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ISL9221
Data Sheet April 3, 2008 FN6541.1
Dual Input Lithium Ion Battery Charger with OVP USB Bypass and 10mA LDO
The ISL9221 Lithium Ion charging IC is designed to meet the charging requirements of most of today's handheld devices. The IC provides two inputs for either USB connection where the current is limited by the USB standard or for powering/charging from a power adapter. If the voltage at either VUSB or VDC pin is within the safe allowable range, the PPR pin is pulled low indicating to the system processor that external power is available. Charging can be enabled/disabled by controlling the state of the EN pin. While charging, the CHG pin is pulled low indicating the battery is being charged. The battery is charged to 4.2V with only a 1% error across the temperature range. USB charge current, Adapter charge current and charge termination currents can be programmed via external resistors. The ISL9221 adds an additional feature in providing a limited amount of current to system architecture while protecting the system from destructively high voltage. The device contains Thermal regulation and protection to provide additional safety features of this device. When the temperature exceeds +125C, the current will fold back to reduce and control the die temperature.
Features
* Lithium Ion/Polymer battery charging * Dual input - USB host or car/wall adapter * Input voltage withstanding up to 28V * 5.4V overvoltage protection on VUSB inputs * Charging current up to 1.2A * 4.9V/10mA linear regulator with input OVP * Current limit on bypass path * Programmable end-of-charge current * Programmable charging current * Programmable USB current limit * Charging and power present indicator pins * Charge enable pin * Reverse current protection * Pb-free (RoHS compliant)
Applications
* Smart Handheld Devices * Cell Phones, PDAs, MP3 Players * Digital Still Cameras * Handheld Test Equipment
Ordering Information
PART NUMBER (Note) ISL9221IRZ PART MARKING 9221 TEMP. RANGE (C) PACKAGE (Pb-Free) PKG. DWG. #
Related Literature
* Technical Brief TB363 "Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)" * Technical Brief TB389 "PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages"
-40C to +85C 12 Ld 4x3 DFN L12.4x3 -40C to +85C 12 Ld 4x3 DFN L12.4x3
ISL9221IRZ-T* 9221
*Please refer to TB347 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Pinout
ISL9221 (12 LD DFN) TOP VIEW
VDC VUSB PPR CHG EN IMIN
1 2 3 4 5 6
12 VDC_LDO 11 BAT 10 USB_BYP 9 8 7 IVDC GND IUSB
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2008. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
ISL9221
Absolute Maximum Ratings
Supply Voltage (VDC, VUSB). . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V Other Input Voltage (EN, IMIN, IUSB, IVDC) . . . . . . . . . . -0.3V to 7V Open Drain Pull Voltage (PPR, CHG) . . . . . . . . . . . . . . .-0.3V to 7V Other Pin Voltage(VDC_LDO, USB_BYP, VBAT) . . . . . .-0.3V to 7V
Thermal Information
Thermal Resistance (Typical, Notes 1, 2) JA (C/W) JC (C/W) 4x3 DFN Package . . . . . . . . . . . . . . . . . . . . 41 3.5 Maximum Junction Temperature (Plastic Package)+ . . . . . . +150C Maximum Storage Temperature Range . . . . . . . . . .-65C to +150C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40C to +85C Supply Voltage (VUSB) . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V to 5.3V Supply Voltage (VDC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V to 6.7V Typical Adapter Charge Current . . . . . . . . . . . . . . . . 100mA to 1.2A Typical USB Charge Current . . . . . . . . . . . . . . . . 46.5mA to 465mA Typical USB Bypass Current . . . . . . . . . . . . . . . . . . . 0mA to 200mA Typical LDO Current . . . . . . . . . . . . . . . . . . . . . . . . . . 0mA to 10mA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.
NOTES: 1. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379. 2. For JC, the "case temp" location is the center of the exposed metal pad on the package underside. 3. Parts are 100% tested at +25C. Temperature limits established by characterization and are not production tested.
Electrical Specifications
Typical Values are tested at USB = VDC = 5V and ambient temperature at +25C, unless otherwise noted. All maximum and minimum values are guaranteed under the recommended operating conditions. SYMBOL CONDITIONS MIN (Note 3) TYP MAX (Note 3) UNITS
PARAMETERS CHARGER POWER-ON THRESHOLDS Rising VUSB/VDC Threshold Falling VUSB/VDC Threshold INPUT VOLTAGE OFFSET Rising Edge of VDC or VUSB Relative to VBAT Falling Edge of VDC or VUSB Relative to VBAT STANDBY CURRENT BAT Pin Sink Current VDC Pin Supply Current VUSB Pin Supply Current VDC/USB Pin Supply Current VOLTAGE REGULATION Output Voltage
3.4 3.2
3.9 3.7
4.2 4.0
V V
VOSHC VOSLC
VBAT = 4.0V, use CHG pin to indicate the comparator output
20
150 80
250 -
mV mV
ISTANDBY IVDC IVUSB
EN = HIGH or both inputs are floating EN = HIGH, ILDO = 0 EN = HIGH, USB_BYP disconnected EN = LOW, ILDO = 0, USB_BYP disconnected
-
0.05 365 300 0.63
0.5 420 360 0.85
A A A mA
VBAT
Load = 10mA Load = 10mA (TJ = +25C)
4.158 4.174 -
4.2 4.2 600 600
4.242 4.226 -
V V m m
VDC Linear ON-resistance USB Linear ON-resistance CHARGE CURRENT IVDC Pin Output Voltage VDC Constant Current Accuracy VDC Trickle Charge Current VIVDC
VBAT =3.8V, IVDC = 0.3A, (TJ = +25C) VBAT =3.8V, IUSB = 0.3A, (TJ = +25C)
VBAT = 3.8V
1.19 500 16
1.22 550 18
1.25 580 20
V mA %
IVDC_CHRG RIVDC = 12.4k, VBAT = 2.7V to 3.8V IVDC_TRKL RIVDC = 12.4k, VBAT = 2.2V, given as a % of the IVDC_CHARGE
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FN6541.1 April 3, 2008
ISL9221
Electrical Specifications
Typical Values are tested at USB = VDC = 5V and ambient temperature at +25C, unless otherwise noted. All maximum and minimum values are guaranteed under the recommended operating conditions. (Continued) SYMBOL VIUSB VBAT = 3.8V CONDITIONS MIN (Note 3) 1.19 211 16 46.5 TYP 1.22 232 18 IUSB_CHRG 55 MAX (Note 3) UNITS 1.25 246 20 63.5 V mA % % mA
PARAMETERS IUSB Pin Output Voltage VUSB Constant Current Accuracy VUSB Trickle Charge Current
IUSB_CHRG RIUSB = 29.4k,VBAT = 2.7V to 3.8V IUSB_TRKL RIUSB = 29.4k, VBAT = 2.2V and if IUSB_CHRG IVDC_TRKL, then given as a % of the IUSB_CHRG If IUSB_CHRG IVDC_TRKL
DC and USB End-of-Charge Threshold
IMIN
RMIN = 10k
PRECONDITIONING CHARGE THRESHOLD Preconditioning Charge Threshold Voltage RECHARGE THRESHOLD Recharge Threshold Voltage PROTECTIONS VDC Overvoltage Level VDC Overvoltage Hysteresis VDC Overvoltage Protection Delay VUSB Overvoltage Level VUSB Overvoltage Hysteresis VUSB Overvoltage Protection Delay Short Circuit (USB_BYP) BYPASS FETS Resistance VUSB to USB_BYP Drop Out VUSB to USB_BYP USB_ rDS(ON) VUSBDO Measured at 200mA, 4.3V < VDC < 5.3V IOUT = 150mA, VUSB > 4.3V 1.3 200 2.0 mV IOCP OVP HOVP 6.7 5.3 6.8 90 1 5.4 60 1 400 6.9 130 5.5 90 600 V mV s V mV s mA VRCH 3.8 3.9 4.0 V VMIN 2.5 2.6 2.7 V
INTERNAL TEMPERATURE MONITORING Current Fold Back Threshold LOGIC INPUT AND OUTPUT EN Pin Logic Input HIGH EN Pin Logic Input LOW EN Pin Internal Pull-down Resistance CHG and PRR Sink Current LINEAR REGULATOR Output Voltage Voltage Regulation Accuracy VLDO VREG Initial accuracy, ILDO = 10mA; TJ = +25C Line/Load, ILDO = 10A to 10mA, VDC = VLDO + 0.5V to 6.5V; TJ = -40C to +125C Dropout (VDC to VLDO) Current Limit VDO ILIMIT ILDO = 10mA, VLDO= 4.9V, VDC > VLDO+0.5V For ILDO = 10mA option, VDC = 5.5V -2.0 -2.8 12 4.94 30 +2.0 +2.8 50 V % % mV mA Pin Voltage = 0.8V VIH VIL 1.3 350 10 600 0.4 850 V V k mA TFOLD 125 C
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FN6541.1 April 3, 2008
ISL9221 Pin Assignments
NAME VDC VUSB VDC_LDO USB_BYP IVDC IUSB IMIN BAT EN PPR CHG GND PIN 1 2 12 10 9 7 6 11 5 3 4 8 TABLE 1. TYPE CHART SYMBOL A D I O OD G Analog Pin Digital Pin Input Pin Output Pin Open-Drain Ground DESCRIPTION TYPE AI AI AO AO AI AI AI AO DI OD OD G DESCRIPTION Input pin from car adapter or AC/DC adapter Input pin from USB host device Output pin of Linear Regulator Output pin from USB bypass circuitry Battery current setting pin for adapter power Current setting pin for USB power End-of-charge current setting pin Output pin to battery Active low charge enable pin Active low power present indicator pin Active low charging indication pin Ground pad
The maximum current drawn from the VUSB pin is the combination of the load at USB_BYP and the programmed USB charging current. A 1F bypass capacitor is recommended on the VUSB pin. Higher values of bypass capacitance can be utilized but the designer should refer to the maximum allowed bus capacitance per USB application standard. When using ceramic capacitors, a small resistance value, such as 1 in series with the capacitor, is recommended to reduce voltage overshoot.
IVDC
Functional Pin Descriptions
VDC
Adapter input pin. This pin is usually connected to adapter power. The maximum input voltage is 28V. The charge current from this pin is programmable up to 1.2A by selection of the resistor on the IVDC pin. When this pin is connected to a power source, no charge current is drawn from the USB pin. A 1F or larger value ceramic capacitor is recommended for decoupling.
Adapter charging current setting pin. A resistor on this pin sets the maximum charging current to be delivered to the BAT pin. The maximum current, however, may be reduced by the adapter's current limit or by the power dissipation within the charging IC.
IUSB
USB charge current pin. This pin is connected internally to a current source for setting the programmed charging current delivered to the BAT pin.
VDC_LDO
Linear regulator output. A 0.1F to 1F ceramic capacitor from this pin to ground is required.
BAT
Charger IC output pin. This pin is to be connected to the positive (+) terminal of the battery. The charging IC monitors this pin to determine the charge state of the battery. A 1F bypass capacitor from the BAT pin to ground is recommended. The charging IC relies on the battery to help stabilize the circuitry and it is not recommended to operate the charger IC without a battery connected to this pin.
USB_BYP
USB input bypass pin. This is an output from the low current bypass FET connected to the USB input pin. The USB_BYP can be connected to the system to provide safe, voltage-limited power from the USB input pin.
VUSB
VUSB Input pin. This pin is usually connected to a USB port power connector. The maximum input voltage is 28V. However, the internal OVP circuitry will trip at 5.4V.
EN
Enable charging pin. This pin is a logic level input to control charging by the system processor. An external pull-up resistor should be connected to processor's I/O power supply.
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FN6541.1 April 3, 2008
ISL9221
The USB_BYP and VDC_LDO stay on regardless of the state of this pin. This ensures that the processor can be powered up when an external source is connected to the VDC or VUSB input pin.
CHG
Charge indication pin. This open-drain pin is pulled low to indicate when the battery is being charged. If connected to the processor, a pull-up resistor should be connected to the processors I/O supply. The CHG pin can also be used to drive an LED to indicate to the user the battery is being charged.
PPR
Power presence indication pin. This pin is used to notify the system processor or enable the power circuitry when a source is connected. The pin is an open drain output pin, which pulls low when a valid voltage (above POR) is present at either the VDC or VUSB pin. The PPR pin is held low regardless of the state of the EN pin. If connected to the processor, a pull-up resistor should be connected to the processors I/O supply. If connected to power circuitry, a pull-up should be tied to the appropriate bypass supply.
GND
Ground pin. This provides the ground path for all internal circuits.
Typical Application
I/O_VDD I/O_VDD
LDO OUTPUT ON
OFF
TO MCU
EN
PPR
VDC
VDC_LDO
CHG
VDC INPUT
TO BATTERY BAT
ISL9221 USB INPUT VUSB USB_BYP
IVDC RIVDC
IUSB
IMIN
GND
USB_BYP
5
RIMIN
FIGURE 1. APPLICATIONS CIRCUIT
RIUSB
FN6541.1 April 3, 2008
ISL9221 Block Diagram
LDO LDO
BYPASS USB_BYP
4.35V TO 6.5V VDC
BAT VMIN + 2.6V
4.35V TO 5.25V VUSB THERM
VRCH
+ 3.9V
CC/CV 6.8VOVP
+ 150/80mV 4.2V +
5.4VOVP
VOLTAGE/CURRENT CONTROLLER
VOS
+ VDC
VOS
+
VUSB
EN IUSB IDC IMIN 1.22V + + + GND CHG I/O CNTL PPR
FIGURE 1. SIMPLIFIED BLOCK DIAGRAM
USB Charge Current
When the EN pin is pulled low and a valid USB voltage is present at the USB pin, the IC will charge the battery at a rate dependent on the IUSB setting. The charge current maybe reduced by the USB source if it is set to a value higher than the current limit of the USB source. Equation 1 for setting the IUSB current is as follows:
6820 IUSB = ----------------- ( mA ) R IUSB (EQ. 1)
Otherwise, the period to charge the battery may be prolonged.
Adapter Charge Current
When the EN pin is pulled low and a valid adapter voltage is present at the VDC pin, the IC will charge the battery at a rate dependent on the IVDC setting; the charge on the battery and the source connected to the VDC pin. An example of this is while the IVDC is set for 1000mA, the adapter supply may only provide 800mA and the battery is limited to the 800mA. Typically the rDS(ON) across the charge path, VDC to BAT is 600m. At a 1.0A charging rate, 600mV is dropped across the charge path. Thus, the voltage at the VDC pin needs to be maintained above ~4.80V. Otherwise the period to charge the battery may be prolonged.
6820 IVDC = ----------------- ( mA ) R IVDC (EQ. 2)
Where RIUSB is in k. The current set by the IUSB pin for charging the battery is in addition to current drawn by the load on the USB_BYP. The system designer should consider the maximum expected USB_BYP load current when selecting the USB charging current so as not to exceed the current limits set by the USB standards. Typically at room temperature, the rDS(ON) across the charge path, VUSB to BAT is 600m. If the entire USB current limit of 465mA is being supplied to the battery, the drop across the charging FET could be more than 300mV. Thus, the voltage at the USB pin needs to be maintained above ~4.5V.
Where RIVDC is in k. It is recommended that the maximum charging current be programmed to between 100mA and 1200mA.
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FN6541.1 April 3, 2008
ISL9221
Floating Charge Voltage
The floating voltage during the constant voltage phase is 4.2V. The floating voltage has 1% accuracy over the ambient temperature range of -40C to +85C.
Power-Good Condition
Even if there is a power present at one of the power input pins, the charger will not deliver power to the battery for charging if three of the conditions below are not met: * VDC or VUSB > VPOR * VDC or VUSB - VBAT > VOS * VDC or VUSB < VOVP Where VPOR is the power on reset voltage and VOS is the offset voltage of the input-to-output comparator. All of these voltages have hysteresis, as given in the "Electrical Specifications" table on page 2.
POR_DLY POR VDC 5.4V OVP POR VUSB 6.8VOVP OVP- HOVP
Trickle Charge Current
When the battery voltage is below 2.7V (VBATmin), the charger operates in trickle/preconditioning mode, where the charge current is typically 18% of the programmed current set by RIVDC.
End-of-Charge Indication
When an EOC condition (charge current falls below IMIN during constant-voltage charging) is encountered, the internal open-drain MOSFET at the CHG pin turn-off. IMIN threshold is programmable by the resistor RIMIN at the IMIN pin for both adapter and USB inputs. If the programmed fast charge current is less than IMIN, then after the de-bounce period for VBAT = VBATmax expires, EOC occurs. Once EOC is reached, the status is latched and can be reset by one of the following conditions: * The part is disabled and re-enabled * The selected input source is removed and reapplied * The BAT pin voltage falls below the recharge threshold (~3.9V)
OVP- HOVP
PPR
EN
ENABLE ACTIVE
IMIN
IMIN sets the charge termination current for EOC (End-ofCharge). IMIN can be calculated by Equation 3:
550 IMIN = ---------------- ( mA ) R IMIN (EQ. 3)
IVDC CHG
ILDO + ICHG ILDO IUSB_BYP + ICHRG IUSB_BYP IVUSB
Where RIMIN is in k. IMIN is applicable for both adapter and USB charging.
Power Presence Indication
When either the Adapter power or USB is above the POR threshold, the PPR internal Open-Drain MOSFET pulls the pin low indicating that there is a valid source on one of the power input pins. If only one source is connected and it is above VOVP or both sources are connected and both exceed VOVP, the PPR will be released (HIGH) indicating that the voltage at the pin(s) is invalid. If one input is valid while the other isn't, the PPR pin will be pulled low.
VBAT
USB_BYP 4.94V 0V
VDC_LDO
Thermal Fold Back (ThermaguardTM)
The thermal fold back function reduces the charge current when the internal temperature reaches the thermal foldback threshold, which is typically +125C. This protects the charger from excessive thermal stress at high input voltages.
FIGURE 2. . CHARGING PROFILE
Input Bypass Capacitors
Due to the wall or car power adapter power lead inductance, the VDC input capacitor type must be properly selected to prevent high voltage transient during a hot-plug event. This is also true for the USB input capacitor. A tantalum capacitor is a good choice for its high ESR, providing damping to the voltage transient. Multi-layer ceramic capacitors, however
7
FN6541.1 April 3, 2008
ISL9221
have a very low ESR and hence when chosen as input capacitors, a 1 series resistor must be placed between the capacitor and ground, as shown in the Typical Applications Section, to provide adequate damping.
Fault Summary
If VDC is greater than 6.8V, then the VDC_LDO and charging FETs are turned off until VDC < VOVP - HOVP (Where HOVP is the OVP hysteresis). PPR will be asserted high (off), unless VUSB is valid. If VUSB is greater than 5.4V, then the VUSB bypass and charging FETs are turned off until VUSB < VOVP - HOVP. PPR will be asserted high (off), unless VDC is valid. If the load on VUSB_BYP exceeds 400mA, the FET will be current limited to protect the load and the IC. If VUSB_BYP > VUSB, USB Bypass FET is turned off.
CHG CHARGE DISABLE EN CHARGE ENABLE VMAX VRCH IMAX VMIN VBAT 0.18*IMAX ICHG IMIN
State Diagram
The state diagram for the charger functions is shown in Figure 4. The diagram starts with the Power-off state. When at least one input voltage rises above the POR threshold, the charger resets itself. If both input voltages are above the POR threshold, the charger selects the VDC input as the power source. Then if the EN pin is at a logic HIGH voltage, the charger will stay in the disabled state. If the EN pin is LOW or is brought LOW charging begins. Any time the EN pin is asserted high, the charger returns to the disabled state. When the EOC condition is reached, the CHG will turn to a logic HIGH to indicate a charge complete status but charging will continue.
EOC
FIGURE 3. TIMING DIAGRAM
8
FN6541.1 April 3, 2008
ISL9221
VDC BAD, VUSB GOOD
VDC = GOOD, IF VPOR < VDC < 6.8V VUSB = GOOD, IF VPOR < VUSB < 5.4V
POWER OFF CHARGER: OFF PPR: OFF CHG: OFF LDO: OFF BYP: OFF
VDC BAD, VOVP < VUSB VDC BAD, VUSB GOOD EN = HI VDC GOOD, VUSB GOOD EN = HI VDC GOOD, VUSB BAD EN = HI
VOVP < VDC, VUSB BAD
NOT ENABLED, EN = HI
POR USB INPUT ONLY CHARGER: OFF PPR: ON CHG: OFF LDO: OFF BYP: ON
POR VDC INPUT CHARGER: OFF PPR: ON CHG: OFF LDO: ON BYP: ON
POR VDC INPUT CHARGER: OFF PPR: ON CHG: OFF LDO: ON BYP: OFF
NOT ENABLED, EN = HI
VDC GOOD, VOVP < VUSB
VBAT < VMIN, EN = LOW
VOVP < VDC, VUSB GOOD
OVP USB INPUT ONLY CHARGER: OFF PPR: OFF CHG: OFF LDO: OFF BYP: OFF
TRICKLE CHARGE CHARGER: ON PPR: ON CHG: ON LDO: ON (IF VDC GOOD) BYP: ON (IF VUSB GOOD)
OVP VDC INPUT SELECTED CHARGER: OFF PPR: OFF CHG: OFF LDO: OFF BYP: OFF
VMIN < VBAT < VMAX, EN = LOW
VMIN < VBAT VDC BAD
VMIN < VBAT < VMAX, EN = LOW
FAST CHARGE @ IUSB CHARGER: ON PPR: ON CHG: ON LDO: OFF BYP: ON VDC GOOD
FAST CHARGE @ IVDC CHARGER: ON PPR: ON CHG: ON LDO: ON BYP: ON (IF VUSB GOOD)
RECHARGE CONDITION MET, VBAT < VRCH VMAX = VBAT, EN = LOW VMAX = VBAT, EN = HI
CHARGE COMPLETE CHARGER: ON PPR: ON CHG: OFF LDO: ON (IF VDC GOOD) BYP: ON (IF VUSB GOOD)
VMAX = VBAT, EN = LOW
VMAX = VBAT, EN = HI
FIGURE 4. STATE DIAGRAM FOR CHARGER FUNCTIONS
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FN6541.1 April 3, 2008
ISL9221 Logic Function State Table
VDC INPUT
VIN < VPOR PGOOD, VPOR < VDC < VOVP VIN > VOVP VIN < VPOR
USB INPUT
PGOOD, VPOR < VUSB < VOVP VIN > VOVP EN PPR CHG BAT CHARGING VDC_LDO OUTPUT USB_BYP
X
X
X
X
Don't Care Low
Hi Z
Hi Z
No, Reverse Blocked Yes, USB Charging Yes, VDC Charging Yes, VDC Charging No, Reverse Blocked No, Reverse Blocked No, Reverse Blocked
No, Reverse Blocked No, reverse blocked Yes
No, Reverse Blocked Yes
X
X
Yes
Low
Low
Yes
X
X
Low
Low
Low
No, Reverse Blocked Yes No, Reverse Blocked Yes
Yes Yes X
Yes X
Low High (Disables Charging) High (Disables Charging) High (Disables Charging)
Low Low
Low Hi Z
Yes Yes
X
X
Yes
Low
Hi Z
No, reverse blocked Yes
Yes
Yes
Low
Hi Z
Yes
NOTES: 4. "X" denotes that the input is either less than VPOR or greater than VOVP 5. VDC_VOVP is a nominal 6.8V 6. VUSB_VOVP is a nominal 5.4V
10
FN6541.1 April 3, 2008
ISL9221 Dual Flat No-Lead Plastic Package (DFN)
L12.4x3
2X A 0.15 C A D 2X 0.15 C B
12 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-229-VGED-4 ISSUE C) MILLIMETERS SYMBOL A A1 MIN 0.80 NOMINAL 0.90 0.20 REF 0.18 0.23 4.00 BSC 3.15 3.30 3.00 BSC 1.55 1.70 0.50 BSC 0.20 0.30 0.40 12 6 0.50 1.80 3.40 0.30 MAX 1.00 0.05 NOTES 5,8 7,8 7,8 8 2 3 Rev. 1 2/05
E 6 INDEX AREA TOP VIEW B
A3 b D D2 E E2
// 0.10 0.08 C C
e k
A SIDE VIEW C SEATING PLANE D2 (DATUM B) 6 INDEX AREA (DATUM A) E2/2 NX L N 8 N-1 e (Nd-1)Xe REF. BOTTOM VIEW (A1) 5 0.10 NX b 1 2 NX k E2 D2/2 A3
L N Nd NOTES:
7
8
1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd refers to the number of terminals on D. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389.
M C AB C L
NX (b) 5
L e
SECTION "C-C" TERMINAL TIP FOR EVEN TERMINAL/SIDE
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 11
FN6541.1 April 3, 2008


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