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| SMD FYLS FYLS-1206UBC Features: Compatible with automatic placement equipment Compatible with reflow solder process. Radiation pattern. Applications: Automotive-Telecommumication Indicators Lcd Back-lights Illuminations Descriptions: Dice material: InGaN. Emitting Color: Blue. Lens Color: Water clear. Relative Lumionous Intensity(LOP @max=1) ratings(Ta=25 Absolute maximun ratings(Ta=25) Parameter Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Continuous Forward Current Derating Linear From 25 Operating Temperature Range Storage Temperature Range Lead Soldering Temperature[4mm(.157") From Body] MAX. Unit 70 100 25 0.4 mW mA mA mA/ -30 to +80 -40 to +100 260 for 5 Seconds characteristics(Ta=25 Electrical and optical characteristics(Ta=25) Parameter Luminous Intensity Viewing Angle Peak Emission Wavelength Dominant Wavelength Spectral Line Half-Width Forward Voltage Reverse Current Symbol IV 21/2 p d VF IR Min. -130 465 460 10 Typ. 120 140 470 465 15 3.2 Max. -150 475 470 20 3.6 10 Unit mcd Deg nm nm nm V A Test Condition IF=20mA VR=5V SMD Typical Electrical Characteristics Curves (25 (25 Ambient Temperature Unless Otherwise Noted) Spectral Reduance Response Normalized Wave Length(nm) Luminous Intensity Vs.forward Current Luminous Intensity Vs.forward Current 1000 intensity( %) 50 40 intensity( %) 100 30 Relative luminous 20 Relative luminous 10 10 0 2.4 0 1 10 100 1000 Forward Voltage(VF)- volts 2.8 3.2 3.6 4.0 4.4 Forward Current(mA) Luminous Intensity Vs. Ambient Temperature Forward Current Derating Curve 60 50 Forward Current(mA) 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 Relative Luminous Intensity 1000 100 0 -60 -35 -10 15 40 65 90 Ambient Temperature TA( C ) Ambient Temperature TA( C) SMD Precautions For Use Over-current-proof Customer must apply resistors for protection,otherwise slight voltage shift will cause big current chang(Burn out will happen) Storage 1. The operation of temperature and R.H are:5 ---30,R.H.60% Max. 2. Once the package is opened ,the products should be used within a week. Otherwise,they Should be kept in a dampproof box with desccating regent.Considering the tape life,we Suggest our customers to use our products within 1.5year (form production date). 3. It's recommended to bake before soldering when the package is unsealed after 72hrs.The Condition is: 60 5 for 15 hrs. Soldering Iron: Temperature at tip of iron:300 Max.(25W Max) Soldering time:31sec. Reflow Temp./Time: Temperature Time SMD Package Package Dimensions of Device Soldering Terminal 1.6 Cathode Mark 0.6 LED Die 2.0 3.2 PCB 2.0 1.6 1.5 Resin 2.0 1.5 0.8 1.1 0.5 0.6 Unit:mm Tape Specification:3000pcs Per Reel. Packing Size Item Spec. Tolerance Item Spec. Tolerance W P1 E F D0 D1 P0 1.5 Unit mm mm 8.00 0.20 10P0 40.00 0.20 Cathode 4.00 0.10 P2 2.00 0.05 D0 P2 1.75 0.10 A0 1.85 0.10 3.50 0.05 B0 3.45 0.10 P0 1.50 +0.1/-0 K0 1.27 0.10 1.00 0.05 T 0.22 0.05 E K0 4.00 0.05 Unit mm mm A' D1 F W 5 P1 A0 A' SEC:A-A' t Reel: Package Dimensions of Reel: sb ? 178 1.0 60+ 0.5/-0 9.00.1 12.00.15 ? ? 13.5 0.2 Unit:mm SMD Packing and Shipping Spec. L1 sb sb Zip-lock Desiccant Antistatic Bag W1 Desiccant Spec. Spec. 203.0. Spec. 198.0 Unit:mm Box Dimension(cm):30*19*11.5 . NO s) pc Y( 'T Q RT PA 10 Reels per box CARTON Dimension(cm):39*32*38 ) cs (p TY Q' RT PA ER MB NU S KG W G. .W S KG C/NO M 8C *3 31 N 8* :3 AS ME 6 Boxes/Carton 0603B/0603/0805: 4000pcs*10reels*6boxs 0805B/1206B/1206/1210/1204/: 3000pcs*10Reels*6boxs* 1311:2000pcs*10Reels*6boxs |
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