View IRMS6115_147042.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

SIDE VIEW
IRMS6115 TOP VIEW IRMT6115
C .116 L .106 (2.95) (2.70)
115 Kb/s Infrared Data Transceiver
Dimensions in inches (mm)
E
D
.157 (4.00)
E
D
.190 (4.83)
www..com
PIN 1 E=Emitter D=Detector
PIN 1
.138 (3.50) .374 (9.86)
IRMS6115
IRMT6115
IRMS6115
IRMT6115
FEATURES * Compliant with IrDA Specification * Data Rates 9.6 Kb/s to 115 Kb/s, usable up to 576 Kb/s * Wide Range of Supply Voltage 2.4 to 5.5 V * Standby Current 90 A Typical * Excellent Power Supply Noise Rejection * Tri-State Receiver Output and TxD Disable * AC Coupled Transmit Input: Provides Integrated Protection for Eye Safety * High DC Ambient Rejection * Independent LED Supply, Anode Pin Can Take - up to 9.0 V DC when not Transmitting and - up to 4.0 V above VCC when Transmitting * Receiver Latency Less than 100 s * Slimline Package: H 4.0 mm x D 4.8 mm x L 9.8 mm DESCRIPTION With state of the art submicron BiCMOS circuitry, coupled with Infineon optoelectronic expertise, the IRMS6115 and IRMT6115 outperforms its closest rival. The transmit input is AC coupled, limiting transmit pulse duration to 70 s, preventing transmitter damage and continuous LED output.
Absolute Maximum Ratings, TA=25C (except where noted) Supply Voltage Range, all states, VCC ................................-0.5 to +7.0 V LED Anode Voltage, VLEDA VCC=0 to 5.5 V, not transmitting ...................................-0.5 to +9.0 V LED Anode Voltage, VLEDA VCC=2.4 to 5.5 V, transmitting ............................. -0.5 to VCC + 4.0 V Input Current ICC VCC=5.0 V, TxD=VCC, transmit ...................................................20 mA Output RxD Current .......................................................................50 mA Storage Temperature, TS.....................................................- 25 to +85C Operating Temperature, TO .................................................- 25 to +85C Lead Solder Temperature, Maximum 230C................................... <10 s IC Junction Temperature, TJ ...........................................................125C Average IR LED Current, ILED ......................................................100 mA Repetitive Pulsed IR LED Current, <10 s, ton <20%, LED Anode=3.3 V, ILED(RP) .........................600 mA Input Voltage: TxD......................................................- 0.5 to VCC + 0.5 V RxD Voltage .............................................................. - 0.5 to VCC + 0.5 V Table 1. Pin Functions
Pin no. 1 2 3 4 Function IR LEDA IR LEDC TxD RxD Pin no. 5 6 7 8 Function SD VCC *Do not connect GND
*Pin 7 internally grounded
Infineon Technologies, Corp. * Optoelectronics Division * Cupertino, CA (formerly Siemens Microelectronics, Inc.) www.infineon.com/opto * 1-800-777-4363 1
May 7 1999-08
Figure 1. Block Diagram
VCC Pin 6 RxD Pin 4 VCC 500 K Tri-State Buffer Comparator Lowpass Filter 25 kHz to 500 kHz BW DC Amplifier
REF ENB
Ambient Light Supressor SD Pin 5 www..com TxD Input Disable IR LED Gated Buffer GND Pin 8 2 A Pull-down LED Anode Pin 1 LED Cathode Pin 2 Regulated Voltage & Current Source AGC & Signal Reference Processor AGC Pin Photodiode
TxD Pin 3 Current Limited LED Driver
Theory of operation The IRMS6115/IRMT6115 Slimline--Infrared Data Transceiver consists of a detector photodiode, an IR LED transmitter, an IC containing ambient light suppressor, and Automatic Gain control circuitry (AGC). The ambient light suppressor can cancel up to 4.0 mW/cm (typical) at 2.4 V of DC ambient signal, and up to 1.5 mW/cm2 (peakto-peak) at 120 Hz AC ambient. The AGC in the IC is to keep the system output constant by varying the gain to accommodate a wide range of input signals. It also provides noise immunity in the high noise ambient environment. For normal operation of the transmit and receiver modes, the Shut Down (SD) pin should be held low. It is recommended that this pin be connected to GND if Shut Down (SD) mode is not used. In receive mode, the receiver output (RxD) which normally stays high, will go low for duration of the receive pulses. It is a push-pull CMOS driver capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is required. In transmit mode, by asserting the TxD pin above 12 VCC will turn on IR LED transmitter. At the LED Anode (pin 1) connect this pin to VCC or unregulated power supply (not to exceed VCC + 4.0 V), through a resistor to set the proper LED current to reduce the thermal dissipation and to lower LED current.
2
Table 2. Slimline IRMS6115/IRMT6115 Truth Table
Inputs SD TxD Detector Outputs RxD LED Off On Off X=don't care 500 k pull-up state Undefined 0.4 mW/sr 40 mW/sr High Low
High X=don't care state Low High Low
Infineon Technologies, Corp. * Optoelectronics Division * Cupertino, CA (formerly Siemens Microelectronics, Inc.) www.infineon.com/opto * 1-800-777-4363 2
IRMS6115/IRMT6115 May 7 1999-08
Electrical Characteristics Table 3. Basic Operating Parameters, TA=25C (except where noted)
Parameter Supported Data Rate Power Supply Voltage Maximum LED Anode Voltage Symbol Min. -- VCC VLEDA ICC1 ICC1 ICC2 ICC3 9.6 K 2.4 -- -- 65 -- -- Typ. -- -- -- 0.01 80 100 2.0 Max. 115 K 5.5 VCC+4 1.0 90 200 2.5 Unit Kb/s V V A A A mA Conditions 1.63 s or 3/16 clock period -25C to +85C, VCC to VSS VCC=2.4 V to 5.5 V SD=VCC, VCC=2.4 V to 5.5 V no signal, VCC=2.7 V to 3.3 V VCC=2.7 V to 3.3 V VCC=2.7 V to 3.3 V, No LED resistor, VLED=3.0 V DC
ICC Shut Down Current (Note 1) ICC Standby Current (Ave) ICC Receiving Current (Ave) ICC Transmitting Current (Ave) Table 4. I/O Parameters
Parameter
www..com
Symbol Min. -- -- -- -- -- -- VIH VIH VIL VIL -- -- -- -- 1.0 -- 0.8 -- -- 4.3 1.9 -- -- -- -- 350 12 20 17 30
Typ. 5.0 2.0 -- 1.4 35 90 4.6 2.1 0.22 0.17 48 10 500 18 30 25 45
Max. -- 3.0 0.01 2.0 100 200 -- -- 0.4 0.3 -- -- 650 27 40 40 70
Unit pF A A V ns ns V V V V mA mA k ns ns ns ns
Conditions VCC=2.4 V to 5.5 V TxD=VCC, VCC=2.4 V to 5.5 V TxD=0, VCC=2.4 V to 5.5 V VCC=2.4 V to 5.0 V VCC=2.4 V to 5.0 V VCC=2.4 V to 5.0 V VCC=5.0 V, IOH=8 mA VCC=2.4 V, IOH=3 mA VCC=5.0 V, IOL =8 mA VCC=2.4 V, IOL=3.0 mA VCC=5.0 V, RxD=0, RxD=VCC VCC=2.4 V, RxD=0, RxD=VCC VCC=2.4 V to 5.0 V, between RxD to VCC VCC=5.0 V, Load=15 pF VCC=5.0 V, Load=50 pF VCC=2.4 V, Load=15 pF VCC=2.4 V, Load=50 pF
TxD, SD input capacitance
TxD High Loading TxD Low Loading TxD, SD Input Threshold (Note 1) SD to RxD Tri-State SD to RxD Enable RxD Output High RxD Output High RxD Output Low RxD Ouput Low RxD Short Circuit RxD Short Circuit RxD to VCC Tri-State Impedance RxD Rise Time RxD Fall Time RxD Rise Time RxD Fall Time
tr tf tr tf
Table 5. Receiver Parameters, TA=25C (except where noted)
Parameter Maximum Data Rate Receive 12 Angle Minimum Signal Detect Irradiance Maximum Signal Detect Irradiance Maximum Signal Irradiance No detect Symbol Min. -- -- EIHmin EEmax -- 9.6 15 -- 500 -- -- -- -- -- -- -- Typ. 115.2 -- 2.0 1000 -- 7.5 4.0 1.0 5.0 2.5 44 Max. 576 -- 4.0 -- 0.3 -- -- 2.0 10 4.0 -- Unit Kb/s degree W/cm
2
Conditions 4.0 W/cm2 to 500 mW/cm2 IrDA Physical Layer specification Bit error rate=10- 8, 1.63 s pulse <0.1 pulse per second detect, 1.63 s VCC=5.0 V
mW/cm2 Bit error rate=10- 8, 1.63 s pulse W/cm2 mW/cm2
Maximum DC Ambient Irradiance, 5.0 V -- (Note 7) Maximum DC Ambient Irradiance, 2.4 V -- (Note 7) AGC Attack Time (Note 2) AGC Settling (Note 3) Near-Far Receiver Latency (Note 4) AGC Decay Rate (Note 5) -- -- -- --
mW/cm2 VCC=2.4 V s pulse ms dB/ms 4 W/cm2 to 500 mW/cm2 4 W/cm2 to 500 mW/cm2 at 115 Kb/s 0 to 5 mW/cm2 ambient input Following AGC settling at 500 mW/cm2
IRMS6115/IRMT6115 May 7 1999-08
Infineon Technologies, Corp. * Optoelectronics Division * Cupertino, CA (formerly Siemens Microelectronics, Inc.) www.infineon.com/opto * 1-800-777-4363 3
Table 5. Receiver Parameters (continued)
Parameter Transmit Receiver Latency (Note 4) RxD Suppression Duration (Note 8) Powerup Receiver Latency Output Pulse Width at RxD Symbol Min. tL -- -- -- -- -- -- 1.0 -- 50 100 Typ. 50 50 50 1.63 57 100 200 Max. 100 100 100 3.0 100 -- -- Unit s s s s s mV/s mV/ms Conditions 0 to 3 mW/cm2 DC ambient input Following end of TxD pulse 0 to 3 mW/cm2 DC ambient input 1.63 s, 4 W/cm2 to 500 mW/cm2 input. 200 s, 500 mW/cm2, VCC=5.0 V 100 mVP-P triangle wave on VCC 1.0 VP-P triangle wave on VCC
Maximum Output Pulse Width at RxD, -- (Note 7) Small Ripple Power Supply Rejection (Note 6) Large Ripple Power Supply Rejection (Note 6) -- --
Table 6. Transmitter Output www..com
Parameter Maximum Data Rate TxD Radiant Intensity TxD Radiant Intensity TxD /2 Angle TxD Peak Wavelength
1
Symbol -- -- -- --
Min. 9.6 40 -- 15 850 1.55 10 35 350 -- -- -- --
Typ. 115.2 150 70 20 870 1.60 -- 70 400 +0.47 -0.5 0.3 5.0
Max. 576 500 500 30 900 1.65 600 140 600 -- -- 0.4 --
Unit Kb/s mW/Sr mW/Sr degree nm s ns s mA %/C %/C V Vs
Conditions TxD pulse width=434 ns
ILED=350 mA, (6.8 LED resistor, 5.0 VLED supply)
LEDA=2.4 V, no current limiting LED resistor IrDA Physical Layer specification
peak
--
IF=20 mA
TxD=1.63 s, VCC=5.0 V
ILED Pulse Width
Optical Rise and Fall Time Pulse Width Limit
tr, tf
-- -- -- -- -- --
VLED=2.7 V
TxD pulse>200 s, 5.0 V pulse, VCC=5.0 V TxD=VCC, LED anode=3.3 V, VCC=5.0 V TxD=VCC, LED anode=3.3 V, VCC=5.0 V
ILED Limit ILED Limit Temperature Coefficient
LED Temperature Coefficient LED Cathode Saturation Drop TxD VCC dV/dt Rejection
ILED=300 mA
300 mA, VCC=2.4 V dV/dt for less than 10% change in TxD output
Note 1: For Shut Down (SD) current to fall below 1A requires driving Shut Down (SD) to within 0.5 V of VCC to ensure cutoff of the PMOS transistor of the input CMOS totem pole. In most applications this is not an issue if Shut Down (SD) is driven from a CMOS driver supplied from the same voltage supply Note 2: "AGC Attack Time" is the time required for internal AGC (Automatic Gain Control) attenuation to rise to within 10% of final value. Note 3: "AGC Settling" is the number of pulses within 100 s required for the output pulse width to settle to 90% of its final value. Note 4: "Near-Far Receiver Latency" is the time required for the AGC and ambient correction circuits to return to maximum sensitivity (Far) following reception of a maximum (Near) signal or a change in ambient. "Transmit Receiver Latency" is commonly called "Receiver Latency" or "Transmitter Turnaround Time."
Note 5: "AGC Decay Rate" is the rate at which the receiver gain increases following the cessation of signal input. Note 6: The receiver VCC power supply rejection is significantly better for small ripple of less than 100 mVP-P than for larger values. For ripple of more than 100 mVP-P , internal circuits can maintain operating headroom provided that the slew rate is significantly slower. Typically, these specifications allow operation without an external filter from either switching supplies with less than 50 mV P-P ripple or unregulated supplies with less than 1 VP-P of 120 Hz ripple. Note 7: If the low going RxD pulse width exceeds 100 s, then the maximum DC ambient irradiance has been exceeded. Note 8: RxD is suppressed (forced high) while (TxD) transmit pulse is active and for the indicated period following the end of the TxD pulse.
Infineon Technologies, Corp. * Optoelectronics Division * Cupertino, CA (formerly Siemens Microelectronics, Inc.) www.infineon.com/opto * 1-800-777-4363 4
IRMS6115/IRMT6115 May 7 1999-08
Figure 2. Timing Diagrams
Transmit Mode 5.0 V SD 0 V 5.0 V TxD In 0V e
Figure 3. Input Schematics
V CC
TxD VCC
VCC
LED Optical Signal Output 5.0 V RxD Out 0 V
1.6 s 8.7 s
Figure 4. Output Schematics
VCC 500 k pull-up
www..com Receive Mode 5.0 V SD 0 V 5.0 V TxD In 0 V e Optical Signal Received
VCC
VCC
VCC VCC RxD
5.0 V 1.6 s 8.7 s
RxD Out 0 V
Latency 5.0 V SD 0 V 5.0 V TxD In 0 V 5.0 V RxD Out 0 V 100 s
Infineon Technologies, Corp. * Optoelectronics Division * Cupertino, CA (formerly Siemens Microelectronics, Inc.) www.infineon.com/opto * 1-800-777-4363 5
IRMS6115/IRMT6115 May 7 1999-08
Figure 5. Infrared Reflow Soldering Profile 300 250 Temperature (C) 200 150 100 50
www..com
Maximum 240(+5/-0) C 210C
30 s minimum 30 s minimum 60 s minimum
0 0
Note: Peak temperature is 240 (+5 -0)C for less than 10 seconds.
50
100 Time (sec)
150
Interface Diagrams Figure 6. Super I/O (PC87108AVJE) to IRMS6115/IRMT6115
VCC R0 C1=0.1 F C2=6.8 F 6 21 VCC IR TxD 39 3 VCC TxD IRMX6115 PC87108AVJE IR RxD 38 4 RxD SD 5 GND 8
IR RxD C3=0.1 F C4=10 F 21 VCC IR TxD PC87108AVJE 38 39 3 TxD IRMX6115 4 RxD SD 5 GND 8 6 VCC
Figure 7. With independent VLED supply
VCC VLED
R0 C1=0.1 F 1 LED Anode
C2=6.8 F
1 LED Anode
IR SLO 37 VSS GND 40
GND
VSS 40
IR SLO 37
Table 7. Recommended External Component
Parameter VLED power supply Resistor Values 2.4 0 2.7 0 3.0 0 3.5 1.5 4.0 3.9 4.5 5.1 5.0 6.8 Unit V
Infineon Technologies, Corp. * Optoelectronics Division * Cupertino, CA (formerly Siemens Microelectronics, Inc.) www.infineon.com/opto * 1-800-777-4363 6
IRMS6115/IRMT6115 May 7 1999-08
Ordering Information
Part Number Description PCB Mounting Orientation
Figure 9. Reel Dimensions in Inches (mm)
Matte finish these areas
IRMS6115 Integrated Packaged in Component Transceiver Carrier Reel (1000/reel) for --Side View Side View Mounting on PCB IRMT6115 Integrated Packaged in Component Transceiver Carrier Reel (1000/reel) for --Top View Top View Mounting on PCB Tape Leader and Trailer is 400 mm minimum.
0.0790.020 (2.0 0.5) 12.97 (330.0) Ref. 4.01 (102.0) Ref. 0.512+0.020 0.79 -0.008 (20.2) Min. 0.5 13.0 + 0.2 -
X
See detail A
W1 (Measured at hub) W2 (Measured at hub)
Detail A
www..comTape Dimensions in Inches (mm) Figure 8. .315.004 (8.00.10) .059+.004 (1.50+.10) .157.004 (4.000.10) .079.004 (2.00.10) .069.004 (1.75.010) 4 Max.
.295.004 (7.500.10) .630 +.012 -.004 16.0 +.30 -.10 Pin 1 .401.004 Bo (10.19.10)
IRMT6115 (top view)
Feed direction
1.50+.25 (.059+.010)
.0140.0005 (.356.013) 8 Max. .167.004 (4.23.10) Ao
.199.004 (5.06.10) Ko
.315.004 (8.00.10)
.059+.004 (1.50+.10) .157.004 (4.000.10)
.079.004 (2.00.10) .069.004 (1.75.010) 4 Max.
.295.004 (7.500.10) .630 +.012 -.004 16.0 +.30 -.10 Pin 1 1.50+.25 (.059+.010)
.216 (5.48)
.400.004 Bo (10.16.10)
IRMS6115 (side view)
Feed direction
.156 (3.97)
.0130.0005 (.330.013) 8 Max. .185.004 Ao (4.70.10)
.167.004 (4.23.10) Ko
Infineon Technologies, Corp. * Optoelectronics Division * Cupertino, CA (formerly Siemens Microelectronics, Inc.) www.infineon.com/opto * 1-800-777-4363 7
IRMS6115/IRMT6115 May 7 1999-08
Figure 10. IRMS6115/IRMT6115 Detail Drawings With Optional Side View or Top View Mounting
Dimensions in inches (mm)--All dimensions have tolerances of 0.004" (0.1 mm)
.197 (5.00) .165 (4.20) .053 (1.35) .167 .051 (4.23) (1.30) .004 (.10) .190 (4.83) 1" Draft pick and place .079 (2.00) .028 (.70) Typ. .039 (1.00) Typ.
.333 (7.71) 12345678
Recommended PCB footprint TOP VIEW
.065 (1.65)
C L
Front pick and place 5 4X .157 (4.00)
www..com
.134 (3.40) .67 (1.70) E D .079 (2.00)
.012 (.28)
5 4X .069 (1.74) .051 (1.30)
Pin 1
.030 (0.75) 90 to 93 .053 (1.35)
.008 (.20) Coplaner .0059 (0.15)
.016 (0.40) Typ.
.116 (2.95) C L
.106 (2.70) .014 (.36) .388 (9.86) Max.
Pin 1 1 Draft (2 Plcs) .027 (0.69) .020 .039 (0.51) (1.00) .138 (3.50) .378 (9.60) 5 4X
6115RYYWW
For high EMI environment application the IRMS6115 and IRMT6115 modules are available with a metal can shield. The metal shielded modules are designated as IRMS6119 and IRMT6119 respectively.
(c) Infineon Technologies, Corp., Optoelectronic Division (formerly Siemens Microelectronics, Inc.) Printed in the United States of America. All rights reserved. The information provided is believed to be accurate and reliable. Infineon reserves the right to make changes to the product described without notice. No liability is assumed as a result of its use nor for any infringement of the rights of others. This document may contain preliminary information and is subject to change by Infineon without notice. Some of the parametric data expressed in this preliminary data sheet is considered to be functional by design. Infineon assumes no responsibility or liability for any use of the information contained herein. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Infineon or third parties. The products described in this document are not intended for use in implantation or other direct life support applications where malfunction may result in the direct physical harm or injury to persons.
NO WARRANTIES OF ANY KIND, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY OF FITNESS FOR A PARTICULAR PURPOSE, ARE OFFERED IN THIS DOCUMENT. Infineon Technologies, Corp. * Optoelectronics Division * Cupertino, CA (formerly Siemens Microelectronics, Inc.) www.infineon.com/opto * 1-800-777-4363 8 IRMS6115/IRMT6115 May 7 1999-08
Sign-off indicates that OEDs Policy and Process requirements have been fulfilled, and this data sheet is ready for the web and print publications. OK as is (see attached) May 7 1999-08 OK with corrections Revision required
IRMS6115/IRMT6115
115 Kb/s Data Transceiver
Product Marketing Manager (or designated delegate):
Sign-off date:
Engineering Manager (or designated delegate):
Sign-off date:
Sign-off indicates that OEDs Policy and Process requirements have been fulfilled, and this data sheet is ready for the web and print publications. OK as is www..comattached) (see OK with corrections Revision required
Product Marketing Manager (or designated delegate):
Sign-off date:
Engineering Manager (or designated delegate):
Sign-off date:
Sign-off indicates that OEDs Policy and Process requirements have been fulfilled, and this data sheet is ready for the web and print publications. OK as is (see attached) OK with corrections Revision required
Product Marketing Manager (or designated delegate):
Sign-off date:
Engineering Manager (or designated delegate):
Sign-off date:
Sign-off indicates that OEDs Policy and Process requirements have been fulfilled, and this data sheet is ready for the web and print publications. OK as is (see attached) OK with corrections Revision required
Product Marketing Manager (or designated delegate):
Sign-off date:
Engineering Manager (or designated delegate):
Sign-off date:
Sign-off indicates that OEDs Policy and Process requirements have been fulfilled, and this data sheet is ready for the web and print publications. OK as is (see attached) OK with corrections Revision required
Product Marketing Manager (or designated delegate):
Sign-off date:
Engineering Manager (or designated delegate):
Sign-off date:
Filename IRMS/T6115 Questions? Doreen Stein X3477 May 7 1999-08

▲Up To Search▲

Price & Availability of IRMS6115

	To Download IRMS6115 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .