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| STB75NF75 STP75NF75 - STP75NF75FP N-channel 75V - 0.0095 - 80A - TO-220 - TO-220FP - D2PAK STripFETTM II Power MOSFET General features Type STB75NF75 STP75NF75 STP75NF75FP VDSS 75V 75V 75V RDS(on) <0.011 <0.011 <0.011 ID 80A(1) 80A(1) 80A(1) TO-220 3 1 2 1 3 2 TO-220FP 1. Current limited by package Exceptional dv/dt capability 100% avalanche tested 3 1 Description This Power MOSFET series realized with STMicroelectronics unique STripFETTM process has specifically been designed to minimize input capacitance and gate charge. It is therefore suitable as primary switch in advanced highefficiency, high-frequency isolated DC-DC converters for Telecom and Computer applications. It is also intended for any applications with low gate drive requirements. DPAK Internal schematic diagram www..com Applications Switching application Order codes Part number STB75NF75T4 STP75NF75 STP75NF75FP Marking B75NF75 P75NF75 P75NF75 Package DPAK TO-220 TO-220FP Packaging Tape & reel Tube Tube February 2007 Rev 8 1/16 www.st.com 16 Contents STB75NF75 - STP75NF75 - STP75NF75FP Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 4 5 6 Test circuit ................................................ 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 www..com 2/16 STB75NF75 - STP75NF75 - STP75NF75FP Electrical ratings 1 Electrical ratings Table 1. Symbol VDS VDGR VGS ID (1) Absolute maximum ratings Value Parameter Drain-source voltage (VGS = 0) Drain-gate voltage (RGS = 20K) Gate-source voltage Drain current (continuous) at TC = 25C Drain current (continuous) at TC=100C Drain current (pulsed) Total dissipation at TC = 25C Derating factor 80 70 320 300 2.0 12 700 --55 to 175 2000 D2PAK /TO-220 75 75 20 80 70 320 45 0.3 Unit TO-220FP V V V A A A W W/C V/ns mJ V C ID(1) IDM(2) PTOT (3) dv/dt Peak diode recovery voltage slope Single pulse avalanche energy Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1s;TC=25C) Operating junction temperature Storage temperature EAS (4) VISO TJ Tstg 1. Current limited by package 2. Pulse width limited by safe operating area 3. ISD 80A, di/dt 300A/s, VDD V(BR)DSS, Tj TJMAX 4. Starting TJ = 25 oC, ID = 40A, VDD = 37.5V www..com Table 2. Symbol RthJC RthJA Tl Thermal data Value Parameter Thermal resistance junction-case max Thermal resistance junction-ambient max Maximum lead temperature for soldering purpose(1) D2PAK /TO-220 0.5 62.5 300 Unit TO-220FP 3.33 C/W C/W C 1. 1.6mm from case for 10sec) 3/16 Electrical characteristics STB75NF75 - STP75NF75 - STP75NF75FP 2 Electrical characteristics (TCASE=25C unless otherwise specified) Table 3. Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on) On/off states Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions ID = 250A, VGS= 0 VDS = Max rating, VDS = Max rating @125C VGS = 20V VDS= VGS, ID = 250A VGS= 10V, ID= 40A 2 3 Min. 75 1 10 100 4 Typ. Max. Unit V A A nA V 0.0095 0.011 Table 4. Symbol gfs (1) Ciss Coss Crss Qg Qgs www..com Dynamic Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Test conditions VDS = 15V, ID = 40A VDS =25V, f = 1 MHz, VGS = 0 Min. Typ. 20 3700 730 240 117 27 47 160 Max. Unit S pF pF pF nC nC nC VDD = 60V, ID = 80A VGS =10V Qgd 1. Pulsed: pulse duration=300s, duty cycle 1.5% 4/16 STB75NF75 - STP75NF75 - STP75NF75FP Electrical characteristics Table 5. Symbol td(on) tr td(off) tf Switching times Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test conditions VDD= 37.5V, ID= 45A, RG=4.7, VGS=10V Figure 15 on page 9 Min. Typ. 25 100 66 30 Max. Unit ns ns ns ns Table 6. Symbol ISD ISDM(1) VSD(2) trr Qrr IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 80A, VGS = 0 ISD = 80A, di/dt = 100A/s, VDD = 25V, TJ = 150C Figure 17 on page 9 132 660 10 Test conditions Min Typ. Max 80 320 1.5 Unit A A V ns nC A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300s, duty cycle 1.5% www..com 5/16 Electrical characteristics STB75NF75 - STP75NF75 - STP75NF75FP 2.1 Figure 1. Electrical characteristics (curves) Safe operating area for TO-220 DPAK Figure 2. Thermal impedancefor TO-220 DPAK Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance for TO-220FP www..com Figure 5. Output characterisics Figure 6. Transfer characteristics 6/16 STB75NF75 - STP75NF75 - STP75NF75FP Figure 7. Transconductance Figure 8. Electrical characteristics Static drain-source on resistance Figure 9. Gate charge vs gate-source voltage Figure 10. Capacitance variations Figure 11. Normalized gate threshold voltage vs temperature www..com Figure 12. Normalized on resistance vs temperature 7/16 Electrical characteristics Figure 13. Source-drain diode forward characteristics STB75NF75 - STP75NF75 - STP75NF75FP Figure 14. Normalized BVDSS vs temperature www..com 8/16 STB75NF75 - STP75NF75 - STP75NF75FP Test circuit 3 Test circuit Figure 16. Gate charge test circuit Figure 15. Switching times test circuit for resistive load Figure 17. Test circuit for inductive load Figure 18. Unclamped inductive load test switching and diode recovery times circuit www..com Figure 19. Unclamped inductive waveform 9/16 Package mechanical data STB75NF75 - STP75NF75 - STP75NF75FP 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com www..com 10/16 STB75NF75 - STP75NF75 - STP75NF75FP Package mechanical data TO-220 MECHANICAL DATA DIM. A b b1 c D E e e1 F H1 J1 L L1 L20 L30 mm. MIN. 4.40 0.61 1.15 0.49 15.25 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 TYP MAX. 4.60 0.88 1.70 0.70 15.75 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 MIN. 0.173 0.024 0.045 0.019 0.60 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 0.645 1.137 0.151 0.116 inch TYP. MAX. 0.181 0.034 0.066 0.027 0.620 0.409 0.106 0.202 0.052 0.256 0.107 0.551 0.154 oP Q www..com 11/16 Package mechanical data STB75NF75 - STP75NF75 - STP75NF75FP D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. DIM. MIN. A A1 A2 B B2 C C2 D D1 E E1 G L L2 L3 M R V2 0 4.88 15 1.27 1.4 2.4 0.4 4 10 8.5 5.28 15.85 1.4 1.75 3.2 0.192 0.590 0.050 0.055 0.094 0.015 4.4 2.49 0.03 0.7 1.14 0.45 1.23 8.95 8 10.4 0.393 0.334 0.208 0.625 0.055 0.068 0.126 TYP MAX. 4.6 2.69 0.23 0.93 1.7 0.6 1.36 9.35 MIN. 0.173 0.098 0.001 0.027 0.044 0.017 0.048 0.352 0.315 TYP. MAX. 0.181 0.106 0.009 0.036 0.067 0.023 0.053 0.368 inch www..com 3 1 12/16 STB75NF75 - STP75NF75 - STP75NF75FP Package mechanical data TO-220FP MECHANICAL DATA mm. MIN. 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 16 28.6 9.8 2.9 15.9 9 3 30.6 10.6 3.6 16.4 9.3 3.2 1.126 .0385 0.114 0.626 0.354 0.118 TYP MAX. 4.6 2.7 2.75 0.7 1 1.7 1.7 5.2 2.7 10.4 MIN. 0.173 0.098 0.098 0.017 0.030 0.045 0.045 0.195 0.094 0.393 0.630 1.204 0.417 0.141 0.645 0.366 0.126 inch TYP. MAX. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.204 0.106 0.409 DIM. A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 O A B L3 www..com L6 L7 F1 F D G1 H F2 E L2 L5 123 L4 G 13/16 Packaging mechanical data STB75NF75 - STP75NF75 - STP75NF75FP 5 Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. www..com BASE QTY 1000 mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 A0 B0 D D1 E F K0 P0 P1 P2 R T W 0.35 0.0098 0.0137 0.933 0.956 * on sales type 14/16 STB75NF75 - STP75NF75 - STP75NF75FP Revision history 6 Revision history Table 7. Date 03-Aug-2006 15-Sep-2006 27-Feb-2007 Revision history Revision 6 7 8 Complete version RDS(on) value update The document has been reformatted Changes www..com 15/16 STB75NF75 - STP75NF75 - STP75NF75FP Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. www..com Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 16/16 |
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