLTAGE (V)
3.30 3.28 3.26 3.24 3.22 3.20 3.6 4 4.4 4.8 5.2 INPUT VOLTAGE (V) VOUT_NOM = 3.3V COUT = 1F IOUT = 200mA
IOUT = 200mA
IOUT = 100mA
IOUT = 100mA
IOUT = 200mA VOUT _NOM = 2.8V
VOUT_NOM = 2.5V COUT = 1F
2.72 2.70
COUT = 1F
3.1
3.5
3.9
4.3
4.7
5.1
5.5
3
3.5
4
4.5
5
5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
2.91 2.89 OUTPUT VOLTAGE (V) 2.87 2.85 2.83 2.81 2.79 2.77 2.75 2.73 2.71 3
LDO4 Output Voltage vs. Input Voltage
IOUT = 1mA
LNR5 Output Voltage vs. Input Voltage
2.84 2.82 OUTPUT VOLTAGE (V) 2.80 2.78 2.76 IOUT = 200mA 2.74 2.72 2.70 IOUT = 100mA VOUT_NOM = 2.8V COUT = 2.2F IOUT = 1mA
2.54 2.52 OUTPUT VOLTAGE (V) 2.50 2.48 2.46
LNR6 Output Voltage vs. Input Voltage
IOUT = 1mA
IOUT = 200mA
IOUT = 100mA
IOUT = 100mA 2.44
IOUT = 200mA VOUT _NOM = 2.5V
VOUT_NOM = 2.85V COUT = 1F 3.5 4 4.5 5 5.5
2.42 2.40
COUT = 2.2F 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
3
3.5
4
4.5
5
5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
LNR7 Output Voltage vs. Input Voltage
1.84
IOUT = 1mA
1.54 1.52 OUTPUT VOLTAGE (V) 1.50 1.48 1.46 1.44 1.42 1.40
LNR8 Output Voltage vs. Input Voltage
IOUT = 1mA
1.24 1.22 OUTPUT VOLTAGE (V) 1.20 1.18 1.16 1.14 1.12 1.10
LNR9/10 Output Voltage vs. Input Voltage
IOUT = 1mA
1.82 OUTPUT VOLTAGE (V) 1.80 1.78 1.76 1.74 1.72 1.70 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 INPUT VOLTAGE (V) IOUT = 100mA IOUT = 200mA VOUT _NOM = 1.8V COUT = 2.2F
IOUT = 100mA
IOUT = 200mA VOUT_NOM = 1.5V COUT = 2.2F
IOUT = 100mA
IOUT = 200mA
VOUT_NOM = 1.2V COUT = 2.2F
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
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Typical Characteristics (Continued)
LDO11 Output Voltage vs. Input Voltage
2.84 IOUT = 1mA 2.82 OUTPUT VOLTAGE (V) IOUT = 100mA
DC1 Output Voltage vs. Temperature
1.40 1.36 OUTPUT VOLTAGE (V) 1.32 1.28 1.24 1.20 1.16 1.12 1.08 1.04 1.00
5.5
1.10
DC2 Output Voltage vs. Temperature
1.08 OUTPUT VOLTAGE (V) 1.06 1.04 1.02 1.00 0.98 0.96 0.94 0.92 0.90 -40 -20 0 20 40 IOUT = 300mA VIN = 5V VOUT_NOM = 1V VSC2 = 0V L = 2.2H COUT = 4.7F 60 80 100 120 IOUT = 120mA
VIN = 5V IOUT = 120mA VOUT_NOM = 1.2V L = 2.2H COUT = 4.7F
2.80 2.78 2.76 2.74 2.72 2.70 3 3.5 4 4.5 5 INPUT VOLTAGE (V) IOUT = 200mA VOUT _NOM = 2.8V COUT = 2.2F
IOUT = 400mA IOUT = 800mA
-40 -20
0
20
40
60
80
100 120
TEMPERATURE (C)
TEMPERATURE (C)
DC3 Output Voltage vs. Temperature
3.20 3.16 OUTPUT VOLTAGE (V) 3.12 3.08 3.04 3.00 2.96 2.92 2.88 2.84 2.80 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C) IOUT = 400mA IOUT = 800mA IOUT = 120mA VIN = 5V OUTPUT VOLTAGE (V) VOUT_NOM = 3V L = 1H COUT = 4.7F 1.90 1.88 1.86 1.84 1.82 1.80 1.78 1.76 1.74 1.72 1.70
DC4 Output Voltage vs. Temperature
3.38 VIN = 5V OUTPUT VOLTAGE (V) IOUT = 120mA VOUT _NOM = 1.8V L = 2.2H COUT = 4.7F 3.36 3.34 3.32 3.30 3.28 3.26 3.24 3.22 -40 -20 0 20 40 60 80 100 120
DC5/6 Output Voltage vs. Temperature
IOUT = 800mA
VIN = 5V IOUT = 120mA VOUT _NOM = 3.3V L = 2.2H COUT = 4.7F 40 60 80 100 120
IOUT = 300mA IOUT = 600mA
-40 -20
0
20
TEMPERATURE (C)
TEMPERATURE (C)
Typical LDO Output Voltage vs. Temperature
2.90 2.88 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 2.86 2.84 2.82 2.80 2.78 2.76 2.74 2.72 2.70 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C) IOUT = 100mA VOUT_NOM = 2.8V COUT = 1F IOUT = 100A 2.90 2.88
Typical LNR Output Voltage vs. Temperature
3.10 3.08 OUTPUT VOLTAGE (V) 3.06 3.04 3.02 3.00 2.98 2.96 2.94 2.92 2.90
-40 -20 0 20 40 60 80 100 120 IOUT = 100A
SIMPWR Output Voltage vs. Temperature
2.86 2.84 2.82 2.80 2.78 2.76 2.74 2.72 2.70 TEMPERATURE (C) IOUT = 100mA VOUT_NOM = 2.8V COUT = 2.2F
IOUT = 50mA
VIN = 5V VOUT _NOM = 3V VSLS = HIGH -40 -20 0 20 40 60 80 100 120
TEMPERATURE (C)
SIMPWR Output Voltage vs. Temperature
1.90
QUIESCENT CURRENT (A) 300
ENGLB Quiescent Current vs. Input Voltage
QUIESCENT CURRENT (A)
20 18 16 14 12 10 8 6 4 2 0 3.3
DC2 Quiescent Current vs. Input Voltage
1.88 OUTPUT VOLTAGE (V) 1.86 1.84 1.82 1.80 1.78 1.76 1.74 1.72 1.70 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C) VIN = 5V VOUT _NOM = 1.8V VSLS = LOW IOUT = 50mA
250
ENGLB = VIN All other enables = 0V
200
150
Switching, No Load DC1, DC3, DC4, LDO1, LDO2, LDO11 = ON 3.3 3.7 4.1 4.5 4.9 5.3
Not Switching No Load 3.7 4.1 4.5 4.9 5.3
100 INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
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Typical Characteristics (Continued)
1200 QUIESCENT CURRENT (A) 1100 1000 900 800 700 600 3.3 3.8 4.3 4.8 5.3 INPUT VOLTAGE (V)
DC5/6 Quiescent Current vs. Input Voltage
QUIESCENT CURRENT (A)
60 50 40 30 20 10
Typical LDO Quiescent Current vs. Input Voltage
QUIESCENT CURRENT (A)
40
Typical LNR Quiescent Current vs. Input Voltage
30
20
10 IOUT = 100A 0 3.3 3.7 4.1 4.5 4.9 5.3
Not Switching No Load
IOUT = 100A 0 3.3 3.8 4.3 4.8 5.3 INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
180 DROPOUT VOLTAGE (mV) 160 140 120 100 80 60 40 20 0 -40 -20
LDO1/11 Dropout vs. Temperature
60 DROPOUT VOLTAGE (mV)
IOUT = 100mA
LDO3 Dropout vs. Temperature
DROPOUT VOLTAGE (mV)
IOUT = 100mA
80 70 60 50 40 30 20 10
LNR5/6/7 Dropout vs. Temperature
50 40 30 20 10 0
IOUT = 100mA
VOUT = 2.8V C OUT = 1F
COUT = 1F 0 20 40 60 80 100 120 -40 -20 0 20 40
COUT = 2.2F 0 -40 -20 0 20 40 60 80 100 120
60
80
100 120
TEMPERATURE (C)
TEMPERATURE (C)
TEMPERATURE (C)
140 DROPOUT VOLTAGE (mV) 120 100 80 60 40 20
LDO2/4 Dropout vs. Temperature
2200
IOUT = 100mA
DC1 Current Limit vs. Temperature
1400 1300 CURRENT LIMIT (mA) 1200 1100 1000 900 800 700 600 500 400 -40 -20 0 20 40 60 80 100 120 2100 CURRENT LIMIT (mA) 2000 1900 1800 1700 1600 1500 1400 1300 1200 VIN = 5V VOUT _NOM = 1.2V L = 2.2H COUT = 4.7F
DC2 Current Limit vs. Temperature
VIN = 5V VOUT _NOM = 1V L = 2.2H COUT = 4.7F -40 -20 0 20 40 60 80 100 120
COUT = 1F 0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C)
TEMPERATURE (C)
TEMPERATURE (C)
DC3/4 Current Limit vs. Temperature
1600 1500 CURRENT LIMIT (mA) 1400 1300 1200 1100 1000 900 800 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C) VIN = 5V L = 2.2H COUT = 4.7F CURRENT LIMIT (mA) 1500 1400
DC5/6 Current Limit vs. Temperature
Typical LDO Current Limit vs. Temperature
1000 900 CURRENT LIMIT (mA) 800 700 600 500 400 300 200 100 0 VIN = 4.3V COUT = 1F VIN = 5V
1300 1200 1100 1000 900 800 700 600 500 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C) VIN = 5V L = 2.2H COUT = 4.7F
-40 -20
0
20
40
60
80 100 120
TEMPERATURE (C)
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Typical Characteristics (Continued)
Typical LNR Current Limit vs. Temperature
1000 900 CURRENT LIMIT (mA) VIN = 5V
SIMPWR Current Limit vs. Temperature
200 180 CURRENT LIMIT (mA)
CURRENT LIMIT (mA)
1000 900 800 700 600 500 400 300 200 100 0
Typical LDO Current Limit vs. Input Voltage
800 700 600 500 400 300 200 100 0
160 140 120 100 80 60 40 20 0 VIN = 5V VOUT_NOM = 1.8V -40 -20 0 20 40 60 80 100 120
VIN = 4.3V COUT = 2.2F -40 -20 0 20 40 60 80 100 120
COUT = 1F 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
TEMPERATURE (C)
TEMPERATURE (C)
INPUT VOLTAGE (V)
Typical LNR Current Limit vs. Input Voltage
1000 900 CURRENT LIMIT (mA)
7.0 6.0 FREQUENCY (MHz) 5.0 4.0
DC1 HLL SW Frequency vs. Output Current
VOUT = 1.2V L = 2.2H COUT = 4.7F VIN = 3.6V
FREQUENCY (MHz)
7.0 6.0 5.0 4.0 3.0
DC2 HLL SW Frequency vs. Output Current
VOUT = 1.0V L = 2.2H COUT = 4.7F VSC2 = 0V VIN = 3.6V
800 700 600 500 400 300 200 100 0 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 INPUT VOLTAGE (V) COUT = 2.2F
VIN = 4.3V 3.0 2.0 1.0 0.0 1 10 100 1000 OUTPUT CURRENT (mA) VIN = 5V
VIN = 4.3V 2.0 1.0 0.0 1 10 100 1000 OUTPUT CURRENT (mA) VIN = 5V
4.0
DC3 HLL SW Frequency vs. Output Current
VOUT = 3V L = 1.0H COUT = 4.7F VIN = 4.3V
7.0 6.0 FREQUENCY (MHz) 5.0 4.0 3.0 2.0 1.0
DC4 HLL SW Frequency vs. Output Current
VOUT = 1.8V L = 2.2H COUT = 4.7F VIN = 3.6V
4MHz HLL SW Frequency vs. Temperature
6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 IOUT = 800mA IOUT = 400mA
FREQUENCY (MHz)
2.0
VIN = 4.3V
FREQUENCY (MHz)
3.0
IOUT = 120mA
VIN = 5V VOUT _NOM = 1.2V L = 2.2H COUT = 4.7F
1.0 VIN = 5V 0.0 1 10 100 1000 OUTPUT CURRENT (mA)
VIN = 5V 0.0 1 10 100 1000 OUTPUT CURRENT (mA)
-40 -20
0
20
40
60
80
100 120
TEMPERATURE (C)
2.5MHz HLL SW Frequency vs. Temperature
5.0 4.5 FREQUENCY (MHz) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C) IOUT = 800mA VIN = 5V VOUT_NOM = 3V L = 1H COUT = 4.7F IOUT = 600mA IOUT = 400mA FREQUENCY (MHz) 2.20 2.16 2.12 2.08 2.04 2.00 1.96 1.92 1.88 1.84 1.80
DC5/6 PWM SW Frequency vs. Temperature
IOUT = 800mA
Typical LDO PSRR
-100 -90 -80 -70 -60 dB -50 -40 -30 -20 -10 0 10 VIN = 4.3V VOUT _NOM = 2.5V COUT = 1F IOUT = 100A IOUT = 100mA
VIN = 5V IOUT = 120mA VOUT_NOM = 3.3V L = 2.2H COUT = 4.7F 40 60 80 100 120
-40 -20
0
20
1000
100000
10000000
TEMPERATURE (C)
FREQUENCY (Hz)
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Typical Characteristics (Continued)
Typical LNR PSRR
-100 -90 -80 NOISE V/Hz 1 IOUT = 100A 10 Noise (10Hz- 100kHz) = 64.9Vrms
Typical LDO Output Noise Spectral Density
Typical LNR Output Noise Spectral Density
10 Noise (10Hz- 100kHz) = 17.7Vrms 1 NOISE V/Hz
-70 -60 dB -50 -40 -30 -20 -10 0 10 1000 VIN = 4.3V VOUT _NOM = 2.8V COUT = 2.2F
IOUT = 100mA
0.1 VIN = 5V 0.01 VOUT = 2.5V Load = 36 COUT = 2.2F CBYP = 0.1F 10 100 1,000 10,000 100,000
0.1
VIN = 5V VOUT = 2.5V Load = 36 COUT = 2.2F
0.01 100000 10000000 10 100 1,000 10,000 100,000 FREQUENCY (Hz) FREQUENCY (Hz)
0.001
FREQUENCY (Hz)
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Functional Characteristics
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MIC2829
Functional Characteristics (Continued)
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MIC2829
Functional Characteristics (Continued)
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MIC2829
Functional Characteristics (Continued)
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MIC2829
Functional Characteristics (Continued)
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MIC2829
Functional Characteristics (Continued)
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MIC2829
Functional Characteristics (Continued)
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MIC2829
Functional Characteristics (Continued)
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MIC2829
Functional Characteristics (Continued)
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MIC2829
Functional Characteristics (Continued)
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Functional Characteristics (Continued)
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Functional Diagram
AVIN1,2,3,4 ENGLB
PVIN1 SW1 FB1 PGND1
MIC2829
BYP
DC1
LDO10 LDO10 LDO10 LDO1 Low Noise Low Noise LDO9 LDO9 LDO9 LDO9 Low Noise ENL910 ENL91 Low Noise INLDO910 DC6 DCDC6
SW6 SW FB6 FB6 PVIN6 PVIN PGND6 PGND
PVIN2 PVIN2 SW2 SW2 DCDC2 FB2 FB2 DC2 PGND2 PGND2
ENDC2 ENDC2 VSC2 VSC2
ENDC ENDC6
PVIN3 PVIN3 SW3 SW3 DC3 FB3 FB3 DCDC3 PGND3 PGND3 PVIN4 PVIN4 SW4 SW4 DC4 FB4 FB4 DCDC4 PGND4 PGND4
INLDO8 LDO8 LDO8 LDO8 LDO8
Low Noise ENL8 Low NoiseENL8
LDO7 LDO7 LDO7 LDO7 Low NoiseENL Low Noise ENL7 INLDO7
SW5 SW5 FB5 FB5 PVIN5 PVIN PGND5 PGND
POR RESETB POR Delay SETDLY Delay LDO1 LDO1 LDO1 LDO11 LDO11 INLDO23 LDO2 LDO3 LDO2 ENL3 LDO3 LDO3 LDO11 LDO3 ENL3 LDO11
MIC2829 LDO4 LDO4 ENL4 LDO4 LSPWR RSTIN CLKIN DATA VSLS ENLS AGND1,2,3,4
AVIN1 DCDC5 DC5
ENDC ENDC5 INLDO6 LDO6 LDO6 LDO6 LDO6 ENL6 Low Noise ENL6 Low Noise LDO5 LDO5 LDO5 LDO5 ENL Low Noise ENL5 Low Noise INLDO INLDO45
Level Shifter 1.8V/3.0V
SIMRST SIMCLK SIMIO SIMPWR SUB1,2
MIC2829 Simplified Block Diagram
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MIC2829 the layout, AGND3 should be connected to the PGND plane near the PGND3 pin. Similarly, AGND4 should be connected to the PGND plane near the PGND4 pin. This allows the AGND3 and AGND4 ground voltage to be as close to the PGND ground voltage as possible. Should the AGND3 and AGND4 connect further from the PGND3 and PGND4 pins, then the effects of parasitic inductance and resistance would reduce the performance by altering the accuracy of ground. Refer to the layout recommendations for more details. PGND1 to PGND6 The power ground pins (PGND1 to PGND6) are the ground path for the high current ground path for DC1 through DC6. The current loop for the power ground should be as small as possible and separate from the analog ground (AGND3, AGND4) loop. All power grounds (PGND1 to PGND6) should be connected on the same plane. Refer to the layout recommendations for more details. INLDO The INLDO pins (INLDO23, INLDO45, INLDO6, INLDO7, INLDO8, and INLDO910) are the power input for the respective LDOs. Due to line inductance, a minimum of 1F input capacitor with a minimum voltage rating of 6.3V should be placed as close as possible to the INLDO pin and ground (AGND1, AGND2). Refer to the layout recommendations for more details. LDO The LDO pins (LDO1 to LDO11) are the output of the LDO and LNR regulators. For LDO1, LDO2, LDO3, LDO4 and LDO11, a minimum of 1F output capacitor with a minimum voltage rating of 6.3V placed as close to the LDO pin and ground (AGND1 and AGND2) as possible is required. For the LNRs (LDO5 to LDO10), a 2.2F output capacitor with a minimum voltage rating of 6.3V placed as close as possible to the LDO pin and ground (AGND1 and AGND2) is recommended. Refer to the layout recommendations for more details. BYP The reference bypass pin (BYP) acts as a filter for the reference voltage of LNR5 to LNR10. A 0.1F bypass capacitor connected to ground (AGND1 and AGND2) is recommended. SUB The SUB pin (SUB1, SUB2) is connected internally to the guard ring ground protection. The guard ring prevents interaction between regulators inside the die package. Connect SUB1 and SUB2 pins to ground (AGND1, AGND2) externally.
Functional Description
AVIN1 and AVIN2 The input supply pins (AVIN1 and AVIN2) provide bias to the internal LDO circuitry and the input voltage to LDO1 and LDO11. The AVIN operating range is 2.7V to 5.5V so a minimum 1F input capacitor with a 6.3V voltage rating placed as close to the AVIN and ground (AGND1 and AGND2) is required. Capacitance decreases as the DC bias across the capacitor increases and should be considered when selecting a suitable capacitor. AVIN1 and AVIN2 are internally connected. All AVINs should be tied together and connected to the PVINs of the device. Refer to the layout recommendations for details. AVIN3 and AVIN4 The input supply pins (AVIN3 and AVIN4) provide bias to the internal circuitry for the switch mode regulators (DC1 through DC6) and power to SIMPWR. The AVIN operating range is 2.7V to 5.5V, so a minimum 1F input capacitor with a minimum voltage rating of 6.3V placed close to AVIN and ground (AGND3 and AGND4) is required. AVIN3 and AVIN4 are internally connected. All AVINs should be tied together and connected to the PVINs of the device. Refer to the layout recommendations for details. PVIN1 to PVIN6 The power input supply pins (PVIN1 to PVIN6) provide power to the switch mode regulators (DC1 to DC6). Due to high switching currents, a minimum 1F input capacitor with a minimum voltage rating of 6.3V placed close to PVIN and the power ground is required. The PVIN tracks should be as wide as possible and the 1F capacitor should be placed from PVIN1 to PGND1 due to the proximity of their pin location. The same should be done with each PVIN and PGND combination. All AVINs should be tied together and connected to the PVINs of the device. Refer to the layout recommendations for details. AGND1 and AGND2 The ground pins (AGND1 and AGND2) are the ground path for the biasing, the control circuitry and the power ground for all LDOs. AGND1 and AGND2 are internally connected. The current loop for the ground should be kept as short as possible. Connect AGND1 and AGND2 together. Refer to the layout recommendations for more details. AGND3 and AGND4 The analog ground pins (AGND3 and AGND4) are the ground path for the biasing and the control circuitry for all buck regulators. This is a low current ground path and should not be mixed with high current paths such as PGND. To reduce the effects of parasitic interference in May 2010 30
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Micrel Inc. ENGLB The global enable pin (ENGLB) must be pulled high in order for the MIC2829 to function. When ENGLB is pulled high, a startup sequence begins. The regulators DC1, DC3, DC4/LDO2, LDO1/LDO11 turn on in sequence. See Turn-ON Sequence Flow Chart in Figure 1. ENDC
ENDC2 ENDC5 ENDC6
MIC2829 HIGH (>1.1V)
DC2 ON DC5 ON DC6 ON
LOW (<0.2V)
DC2 OFF DC5 OFF DC6 OFF
Table 1. Buck Regulator Enable
ENL ENGLB needs to be high in order for any other enables to function. A logic high signal on the enable pin (ENL3 to ENL8, ENL910) activates the output voltage of LDO3, LDO4 and LNR5 to LNR10 as shown in Table 2. A logic low signal on the enable pin deactivates the output of the respective LDO. Do not leave floating, as it would leave the regulator in an unknown state. ENL
ENL3 ENL4 ENL5 ENL6 ENL7 ENL8 ENL910
HIGH (>1.1V)
LDO3 ON LDO4 ON LNR5 ON LNR6 ON LNR7 ON LNR8 ON LNR9, LNR10 ON
LOW (<0.2V)
LDO3 OFF LDO4 OFF LNR5 OFF LNR6 OFF LNR7 OFF LNR8 OFF LNR9, LNR10 OFF
Table 2. LDO Regulator Enable
SETDLY If the output voltage of DC4 is greater than 90% of nominal, the Power On Reset (POR) delay circuit begins to source a current to the set-delay pin (SETDLY). The SETDLY pin is used to adjust the delay time of the RESETB flag. A capacitor may be placed from SETDLY to ground (AGND1, AGND2) to adjust the delay time at a rate of 1 second/F. RESETB The RESETB is an open drain output and can, for instance, be tied to the output of DC4 through a 100k resistor. When DC4 output voltage is greater than 96%, then the RESETB voltage will be pulled high after a delay set by the capacitor on the SETDLY pin. A capacitor at the SETDLY pin will delay the RESETB flag at a rate of 1 second / F. When the output of DC4 is below 90%, RESETB is pulled low.
Figure 1. Turn-ON Sequence Flow Chart
ENDC ENGLB needs to be high in order for any other enables to function. A logic high signal on the enable pin (ENDC2, ENDC5, ENDC6) activates the output voltage of its respective buck regulator shown in Table 1. A logic low signal on the enable pin deactivates the output of the buck regulator. Do not leave floating, as it would leave the regulator in an unknown state. May 2010 31
FB1 to FB4 The feedback pin (FB1 to FB4) is connected to the TM circuit to provide output of the HyperLight Load feedback to the control circuitry. The FB connection should be connected close to the output capacitor. Refer to the layout recommendations for more details.
M9999-051410-B
Micrel Inc. FB5 and FB6 The feedback pin (FB5, FB6) allows DC5 and DC6 output voltage to be set by applying an external resistor network. The internal reference voltage is 1V and the recommended value of RBOTTOM is 20k or below. A feed-forward capacitor (CFF) of 120pF should be placed parallel to RTOP to improve stability and transient response. This does not impact the output voltage setting. The output voltage is calculated from the equation below.
MIC2829 VSLS VSLS selects the level shifted voltage for the SIM Card. A high logic voltage on VSLS selects the level shifter to 3V. A low logic voltage on VSLS selects the level shifter to 1.8V. Do not leave floating. RSTIN, SIMRST RSTIN is the digital reset input for the SIM Card and translates to SIMRST through the digital level shifter. It is one directional. If VSLS is low, then the input at RSTIN will be level shifted to 1.8V at the SIMRST output. If VSLS is high, then the input at RSTIN will be level shifted to 3V at the SIMRST output. CLKIN, SIMCLK CLKIN is the digital input clock for SIM card. The CLKIN translates to SIMCLK and is one directional. If VSLS is low, then the input at CLKIN will be level shifted to 1.8V at the SIMCLK output. If VSLS is high, then the input at CLKIN will be level shifted to 3V at the SIMCLK output. DATA, SIMIO DATA is the digital data for the SIM Card. The DATA translate to SIMIO through the digital level shifter and is bi-directional using internal pull ups. If VSLS is low, then the level shifted output is 1.8V at the SIMIO output. If VSLS is high, then the level shifted output is 3V at the SIMIO output. Since DATA and SIMIO are bi-directional, the input at SIMIO is level shifted to equal the LSPWR voltage at the DATA output. G1 - G9 The G1 through G9 pins are not internally connected. They serve as thermal relief and should be connected to ground (AGND1, AGND2) to maximize the heat dissipation. See layout recommendations for details.
R VOUT = 1V TOP + 1 20k
VOUT
CFF RTOP RBOTTOM
Figure 2. Feedback Resistor Network
SW The switch pin (SW1 to SW6) connects directly to one end of the inductor and provides the current path during switching cycles. The other end of the inductor is connected to the output of the buck regulator. Due to the high speed switching on this pin, the switch node should be routed away from sensitive nodes whenever possible. VSC2 The voltage scaling pin (VSC2) is used to switch the output of DC2 between two different voltage levels. A high on the VSC2 pin will set the output voltage of DC2 to the higher voltage. A low on the VSC2 pin will set the output voltage to the lower voltage. Do not leave floating. LSPWR The level shifter input supply pin (LSPWR) provides power to the level shifter. A minimum 1F input capacitor with a minimum voltage rating of 6.3V placed close to LSPWR and ground (AGND1, AGND2) is required. Refer to the layout recommendations for details. SIMPWR SIM power (SIMPWR) provides power to the SIM Card. A minimum 1F input capacitor with a minimum voltage rating of 6.3V to ground (AGND1, AGND2) is required. Refer to the layout recommendations for details.
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MIC2829 Pin Name
PVIN2 PVIN3 PVIN4 PVIN5 PVIN6
Application Information
The MIC2829 is a Power Management Integrated Circuit (PMIC) designed for 3G/4G (HEDGE/LTE or WiMAX) modules. It incorporates six buck converters, eleven LDOs and a SIM card level translator in a 5.5mm x 5.5mm package designed to support 3G/4G (HEDGE/LTE or WiMAX) wireless modems. A typical power source for the MIC2829 can be from a USB host or a single cell lithium ion battery. The MIC2829 has six integrated step-down regulators. Four of the six integrated step-down converters TM (HLL) technology. The incorporate HyperLight Load DC1, DC2, and DC4 operate at 4MHz switching frequency range and can support 1A, 300mA and 600mA respectively. DC3 operates at 2.5MHz and can support up to 600mA. DC5 and DC6 operate at a 2MHz switching frequency, can support 100% duty cycle operation and can maintain 800mA on each output. They both have adjustable output voltages using external resistors. The MIC2829 has eleven low dropout regulators (LDOs). Five general purpose LDOs (LDO1 to LDO4, LDO11) have low dropout, output accuracy of 3% and drawing 40A of ground current. The other six are high performance LNRs (LNR5-LNR10) with a PSRR of over 70dB at 1kHz and 20Vrms Output Noise. The LNRs require just 20A to operate. The MIC2829 also has three level shifters and a 50mA power supply for digital SIM Card signal translations. Input Capacitor The MIC2829 has many input pins that are externally connected. A 1F ceramic capacitor or greater should be placed close to the power input pin and ground. The following chart indicates the minimum capacitance needed for each input pin and their ideal grounding points. Pin Name
AVIN1 AVIN2 AVIN3 AVIN4 INLDO23 INLDO45 INLDO6 INLDO7 INLDO8 INLDO910 LSPWR PVIN1
Capacitance
1 F 1 F 1 F 1 F 1 F
Ideal Ground
PGND2 PGND3 PGND4 PGND5 PGND6
Table 3. Recommended Input Capacitance
A case size 0402, 1F ceramic capacitor (Samsung CL05A105KP5NNN) is recommended based upon performance, size and cost. A X5R or X7R temperature rating is recommended for the input capacitor. Y5V temperature rating capacitors, aside from losing most of their capacitance over temperature, can also become resistive at high frequencies. This reduces their ability to filter out high frequency noise. Output Capacitor The buck regulators (DC1 to DC6) are designed for use with a 4.7F or greater ceramic output capacitor. A case size 0402, 4.7F ceramic capacitor (Samsung, CL05A475MQ5NRN) is recommended based upon performance, size and cost. A case size 0402, 1F ceramic capacitor (Samsung, CL05A105KP5NNN) is recommended for each LDO (LDO1 to LDO4, LDO11, and SIMPWR) output. Each LNR (LNR5 to LNR10) is designed for low noise operation; therefore, a case size 0402, 2.2F ceramic capacitor (Samsung, CL05A225MP5NSN) is recommended. Table 4 below indicates the recommended capacitance needed for each output and their ideal grounding points. Output Capacitance Ideal Ground
LDO1 LDO2 LDO3 LDO4 LDO5 LDO6 LDO7 LDO8 LDO9 LDO10 LDO11 SIMPWR DC1 DC2 DC3 DC4 DC5 DC6 1 F 1 F 1 F 1 F 2.2 F 2.2 F 2.2 F 2.2 F 2.2 F 2.2 F 1 F 1 F 4.7 F 4.7 F 4.7 F 4.7 F 4.7 F 4.7 F AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 PGND1 PGND2 PGND3 PGND4 PGND5 PGND6
Capacitance
1 F 1 F 1 F 1 F 1 F 1 F 1 F 1 F 1 F 1 F 1 F 1 F
Ideal Ground
AGND1 AGND2 AGND3 AGND4 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 AGND1 or AGND2 PGND1
Table 4. Recommended Output Capacitance
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Micrel Inc. Although all grounds eventually connect externally, it is important to place the capacitors close to their ideal ground for the load to minimize parasitic inductance and resistance. This is especially important for a PMIC with multiple regulators. Increasing the output capacitance will lower output ripple and improve load transient response, but could increase solution size or cost. Both the X7R or X5R temperature rated capacitors are recommended. The Y5V and Z5U temperature rated capacitors are not recommended due to their wide variation in capacitance over temperature and increased resistance at high frequencies. Inductor Selection When selecting an inductor, it is important to consider the following factors (not necessarily in the order of importance): * * * Inductance Rated current value Size requirements
MIC2829 Efficiency Considerations Efficiency is defined as the amount of useful output power, divided by the amount of power supplied.
V xI Efficiency % = OUT OUT V xI IN IN
x 100
* DC resistance (DCR) The MIC2829 was designed for use with an inductance range from 1H to 2.2H. Typically, a 2.2H inductor is recommended for a balance of transient response, efficiency and output ripple. For faster transient response, a 1H inductor will yield the best result. For lower output ripple, a 2.2H inductor is recommended. Maximum current ratings of the inductor are generally given in two methods; permissible DC current and saturation current. Permissible DC current can be rated either for a 40C temperature rise or a 10% to 20% loss in inductance. Ensure the inductor selected can handle the maximum operating current. When saturation current is specified, make sure that there is margin so that the peak current does not cause the inductor to saturate. Peak current can be calculated as follows:
Maintaining high efficiency serves two purposes. It reduces power dissipation in the power supply, reducing the need for heat sinks and thermal design considerations and it reduces consumption of current for battery powered applications. Reduced current draw from a battery increases the devices operating time which is critical in hand held devices. There are two types of losses in switching converters; DC losses and switching losses. DC losses are simply 2 the power dissipation of I R. Power is dissipated in the high side switch during the on cycle. Power loss is equal to the high side MOSFET RDSON multiplied by the Switch Current squared. During the off cycle, the low side Nchannel MOSFET conducts, also dissipating power. Device operating current also reduces efficiency. The product of the quiescent (operating) current and the supply voltage represents another DC loss. The current required for driving the gates on and off at the constant switching frequency and other internal switching transitions make up the switching losses.
DC4 Buck Efficiency vs. Output Current
VIN = 4.3V
100 90 80 EFFICIENCY (%) 70 60 50 40 30 20 10 0 1
VIN = 3.6V
VIN = 5V
1 - VOUT /VIN I PEAK = IOUT + VOUT 2 x f x L
As shown by the calculation above, the peak inductor current is inversely proportional to the switching frequency (f) and the inductance (L); the lower the switching frequency or the inductance the higher the peak current. As input voltage increases, the peak current also increases. The size of the inductor depends on the requirements of the application. Refer to the Typical Application Circuit and Bill of Materials for details. DC resistance (DCR) is also important. While DCR is inversely proportional to size, DCR can represent a significant efficiency loss. Refer to the Efficiency Considerations.
VOUT_NOM = 1.8V L = 2.2H COUT = 4.7F 10 100 1000
OUTPUT CURRENT (mA)
Figure 3. HLL Efficiency vs. Output Current
Figure 3 shows an efficiency curve. From an output current of 1mA to 100mA, efficiency losses are dominated by quiescent current losses, gate drive and transition losses. By lowering the switching frequency, the HyperLight LoadTM buck regulator (DC1 to DC4) is able to maintain high efficiency at low output currents. Over 100mA, efficiency loss is dominated by MOSFET RDSON and inductor losses. Higher input supply voltages will increase the Gate-to-Source overdrive on the internal MOSFETs, thereby reducing the internal RDSON. This improves efficiency by reducing conduction losses in the device. All but the inductor losses are inherent to the device. For higher current levels, inductor selection
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MIC2829 If each regulator on the MIC2829 is turned on at its maximum load capability, the power dissipation into the device will cause excessive temperature rise. In order to avoid excessive temperature rise and unexpected thermal shutdown the total power dissipation should be considered.
LDO Power Dissipation The power dissipation of a LDO can be calculated with the input voltage, the output voltage and the output current, as shown in the following equation. PD_LDO (VIN - VOUT) IOUT + VIN IGND Since the ground current (IGND) is relatively low, it can be ignored for this calculation. For example, if the input voltage is 3.3V, the output voltage is 2.8V and the output current of the LDO is 200mA, the power dissipation of the LDO can be calculated as follow: PD_LDO (3.3V - 2.8V) x 200mA PD_LDO 0.1W Buck Regulator Power Dissipation Neglecting some minor losses, the power dissipation in a MIC2829 buck regulator (DC1 to DC6) is approximately the switcher's input power minus the switcher's output power and minus the power loss in the inductor. PD_SWITCHER PIN x IIN - POUT x IOUT - PL_LOSS Total Power Dissipation The total power dissipation in the MIC2829 package is equal to the sum of the power loss of each regulator. PD_TOTAL SUM (PD_LDOS + PD_SWITCHERS) The maximum power dissipation of the package can be calculated by the following equation.
VOUT x I OUT Efficiency Loss 1 - V x I OUT OUT + PL _ LOSS
x 100
Efficiency loss due to DCR is minimal at light loads and gains significance as the load is increased. Inductor selection becomes a trade-off between efficiency and size in this case.
Partitioning for Optimal System Efficiency Many of the LDOs can be post-regulated from the DC regulator output to increase system efficiency. For example, DC4 output can be used to power low output voltage LNRs in order to reduce power loss during voltage conversion. Thermal Considerations Whenever there is power dissipation, there will be thermal considerations. In order to account for the temperature rise in a PMIC with multiple regulators, the power dissipation in each regulator must be accounted for. The current rating of each regulator is shown below: Output
DC1 DC2 DC3 DC4 DC5 DC6 LDO1 LDO2 LDO3 LDO4 LDO5 LDO6 LDO7 LDO8 LDO9 LDO10 LDO11 SIMPWR
Maximum Load (mA)
1000 300 600 600 800 800 200 200 200 200 200 200 200 200 200 200 200 50
TJ( max ) - T A PD( max ) JA
TJ(MAX) is the maximum junction temperature (125C), TA is the ambient temperature and JA is the junction-toambient thermal resistance of the package (38.7C/W). The following table shows the maximum power dissipation versus the ambient temperature.
Table 5. Output Current Rating
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PD(MAX) (W)
4.26 3.75 3.23 2.71 2.20 1.68 1.16 0.65 0.13
MIC2829
TA (C)
-40 -20 0 20 40 60 80 100 120
7.0 6.0 FREQUENCY (MHz) 5.0 4.0 3.0 2.0 1.0 0.0 1 10 100 1000 OUTPUT CURRENT (mA) L = 1H
switching frequency versus the output current. Since the inductance range of MIC2829 is from 1H to 2.2H, the device may then be tailored to enter HyperLight LoadTM mode or PWM mode at a specific load current by selecting the appropriate inductance. For example, in Figure 4, when the inductance is 2.2H the HLL regulator will transition into PWM mode at a load of approximately 30mA. Under the same condition, if 1H inductance is used, the MIC2829 will transition into PWM mode at approximately 100mA.
DC4 Switching Frequency vs. Output Current
VIN = 5V VOUT = 1.8V COUT = 4.7F L = 2.2H
Table 6. Maximum Power Dissipation
It is good practice to not exceed the maximum power dissipation of the device in order to avoid excessive temperature rise or unexpected thermal shutdown.
HyperLight LoadTM Mode The HyperLight LoadTM (HLL) buck regulators on the MIC2829 use a proprietary control loop (patented by Micrel). It has two modes of operation (HLL mode and PWM mode). The transition from HLL mode to PWM mode is determined by the inductor ripple current. If the inductor ripple current reaches below zero it is considered to be in discontinuous mode (DCM). The HLL control loop will control the switching in DCM using pulse frequency modulation (PFM). As the load pulls the output voltage below the monitored threshold, the HLL control loop turns on the topside PMOS transistor for a predetermined time until the output voltage rises above the monitored threshold. Once the upper threshold is reached, the topside PMOS is switched off and the voltage will then be slowly pulled down by the load. As the load increases, the switching frequency increases. By varying the switching frequency, the regulator only switches when needed which improves efficiency by reducing switching losses. As the load increases and the inductor ripple current rises above zero, the HLL regulator switches into continuous conduction mode (CCM). The equation to calculate the load when the HLL regulator goes into continuous conduction mode may be approximated by the following formula:
Figure 4. Switching Frequency with Various Inductance
(V - VOUT ) x D I LOAD > IN 2L x f
As shown in the equation, the load at which HLL regulators transitions from HyperLight LoadTM mode to PWM mode is a function of the input voltage (VIN), the output voltage (VOUT), the duty cycle (D), the inductance (L) and the switching frequency (f). Note that the duty cycle is approximately VOUT divided by VIN for buck converters. The following graph shows the HLL regulator May 2010 36
In CCM, the HLL regulator works in pulse width modulation (PWM) by controlling the PMOS transistor off-time. To regulate the output voltage, the PMOS transistor off-time is controlled. As the output voltage decreases, the PMOS transistor off-time is decreased. As the output voltage increases, the off-time is increased. This method of controlling the off-time achieves the same goal as controlling the on-time as in other PWM regulators by increasing or decreasing the duty cycle of the PMOS transistor. In CCM, the synchronous switching between the PMOS and the NMOS is modulated at 4MHz for DC1, DC2 and DC4. Due to the higher output voltage of DC3 (3V), the switching frequency in CCM is at 2.5MHz. The HLL regulators may reach the minimum-off-time limit at lower input voltage and higher load currents. In order to regulate at such high duty cycles, the HLL regulator transitions into the on-time control scheme. During the on-time control scheme, the off-time is set constant at around (65ns), and the on-time is increased to deliver more energy. By doing so, the duty cycle is increased, and the output voltage maintains regulation even at lower input voltages and extreme load situations. As a result of increasing the on-time and fixing the off-time, the switching frequency is lowered. In CCM, the switching frequency is relatively constant, but at higher output voltage and output current levels, the control may transition into on-time control to regulate the output and thus, lower the switching frequency.
M9999-051410-B
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MIC2829
Typical Application Circuit
VIN
C1 1F C18 1F C23 1F C28 1F
AVIN1 AGND1 AVIN2 AGND2 AVIN3 AGND3 AVIN4 AGND4 ENGLB PVIN1
BYP LDO10 LDO9 ENL910 INLDO910
C9 1F C8 2.2F C10 2.2F C7 0.1F
PVIN6 SW6 FB6 PGND6 ENDC6
C32 1F L6 2.2H C40 120pF R10 20k R16 20k
DC6
C31 4.7F
DC1
C19 4.7F
L1 2.2H
C20 1F
SW1 FB1 PGND1
DC2
C22 4.7F
L2 2.2H
C21 1F
PVIN2 SW2 FB2 PGND2 ENDC2 VSC2
INLDO8 ENL8 LDO8
C13 2.2F C14 1F
DC3
C24 4.7F
L3 1H
C25 1F
PVIN3 SW3 FB3 PGND3 PVIN4
MIC2829
INLDO7 ENL7 LDO7
C11 2.2F C12 1F
PVIN5 SW5 FB5 PGND5 ENDC5
C29 1F L5 2.2H C39 120pF
DC4
R23 10k
L4 2.2H C27 4.7F
C26 1F
SW4 FB4 PGND4 RESETB SETDLY
DC5
R7 46.4k R8 20k C30 4.7F
C35 1F C34 1F C33 1F C16 1F C17 1F
LDO1 LDO11 INLDO23 LDO2
INLDO6 ENL6 LDO6
C3 2.2F
C2 1F
INLDO45 LDO3 ENL3 LDO4 ENL5 LDO5
C6 2.2F C5 1F
C15 1F C4 1F
ENL4 LSPWR RSTIN CLKIN DATA VSLS ENLS SIMRST SIMCLK SIMIO SIMPWR SUB1 SUB2
C36 1F
C37 1F
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Bill of Material
Item Part Number Manufacturer Description Qty.
C1, C2, C4, C9, C14 - C18, C20, C21, C23, C25, C26, C28, C29, C32 - C37 C3, C5, C6, C8, C10 - C13 C19, C22, C24, C27, C30, C31 C7 C39, C40 L1, L2, L4, L5, L6 L3 R7, R10 R8, R16 R23
U1
Notes:
CL05A105KP5NNN
Samsung
(1)
1.0F Ceramic Capacitor, 10V, X5R, Size 0402
22
CL05A225MP5NSN
Samsung
2.2F Ceramic Capacitor, 10V, X5R, Size 0402
8
CL05A475MQ5NRN CL05B104K05NNNC CL05C121JB5NNNC CIG21L2R2MNE CIG21L1R0MNE CRCW040246K4FKED CRCW040220KFKED CRCW040210KFKED
MIC2829-xxYAL or MIC2829-xxYAB
Samsung Samsung Samsung Samsung Samsung Vishay
(2)
4.7F Ceramic Capacitor, 6.3V, X5R, Size 0402 100nF Ceramic Capacitor, 16V, X7R, Size 0402 120pF, Ceramic Capacitor, 50V, C0G, Size 0402 2.2H 950mA, 160m, L2.0mm x W1.25mm x H1.0mm 1.0H 1.15A 110m, L2.0mm x W1.25mm x H1.0mm 46.4 k, 1%, 0402 20 k, 1%, 0402 10k, 1%, 0402
(3)
6 1 2 5 1 1 3 1
1
Vishay Vishay
Micrel, Inc.
3G/4G HEDGE/LTE PMIC
1. Samsung: www.sem.samsung.com. 2. Vishay: www.vishay.com. 3. Micrel, Inc: www.micrel.com.
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MIC2829
PCB Layout Recommendations
FBGA Top (Layer 1)
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MIC2829
LGA Top (Layer 1)
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MIC2829
FBGA/LGA LDO GND (Layer 2)
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MIC2829
FBGA/LGA Power and Signal (Layer 3)
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MIC2829
FBGA/LGA DC Regulator PGND (Layer 4)
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MIC2829
FBGA/LGA DC Regulator AGND (Layer 5)
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MIC2829
FBGA/LGA Signal (Layer 6)
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MIC2829
FBGA/LGA LDO GND (Layer 7)
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MIC2829
FBGA/LGA Bottom (Layer 8)
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MIC2829
Package Information (LGA)
76-pin 5.5mm x 5.5mm LGA Package (AL)
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MIC2829
Package Information (FBGA)
85-pin 5.5mm x 5.5mm FBGA Package (AB)
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MIC2829
Recommended Land Pattern (LGA)
76-pin 5.5mm x 5.5mm LGA Land Pattern
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MIC2829
Recommended Land Pattern (FBGA)
85-pin 5.5mm x 5.5mm FBGA Land Pattern
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MIC2829
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. (c) 2010 Micrel, Incorporated.
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