 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Ceramic Package Ceramic Leadless Chip Carrier Packages (CLCC) 0.010 S E H S D D3 J68.A 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE INCHES SYMBOL A A1 B B1 E3 E MILLIMETERS MIN 1.70 1.47 0.85 0.15 23.88 MAX 2.20 1.83 0.99 0.56 24.51 NOTES 6, 7 2, 4 2 2 2 5 3 3 3 Rev. 0 5/18/94 j x 45o MIN 0.067 0.058 0.033 0.006 0.940 MAX 0.087 0.072 0.039 0.022 0.965 B B3 D D1 D2 0.800 BSC 0.400 BSC 0.616 0.940 0.632 0.965 20.32 BSC 10.16 BSC 15.65 23.88 16.05 24.51 h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 D3 E E1 E2 E3 e 0.800 BSC 0.400 BSC 0.616 0.632 20.32 BSC 10.16 BSC 15.65 16.05 0.050 BSC 0.015 0.040 Ref 0.045 0.045 0.075 0.003 17 17 68 0.055 0.055 0.095 0.015 - 1.27 BSC 0.38 1.00 Ref 1.14 1.14 1.91 0.08 17 17 68 1.40 1.40 2.41 0.38 -E- e1 j L 0.007 M E F S H S B1 L1 L2 e L -HL3 L3 ND NE N -FE1 B3 NOTES: 1. Metallized castellations shall be connected to plane 1 terminals and extend toward plane 2 across at least two layers of ceramic or completely across all of the ceramic layers to make electrical connection with the optional plane 2 terminals. 2. Unless otherwise specified, a minimum clearance of 0.015 inch (0.38mm) shall be maintained between all metallized features (e.g., lid, castellations, terminals, thermal pads, etc.) L1 E2 L2 B2 e1 D1 D2 3. Symbol "N" is the maximum number of terminals. Symbols "ND" and "NE" are the number of terminals along the sides of length "D" and "E", respectively. 4. The required plane 1 terminals and optional plane 2 terminals (if used) shall be electrically connected. 5. The corner shape (square, notch, radius, etc.) may vary at the manufacturer's option, from that shown on the drawing. 6. Chip carriers shall be constructed of a minimum of two ceramic layers. 7. Dimension "A" controls the overall package thickness. The maximum "A" dimension is package height before being solder dipped. 8. Dimensioning and tolerancing per ANSI Y14.5M-1982. 9. Controlling dimension: INCH. 39 |
Price & Availability of J68APACKAGE
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |