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| BCR158... PNP Silicon Digital Transistor * Switching circuit, inverter, interface circuit, driver circuit * Built in bias resistor (R1=2.2 k, R2 =47 k) * Pb-free (RoHS compliant) package 1) * Qualified according AEC Q101 BCR158/F BCR158W C 3 R1 R2 1 B 2 E EHA07183 Type BCR158 BCR158F BCR158W 1Pb-containing Marking WIs WI WIs 1=B 1=B 1=B Pin Configuration 2=E 2=E 2=E 3=C 3=C 3=C - Package SOT23 TSFP-3 SOT323 package may be available upon special request Maximum Ratings Parameter Collector-emitter voltage Collector-base voltage Input forward voltage Input reverse voltage Collector current Total power dissipationBCR158, TS 102C BCR158F, TS 128C BCR158W, TS 124C Junction temperature Storage temperature 1 Symbol VCEO VCBO Vi(fwd) Vi(rev) IC Ptot Value 50 50 20 5 100 200 250 250 Unit V mA mW Tj Tstg 150 -65 ... 150 C 2007-08-27 BCR158... Thermal Resistance Parameter Junction - soldering point1) BCR158 BCR158F BCR158W Symbol RthJS Value 240 90 105 Unit K/W Electrical Characteristics at TA = 25C, unless otherwise specified Symbol Values Unit Parameter min. typ. max. DC Characteristics Collector-emitter breakdown voltage V(BR)CEO 50 V IC = 100 A, IB = 0 Collector-base breakdown voltage IC = 10 A, IE = 0 Collector-base cutoff current VCB = 40 V, IE = 0 Emitter-base cutoff current VEB = 5 V, IC = 0 DC current gain2) IC = 5 mA, VCE = 5 V Collector-emitter saturation voltage2) IC = 10 mA, IB = 0.5 mA Input off voltage IC = 100 A, VCE = 5 V Input on voltage IC = 2 mA, VCE = 0.3 V Input resistor Resistor ratio AC Characteristics Transition frequency IC = 10 mA, VCE = 5 V, f = 100 MHz Collector-base capacitance VCB = 10 V, f = 1 MHz 1For V(BR)CBO I CBO I EBO h FE VCEsat Vi(off) Vi(on) R1 R1/R 2 fT Ccb 50 70 0.4 0.5 1.5 0.042 - 2.2 0.047 200 3 100 164 0.3 0.8 1.1 2.9 k nA A V 0.052 MHz pF calculation of RthJA please refer to Application Note Thermal Resistance test: t < 300s; D < 2% 2Pulse 2 2007-08-27 BCR158... DC current gain hFE = (IC) VCE = 5V (common emitter configuration) 10 3 Collector-emitter saturation voltage VCEsat = (IC), IC/IB = 20 0.5 V 0.4 V CEsat h FE 10 2 0.35 0.3 0.25 0.2 0.15 0.1 0.05 -40 C -25 C 25 C 85 C 125 C 10 1 -40 C -25 C 25 C 85 C 125 C 10 0 -4 10 10 -3 10 -2 A 10 -1 0 -3 10 10 -2 A 10 -1 IC IC Input on Voltage Vi(on) = (IC ) VCE = 0.3V (common emitter configuration) 10 1 Input off voltage V i(off) = (IC) VCE = 5V (common emitter configuration) 10 1 V 10 0 Vi(off) Vi(on) -40 C -25 C 25 C 85 C 125 C V -40 C -25 C 25 C 85 C 125 C 10 0 10 -1 -5 10 10 -4 10 -3 10 -2 A 10 -1 10 -1 -5 10 10 -4 10 -3 10 -2 A 10 -1 IC IC 3 2007-08-27 BCR158... Total power dissipation Ptot = (TS) BCR158 300 mW Total power dissipation Ptot = (TS) BCR158F 300 mW 250 225 250 225 P tot 175 150 125 100 75 50 25 0 0 15 30 45 60 75 90 105 120 C 150 P tot 200 200 175 150 125 100 75 50 25 0 0 15 30 45 60 75 90 105 120 C 150 TS TS Total power dissipation Ptot = (TS) BCR158W 300 mW 250 225 Ptot 200 175 150 125 100 75 50 25 0 0 15 30 45 60 75 90 105 120 C 150 TS 4 2007-08-27 BCR158... Permissible Pulse Load RthJS = (tp ) BCR158 10 K/W 3 Permissible Pulse Load Ptotmax/P totDC = (tp) BCR158 10 3 10 2 P totmax / P totDC - 10 2 10 1 10 0 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 RthJS 10 1 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tp tp Permissible Puls Load RthJS = (tp) BCR158F 10 2 Permissible Pulse Load Ptotmax/P totDC = (tp) BCR158F 10 3 10 1 10 0 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 Ptotmax /PtotDC K/W RthJS 10 2 10 1 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tp tp 5 2007-08-27 BCR158... Permissible Puls Load RthJS = (tp) BCR158W 10 K/W 3 Permissible Pulse Load Ptotmax/P totDC = (tp) BCR158W 10 3 10 2 P totmax / P totDC - 10 2 10 1 10 0 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 R thJS 10 1 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tp tp 6 2007-08-27 Package SOT23 BCR158... Package Outline 0.15 MIN. 1 0.1 0.1 MAX. 1.3 0.1 2.9 0.1 3 B 2.4 0.15 10 MAX. 0.4 +0.1 -0.05 1) 1 2 10 MAX. C 0.95 1.9 0.08...0.1 A 5 0...8 0.25 M B C 0.2 M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s Pin 1 0.9 1.3 2005, June Date code (YM) BCW66 Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.9 2.13 2.65 0.2 8 Pin 1 3.15 1.15 7 2007-08-27 Package SOT323 BCR158... Package Outline 2 0.2 0.3 +0.1 -0.05 3 1.25 0.1 2.1 0.1 0.9 0.1 3x 0.1 M 0.1 MAX. 0.1 A 1 0.65 0.65 2 0.1 MIN. 0.15 +0.1 -0.05 0.2 M A Foot Print 0.6 0.8 0.65 0.65 Marking Layout (Example) Manufacturer 1.6 2005, June Date code (YM) Pin 1 BCR108W Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.2 Pin 1 2.15 2.3 8 1.1 8 2007-08-27 Package TSFP-3 BCR158... Package Outline 1.2 0.05 10 MAX. 0.8 0.05 0.2 0.05 1.2 0.05 0.2 0.05 0.4 0.45 3 0.55 0.04 1 2 0.2 0.05 0.4 0.05 0.4 0.05 0.15 0.05 Foot Print 0.4 0.4 Marking Layout (Example) Manufacturer 1.05 Pin 1 BCR847BF Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.3 1.2 1.5 8 0.2 Pin 1 1.35 0.7 9 2007-08-27 BCR158... Edition 2006-02-01 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 10 2007-08-27 |
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