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www..com PD - 5.067A PRELIMINARY GA150TD120U Ultra-FastTM Speed IGBT VCES = 1200V VCE(on) typ. = 2.4V @VGE = 15V, IC = 150A "HALF-BRIDGE" IGBT DOUBLE INT-A-PAK Features * Generation 4 IGBT technology * Standard: Optimized for minimum saturation voltage and operating frequencies up to 10kHz * Very low conduction and switching losses * HEXFREDTM antiparallel diodes with ultra- soft recovery * Industry standard package * UL approved Benefits * Increased operating efficiency * Direct mounting to heatsink * Performance optimized for power conversion: UPS, SMPS, Welding * Lower EMI, requires less snubbing Absolute Maximum Ratings Parameter VCES IC @ TC = 25C I CM ILM IFM VGE VISOL PD @ TC = 25C PD @ TC = 85C TJ TSTG Collector-to-Emitter Voltage Continuous Collector Current Pulsed Collector Current Peak Switching Current Peak Diode Forward Current Gate-to-Emitter Voltage RMS Isolation Voltage, Any Terminal To Case, t = 1 min Maximum Power Dissipation Maximum Power Dissipation Operating Junction Temperature Range Storage Temperature Range Max. 1200 150 300 300 300 20 2500 780 406 -40 to +150 -40 to +125 Units V A V W C Thermal / Mechanical Characteristics Parameter RJC RJC RCS Thermal Resistance, Junction-to-Case - IGBT Thermal Resistance, Junction-to-Case - Diode Thermal Resistance, Case-to-Sink - Module Mounting Torque, Case-to-Heatsink Mounting Torque, Case-to-Terminal 1, 2 & 3 Weight of Module Typ. -- -- 0.1 -- -- 400 Max. 0.16 0.20 -- 4.0 3.0 -- Units C/W N. m g www.irf.com 1 3/20/98 GA150TD120U Electrical Characteristics @ TJ = 25C (unless otherwise specified) V(BR)CES VCE(on) Parameter Min. Collector-to-Emitter Breakdown Voltage 1200 Collector-to-Emitter Voltage -- -- VGE(th) Gate Threshold Voltage 3.0 V GE(th)/T J Temperature Coeff. of Threshold Voltage -- gfe Forward Transconductance -- ICES Collector-to-Emitter Leaking Current -- -- Diode Forward Voltage - Maximum -- VFM -- IGES Gate-to-Emitter Leakage Current -- Typ. Max. Units Conditions -- -- VGE = 0V, IC = 1mA 2.4 2.9 VGE = 15V, IC = 150A 2.2 -- V VGE = 15V, IC = 150A, TJ = 125C -- 6.0 IC = 1.75 mA -11 -- mV/C VCE = VGE, IC = 1.75mA 201 -- S VCE = 25V, IC = 150A -- 2 mA VGE = 0V, VCE = 1200V -- 20 VGE = 0V, VCE = 1200V, TJ = 125C 2.7 3.5 V IF = 150A, VGE = 0V 2.6 -- IF = 150A, VGE = 0V, TJ = 125C -- 500 nA VGE = 20V Dynamic Characteristics - TJ = 125C (unless otherwise specified) Qg Qge Qgc td(on) tr td(off) tf Eon Eoff Ets Cies Coes Cres t rr I rr Q rr di(rec)M/dt Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Energy Turn-Off Switching Energy Total Switching Energy Input Capacitance Output Capacitance Reverse Transfer Capacitance Diode Reverse Recovery Time Diode Peak ReverseCurrent Diode Recovery Charge Diode Peak Rate of Fall of Recovery During tb Min. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ. 1139 192 377 414 208 552 342 29 32 61 25630 1139 221 186 133 12381 2524 Max. Units Conditions 1709 VCC = 400V, VGE = 15V 288 nC IC = 171A 566 TJ = 25C -- RG1 = 15, RG2 = 0 -- ns IC = 150A -- VCC = 720V -- VGE = 15V -- mJ See Fig.17 through Fig.21 -- 90 -- VGE = 0V -- pF VCC = 30V -- = 1 MHz -- ns IC = 150A -- A RG1= 15 -- nC RG2 = 0 -- A/s VCC = 720V di/dt=1260A/s Details of note through are on the last page 2 www.irf.com GA150TD120U 120 F or b oth: 100 Load Current ( A ) LOAD CURRENT (A) D uty c y c le : 50 % T J = 12 5 C T sink = 90 C G a te d riv e a s s pe c ified P ow er D is s ipation = 134 W S q u a re w a v e: 80 60 60% of rated v oltage I 40 20 Ide a l d io d e s 0 0.1 1 10 100 f, Frequency (KHz) Fig. 1 - Typical Load Current vs. Frequency (Load Current = IRMS of fundamental) 1000 1000 I C , Collector-to-Emitter Current (A) I C , Collector-to-Emitter Current (A) TJ = 125 C 100 100 TJ = 125 C TJ = 25 C TJ = 25 C 10 10 1.0 V GE = 15V 80s PULSE WIDTH 1.5 2.0 2.5 3.0 1 5 6 V CC = 25V 50V 5s PULSE WIDTH 7 8 VCE , Collector-to-Emitter Voltage (V) VGE , Gate-to-Emitter Voltage (V) Fig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer Characteristics www.irf.com 3 GA150TD120U 200 4.0 150 VCE , Collector-to-Emitter Voltage(V) VGE = 15V 80 us PULSE WIDTH Maximum DC Collector Current(A) 3.0 IC = 300 A 100 IC = 150 A 2.0 IC = 75 A 50 0 25 50 75 100 125 150 1.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 TC , Case Temperature ( C) TJ , Junction Temperature (( C ) C) Fig. 4 - Maximum Collector Current vs. Case Temperature Fig. 5 - Typical Collector-to-Emitter Voltage vs. Junction Temperature 1 T he rm a l R e sp on s e (Zth JC ) 0.1 D = 0.50 P DM 0.20 0.10 0.05 0.02 0.01 0.01 0.0001 t 1 t2 S IN G LE P U LS E (TH E R M A L R E S P O N S E ) 0.001 0.01 0.1 1 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = PDM x Z thJC + TC A 1000 10 100 t 1 , R e cta n g u la r P u ls e D u ra tio n (se c) Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case 4 www.irf.com GA150TD120U 50000 40000 VGE , Gate-to-Emitter Voltage (V) VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc 20 VCC = 400V I C = 171A C, Capacitance (pF) C ies 30000 15 10 20000 C oes Cres 5 10000 0 1 10 100 0 0 200 400 600 800 1000 1200 VCE , Collector-to-Emitter Voltage (V) Q G , Total Gate Charge (nC) Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage 100 Total Switching Losses (mJ) Total Switching Losses (mJ) V CC V GE TJ 90 I C = 720V = 15V = 125 C 25 = 150A 1000 15 RG =15;RG2 = 0 G1 = 15Ohm VGE = 15V VCC = 720V 960V 80 IC = 300 A 100 IC = 150 A IC = 75 A 70 60 50 0 10 20 30 40 50 10 -60 -40 -20 0 20 40 60 80 100 120 140 160 RG , Gate Resistance (Ohm) () RG , Gate Resistance ( ) TJ , Junction Temperature ( C ) Fig. 9 - Typical Switching Losses vs. Gate Resistance Fig. 10 - Typical Switching Losses vs. Junction Temperature www.irf.com 5 GA150TD120U 150 RG1=15;RG2 = 0 RG = 15Ohm 400 IC , Collector Current ( A ) Total Switching Losses (mJ) T J = 150 C VCC = 720V 125 VGE = 15V 100 V G E = 20V T J = 125C V C E m easured at term inal (Peak Voltage) 300 SAFE OPERATING AREA 200 75 50 100 25 0 0 50 100 150 200 250 300 350 0 0 200 400 600 800 1000 1200 A 1400 I C , Collector Current (A) VCE , Collector-to-Em itter Voltage (V) Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current 25000 Fig. 12 - Reverse Bias SOA 1000 IF = 300A Instantaneous Forward Current - IF ( A ) IF = 150A 20000 IF = 75A 15000 100 T = 1 25C J T= J 25 C QRR - ( nC) 10000 5000 V R = 7 20V T J = 1 2 5 C T J = 2 5 C 10 1.0 2.0 3.0 4.0 0 500 800 F o rwa rd Vo lta g e D ro p - V FM ) (V di f /dt - (A/ s ) 1100 1400 1700 2000 Fig. 13 - Typical Forward Voltage Drop vs. Instantaneous Forward Current Fig. 14 - Typical Stored Charge vs. dif/dt 6 www.irf.com GA150TD120U 400 250 IF = 300A IF = 150A IF = 75A 300 200 I F = 300A I F = 150A IF = 75A trr - ( ns ) 200 IRRM - ( A ) VR = 7 20 V T J = 1 25 C T J = 2 5C 150 100 100 50 VR = 7 2 0 V TJ = 1 2 5 C T J = 2 5 C 2000 0 500 800 1100 1400 1700 2000 0 500 800 di f /dt - (A/ s) 1100 1400 1700 d i f /d t - (A / s ) Fig. 15 - Typical Reverse Recovery vs. dif/dt Fig. 16 - Typical Recovery Current vs. dif/dt www.irf.com 7 GA150TD120U 90% V ge +V ge V ce Ic 10% V ce Ic 90% Ic 5% Ic td (off) tf E off = Vce Ic dt t1+5 S V ce ic dt t1 Fig. 17 - Test Circuit for Measurement of ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf t1 t2 Fig. 18 - Test Waveforms for Circuit of Fig. 17, Defining Eoff, td(off), tf G A T E V O LT A G E D .U .T . 10% + V g +V g trr Ic Q rr = Ic dt dt id dt Ic tx trr tx 10% V c c Vce 10% Ic 90% Ic D U T V O LT A G E AND CURRENT Ipk Ic 10% Irr Vcc V pk Irr Vcc D IO D E R E C O V E R Y W AVEFORMS td(on) tr 5% V c e t2 Vce Ic dt E on = V c e ieIc dt Vce dt t1 t2 D IO D E R E V E R S E RECOVERY ENERG Y t3 t4 E rec = Vd Ic dt V d idIc dt Vd dt t3 t4 t1 Fig. 19 - Test Waveforms for Circuit of Fig. 17, Defining Eon, td(on), tr Fig. 20 - Test Waveforms for Circuit of Fig. 17, Defining Erec, trr, Qrr, Irr 8 www.irf.com GA150TD120U V g G A T E S IG N A L D E V IC E U N D E R T E S T C U R R E N T D .U .T . V O LT A G E IN D .U .T . C U R R E N T IN D 1 t0 t1 t2 Figure 21. Macro Waveforms for Figure 17's Test Circuit L 1000V 50V 600 0 F 100 V Vc* D.U.T. RL= 0 - 600V 600V 4 X IC @25C Figure 18. Clamped Inductive Load Test Circuit Figure 22. Pulsed Collector Current Test Circuit www.irf.com 9 GA150TD120U Notes: Repetitive rating; VGE = 20V, pulse width limited by max. junction temperature. See fig. 17 For screws M5x0.8 Pulse width 80s; single shot. Case Outline -- DOUBLE INT-A-PAK Dimensions are shown in millimeters (inches) WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan 171 Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 3/98 10 www.irf.com |
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