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APTML1002U60R020T3AG Linear MOSFET Power Module VDSS = 1000V RDSon = 600m typ @ Tj = 25C ID = 20A @ Tc = 25C Application * Electronic load dedicated to power supplies and battery discharge testing Features * * * * * Linear MOSFET Very low stray inductance Internal thermistor for temperature monitoring High level of integration AlN substrate for improved thermal performance Benefits * * 16 15 28 27 26 25 29 30 23 22 20 19 18 * * * * 31 32 2 3 4 7 8 10 11 12 14 13 Direct mounting to heatsink (isolated package) easy series and parallels combinations for power and voltage improvements Low junction to case thermal resistance Solderable terminals both for power and signal for easy PCB mounting Low profile RoHS Compliant Pins 13/14 ; 29/30 ; 31/32 must be shorted together Absolute maximum ratings (per leg) Symbol VDSS ID IDM VGS RDSon PD Parameter Drain - Source Breakdown Voltage Continuous Drain Current Pulsed Drain current Gate - Source Voltage Drain - Source ON Resistance Maximum Power Dissipation Tc = 25C Tc = 80C Max ratings 1000 20 14 74 30 630 520 Unit V A V m W APTML1002U60R020T3AG - Rev 0 November, 2009 Tc = 25C In saturation mode These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1-3 APTML1002U60R020T3AG All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics (per leg) Symbol Characteristic IDSS RDS(on) VGS(th) IGSS Zero Gate Voltage Drain Current Drain - Source on Resistance Gate Threshold Voltage Gate - Source Leakage Current Test Conditions VDS = 1000V ; VGS = 0V VDS = 800V ; VGS = 0V Tj = 25C Tj = 125C Min Typ VGS = 10V, ID = 10A VGS = VDS, ID = 2.5mA VGS = 30 V 600 2 Max 250 1000 630 4 100 Unit A m V nA Dynamic Characteristics (per leg) Symbol Ciss Coss Crss Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions VGS = 0V VDS = 25V f = 1MHz Min Typ 6000 775 285 Max Unit pF Shunt Electrical Characteristics (per leg) Symbol Characteristic Resistance value Rsh Tsh Tolerance Psh Ish Load capacity Current capacity TC=25C TC=80C TC=25C TC=80C Min Typ 20 2 Max Unit m % W A 20 10 31 22 Temperature sensor PTC Symbol R25 R100/R25 R-55/R25 B Characteristic Resistance @ 25C Resistance ratio Resistance ratio Temperature coefficient Tamb=100C & 25C Tamb=-55C & 25C Min 1980 1.676 0.48 Typ 1.696 0.49 7900 Max 2020 1.716 0.50 Unit ppm/K Thermal and package characteristics Symbol RthJC VISOL TJ TSTG TC Torque Wt Characteristic Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight Min MOSFET (per leg) 4000 -40 -40 -40 2.5 Typ Max 0.24 150 125 100 4.7 110 RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz Unit C/W V C N.m g APTML1002U60R020T3AG - Rev 0 November, 2009 To heatsink M4 www.microsemi.com 2-3 APTML1002U60R020T3AG SP3 Package outline (dimensions in mm) 1 See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 3-3 APTML1002U60R020T3AG - Rev 0 November, 2009 17 12 28 |
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