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| This product complies with the RoHS Directive (EU 2002/95/EC). DMA50101 Silicon PNP epitaxial planar type For general amplification DMA20101 in SMini5 type package Features High forward current transfer ratio hFE with excellent linearity Low collector-emitter saturation voltage VCE(sat) Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package Package Code SMini5-F3-B Name Pin 1: Base (Tr1) 2: Emitter (Common) 3: Base (Tr2) Basic Part Number Dual DSA2001 (Common emitter) 4: Collector (Tr2) 5: Collector (Tr1) Marking Symbol: A0 Internal Connection (C1) 5 (C2) 4 Packaging Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard) Absolute Maximum Ratings Ta = 25C Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector current Peak collector current Total power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC ICP PT Tj Tstg Rating -60 -50 -7 -100 -200 150 150 -55 to +150 Unit V V V mA mA mW C C Tr1 Tr2 1 (B1) 2 (E) 3 (B2) Electrical Characteristics Ta = 25C3C Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open) Forward current transfer ratio hFE ratio * Collector-emitter saturation voltage Transition frequency Collector output capacitance (Common base, input open circuited) Symbol VCBO VCEO VEBO ICBO ICEO hFE hFE (Small/Large) VCE(sat) fT Cob Conditions IC = -10 A, IE = 0 IC = -2 mA, IB = 0 IE = -10 A, IC = 0 VCB = -20 V, IE = 0 VCE = -10 V, IB = 0 VCE = -10 V, IC = -2 mA VCE = -10 V, IC = -2 mA IC = -100 mA, IB = -10 mA VCE = -10 V, IC = -2 mA VCB = -10 V, IE = 0, f = 1 MHz 210 0.50 0.99 - 0.2 150 2 - 0.5 Min -60 -50 -7 - 0.1 -100 460 Typ Max Unit V V V A A V MHz pF Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Ratio between 2 elements Publication date: November 2010 Ver. BED 1 This product complies with the RoHS Directive (EU 2002/95/EC). DMA50101 DMA50101_PT-Ta DMA50101_IC-VCE DMA50101_hFE-IC PT Ta 200 -120 Ta = 25C IC VCE 600 IB = -600 A -500 A -400 A -300 A -200 A -100 A -20 hFE IC VCE = -10 V Total power dissipation PT (mW) Forward current transfer ratio hFE -100 150 500 400 300 200 100 0 - 0.1 Collector current IC (mA) -80 -60 -40 Ta = 85C 25C -30C 100 50 0 0 40 80 120 160 200 0 0 -2 -4 -6 -8 -10 -12 -1 -10 -100 Ambient temperature Ta (C) DMA50101_VCEsat-IC Collector-emitter voltage VCE (V) DMA50101_IC-VBE Collector current IC (mA) DMA50101_Cob-VCB VCE(sat) IC IC VBE Collector output capacitance (Common base, input open circuited) Cob (pF) -120 VCE = -10 V -100 25C 4.0 Cob VCB IE = 0 f = 1 MHz Ta = 25C Collector-emitter saturation voltage VCE(sat) (V) -10 IC / IB = 10 Collector current IC (mA) Ta = 85C -80 -60 -40 -20 0 -30C -1 3.0 2.0 - 0.1 Ta = 85C 25C -30C 1.0 - 0.01 - 0.1 -1 -10 -100 0 - 0.4 - 0.8 -1.2 0 -1 -10 -100 Collector current IC (mA) DMA50101_fT-IC Base-emitter voltage VBE (V) Collector-base voltage VCB (V) fT IC 250 VCE = -10 V Ta = 25C Transition frequency fT (MHz) 200 150 100 50 0 - 0.1 -1 -10 -100 Collector current IC (mA) 2 Ver. BED This product complies with the RoHS Directive (EU 2002/95/EC). DMA50101 SMini5-F3-B Unit: mm 2.0 0.1 1.3 0.1 (0.65) 5 (0.65) 4 1.25 0.10 2.1 0.1 1 2 3 7 (0.425) 0.20 0.05 7 0.13 -0.02 +0.05 0 to 0.10 0.7 0.1 (0.15) Ver. BED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: - Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202 |
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