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C02E6.pdf 00.7.18
CHIP MONOLITHIC CERAMIC CAPACITOR
CHIP MONOLITHIC CERAMIC CAPACITOR
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Murata Manufacturing Co., Ltd.
DataShee
Cat.No.C02E-6
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CONTENTS
Part Numbering 1 2 3 4 for Flow/Reflow Soldering GRM Series for Reflow Soldering GRM Series Ultra-small Type GRM33 Series Thin Type for Flow/Reflow GRM Series
GRM Series Specifications and Test Methods
1
2 3 9 12 14 15 20 25 27 33 36 41 44 49 55 61 63 67 76 83 88 91 95 99 101 104 107
2
3
4
5
High-power Type GRM600 Series
5
GRM Series Data 6 7 8 9 10 11 12 Low ESL Wide-width Type LL Series Monolithic Microchip GM Series Capacitor Arrays GNM Series for Ultrasonic Sensors ZLM Type High-frequency for Flow/Reflow Soldering GRQ Series High-Q & High-power GRH/RPN100 Series High-frequency GRH/RPN700 Series
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6
7
8
9
GRH/RPN Series Data Package
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Notice Reference Data 13 14 15 16 for High-voltage Low Dissipation Type GHM1000 Series for High-voltage High-capacitance Type GHM1500 Series for High-voltage GHM2000 Series AC250V r.m.s. for High-voltage GHM3000 Series Safety Recognized
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11
12
13
GHM Series Data Package ! Caution Notice
14
15
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Please refer to "Specifications and Test Methods" at the end of each chapter of
5
-
16
except for GRM series.
16
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Part Numbering
(Please specify the part number when ordering.) (Ex.) GRM40 Type C0G 151 q w J e 50 r Murata's control no. PT t GHM3045 X7R 101 Type q w K - GC e y
qTemperature Characteristic * Temperature compensating type Code Temp. range Temp. coeff. (ppm/ :) * High dielectric constant Code Temp. range Cap. change (%) X7R e55 to 125: f15 X5R e55 to 85: f15 Z5U 10 to 85: d22 e56 Y5V e30 to 85: d22 e82 f10 B e25 to 85: f15 R C0G C0H P2H R2H S2H e55 to 85: e150f60 e220f60 e330f60 e470f60 e750f120 d350 to e1000 T2H U2J SL
e55 to 125: 0f30 0f60
* High-Voltage/AC250V type/Safety std. Recognition Code Temp. range Cap. change SL 20 to 85: d350 to e1000ppm/: R/X7R e55 to 125: f15% B e25 to 85: f10%
* For ultrasonic code Temp.range Temp. coeff. (ppm/:) e25 to 20: e4700
d1000 e2500
ZLM 20 to 85: e4700
d500 e1000
wCapacitance (Ex.) Code Capacitance (pF) 0R5 R75 010 100 101 103 0.5 0.75 1 10 100 10000
eCapacitance Tolerance Type
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Temperature Characteristic C0G to U2J Code C D J K M Z D J X7R, B, R B K M
Capacitance Tolerance 10 pF 10 pF
Capacitance Step
f0.25pF 0.5, 1, 1.5, 2, 3, 4, 5 (pF) f0.5pF f5% 6, 7, 8, 9, 10 (pF) E12 series E6 series E6 series E3 series 10 (pF) E12 series E6 series E3 series
Temperature compensating type
(NP0) (N750) and SL X7R, X5R, B, R
f10% f20% d80, e20% 10 pF 10 pF f0.5pF f5%
High dielectric constant
Z5U Z5U, Y5V SL
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High-Voltage/AC250V type/ Safety Standard Recognition
f10% f20%
rRated Voltage Code 6.3 10 16 25 Rated voltage DC6.3V DC10V DC16V DC25V Code 50 250 630 2K Rated voltage DC50V DC250V DC630V DC2kV Code 3K AC250 Rated voltage DC3.15kV AC250V(r.m.s.)
Not apply to GHM3000 Series [Rated voltage : AC250V (r.m.s.)]
tPacking Code (only for chip type) Code PB PT PC PM Packaging Bulk packaging in a bag Tape carrier packaging Bulk case packaging Bulk packaging in a tray
yType Designation (Apply to GHM3000 Series.) Code -GB -GC Type Designation Type GB Type GC
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CHIP MONOLITHIC CERAMIC CAPACITOR
for Flow/Reflow Soldering GRM Series
e g e
1
s Features
1. Terminations are made of metal highly resistant to migration. 2. The GRM series is a complete line of chip ceramic capacitors in 10V,16V,25V,50V,100V,200V and 500V ratings. These capacitors have temperature characteristics ranging from C0G to Y5V. 3. A wide selection of sizes is available, from the miniature GRM36(LxWxT:1.0x0.5x0.5mm) to GRM42-6 (LxWxT:3.2x1.6x1.25mm). GRM39, 40 and GRM42-6 types are suited to flow and reflow soldering. GRM36 types is applied to only reflow soldering. 4. Stringent dimensional tolerances allow highly reliable, high speed automatic chip placement on PCBs. 5. The GRM series is available in paper or plastic embossed tape and reel packaging for automatic placement. Bulk case packaging is also available for GRM36,GRM39,GRM40(T:0.6,1.25).
L
W
Part Number GRM36 GRM39* GRM40
GRM42-6
Dimensions (mm) L W T e 1.0 0.05 0.5 0.05 0.5 0.05 0.15 to 0.3 1.6 0.1 0.8 0.1 0.8 0.1 0.2 to 0.5 0.6 0.1 2.0 0.1 1.25 0.1 0.85 0.1 0.2 to 0.7 1.25 0.1 0.85 0.1 3.2 0.15 1.6 0.15 1.15 0.1 0.3 to 0.8 3.2 0.2 1.6 0.2 1.6 0.2
g min. 0.4 0.5 0.7
* Bulk Case : 1.6 0.07(L)g0.8 0.07(W)g0.8 0.07(T)
s Application
General electronic equipment.
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Temperature Compensating Type GRM36 Series
Part Number L x W(mm) TC Code GRM36
1.00x0.50 C0G 50
0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50
C0H 25
P2H 50
R2H 50
S2H 50 25
SL 50
T2H 50
U2J 50
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Rated Volt.(Vdc) 0.5pF 0.75pF 1.0pF 2.0pF 3.0pF 4.0pF 5.0pF 6.0pF 7.0pF 8.0pF 9.0pF 10.0pF 12.0pF 15.0pF 18.0pF 22.0pF 27.0pF 33.0pF 39.0pF
T
1.5
Capacitance and T(mm)
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47pF .com 56pF
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Part Number L x W(mm) TC Code Rated Volt.(Vdc) 68pF 82pF 100pF 120pF 150pF 180pF 220pF 270pF 330pF 390pF
GRM36
1.00x0.50 C0G 50
0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50
C0H 25
P2H 50
R2H 50
S2H 50 25
SL 50
0.50 0.50 0.50 0.50 0.50 0.50
T2H 50
0.50 0.50 0.50
U2J 50
0.50 0.50 0.50 0.50 0.50 0.50
Capacitance and T(mm)
Temperature Compensating Type GRM39 Series
Part Number L x W(mm) TC Code Rated Volt.(Vdc) 0.5pF 1.0pF 2.0pF 3.0pF 4.0pF 5.0pF 6.0pF 7.0pF 8.0pF 9.0pF 10.0pF 12pF 15pF 18pF 22pF 27pF 33pF 39pF 47pF 56pF 68pF 82pF 100pF 120pF 150pF 180pF 220pF 270pF 330pF 390pF 470pF 560pF 680pF 820pF .com 1000pF GRM39
1.60x0.80 C0G 50
0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80
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C0H 200 25
P2H 50
R2H 50
S2H 50 25 50
SL 100 200
T2H 50
U2J 50
100
Capacitance and T(mm) 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80
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Part Number L x W(mm) TC Code Rated Volt.(Vdc) 1200pF 1500pF
GRM39
1.60x0.80 C0G 50 100 200 C0H 25 P2H 50 R2H 50 S2H 50 25
0.80 0.80
1
SL 50 100 200 T2H 50 U2J 50
Capacitance and T(mm)
Temperature Compensating Type GRM40 Series
Part Number L x W(mm) TC Code Rated Volt.(Vdc) 12pF 15pF 18pF 22pF 27pF 33pF 39pF 47pF 56pF 68pF 82pF 100pF 120pF 150pF 180pF 220pF 270pF 330pF 390pF 470pF 560pF 680pF 820pF 1000pF 1200pF 1500pF 1800pF 2200pF 2700pF 3300pF 3900pF 4700pF 5600pF 6800pF 0.60 0.85 0.85 0.85 0.85 0.85 1.25 1.25 1.25 1.25 1.25 0.85 0.85 1.25 1.25 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 1.25 1.25 1.25 1.25 1.25 1.25 GRM40
2.00x1.25 C0G 50 100 200
0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 1.25 1.25 1.25 1.25 1.25 1.25 1.25 0.85
C0H 25
P2H 50
R2H 50
S2H 50 25 50
SL 100 200
T2H 50
U2J 50
Capacitance and T(mm)
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0.85 0.85 0.85 0.85 1.25 1.25 1.25 0.85 0.85 0.85 0.85 0.85 1.25 1.25 0.85 0.85 0.85 0.85 1.25 1.25 1.25 0.60 0.60 0.60 0.85 0.85 0.85 1.25 1.25 0.85 0.85 0.85 1.25 1.25 1.25 1.25 1.25
1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 0.60 0.60 0.60 0.85 0.85 0.85 1.25 1.25
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Temperature Compensating Type GRM42-6 Series
Part Number L x W(mm) TC Code Rated Volt.(Vdc) 1.0pF 2.0pF 3.0pF 4.0pF 5.0pF 6.0pF 7.0pF 8.0pF 9.0pF 10.0pF 12pF 15pF 18pF 22pF 27pF 33pF 39pF 47pF 56pF 68pF 82pF 100pF 120pF 150pF 180pF 220pF 270pF 330pF 390pF 470pF 560pF 680pF 820pF 1000pF 1200pF 1500pF 1800pF 2200pF 2700pF 3300pF 3900pF 4700pF 5600pF 6800pF 8200pF 10000pF 12000pF 15000pF 0.85 0.85 1.15 1.15 1.15 0.85 1.15 1.15 1.15 1.15 1.15 0.85 0.85 0.85 1.15 1.15 1.15 1.15 1.15 1.15 0.85 0.85 1.15 1.15 1.15 0.85 1.15 1.15 1.15 0.85 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 0.85 0.85 0.85 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 GRM42-6
3.20x1.60 C0G 50 100 200 500
1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15
C0H 25
P2H 50
R2H 50
S2H 50 25 50
SL 100 200 500
T2H 50
U2J 50
Capacitance and T(mm)
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High Dielectric Constant Type X5R GRM36/40/42-6 Series
TC Code Part Number L x W(mm) Rated Volt.(Vdc) Capacitance and T(mm) 33000pF 47000pF 68000pF 0.1F 0.47F 1.0F 2.20F 3.3F 4.7F 10.0F
4.7F for 6.3V is replaced with GRM40-034 series of L:20.15, W:1.250.15, T:1.250.15. T:1.250.1mm is also available for GRM40 10V 1.0F type. 3.3F for 10V rated is replaced with GRM42-631series of L:3.20.2, W:1.60.2, T:1.3+0/-.3mm. T:1.15mm is also available for GRM42-6 16V 1.0F type. The torelance will be changed to L:3.20.2, W:1.60.2, T:1.150.15 for GRM42-6 16V 2.2F type.
1
GRM42-6
X5R
GRM36 GRM39 GRM40
1.00x0.50 10
0.50 0.50 0.50 0.50
1.60x0.80 6.3 6.3
2.00x1.25 10 6.3
3.20x1.60 10 16
0.80 0.80 1.25 1.30 1.25 1.60 1.60 1.60 0.85 1.15
High Dielectric Constant Type X7R GRM36/39/40/42-6 Series
TC Code Part Number L x W(mm) Rated Volt.(Vdc) 220pF 330pF 470pF 680pF 1000pF 1500pF 2200pF 3300pF 4700pF 6800pF 10000pF 15000pF 22000pF 33000pF 47000pF 68000pF 0.10F 0.15F 0.22F 0.33F 0.47F 0.68F 1.00F 1.5F 2.2F
0.10F, 50V rated are GRM40-034 series of L:20.15, W:1.250.15, T:1.250.15. T:1.250.1mm .com is also available for GRM42-6 1.0F for 16V. The torelance will be changed to L:3.20.2, W:1.60.2, T:1.150.15 for GRM42-6 16V 2.2F type.
X7R
GRM36 GRM39 GRM40 GRM42-6
1.00x0.50 10 16 25 50
0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.80 0.80 0.80
1.60x0.80 10 16 25 50 100 .com
0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80
2.00x1.25 200
0.80 0.80 0.80 0.80 0.80 0.80
3.20x1.60 50 10 16 25 50
16
25
Capacitance and T(mm)
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0.85 1.25 1.25 1.25 0.85 1.25 0.85 0.85 1.25 0.85 1.15 0.85 1.15 1.15 1.25 0.85 1.15 1.25 1.25 1.25 1.15 0.85 1.15
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High Dielectric Constant Type Y5V GRM36/39/40/42-6 Series
TC Code Part Number L x W(mm) Rated Volt.(Vdc) 2200pF 4700pF 10000pF 22000pF 47000pF 0.10F 0.22F 0.47F 1.0F 1.5F 2.2F 4.7F 10.0F
T:1.250.1mm is also available for GRM40 16V 1.0F type.
Y5V
GRM36 GRM39 GRM40 GRM42-6
1.00x0.50 16 25 50
0.50 0.50 0.50 0.50 0.50 0.50 0.80 0.80 0.80 0.80
1.60x0.80 10 16 25 50 100 10
2.00x1.25 16 25 50 6.3
3.20x1.60 10 16 25
Capacitance and T(mm) 0.80 0.80 0.80 0.80 0.80 0.85 1.25 0.85 1.25 1.25 1.15 0.85 1.25 1.25 0.85 1.25 1.25 0.85 1.15 1.15 1.15 1.15 0.85 1.15 0.85 1.25
High Dielectric Constant Type Z5U GRM39/40/42-6 Series
TC Code Part Number L x W(mm) Rated Volt.(Vdc) 2200pF 4700pF 10000pF 22000pF 47000pF 0.10F 0.22F GRM39 GRM40
Z5U
GRM42-6
1.60x0.80 50
0.80 0.80 0.80 0.60 0.60 0.85
2.00x1.25 100
0.80 0.85 1.25
3.20x1.60 200
1.25 1.15 0.85
50
100 .com
50
100
200
Capacitance and T(mm)
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CHIP MONOLITHIC CERAMIC CAPACITOR
for Reflow Soldering GRM Series
2
s Features
1. Terminations are made of metal highly resistant to migration. 2. The GRM series is a complete line of chip ceramic capacitors in 25V,50V,100V,200V and 500V rated. These capacitors have temperature characteristics ranging from C0G to Y5V. 3. This series consists of type GRM42-2(LxWxT:3.2x2.5x 0.85mm) to type GRM44-1(LxWxT:5.7x5.0x2.0mm). These are suited to only reflow soldering. 4. Stringent dimensional tolerances allow highly reliable, high speed automatic chip placements on PCBs. 5. The GRM series is available in plastic embossed tape or paper taping and reel packaging for automatic placement.
e g e
L
W
Part Number
L
GRM42-2
3.2 0.3
GRM43-2 GRM44-1
4.5 0.4 5.7 0.4
Dimensions (mm) T e min. 0.85 0.1 1.15 0.1 2.5 0.2 1.35 0.15 0.3 1.8 0.2 2.5 0.2 3.2 0.3 2.0 max. 0.3 5.0 0.4 2.0 max. 0.3 W
g min.
s Application
General electronic equipment.
Temperature Compensating Type GRM42-2 Series
Part Number L x W(mm) TC Code Rated Volt.(Vdc) 150pF 180pF 330pF 390pF 470pF 560pF 680pF 820pF 1000pF 1500pF 2700pF 3300pF 3900pF 5600pF 6800pF 10000pF 12000pF 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 GRM42-2 .com
3.20x2.50 C0G 50 100 200 500
1.35 1.35 1.15 1.15 1.35
SL 50 100 200 500
Capacitance and T(mm)
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1.0
2.0 2.0
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Temperature Compensating Type GRM43-2 Series
Part Number GRM43-2 L x W(mm) TC Code Rated Volt.(Vdc) 220pF 270pF 330pF 390pF 470pF 560pF 680pF 820pF 1000pF 1200pF 1500pF 1800pF 2200pF 2700pF 3300pF 3900pF 4700pF 5600pF 6800pF 8200pF 10000pF 12000pF 15000pF 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00
2
4.50x3.20 C0G 50 100 200 500
2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00
SL 50 100 200 500
Capacitance and T(mm)
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2.00
2.00 2.00
Temperature Compensating Type GRM44-1 Series
Part Number GRM44-1 L x W(mm) TC Code Rated Volt.(Vdc) Capacitance and T(mm) 560pF 680pF 820pF 1000pF 3300pF 3900pF 4700pF 5600pF 6800pF 8200pF 15000pF 18000pF 22000pF 27000pF 33000pF 39000pF 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00
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High Dielectric Constant Type GRM42-2 Series
Part Number L x W(mm) TC Code Rated Volt.(Vdc) 10000pF 15000pF 22000pF 33000pF 47000pF 68000pF 0.10F 0.33F 0.47F 0.68F 1.00F 2.2F 3.3F 4.7F 10.0F 2.50 1.15 1.35 1.80 1.80 1.15 1.35 1.80 1.8 1.80 1.35 1.35 1.15 1.35 1.35 1.35 1.35 1.35 GRM42-2
3.20x2.50 X5R 10 16 25 X7R 50 100 200 Y5V 50 50 Z5U 100 200
1.15 1.35 1.35
2
Capacitance and T(mm)
High Dielectric Constant Type GRM43-2 Series
Part Number L x W(mm) TC Code Rated Volt.(Vdc) Capacitance and T(mm) 33000pF 47000pF 68000pF 100000pF 0.15F 0.22F 0.33F 0.47F 0.68F 1.0F 2.00 2.00 1.50 1.50 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 GRM43-2
4.50x3.20 X7R 50 100
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Z5U 100 200
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High Dielectric Constant Type GRM44-1 Series
Part Number L x W(mm) TC Code Rated Volt.(Vdc) Capacitance and T(mm) 0.15F 0.22F 0.33F 0.47F 0.68F 1.0F 1.5F .com 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 GRM44-1
5.70x5.00 X7R 50 100 200 50 Z5U 100 200
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C02E6.pdf 00.7.18
CHIP MONOLITHIC CERAMIC CAPACITOR
Ultra-small Type GRM33 Series
s Features
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1. Small chip size (LXWXT : 0.6X0.3X0.3mm ). 2. Terminations are made of metal highly resistant to migration. 3. GRM33 type is suited to only reflow soldering. 4. Stringent dimensional tolerances are allow highly reliable, high speed autom atic chip placements on PCBs. 5. GRM33 series are suited to miniature micro wave module, portable equipment and high-frequency circuit.
L
W
Part Number GRM33
Dimensions (mm) L W T e 0.6 0.03 0.3 0.03 0.3 0.03 0.1 to 0.2
g min. 0.2
s Application
*Miniature micro wave module. *Portable equipment. *High-frequency circuit.
Part Number L x W(mm) TC Code Rated Volt.(Vdc) Capacitance and T(mm) 0.5pF 1pF 2pF 3pF 4pF 5pF 6pF 7pF 8pF 9pF 10pF 12pF 15pF 18pF 22pF 27pF 33pF 39pF 47pF 56pF 68pF 82pF 100pF 150pF 220pF 330pF 470pF 680pF 1000pF .com 2200pF 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3
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GRM33
0.6x0.3 C0G 25 X7R 16 Y5V 10
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C02E6.pdf 00.7.18
Part Number L x W(mm) TC Code Rated Volt.(Vdc) Capacitance and T(mm) 4700pF 10000pF
GRM33
0.6x0.3 C0G 25 X7R 16 Y5V 10
0.3 0.3
3
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This is the PDF file of catalog No.C02E-6
C02E6.pdf 00.7.18
CHIP MONOLITHIC CERAMIC CAPACITOR
Thin Type for Flow/Reflow GRM Series
s Features
1. This series is suited to flow and reflow soldering. Capacitor terminations are made of metal highly resistant to migration. 2. Large capacitance values enable excellent bypass effects to be realized. 3. Its thin package makes this series ideally suited for the production of small electronic products and for mounting underneath ICs.
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L
W
Part Number
Dimensions (mm) L W T e GRM36-019 1.0 0.05 0.5 0.05 0.25 0.05 0.15 to 0.3
g min. 0.4
s Application
Thin equipment such as IC cards.
Part Number L x W(mm) TC Code Rated Volt.(Vdc) Capacitance and T(mm) 1pF 2pF 3pF 4pF 5pF 6pF 7pF 8pF 9pF 10pF 12pF 15pF 18pF 22pF 27pF 33pF 39pF 47pF 56pF 68pF 82pF 100pF 120pF 150pF 180pF 220pF 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 GRM36-019
1.00x0.50 C0G 25 50
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0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25
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C02E6.pdf 00.7.18
Specifications and Test Methods
Specification No. Item Temperature Compensating Type
GRM Series Specifications and Test Methods
Test Method High Dielectric Type X5R : Y55 to W85D X7R : Y55 to W125D Z5U : W10 to W85D Y5V : Y30 to W85D The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, shall be maintained within the rated voltage range. Visual inspection. Using calipers on micrometer. No failure shall be observed when *300% of the rated voltage (C0 to U2J and SL) or *250% of the rated voltage (X5R, X7R, Z5U and Y5V) is applied between the terminations for 1 to 5 seconds, provided the charge/discharge current is less than 50mA. *200% for 500V The insulation resistance shall be measured with a DC voltage not exceeding the rated voltage at 25D and 75%RH max. and within 2 minutes of charging. The capacitance/Q/D.F. shall be measured at 25D at the frequency and voltage shown in the table. Char. Item C0 toU2J,SL (1000pF and below) C0 toU2J,SL (more than 1000pF) X5R,X7R,Y5V (10F and below) X5R,X7R,Y5V (more than 10F) Z5U Frequency 1T0.1MHz Voltage 0.5 to 5Vrms
1
Operating Temperature
Y55 to W125D
2
Rated Voltage
See the previous page.
3 4
Appearance Dimensions
No defects or abnormalities. Within the specified dimensions.
5
Dielectric Strength
No defects or abnormalities.
6 7
Insulation Resistance Capacitance
More than 10,000M or 500 * F (Whichever is smaller) Within the specified tolerance. [X5R,X7R] W.V. : 25Vmin. : 0.025max. W.V. : 16/10V : 0.035max. W.V. : 6.3V 0.05max.(CF3.3F) 0.1max.(CU3.3F)
8
Q/ Dissipation Factor (D.F.)
30pFmin. : Q U1000 30pFmax. : Q U400+20C C : Nominal Capacitance (pF)
[Z5U] W.V. : 25Vmin. : 0.025max. [Y5V] .com W.V. : 25Vmin. : 0.05max.(CF10F) : 0.09max.(CU1.0F) W.V. : 16V : 0.07max.(CF1.0F) : 0.09max.(CU1.0F) W.V. : 10Vmax. : 0.125max. X5R : WithinT15% (Y55 to W85D) X7R : Within15% (Y55 to W125D) Z5U : Within W22/Y56% (W10 to W85D) Y5V : Within W22/Y82% (Y30 to W85D)
1T0.1kHz
1T0.2Vrms
1T0.1kHz
1T0.2Vrms
120T24Hz 1T0.1kHz
0.5T0.1Vrms 0.5T0.05Vrms
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Capacitance Change Within the specified tolerance. (Table A)
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Capacitance Temperature Characteristics
The capacitance change shall be measured after 5 Min. at each specified temperature stage. (1) Temperature Compensating Type The temperature coefficient is determined using the Capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5 (C0 : W25D to W125D : other temp. coeffs. : W25D to W85D) the capacitance shall be within the specified tolerance for the temperature coefficient and capacitance change as Table A. The capacitance drift is caluculated by dividing the differences between the maximum and minimum measured values in the step 1,3 and 5 by the cap value in step 3. Step 1 2 3 4 Temperature(D) 25T2 Y55T3 (for C to U2J/SL/X5R/X7R) Y30T3 (for Y5V) 10T3 (for Z5U) 25T2 125T3 (for C/X7R) 85T3 (for other TC) 25T2
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Temperature Coefficient
Within the specified tolerance. (Table A)
Capacitance Drift
Within T0.2% or T0.05pF (Whichever is larger.) *Not apply to SL/25V
5
(2) High Dielectric Constant Type The ranges of capacitance change compared with the above 25D value over the temperature ranges shown in the table shall be within the specified ranges.
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GRM Series Specifications and Test Methods
Continued from the preceding page.
Specifications and Test Methods
Specification No. Item Temperature Compensating Type Test Method High Dielectric Type Solder the capacitor to the test jig (glass epoxy board) shown in Fig.1 using a eutectic solder. Then apply 10N* force in parallel with the test jig for 10T1sec. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and gree of defects such as heat shock. *2N (GRM33) 5N (GRM36,GRM39)
c
b
10
Adhesive Strength of Termination
No removal of the terminations or other defect shall occur. Type GRM33 GRM36 GRM39 GRM40 GRM42-6 GRM42-2 GRM43-2 GRM44-1 a 0.3 0.4 1.0 1.2 2.2 2.2 3.5 4.5 Fig.1 b 0.9 1.5 3.0 4.0 5.0 5.0 7.0 8.0
a Solder resist Baked electrode or copper foil
c 0.3 0.5 1.2 1.65 2.0 2.9 3.7 5.6 (in mm)
Appearance Capacitance
No defects or abnormalities. Within the specified tolerance. [X5R,X7R] W.V. : 25Vmin. : 0.025max. W.V. : 16/10V : 0.035max. .com W.V. : 6.3V : 0.05max. (CF3.3F) 0.1max. (C U3.3F)
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Vibration Resistance Q/D.F.
30pFmin. : QU1000 30pFmax. : QU400W20C C : Nominal Capacitance (pF)
[Z5U] W.V. : 25Vmin. : 0.025max. [Y5V] W.V. : 25Vmin. : 0.05max. (CF1.0F) : 0.09max. (C U1.0F) W.V. : 16V : 0.07max. (CF1.0F) : 0.09max. (CU1.0F) W.V. : 10Vmax.:0.125max.
Solder the capacitor to the test jig (glass epoxy board) in the same manner and under the same conditions as (10). The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours).
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No crack or marked defect shall occur.
Solder the capacitor on the test jig (glass epoxy board) shown in Fig.2 using a eutectic solder. Then apply a force in the direction shown in Fig. 3. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
4.5
TR S RT QS Q ,, T S
c 40 a
b
20
50 Pressurizing speed : 1.0mm/sec. Pressurize
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Deflection
100
R230
t : 1.6mm (GRM33/36 : 0.8mm)
Type GRM33 GRM36 GRM39 GRM40 GRM42-6 GRM42-2 GRM43-2 GRM44-1
a 0.3 0.4 1.0 1.2 2.2 2.2 3.5 4.5
b 0.9 1.5 3.0 4.0 5.0 5.0 7.0 8.0
c 0.3 0.5 1.2 1.65 2.0 2.9 3.7 5.6
Flexure : V1 Capacitance meter 45 45
Fig.3
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(in mm)
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Specifications and Test Methods
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GRM Series Specifications and Test Methods
Specification No. Item Temperature Compensating Type Test Method High Dielectric Type Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight propotion). Preheat at 80 to 120D for 10 to 30 seconds. After preheating, immerse in eutectic solder solution for 2T0.5 seconds at 230T5D.
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Solderability of Termination
75% of the terminations is to be soldered evenly and continuously.
The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Capacitance Change No marking defects. Within T2.5% or T0.25pF (Whichever is larger) X5R,X7R : Within T7.5% Z5U,Y5V : Within T20% [X5R,X7R] W.V. : 25Vmin. : 0.025max. W.V. : 16/10V : 0.035max. W.V. : 6.3V : 0.05max. (CF3.3F) 0.1max. (C U3.3F) [Z5U] W.V. : 25Vmin. : 0.025max. [Y5V] W.V. : 25Vmin. : 0.05max. (CF1.0F) : 0.09max. (C U1.0F) W.V.:16V : 0.07max. (CF1.0F) : 0.09max. (C U1.0F) W.V. : 10Vmax. : 0.125max.
Preheat the capacitor at 120 to 150D for 1 minute. Immerse the capacitor in a eutectic solder solution at 270T5D for 10T0.5 seconds. Let sit at room temperature for 24T2 hours (temperature compensating type) or 48T4 hours (high dielectric constant type), then measure. #Initial measurement for high dielectric constant type W0 Perform a heat treatment at 150 Y10D for one hour and then let sit for 48T4 hours at room temperature. Perform the initial measurement. *Preheating for GRM42-2/43-2/44-1 Step 1 2 Temperature 100D to 120D 170D to 200D Time 1 min. 1 min.
Resistance to 14 Soldering Q/D.F. Heat
30pFmin. : Q U1000 30pFmax. : Q U400W20C C : Nominal Capacitance (pF)
I.R. Dielectric Strength
More than 10,000M or 500 * F (Whichever is smaller) No failure The measured and observed characteristics shall safisfy the specifications in the following table.
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Appearance Capacitance Change
No marking defects. Within T2.5% or T0.25pF (Whichever is larger) X5R,X7R : Within T7.5% Z5U,Y5V : Within T20% [X5R,X7R] W.V. : 25Vmin. : 0.025max. W.V. : 16/10V : 0.035max. W.V. : 6.3V 0.05max. (CF3.3F) 0.1max. (C U3.3F)
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15 Temperature Cycle Q/D.F. 30pFmin. : Q U1000 30pFmax. : Q U400W20C C : Nominal Capacitance (pF)
Fix the capacitor to the supporting jig in the same manner and under the same conditions as (10). Perform the five cycles according to the four heat treatments listed in the following table. Let sit for 24T2 hours (temperature compensating type) or 48T4 hour (high dielectric constant type) at room temperature, then measure. Step Temp.(D) Time(min.) 1 2 3 4 Max. Min. Room Room Operating Operating Temp. Temp. Temp.W3/Y0 Temp.W0/Y3 30T3 2 to 3 30T3 2 to 3
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[Z5U] W.V. : 2.5Vmin. : 0.025max. [Y5V] W.V. : 25Vmin. : 0.05max. (CF1.0F) : 0.09max. (C U1.0F) W.V. : 16V : 0.07max. (CF1.0F) : 0.09max. (C U1.0F) W.V. : 10Vmax. : 0.125max.
#Initial measurement for high dielectric constant type W0 Perform a heat treatment at 150 Y10D for one hour and then let sit for 48T4 hours at room temperature. Perform the initial measurement.
I.R. Dielectric Strength
More than 10,000M or 500 * F (Whichever is smaller) No failure
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GRM Series Specifications and Test Methods
Continued from the preceding page.
Specifications and Test Methods
Specification No. Item Temperature Compensating Type Test Method High Dielectric Type
The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Capacitance Change No marking defects. Within T5% or T0.5pF (Whichever is larger) X5R,X7R : Within T12.5% Z5U,Y5V : Within T30% [X5R,X7R] W.V. : 25Vmin. : 0.05max. W.V. : 16/10V : 0.05max. W.V. : 6.3V 0.075max. (CF3.3F) 0.125max. (CU3.3F) [Z5U] W.V. : 25Vmin. : 0.05max. [Y5V] W.V. : 25Vmin. : 0.075max. (CF1.0F) : 0.0125max.(CU1.0F) W.V. : 16V : 0.1max. (CF1.0F) : 0.125max. (CU1.0F) W.V. : 10Vmax. : 0.15max.
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Humidity Steady State
Q/D.F.
30pF and over : QU350 10pF and over 30pF and below : QU275W5C/2 10pF and below : QU200W10C C : Nominal Capacitance (pF)
Sit the capacitor at 40T2D and 90 to 95% humiduty for 500T12 hours. Remove and let sit for 24T2 hours (temperature compensating type) or 48T4 hours (high dielectric constant type) at room temperature, then measure.
I.R. Dielectric Strength
More than 1,000M or 50 * F(Whichever is smaller) No failure The measured and observed characteristics shall satisfy the specifications in the following table.
Appearance
No marking defects. X5R,X7R : Within T12.5% Z5U : .com Within T30% Y5V : Within T30% [W.V. : 10Vmax.] Y5V : Within W30/Y40% [X5R,X7R] W.V. : 25Vmin. : 0.05max. W.V. : 16/10V : 0.05max. W.V. : 6.3V 0.075max. (CF3.3F) 0.125max. (CU3.3F) 30pF and over : QU200 30pF and below : QU100T10C/3 C : Nominal Capacitance (pF) [Z5U] W.V. : 25Vmin. : 0.05max. [Y5V] W.V. : 25Vmin. : 0.075max. (CF1.0F) : 0.0125max. (CU1.0F) W.V. : 16V : 0.1max. (CF1.0F) : 0.125max. (CU1.0F) W.V. : 10Vmax. : 0.15max. Apply the rated voltage at 40T2D and 90 to 95% humidity for 500T12 hours. Remove and let sit for 24T2 hours (temperature compensating type) or 48T4 hours (high dielectric constant type) at room temperature, then muasure.The charge/discharge current is less than 50mA. #Initial measurement for Y5V/10Vmax. Apply the rated DC voltage for 1 hour at 40T2D. Remove and let sit for 48T4 hours at room temperature. Perform initial measurement.
Capacitance Change
Within T7.5% or T0.75pF (Whichever is larger)
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Humidity Load Q/D.F.
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I.R. Dielectric Strength
More than 500M or 25 * F(Whichever is smaller) No failure
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Specifications and Test Methods
Continued from the preceding page.
GRM Series Specifications and Test Methods
Specification No. Item Temperature Compensating Type Test Method High Dielectric Type
The measured and observed characteristics shall satisfy the specifications in the following table. Appearance No marking defects. X5R,X7R : Within T12.5% Z5U : Within T30% Y5V : Within T30% (CapF1.0F) Y5V : Within W30/Y40%(CapU1.0F) [X5R,X7R] W.V. : 25Vmin. : 0.05max. W.V. : 16/10V : 0.05max. W.V. : 6.3V 0.075max. (CF3.3F) 0.125max. (CU3.3F) [Z5U] W.V. : 25Vmin. : 0.05max [Y5V] W.V. : 25Vmin. : 0.075max. (CF1.0F) : 0.0125max.(CU1.0F) W.V. : 16V : 0.1max. (CF1.0F) : 0.125max. (CU1.0F) W.V. : 10Vmax. : 0.15max.
Capacitance Change
Within T3% or T0.3pF (Whichever is larger)
18
High Temperature Load Q/D.F.
30pF and over : QU350 10pF and over 30pF and below : QU275T5C/2 10pF and below : QU200T10C C : Nominal Capacitance (pF)
Apply 200% of the rated voltage for 1000T12 hours at the maximun operating temperature T3D. Let sit for 24T2 hours (temperature compensating type) or 48T4 hours (high dielectric constant type) at room temperature, then measure. The charge/discharge current is less than 50mA. #Initial measurement for high dielectric constant type. Apply 200% of the rated DC voltage for one hour at the maximun operating temperature T3D. Remove and let sit for 48T4 hours at room temperature. Perform initial measurement. *150% for 500V and CU10F
I.R. Dielectric Strength 19 Notice
More than 1,000M or 50 #F(Whichever is smaller) No failure When mounting capacitor of 500V rated voltage, perform the epoxy resin coating(min.1.0mm thickness)
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Table A
Capacitance Change from 25D (%) Char. Nominal Values (ppm/D)* Y55 Y30 Max. 0.25 0.38 1.02 1.32 1.79 2.39 3.84 Y Y10 Min. Y0.11 Y0.21 0.32 0.56 0.95 1.44 2.21 Y Max. Min. Max. Min. Y0.24 Y0.17 0.58 0.40 Y000T030 C0G Y0.48 Y0.33 0.87 0.59 Y000T060 C0H 0.72 0.50 2.33 1.61 Y150T060 P2H 1.28 0.88 3.02 2.08 Y220T060 R2H 2.16 1.49 4.09 2.81 Y330T060 S2H 3.28 2.26 5.46 3.75 Y470T060 T2H 5.04 3.47 8.78 6.04 Y750T120 U2J Y Y Y Y W350 to Y1000 SL *Nominal values denote the temperature coefficient within a range of 25D to 125D (for Co)/85D (for other TC).
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CHIP MONOLITHIC CERAMIC CAPACITOR
High-power Type GRM600 Series
s Features
1. Mobile Telecommunication and RF module, mainly. 2. Quality improvement of telephone call, Low power Consumption, yield ratio improvement.
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VCO, PA, Mobile Telecommunication
Part Number GRM615
L
W
5
Rated Voltage (Vdc) 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50
Dimensions (mm) L W T e 1.0 0.05 0.5 0.05 0.5 0.05 0.15 to 0.3
g min. 0.4
Part Number GRM615C0G010B50 GRM615C0G010C50 GRM615C0G020B50 GRM615C0G020C50 GRM615C0G030B50 GRM615C0G030C50 GRM615C0G040B50 GRM615C0G040C50 GRM615C0G050B50 GRM615C0G050C50 GRM615C0G060C50 GRM615C0G060D50 GRM615C0G070C50 GRM615C0G070D50 GRM615C0G080C50 GRM615C0G080D50 GRM615C0G090C50 GRM615C0G090D50 GRM615C0G0R5B50 GRM615C0G0R5C50 GRM615C0G100C50 GRM615C0G100D50 GRM615C0G110G50 GRM615C0G120G50 GRM615C0G120J50 GRM615C0G130G50 GRM615C0G150G50 GRM615C0G150J50 GRM615C0G160G50 GRM615C0G180G50 GRM615C0G180J50 GRM615C0G1R1B50 GRM615C0G1R2B50 GRM615C0G1R3B50 GRM615C0G1R5B50 GRM615C0G1R5C50 GRM615C0G1R6B50 .com GRM615C0G1R8B50
TC Code C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G
Capacitance (pF) 1.0 -0.1pF 1.0 -0.25pF 2.0 -0.1pF 2.0 -0.25pF 3.0 -0.1pF 3.0 -0.25pF 4.0 -0.1pF 4.0 -0.25pF 5.0 -0.1pF .com 5.0 -0.25pF 6.0 -0.25pF 6.0 -0.5pF 7.0 -0.25pF 7.0 -0.5pF 8.0 -0.25pF 8.0 -0.5pF 9.0 -0.25pF 9.0 -0.5pF 0.5 -0.1pF 0.50 -0.25pF 10 -0.25pF 10.0 -0.5pF 11 -2% 12 -2% 12 -5% 13 -2% 15 -2% 15 -5% 16 -2% 18 -2% 18 -5% 1.1 -0.1pF 1.2 -0.1pF 1.3 -0.1pF 1.5 -0.1pF 1.5 -0.25pF 1.6 -0.1pF 1.8 -0.1pF
Length L (mm) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00
Width W (mm) 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50
Thickness T (mm) 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50
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C02E6.pdf 00.7.18
Part Number GRM615C0G200G50 GRM615C0G2R2B50 GRM615C0G2R4B50 GRM615C0G2R7B50 GRM615C0G3R3B50 GRM615C0G3R6B50 GRM615C0G3R9B50 GRM615C0G4R3B50 GRM615C0G4R7B50 GRM615C0G5R1C50 GRM615C0G5R6C50 GRM615C0G6R2C50 GRM615C0G6R8C50 GRM615C0G7R5C50 GRM615C0G8R2C50 GRM615C0G9R1C50
Rated Voltage (Vdc) 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50
TC Code C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G
Capacitance (pF) 20 -2% 2.2 -0.1pF 2.4 -0.1pF 2.7 -0.1pF 3.3 -0.1pF 3.6 -0.1pF 3.9 -0.1pF 4.3 -0.1pF 4.7 -0.1pF 5.1 -0.25pF 5.6 -0.25pF 6.2 -0.25pF 6.8 -0.25pF 7.5 -0.25pF 8.2 -0.25pF 9.1 -0.25pF
Length L (mm) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00
Width W (mm) 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50
Thickness T (mm) 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50
5
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C02E6.pdf 00.7.18
Specifications and Test Methods Specifications and Test Methods
Specification No. Item Temperature Compensating Type 1 Operating Temperature Range Y55 to W125D The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, shall be maintained within the rated voltage range. Visual inspection. Using calipers. No failure shall be observed when 300% of the rated voltage is applied between the terminations for 1 to 5 seconds, provided the charge/discharge current is less than 50mA. The insulation resistance shall be measured with a DC voltage not exceeding the rated voltage at 25D and 75%RH max. and within 2 minutes of charging. The capacitance/Q shall be measured at 25D at the frequency and voltage shown in the table. Char. C0G(1000pF and below) Item Frequency 1T0.1MHz
Voltage
Test Method
2
Rated Voltage
See the previous pages.
3 4 5
Appearance Dimensions Dielectric Strength
No defects or abnormalities. Within the specified dimensions. No defects or abnormalities.
5
6 7 Insulation Resistance 10,000M min. or 500 * F min. (Whichever is smaller) (I.R.) Capacitance Within the specified tolerance. 30pF min. : QU1,000 30pF max. : QU400W20C C : Nominal Capacitance (pF) Capacitance Change Temperature Coefficent Within the specified tolerance. (Table A-1) Within the specified tolerance. (Table A-1)
8
Q
0.5 to 5Vr.m.s.
9
Capacitance Temperature Characteristics Capacitance Drift Within T0.2% or T0.05pF (Whichever is larger.)
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The capacitance change shall be measured after 5 min. at each specified temperature stage. Temperature Compensating Type The temperature coefficient is determined using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5, (C0G : W25D toW125D : other temp. coeffs. : W25D to 85D) the capacitance shall be within the specified tolerance for the temperature coefficient and capacitance change as Table A. The capacitance drift is calculated by dividing the differences between the maximum and minimum measured values in the step 1, 3 and 5 by the cap value in step 3. Step 1 2 3 4 Temperature(D) 25T2 Y55T3 25T2 125T3 25T2
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Solder the capacitor to the test jig (glass epoxy board) shown in Fig.1 using a eutectic solder. Then apply a 5N force in parallel with the test jig for 10T1sec. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
c
10
Adhesive Strength of Termination
No removal of the terminations or other defect shall occur.
b
a Solder resist Baked electrode or copper foil
Type GRM615
a 0.4 Fig.1
b 1.5
c 0.5 (in mm)
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
Specification No. Item Temperature Compensating Type Appearance Capacitance 11 Vibration Resistance Q No defects or abnormalities. Within the specified tolerance. Solder the capacitor to the test jig (glass epoxy board) in the same manner and under the same conditions as (10). The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). Solder the capacitor to the test jig (glass epoxy boards) shown in Fig.2 using a eutectic solder. Then apply a force in the direction shown in Fig.3. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock..
20 50 Pressurizing speed : 1.0mm/sec. Pressurize
Test Method
30pF min. : QU1,000 30pF max. : QU400W20C C : Nominal Capacitance (pF)
No cracking or marking defects shall occur.
5
12
TR S RT QS Q ,, T S
Deflection
c 40 a 100 t : 0.8mm
b
4.5
R230
Type GRM615
a 0.4
b 1.5
c 0.5
Flexure : V1 Capacitance meter 45 45
(in mm)
Fig.2
(in mm)
Fig.3 Solderability of Termination Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at 80 to 120D for 10 to 30 seconds. After preheating, immerse in eutectic solder solution for 2T0.5 seconds at 230T5D.
13
75% of the terminations is to be soldered evenly and continuously.
The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Capacitance Change Q I.R. Dielectric Strength No marking defects. Within T2.5% or T0.25pF (Whichever is larger) 30pF and over : QU1,000 30pF and below : QU400W20C C : Nominal Capacitance (pF) More than 10,000M or 500 * F (Whichever is smaller) No failure The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Capacitance Change 15 Temperature Cycle Q I.R. Dielectric Strength No marking defects. Within T2.5% or T0.25pF (Whichever is larger) 30pF and over : QU1,000 30pF and below : QU400W20C C : Nominal Capacitance (pF) More than 10,000M or 500 * F (Whichever is smaller) No failure The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Humidity, Steady State Capacitance Change No marking defects. Within T5% or T0.5pF (Whichever is larger) 30pF and over. : QU350 10pF and over, 30pF and below : QU275W 10pF and below : QU200W10C C : Nominal Capacitance (pF)
5 2
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Resistance 14 to Soldering Heat
Preheat the capacitor at 120 to 150D for 1 minute. Immerse the capacitor in a eutectic solder solution at 270T5D for 10T0.5 seconds. Let sit at room temperature for 24T2 hours.
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Fix the capacitor to the supporting jig in the same manner and under the same conditions as (10). Perform the five cycles according to the four heat treatments listed in the following table. Let sit for 24T2 hours at room temperature, then measure. Step Temp.(D) Time(min.) 1 2 3 4 Min. Operating Room Max. Operating Room W0 W3 Temp. Y3 Temp. Y0 Temp. Temp. 30T3 2 to 3 30T3 2 to 3
16
Q
C
Sit the capacitor at 40T2D and 90 to 95% humidity for 500T12 hours. Remove and let sit for 24T2 hours (temperature compensating type) at room temperature, then measure.
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I.R.
More than 10,000M or 500 * F (Whichever is smaller)
Continued on the following page.
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
Specification No. Item Temperature Compensating Type The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Capacitance Change 17 Humidity Load Q I.R. Dielectric Strength No marking defects. Within T7.5% or T0.75pF (Whichever is larger) 30pF and over : QU200 30pF and below : QU100W 10 C 3 C : Nominal Capacitance (pF) More than 500M or 25 * F (Whichever is smaller) No failure The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Capacitance Change 18 High Temperature Load No marking defects. Within T3% or T0.3pF (Whichever is larger) 30pF and over. : QU350 10pF and over, 30pF and below : QU275W 10pF and below : QU200W10C C : Nominal Capacitance (pF)
5 2
Test Method
Apply the rated voltage at 40T2D and 90 to 95% humidity for 500T12 hours. Remove and let sit for 24T2 hours at room temperature, then measure. The charge/discharge current is less than 50mA.
5
Q
C
Apply 200% of the rated voltage for 1000T12 hours at the maximum operating temperature T3D. Let sit for 24T2 hours (temperature compensating type) at room temperature, then measure. The charge/discharge current is less than 50mA.
I.R. Dielectric Strength
More than 1,000M or 50 * F (Whichever is smaller) No failure 0.5pFVCV1pF : 350M . pF below 1pFFCV5pF : 300M below 5pFFCV10pF : 250M below 10pFFCV20pF : 400M below The ESR shall be measured at room Temp. and frequency 1T0.2GHz with the equivalent of BOONTON Model 34A.
19
ESR
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The ESR shall be measured at room Temp. and frequency 500T50MHz with the equivalent of HP8753B.
Table A
Capacitance Change from 25D Value (%) Char. Temp. Coeff. (ppm/D) Note 1 Y55D Y30D Min. Y0.17 Max. 0.25 Y10D Min. Y0.11 Max. Max. Min. 0T30 Y0.24 0.58 0.40 C0G t4U.com Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.(for C0)
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GRM Series Data
s Capacitance-Temperature Characterstics
Measuring condition : 1MHz, 1Vrms 10 +40 5 Capacitance Change [%] +20 C0G 50V 0 -20 -40 -60 -80 -10 -60 -40 -20 -100 0 Y5V 50V 10 20 30 DC Voltage [VDC] 40 50 X7R 50V Z5U 50V
s Capcitance-DC Voltage Characteristics
Measuring condition Z5U X7R, Y5V C0G : 1kHz, 0.5Vrms : 1kHz, 1Vrms : 1MHz, 1Vrms
Capacitance Change [%]
0
C0G P2H R2H S2H T2H U2J
-5
0
20 40 Temperature [C]
60
80
100
120
s Capcitance-AC Voltage Characteristics
Measuring condition C0G X7R, Z5U, Y5V : 1MHz : 1kHz
s Capacitance Change-Aging
10 +80 Capacitance Change [%] +60 +40 Z5U 50V +20 0 C0G 50V -20 0 1 AC Voltage [Vrms] 2 3 Y5V 50V X7R 50V 0 -10 -20 -30 -40 0 C0G X7R
Capacitance Change [%]
Y5V, Z5U
50
100
1000 Time [Hr]
10000
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s Impedance-Frequency Characteristics
COG (GRM40) 100
s Allowable Voltage-Frequency
[T=20C] 100
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10
1 [pF]
DataShee
1pF
-6 42 M0 GR M4 GR 39 M GR
-2 43 M2 GR 42M6 GR 42M 40 GR RM G
-6 42 M0 GR M4 GR 39 M GR
100 [pF]
pF 10
Allowable Voltage [Vrms] 10
4-1 M4 GR
Impedance []
1000 [pF]
100 pF
100 0pF
1
F 0.01
1
100m
10m 1M
10M
100M Frequency [Hz]
1G
100m 10M
100M Frequency [Hz]
1G
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GRM Series Data
Continued from the preceding page.
s Allowable Current-Frequency
10 [T=20C]
s Allowable Appearant Power
100
4 M4 GR
[T=20C]
G
2 3M4 GR -2 4 2 -6 RM 42 40 RM RM G
G
GRM44 -1
0.01 F GRM 4 GRM 2-2 42-6 GRM 40
0 M4 GR M39 GR
GR
M4 3-2
GR
2-6 M4 GR M40 9 GR M3 GR
-1
pF 00 10
GR
G
Allowable Apparent Power [VA]
1000pF 1 Allowable Current [Arms]
GRM 40 GRM 39
2-6 M4
M4 2-6
-6 42 0 RM M 4 R G
10 0p
0.01
100pF
10
pF 10
F
GR M3 9
F
10pF
1pF
100m
1pF
1
10m 10M
100M Frequency [Hz]
1G
100m 10M
100M Frequency [Hz]
1G
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CHIP MONOLITHIC CERAMIC CAPACITOR
Low ESL Wide-width Type LL Series
L W T
s Features
1. Low ESL, good for noise reduction for high frequency. 2. Small, high cap.
s Application
* High speed micro processor. * High frequency digital equipment
Part Number LL0306 LL0508 LL0612 L 0.8 0.1 1.25 0.1 1.6 0.15 Dimensions (mm) W 1.6 0.1 2.0 0.1 3.2 0.15 T 0.6 max. 0.6 0.1 0.85 0.1 0.7 0.1 1.15 0.1
LL0306 Series
Part Number L x W(mm) TC Code Rated Volt.(Vdc) 2200pF 2700pF 3300pF 3900pF 4700pF 5600pF 6800pF 8200pF 10000pF 12000pF 15000pF 18000pF 22000pF 27000pF 33000pF 39000pF 47000pF 56000pF 68000pF 82000pF 0.1F 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 LL0306
6
0.8x1.6 X7R 10 16 25 50
0.6 0.6 0.6 0.6 .com 0.6 0.6
Y5V 16 50 25
Z5U 50
Capacitance and T(mm)
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LL0508 Series
Part Number L x W(mm) TC Code Rated Volt.(Vdc) 0.15pF 0.22pF .com 4700pF 0.6 0.6
Continued on the following page.
LL0508
1.25x2.0 X7R 10 16 25 50 16 Y5V 25 50 25
0.85
Z5U 50
Capacitance and T(mm)
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C02E6.pdf 00.7.18
Part Number L x W(mm) TC Code Rated Volt.(Vdc) 5600pF 6800pF 8200pF 10000pF 12000pF 15000pF 18000pF 22000pF 27000pF 33000pF 39000pF 47000pF 56000pF 68000pF 82000pF 0.1F 0.12F 0.15F 0.18F 0.22F 0.27F 0.33F 0.39F 0.47F 0.56F 0.6 0.6 0.85 0.85 0.85 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.85 0.85 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6
LL0508
1.25x2.0 X7R 10 16 25 50
0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.85 0.85 0.85 0.6 0.6 0.6 0.6 0.6 0.85 0.85 0.85 0.6 0.85 0.85 0.85 0.85 0.6
Y5V 16 25 50 25
Z5U 50
Capacitance and T(mm)
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LL0612 Series
Part Number L x W(mm) TC Code Rated Volt.(Vdc) 10000pF 12000pF 15000pF 18000pF 22000pF 27000pF 33000pF 39000pF 47000pF 56000pF 68000pF 82000pF 0.1F 0.12F 0.15F 0.18F 0.22F 0.27F 0.33F .com 0.39F 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7
Continued on the following page.
LL0612
1.6x3.2 X7R 10 16 25 50
0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 1.15 1.15 1.15 1.15 1.15 0.7 0.7 1.15 1.15 1.15 1.15 0.7 1.15 0.7
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Z5U 50
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Capacitance and T(mm)
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Part Number L x W(mm) TC Code Rated Volt.(Vdc) 0.47F 0.56F 0.68F 0.82F 1000000pF 1.2F 1.5F 1.8F 2.2F 0.7 0.7 0.7 0.7 1.15 1.15 1.15 1.15
LL0612
1.6x3.2 X7R 10 16
0.7 1.15 1.15 1.15 1.15 1.15 0.7
Y5V 25
1.15
Z5U 50 25
1.15
50
16
0.7
25
1.15
50
Capacitance and T(mm)
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Specifications and Test Methods Specifications and Test Methods
No. Item Operating Temperature Range X7R : Y55D to W125D Z5U : W10D to W85D Y5V : Y30D to W85D The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, shall be maintained within the rated voltage range. Visual inspection. Using calipers. No failure shall be observed when 250% of the rated voltage is applied between the terminations for 1 to 5 seconds, provided the charge/discharge current is less than 50mA. The insulation resistance shall be measured with a DC voltage not exceeding the rated voltage at 25D and 75%RH max. and within 2 minutes of charging. The capacitance/D.F. shall be measured at 25D at the frequency and voltage shown in the table. X7R . Y5V Z5U Frequency 1T0.1kHz 0.1T0.1kHzii Voltage 1T0.2Vr.m.s. 0.5T0.05Vr.m.s. The ranges of capacitance change compared with the 25D value over the temperature ranges shown in the table shall be within the specified ranges. The capacitance change shall be measured after 5 min. at each specified temperature stage. Solder the capacitor to the test jig (glass epoxy board) shown in Fig.1 using a eutectic solder. Then apply 10N* force in the direction of the arrow. *5N:LL0306 The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
c
Specification
Test Method
1
2
Rated Voltage
See the previous pages.
3 4 5
Appearance Dimensions Dielectric Strength
No defects or abnormalities. Within the specified dimension. No defects or abnormalities.
6 7
Insulation Resistance More than 10,000M or 500 * F (Whichever is smaller) (I.R.) Capacitance Within the specified tolerance. Char. X7R Z5U Y5V 25V min. 0.025 max. 0.025 max. 0.05 max. 16V 0.035 max. 0.07 max. (CF1.0F) 0.09 max. (CU1.0F) Cap. Change. WithinT15% WithinW22%/Y56% WithinW22%/Y82%
6
8 Dissipation Factor (D.F.)
9
Capacitance Temperature Characteristics
Char. Temp. Range (D) Reference Temp. Y55 to W125 X7R W10 to W85 25D Z5U Y30 to W85 Y5V
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Adhesive Strength of Termination
b
No removal of the terminations or other defect shall occur.
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Type LL0306 LL0508 LL0612 a 0.3 0.6 1.0 Fig.1 Appearance Capacitance 11 Vibration Resistance D.F. No defects or abnormalities. Within the specified tolerance. Char. X7R Z5U Y5V 25V min. 0.025 max. 0.025 max. 0.05 max. 16V 0.035 max. 0.07 max. (CF1.0F) 0.09 max. (CU1.0F) b 1.2 1.6 3.0
a Solder resist Baked electrode or copper foil
DataShee
c 2.0 2.4 3.7 (in mm)
Solder the capacitor to the test jig (glass epoxy board) in the same manner and under the same conditions as (10). The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours).
Continued on the following page.
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specification
Test Method Solder the capacitor to the test jig (glass epoxy boards) shown in Fig.2 using a eutectic solder. Then apply a force in the direction shown in Fig.3. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
4.5 20 50 Pressurizing speed : 1.0mm/sec. Pressurize
No crack or marked defect shall occur.
12
TR S RT QS Q ,, T S
c
b
Deflection
40
a
R230
100
t : 1.6mm
Flexure : V1 Capacitance meter 45 45 (in mm)
Type LL0306 LL0508 LL0612
a 0.3 0.6 1.0
b 1.2 1.6 3.0
c 2.0 2.4 3.7
(in mm) Fig.2 Solderability of Termination Appearance Capacitance Change
Fig.3 Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at 80 to 120D for 10 to 30 seconds. After preheating, immerse in eutectic solder solution for 2T0.5 seconds at 230T5D.
6
13
75% of the terminations is to be soldered evenly and continuously.
No defects or abnormalities. X7R : WithinT7.5% Z5U . Y5V : WithinT20% Char. X7R Z5U Y5V 25V min. 0.025 max. 0.025 max. 0.05 max. 16V 0.035 max. 0.07 max. (CF1.0F) 0.09 max. (CU1.0F) Preheat the capacitor at 120 to 150D for 1 minute. Immerse the capacitor in a eutectic solder solution at 270T5D for 10T0.5 seconds. Let sit at room temperature for 48T4 hours , then measure. #Initial measurement. Perform a heat treatment at 150 W0 D for one hour and then Y10 let sit for 48T4 hours at room temperature. Perform the initial measurement.
Resistance 14 to Soldering Heat
D.F.
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I.R. Dielectric Strength Appearance Capacitance Change
More than 10,000M or 500 * F (Whichever is smaller) No failure No defects or abnormalities. X7R : WithinT7.5% Z5U . Y5V : WithinT20% Char. X7R Z5U Y5V 25V min. 0.025 max. 0.025 max. 0.05 max. 16V 0.035 max. 0.07 max. (CF1.0F) 0.09 max. (CU1.0F)
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Temperature Cycle
D.F.
Fix the capacitor to the supporting jig in the same manner and under the same conditions as (10). Perform the five cycles according to the four heat treatments listed in the following table. Let sit for 48T4 hours at room temperature, then measure. Step 1 2 3 4 Min. Operating Room Max. Operating Room W0 W3 Temp.(D) Temp. Y3 Temp. Y0 Temp. Temp. Time(min.) 30T3 2 to 3 30T3 2 to 3 #Initial measurement. Perform a heat treatment at 150 W0 D for one hour and then Y10 let sit for 48T4 hours at room temperature. Perform the initial measurement.
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I.R. Dielectric Strength Appearance Capacitance Change 16 Humidity, Steady State
More than 10,000M or 500 * F (Whichever is smaller) No failure No defects or abnormalities. X7R : WithinT12.5% Z5U . Y5V : WithinT30% Char. X7R Z5U Y5V 25V min. 0.05 max. 0.05 max. 0.075 max. 16V 0.05 max. 0.100 max. (CF1.0F) 0.125 max. (CU1.0F)
D.F.
Sit the capacitor at 40T2D and 90 to 95% humidity for 500T12 hours. Remove and let sit for 48T4 hours at room temperature, then measure.
I.R.
More than 1,000M or 50 * F (Whichever is smaller)
Continued on the following page.
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item Appearance Capacitance Change
Specification No defects or abnormalities. X7R : WithinT12.5% Z5U . Y5V : WithinT30% Char. X7R Z5U Y5V 25V min. 0.05 max. 0.05 max. 0.075 max. 16V 0.05 max. 0.1 max. (CF1.0F) 0.125 max. (CU1.0F)
Test Method
17
Humidity Load
D.F.
Apply the rated voltage at 40T2D and 90 to 95% humidity for 500T12 hours. Remove and let sit for 48T4 hours at room temperature, then measure. The charge/discharge current is less than 50mA.
I.R. Dielectric Strength Appearance Capacitance Change
More than 500M or 25 * F (Whichever is smaller) No failure No defects or abnormalities. X7R : WithinT12.5% Z5U : WithinT30% Y5V : WithinT30% (CF1.0F) : Within W30 % (CU1.0F) Y40 Char. X7R Z5U Y5V 25V min. 0.05 max. 0.05 max. 0.075 max. 16V 0.05 max. 0.1 max. (CF1.0F) 0.125 max. (CU1.0F) Apply 200% of the rated voltage for 1,000T12 hours at maximum operating temperature T3D. Let sit for 48T4 hours at room temperature, then measure. The charge/discharge current is less than 50mA. #Initial measurement. Apply 200% of the rated DC voltage for one hour at the maximum operating temperature T3D. Remove and let sit for 48T4 hours at room temperature. Perform initial measurement.
6
18
High Temperature Load
D.F.
I.R. Dielectric Strength
More than 1,000M or 50 * F (Whichever is smaller) No failure
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C02E6.pdf 00.7.18
CHIP MONOLITHIC CERAMIC CAPACITOR
Monolithic Microchip GM Series
L W
s Features
1. Better micro wave characteristics. 2. Suitable for by-passing. 3. High density mounting.
T
s Application
* Optical device for telecommunication. * IC, IC packaging built-in. * Measuring equipment.
Part Number GM250 GM260 Dimensions (mm) W 0.5 0.05 0.8 0.05
L 0.5 0.05 0.8 0.05
T 0.35 0.05 0.5 0.1
Part Number GM250X7R102M16 GM250X7R152M16 GM250X7R222M16 GM250X7R471M50 GM250Y5V153Z10 GM250Y5V472Z16 GM250Y5V682Z16 GM260X7R103M16 GM260Y5V104Z10 GM260Y5V473Z16
Rated Voltage (Vdc) 16 16 16 50 10 16 16 16 10 16
TC Code X7R X7R X7R X7R Y5V Y5V Y5V X7R Y5V Y5V
Capacitance 1000pF 1500pF 2200pF 470pF 15000pF 4700pF 6800pF 10000pF 0.1F .com 47000pF
Length L (mm) 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.8 0.8 0.8
Width W (mm) 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.8 0.8 0.8
Thickness T (mm) 0.35 0.35 0.35 0.35 0.35 0.35 0.35 0.5 0.5 0.5
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Specifications and Test Methods Specifications and Test Methods
No. 1 Item Operating Temperature X7R : Y55D to W125D Y5V : Y30D to W85D The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, shall be maintained within the rated voltage range. Visual inspection. Visual inspection. No failure shall be observed when a voltage of 250% of the rated voltage is applied between the both terminations for 1 to 5 seconds, provided the charge/discharge current is less than 50mA. The insulation resistance shall be measured with a DC voltage not exceeding the rated voltage at normal temperature and humidity and within 2 minutes of charging. The capacitance shall be measured at 25D with 1T0.1kHz in frequency and 1T0.2Vr.m.s. in voltage. D.F. shall be measured under the same conditions at the capacitance. The range of capacitance change in reference to 25D within the temperature range shown in the table shall be within the specified ranges. The capacitance change shall be measured after 5 min. at each specified temperature stage. MIL-STD-883 Method 2011 Condition D Mount the capacitor on a gold metallized alumina substrate with Au-Sn (80/20) and bond a 20m (0.0008 inch) gold wire to the capacitor terminal using an ultrasonic wedge bond. Then, pull wire. MIL-STD-883 Method 2019 Mount the capacitor on a gold metallized alumina substrate with Au-Sn (80/20). Apply the force parallel to the substrate. Ramp frequency from 10 to 55Hz then return to 10Hz all within 1 minute. Amplitude : 1.5 mm (0.06 inch) max. total excursion. Apply this motion for a period of 2 hours in each of 3 mutually perpendicular directions (total 6 hours). The capacitor shall be set for 48T4 hours at room temperature after one hour heat of treatment at 150 W0 D, then measure Y10 for the initial measurement. Fix the capacitor to the supporting jig in the same manner and under the same conditions as (11) and conduct the five cycles according to the temperatures and time shown in the following table. Set it for 48T4 hours at room temperature, then measure. Step 1 2 3 4 Min. Operating Room Max. Operating Room W0 W3 Temp.(D) Temp. Y3 Temp. Y0 Temp. Temp. Time(min.) 30T3 2 to 3 30T3 2 to 3 Specification Test Method
2
Rated Voltage
See the previous pages.
3 4 5
Appearance Dimensions Dielectric Strength
No defects or abnormalities. See the previous pages. No defects or abnormalities.
6
Insulation Resistance 10,000M min. (I.R.) Capacitance Dissipation Factor (D.F.) Within the specified tolerance. X7R : 0.035 max. Y5V : 0.09 max. (for 16V) Y5V : 0.125 max. (for 10V) Char. X7R Y5V Temp. Range Reference Temp. Cap. Change Rate Y55 to W125D 25D WithinT15% Y30 to W85D 25D WithinT22% 82
7
8
7
9
Capacitance Temperature Characteristics
Bond Strength
Pull force : 3.0g min.
10
Mechanical Strength
Die Shear Strength
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Die Shear force : 200g min. No defects or abnormalities. Within the specified tolerance. X7R : 0.035 max. Y5V : 0.09 max. (for 16V) Y5V : 0.125 max. (for 10V) The measured values shall satisfy the values in the following table. Item Appearance Specification No marked defect X7R ....... WithinT7.5% Y5V ....... WithinT20% More than 10,000M X7R ....... 0.035 max. Y5V ....... 0.09 max.(for 16V) Y5V ....... 0.125 max.(for 10V) No failure
Appearance 11 Vibration Resistance Capacitance D.F.
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12
Temperature Cycle
Capacitance Change I.R. D.F. Dielectric Strength
The measured values shall satisfy the values in the following table. Item Appearance 13 Humidity (Steady State) Capacitance Change I.R. D.F. Dielectric Strength Specification No marked defect X7R ....... WithinT12.5% Y5V ....... WithinT30% More than 1,000M X7R ....... 0.05 max. Y5V ....... 0.125 max.(for 16V) Y5V ....... 0.15 max.(for 10V) No failure Set the capacitor for 500T12 hours at 40T20D, in 90 to 95% humidity. Take it out and set it for 48T4 hours at room temperature, then measure.
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specification The measured values shall satisfy the values in the following table. Item Appearance Specification No marked defect X7R ....... WithinT12.5% Y5V ....... WithinT30% 40 More than 500M X7R ....... 0.05 max. Y5V ....... 0.125 max.(for 16V) Y5V ....... 0.15 max.(for 10V) No failure
Test Method
14
Humidity Load
Capacitance Change I.R. D.F. Dielectric Strength
Apply the rated voltage for 500T12 hours at 40T20D, in 90 to 95% humidity and set it for 48T4 hours at room temperature, then measure. The charge/discharge current is less than 50mA. # Initial measurement for Y5V Perform a heat treatment at 150 W0 D for one hour and then Y10 let sit for 48T4 hours at room temperature. Perform the initial measurement.
The measured values shall satisfy the values in the following table. Item Appearance 15 High Temperature Load Capacitance Change I.R. D.F. Dielectric Strength Specification No marked defect X7R ....... WithinT12.5% Y5V ....... WithinT30% 40 More than 1,000M X7R ....... 0.05 max. Y5V ....... 0.125 max.(for 16V) Y5V ....... 0.15 max.(for 10V) No failure
A voltage treatment shall be given to the capacitor, in which a DC voltage of 200% the rated voltage is applied for one hour at the maximum operating temperature T3D then it shall be set for 48T4 hours at room temperature and the initial measurement shall be conducted. Then apply the above mentioned voltage continuously for 1000T12 hours at the same temperature, remove it from the bath, and set it for 48T4 hours at room temperature, then measure. The charge/discharge current is less than 50mA.
Mounting for testing : The capacitors shall be mounted on the substrate as shown below using die bonding and wire bonding when tests No. 11 to 15 are performed.
7
Capacitor Die bond Gold wire Gold land
Alumina substrate
Alumina substrate
Gold land
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CHIP MONOLITHIC CERAMIC CAPACITOR
Capacitor Arrays GNM Series
s Features
1. High density mounting due to mounting space saving. 2. Mounting cost saving.
L W T P e
s Application
General electronic equipment
Part Number GNM30-401
L 3.2 0.15
Dimensions (mm) W T P e 1.6 0.15 0.8 0.1 0.8 0.1 0.4 0.15
Temperature Compensating Type
Part Number L x W(mm) TC Code Rated Volt.(Vdc) Capacitance and T(mm) 10pF 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8
Continued on the following page.
GNM30-401
3.2x1.6 C0G 50 100
0.8 0.8 0.8
8
11pF 12pF 13pF 15pF 16pF 18pF 20pF 22pF 24pF 27pF 30pF 33pF 36pF 39pF 43pF 47pF 51pF 56pF 62pF 68pF 75pF 82pF 91pF 100pF 110pF 120pF 130pF 150pF 160pF 180pF
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0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8
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Part Number L x W(mm) TC Code Rated Volt.(Vdc) Capacitance and T(mm) 240pF 270pF 300pF 330pF 360pF 0.8 0.8 0.8 0.8 0.8
GNM30-401
3.2x1.6 C0G 50 100
High Dielectric Constant Type
Part Number L x W(mm) TC Code Rated Volt.(Vdc) Capacitance and T(mm) 220pF 240pF 270pF 300pF 330pF 360pF 390pF 470pF 560pF 680pF 820pF 1000pF 1200pF 1500pF 1800pF 2200pF 2700pF 3300pF 3900pF 4700pF 5600pF 6800pF 8200pF 10000pF 12000pF 15000pF 18000pF 22000pF 27000pF 33000pF 39000pF 47000pF 68000pF 100000pF 150000pF 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 GNM30-401
3.2x1.6 X7R 16 25 50 100 16 Y5V 50 100
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Specifications and Test Methods Specifications and Test Methods
Specification No. Item Temperature Compensating Type C0G : Y55 to W125D Test Method High Dielectric Constant Type X7R : Y55 to W125D Y5V : Y30 to W85D The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, shall be maintained within the rated voltage range. Visual inspection. Using calipers. No failure shall be observed when 300% of the rated voltage (C0G ) or 250% of the rated voltage (X7R and Y5V) is applied between the terminations for 1 to 5 seconds, provided the charge/discharge current is less than 50mA. The insulation resistance shall be measured with a DC voltage not exceeding the rated voltage at 25D and 75%RH max. and within 2 minutes of charging. The capacitance/Q/D.F. shall be measured at 25D at the frequency and voltage shown in the table. 25V min. 0.025 max. 0.05 max. 16V 0.035 max. 0.07 max. Char. Item Frequency Voltage C0G 1T0.1MHz 0.5 to 5Vr.m.s. X7R, Y5V 1T0.1MHz 1T0.2Vr.m.s.
1
Operating Temperature
2
Rated Voltage
See the previous page.
3 4
Appearance Dimensions
No defects or abnormalities. Within the specified dimension.
5
Dielectric Strength
No defects or abnormalities.
6 7
Insulation Resistance (I.R.) Capacitance
More than 10,000M or 500 * F (Whichever is smaller) Within the specified tolerance. 30pF min. : QU1,000 30pF max. : QU400W20C C : Nominal Capacitance (pF) Char. X7R Y5V
8
Q/Dissipation Factor (D.F.)
Capacitance Change
Within the specified tolerance. (Table A-5) Within the specified tolerance. (Table A-5)
Char.
8
Temp. Reference Cap. Range. Temp. Change WithinT15% X7R Y55to W125D 25D W22 WithinT % Y5V Y30to W85D Y82
Temperature Coefficient
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Capacitance Temperature Characteristics Capacitance Drift Within T0.2% or T0.05pF (Whichever is larger)
The capacitance change shall be measured after 5 min. at each specified temperature stage. (1) Temperature Compensating Type The temperature coefficient is determined using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5, the capacitance shall be within the specified tolerance for the temperature coefficient and capacitance change as Table A. The capacitance drift is calculated by dividing the differences between the maximum and minimum measured values in the step 1, 3 and 5 by the cap. value in step 3. Step 1 2 3 4 5 Temperature(D) 25T2 Y55T3 25T2 125T3 25T2
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(2) High Dielectric Constant Type The ranges of capacitance change compared with the 25D value over the temperature ranges shown in the table shall be within the specified ranges. Solder the capacitor to the test jig (glass epoxy board) shown in Fig.1 using a eutectic solder. Then apply 5N force in parallel with the test jig for 10T1 sec. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
b a c
10
Adhesive Strength of Termination
No removal of the terminations or other defects shall occur.
d Solder resist Copper foil
Type GNM30-401
a 0.8
b 2.5 Fig.1
c 0.4
d 0.8 (in mm)
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
Specification No. Item Temperature Compensating Type No defects or abnormalities. Within the specified tolerance. 30pF min. : QU1000 30pF max. : QU400W20C C : Nominal Capacitance (pF) Test Method High Dielectric Constant Type Solder the capacitor to the test jig (glass epoxy board) in the same manner and under the same conditions as (10). The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). Solder the capacitor to the test jig (glass epoxy boards) shown in Fig.2 using a eutectic solder. Then apply a force in the direction shown in Fig.3. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
20 50 Pressurizing speed : 1.0mm/sec. Pressurize
Appearance Capacitance 11 Vibration Resistance Q/D.F.
Char. X7R Y5V
25V min. 0.025 max. 0.05 max.
16V 0.035 max. 0.07 max.
No cracking or marking defects shall occur.
2.5T0.05 0.8T0.05 15 20 0.8T0.1
12
Deflection
0.4T0.05
40
R230
Flexure : V1
100 : Copper foil : Solder resist t =1.6mm
Capacitance meter 45 45
(in mm)
Fig.2
Fig.3 Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at 80 to 120D for 10 to 30 seconds. After preheating, immerse in eutectic solder solution for 2T0.5 seconds at 230T5D.
13
Solderability of Termination
75% of the terminations is to be soldered evenly and continuously. The measured and observed characteristics shall satisfy the specifications in the following table.
8
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Preheat the capacitor at 120 to 150D for 1 minute. Immerse the capacitor in a eutectic solder solution at 270T5D for 10T0.5 seconds. Let sit at room temperature for 24T2 hours (temperature compensating type) or 48T4 hours (high dielectric constant type), then measure. # Initial measurement for high dielectric constant type Perform a heat treatment at 150 W0 D for one hour and then Y10 let sit for 48T4 hours at room temperature. Perform the initial measurement.
Appearance Capacitance Change Resistance 14 to Soldering Heat
No marking defects. Within T2.5% or T0.25pF (Whichever is larger) 30pF and over : QU1,000 30pF and below : QU400W20C C : Nominal Capacitance (pF) X7R ........ WithinT7.5% Y5V ........ WithinT20% Char. X7R Y5V 25V min. 0.025 max. 0.05 max. 16V 0.035 max. 0.07 max.
Q/D.F.
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I.R. Dielectric Strength
DataShee
More than 10,000M or 500 * F (Whichever is smaller) No failure The measured and observed characteristics shall satisfy the specifications in the following table.
Appearance Capacitance Change 15 Temperature Cycle Q/D.F.
No marking defects. Within T2.5% or T0.25pF (Whichever is larger) 30pF and over : QU1,000 30pF and below : QU400W20C C : Nominal Capacitance (pF) X7R ........ WithinT7.5% Y5V ........ WithinT20% Char. X7R Y5V 25V min. 0.025 max. 0.05 max. 16V 0.035 max. 0.07 max.
Fix the capacitor to the supporting jig in the same manner and under the same conditions as (10). Perform the five cycles according to the four heat treatments listed in the following table. Let sit for 24T2 hours (temperature compensating type) or 48T4 hours (high dielectric constant type) at room temperature, then measure. Step Temp.(D) Time(min.) 1 2 3 4 Min. Operating Room Max. Operating Room W0 W3 Temp. Y3 Temp. Y0 Temp. Temp. 30T3 2 to 3 30T3 2 to 3
I.R. Dielectric Strength
More than 10,000M or 500 * F (Whichever is smaller) No failure
# Initial measurement for high dielectric constant type Perform a heat treatment at 150 W0 D for one hour and then Y10 let sit for 48T4 hours at room temperature. Perform the initial measurement.
Continued on the following page.
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
Specification No. Item Temperature Compensating Type Test Method High Dielectric Constant Type
The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Capacitance Change 16 Humidity, Steady State Q/D.F. No marking defects. Within T5% or T0.5pF (Whichever is larger) 30pF and over : QU350 10pF and over, 30pF and below : QU275W 5 C 2 10pF and below : QU200W10C C : Nominal Capacitance (pF) X7R ........ WithinT12.5% Y5V ........ WithinT30%
Char. X7R Y5V
25V min. 0.05 max. 0.075 max.
16V 0.05 max. 0.1 max.
Sit the capacitor at 40T2D and 90 to 95% humidity for 500T12 hours. Remove and let sit for 24T2 hours (temperature compensating type) or 48T4 hours (high dielectric constant type) at room temperature, then measure.
I.R.
More than 1,000M or 50 * F (Whichever is smaller) The measured and observed characteristics shall satisfy the specifications in the following table.
Appearance Capacitance Change 17 Humidity Load Q/D.F.
No marking defects. Within T7.5% or T0.75pF (Whichever is larger) 30pF and over : QU200 30pF and below : QU100W 10 C 3 C : Nominal Capacitance (pF) X7R ........ WithinT12.5% Y5V ........ WithinT30% Char. X7R Y5V 25V min. 0.05 max. 0.075 max. 16V 0.05 max. 0.1 max. Apply the rated voltage at 40T2D and 90 to 95% humidity for 500T12 hours. Remove and let sit for 24T2 hours (temperature compensating type) or 48T4 hours (high dielectric constant type) at room temperature, then measure. The charge/discharge current is less than 50mA.
I.R.
More than 500M or 25 * F (Whichever is smaller) No failure The measured and observed characteristics shall satisfy the .com specifications in the following table.
8
Dielectric Strength
Appearance Capacitance Change
No marking defects. Within T3% or T0.3pF (Whichever is larger) 30pF and over : QU350 10pF and over, 30pF and below : QU275W 5 C 2 10pF and below : QU200W10C C : Nominal Capacitance (pF) X7R ........ WithinT12.5% Y5V ........ WithinT30% Apply 200% of the rated voltage for 1,000T12 hours at the maximum operating temperature T3D. Let sit for 24T2 hours (temperature compensating type) or 48T4 hours (high dielectric constant type) at room temperature, then measure. The charge/discharge current is less than 50mA. #Initial measurement for high dielectric constant type. Apply 200% of the rated DC voltage for one hour at the maximum operating temperature T3D. Remove and let sit for 48T4 hours at room temperature. Perform initial measurement.
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High Temperature Load
Q/D.F.
Char. X7R Y5V
25V min. 0.04 max. 0.075 max.
16V 0.05 max. 0.1 max.
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I.R. Dielectric Strength
More than 1,000M or 50 * F (Whichever is smaller) No failure
Table A
Capacitance Change from 25D (%) Char. Temp. Coeff. (ppm/D) Note 1 Y55D Max. 0.40 Y30D Min. Y0.17 Max. 0.25 Y10D Min. Y0.11 Max. Min. 0T30 Y0.24 0.58 C0G Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.
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CHIP MONOLITHIC CERAMIC CAPACITOR
for Ultrasonic Sensors ZLM Type
s Features
1. Proper to compensate for ultrasonic sensor. 2. Small chip size and high cap. Value.
e g e
s Application
Ultrasonic sensor (Back sonar, Corner sonar and etc.)
Part Number GRM40
L W
Dimensions (mm) L W T e 2.0 0.1 1.25 0.1 0.85 0.1 0.2 to 0.7
g min. 0.7
Part Number GRM40ZLM102K100 GRM40ZLM152K100
Rated Voltage (Vdc) 100 100
TC Code ZLM ZLM
Capacitance (pF) 1000 10% 1500 10%
Length L (mm) 2.0 0.1mm 2.0 0.1mm
Width W (mm) 1.25 0.1mm 1.25 0.1mm
Thickness T (mm) 0.85 0.1mm 0.85 0.1mm
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Specifications and Test Methods Specifications and Test Methods
No. 1 Item Operating Temperature Y25D to W85D The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, shall be maintained within the rated voltage range. Visual inspection. Using calipers. No failure shall be observed when 300% of the rated voltage is applied between the terminations for 1 to 5 seconds, provided the charge/discharge current is less than 50mA. The insulation resistance shall be measured with a DC voltage not exceeding the rated voltage at 20D and 75%RH max. and within 2 minutes of charging. The capacitance/D.F. shall be measured at 20D with 1T0.1kHz in frequency and 1T0.2Vr.m.s. in voltage. The temperature coefficient is determined using the capacitance measured in step 1 as a reference. When cycling the temperature sequentially from step 1 through 5, the capacitance shall be within the specified tolerance for the temperature coefficient. The capacitance change shall be measured after 5 min. at each specified temperature stage. Step 1 2 3 Temperature(D) 20T2 Y25T3 20T2 85T3 20T2 Specification Test Method
2
Rated Voltage
See the previous pages.
3 4 5
Appearance Dimensions Dielectric Strength
No defects or abnormalities. Within the specified dimensions. No defects or abnormalities.
6 7 8
Insulation Resistance More than 10,000M or 500 * F. (Whichever is smaller) (I.R.) Capacitance Dissipation Factor (D.F.) Within the specified tolerance. 0.01 max.
9
Capacitance Temperature Characteristics
Within Y4,700 W1,000 ppm/D (at Y25 to W20D) Y2,500 Within Y4,700 W500 ppm/D (at W20 to W85D) Y1,000
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Solder the capacitor to the test jig (glass epoxy board) shown in Fig.1 using a eutectic solder. Then apply 10N force in the direction of the arrow. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
c
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10 Adhesive Strength of Termination No removal of the terminations or other defect shall occur.
b
a
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Solder resist Baked electrode or copper foil
Type GRM40
a 1.2 Fig.1
b 4.0
c 1.65 (in mm)
Appearance Capacitance 11 Vibration Resistance D.F.
No defects or abnormalities. Within the specified tolerance.
0.01 max.
Solder the capacitor to the test jig (glass epoxy board) in the same manner and under the same conditions as (10). The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours).
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specification
Test Method Solder the capacitor to the test jig (glass epoxy boards) shown in Fig.2 using a eutectic solder. Then apply a force in the direction shown in Fig.3. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
20 50 Pressurizing speed : 1.0mm/sec. Pressurize
No cracking or marking defects shall occur.
12
TR S RT QS Q ,, T S
Deflection
c 40 a 100
b
4.5
R230
t : 1.6mm
Flexure : V1 Capacitance meter 45 45
Type GRM40
a 1.2
b 4.0
c 1.65
(in mm)
(in mm)
Fig.2 Solderability of Termination Appearance Capacitance Change D.F. I.R. Dielectric Strength Appearance Capacitance Change 15 Temperature Cycle D.F. I.R. Dielectric Strength Appearance
Fig.3 Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at 80 to 120D for 10 to 30 seconds. After preheating, immerse in eutectic solder solution for 2T0.5 seconds at 230T5D.
13
75% of the terminations is to be soldered evenly and continuously.
No defects or abnormalities. Within T7.5% 0.01 max. More than 10,000M or 500 * F (Whichever is smaller) No failure No defects or abnormalities. Within T7.5% 0.01 max. More than 10,000M or 500 * F (Whichever is smaller) No failure No defects or abnormalities. Within T12.5% 0.02 max. More than 1,000M or 50 * F (Whichever is smaller) No failure No defects or abnormalities. Within T12.5% 0.02 max. More than 500M or 25 * F (Whichever is smaller) No defects or abnormalities. Within T12.5% 0.02 max. More than 1,000M or 50 * F (Whichever is smaller) Apply 200% of the rated voltage for 1,000T12 hours at 85T3D. Let sit for 24T2 hours at room temperature, then measure. The charge/discharge current is less than 50mA. Apply the rated voltage at 40T2D and 90 to 95% humidity for 500T12 hours. Remove and let sit for 24T2 hours at room temperature, then measure. The charge/discharge current is less than 50mA. Sit the capacitor at 40T2D and 90 to 95% humidity for 500T12 hours. Remove and let sit for 24T2 hours at room temperature, then measure. Fix the capacitor to the supporting jig in the same manner and under the same conditions as (11). Perform the five cycles according to the four heat treatments listed in the following table. Let sit for 24T2 hours at room temperature, then measure. Step 1 2 3 4 Y25 W0 RoomTemp. 85 W3 Temp.(D) Y3 Y0 RoomTemp. Time(min.) 30T3 2 to 3 30T3 2 to 3 Preheat the capacitor at 120 to 150D for 1 minute. Immerse the capacitor in a eutectic solder solution at 270T5D for 10T0.5 seconds. Let sit at room temperature for 24T2 hours , then measure.
Resistance 14 to Soldering Heat
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Humidity, Steady State
Capacitance Change D.F. I.R. Dielectric Strength Appearance
DataShee
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Humidity Load
Capacitance Change D.F. I.R. Appearance
18
High Temperature Load
Capacitance Change D.F. I.R.
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C02E6.pdf 00.7.18
CHIP MONOLITHIC CERAMIC CAPACITOR
High-frequency for Flow/Reflow Soldering GRQ Series
s Features
1.HiQ and low ESR at VHF, UHF, Microwave. 2.Feature improvement, low power consumption for mobile telecommunication (Base station, terminal, etc.)
L W e g e
s Application
High-frequency circuit (Mobile telecommunication, etc.)
Part Number GRQ706 GRQ708 Dimensions (mm) L W T e 1.6 0.1 0.8 0.1 0.8 0.1 0.2 to 0.5 2.0 0.1 1.25 0.1 0.85 0.1 0.2 to 0.7 g min. 0.5 0.7
Part Number L x W(mm) TC Code Rated Volt.(Vdc) Capacitance and T(mm) 0.5pF 0.75pF 1.0pF 1.1pF 1.2pF 1.3pF 1.5pF 1.6pF 1.8pF 2.0pF 2.2pF 2.4pF 2.7pF 3.0pF 3.3pF 3.6pF 3.9pF 4.0pF 4.3pF 4.7pF 5.0pF 5.1pF 5.6pF 6.0pF 6.2pF 6.8pF 7.0pF 7.5pF 8.0pF 8.2pF 9.0pF 9.1pF 10.0pF 11pF .com 12pF 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80
GRQ706
GRQ708
1.60x0.80 C0G 50 100
0.80 0.80 0.80 0.80 0.80 0.80 .com 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80
2.00x1.25 C0G 50 100
0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85
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Part Number L x W(mm) TC Code Rated Volt.(Vdc) Capacitance and T(mm) 13pF 15pF 16pF 18pF 20pF 22pF 24pF 27pF 30pF 33pF 36pF 39pF 43pF 47pF 0.80 0.80 0.80 0.80 0.80 0.80 0.80
GRQ706
GRQ708
1.60x0.80 C0G 50 100 50
2.00x1.25 C0G 100
0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85
s Q-Frequency Characteristics
Q-Frequency Characteristics GRQ706 10000
s Resonant Frequency-Capacitance
Resonant Frequency * Capacitance 100
6.8pF 1000
2.4pF 1pF
Resonant Frequency (GHz)
10 GRQ708
Q
100
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GRQ706 10 0 0.1 1 100M 1G Frequency (Hz) 10G
1 Capacitance (pF)
10
100
10
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C02E6.pdf 00.7.18
Specifications and Test Methods Specifications and Test Methods
No. 1 Item Operating Temperature Range C0G : Y55D to 125D The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, shall be maintained within the rated voltage range. Visual inspection. Using calipers. No failure shall be observed when 300% of the rated voltage is applied between the terminations for 1 to 5 seconds, provided the charge/discharge current is less than 50mA. The insulation resistance shall be measured with a DC voltage not exceeding the rated voltage at 25D and 75%RH max. and within 2 minutes of charging. The capacitance/Q shall be measured at 25D at the frequency and voltage shown in the table. Char. C0G(1000pF and below) Item Frequency 1T0.1MHz
Voltage
Specification
Test Method
2
Rated Voltage
See the previous pages.
3 4 5
Appearance Dimensions Dielectric Strength
No defects or abnormalities. Within the specified dimensions. No defects or abnormalities.
6 7
Insulation Resistance More than 10,000M or 500 * F. (Whichever is smaller) (I.R.) Capacitance Within the specified tolerance.
8
Q
QU1000
0.5 to 5Vrms
Capacitance Change Temperature Coefficent
Within the specified tolerance. (Table A-1) Within the specified tolerance. (Table A-1)
9
Capacitance Temperature Characteristics Capacitance Drift Within T0.2% or T0.05pF (Whichever is larger.)
The temperature coefficient is determined using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5, the capacitance shall be within the specified tolerance for the temperature coefficient and capacitance change as Table A. The capacitance drift is caluculated by dividing the differences between the maximum and minimum measured values in the step 1, 3 and 5 by the cap. value in step 3. Step 1 2 3 4 5 Temperature(D) 25T2 Y55T3 25T2 125T3 25T2
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Solder the capacitor to the test jig (glass epoxy board) shown in Fig.1 using a eutectic solder. Then apply 10N* force in parallel with the test jig for 10T1sec. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock. *5N (GRQ706)
c
DataShee
b
Type GRQ706 GRQ708
a 1.0 1.2 Fig.1
b 3.0 4.0
a Solder resist Baked electrode or copper foil
10
Adhesive Strength of Termination
No removal of the terminations or other defect shall occur.
c 1.2 1.65 (in mm)
Appearance Capacitance 11 Vibration Resistance Q
No defects or abnormalities. Within the specified tolerance.
QU1000
Solder the capacitor to the test jig (glass epoxy board) in the same manner and under the same conditions as (10). The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours).
Continued on the following page.
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specification
Test Method Solder the capacitor to the test jig (glass epoxy board) shown in Fig.2 using a eutectic solder. Then apply a force in the direction shown in Fig.3. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
No cracking or marking defects shall occur.
TR S RT QS Q ,, T S
c 40
b
4.5
20
12
Deflection
a
100
t : 1.6mm
50 Pressurizing speed : 1.0mm/sec. Pressurize
R230
Type GRQ706 GRQ708
a 1.0 1.2
b 3.0 4.0
c 1.2 1.65
Flexure : V1 Capacitance meter 45 45
(in mm) Fig.2
(in mm)
Fig.3 Solderability of Termination Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at 80 to 120D for 10 to 30 seconds. After preheating, immerse in eutectic solder solution for 2T0.5 seconds at 230T5D.
13
75% of the terminations is to be soldered evenly and continuously.
The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Resistance 14 to Soldering Heat Capacitance Change Q I.R. Dielectric Strength No marking defects. Within T2.5% or T0.25pF (Whichever is larger) QU1000 More than 10,000M or 500 * F (Whichever is smaller) No failure Preheat the capacitor at 120 to 150D for 1 minute. Immerse the capacitor in a eutectic solder solution at 270T5D for 10T0.5 seconds. Let sit at room temperature for 24T2 hours.
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Fix the capacitor to the supporting jig in the same manner and under the same conditions as (10). Perform the five cycles according to the four heat treatments listed in the following table. Let sit for 24T2 hours at room temperature, then measure. 1 2 3 4 Min. Operating Room Max. Operating Room Temp.(D) Temp.W0/Y3 Temp. Temp.W3/Y0 Temp. Time(min.) 30T3 2 to 3 30T3 2 to 3 Step
The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Temperature Cycle Capacitance Change Q No marking defects. Within T2.5% or T0.25pF (Whichever is larger) QU1000 More than 10,000M or 500 * F (Whichever is smaller) No failure The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Humidity, Steady State Capacitance Change Q I.R. Dielectric Strength No marking defects. Within T5% or T0.5pF (Whichever is larger) QU350 More than 1,000M or 50 * F (Whichever is smaller) No failure The measured and observed characteristics shall satisfy the specifications in the following table. Appearance Humidity Load Capacitance Change Q I.R. Dielectric Strength No marking defects. Within T7.5% or T0.75pF (Whichever is larger) QU200 More than 500M or 25 * F (Whichever is smaller) No failure
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Sit the capacitor at 40T2D and 90 to 95% humidity for 500T12 hours. Remove and let sit for 24T2 hours (temperature compensating type) at room temperature, then measure.
17
Apply the rated voltage at 40T2D and 90 to 95% humidity for 500T12 hours. Remove and let sit for 24T2 hours at room temperature, then measure. The charge/discharge current is less than 50mA.
Continued on the following page.
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specification The measured and observed characteristics shall satisfy the specifications in the following table.
Test Method
Appearance High Temperature Load Capacitance Change Q I.R. Dielectric Strength
No marking defects. Within T3% or T0.3pF (Whichever is larger) QU350 More than 1,000M or 50 * F (Whichever is smaller) No failure
18
Apply 200% of the rated voltage for 1,000T12 hours at the maximum operating temperature T3D. Let sit for 24T2 hours (temperature compensating type) at room temperature, then measure. The charge/discharge current is less than 50mA.
Table A
Capacitance Change from 25D (%) Char. Nominal Values (ppm/D) Note 1 Y55D Y30D Min. Y0.17 Max. 0.25 Y10D Min. Y0.11 Max. Max. Min. 0T30 Y0.24 0.58 0.40 C0G Note 1 : Nominal values denote the temperature coefficient within a range of 25D to 125D. (for C0G)
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CHIP MONOLITHIC CERAMIC CAPACITOR
High-Q & High-power GRH/RPN100 Series
e e
s Features(GRH100 Series)
1. The dielectric is composed of low dielectric loss ceramics. This series is perfectly suited to highfrequency applications (VHS-microwave band). 2. The series is ultraminiature, yet has a high-power capacity. This is the best capacitor available for transmitter and amplifier circuits such as those in broadcasting equipment and mobile base stations. 3. GRH110 type is designed for both flow and reflow soldering and GRH111 type is designed for reflow soldering. 4. GRH type capacitors exhibit better solderability and lower solder leaching because of its nickel barriered terminations.
L
W
Part Number GRH110 GRH111
L +0.6 1.4 - 0.4 +0.6 2.8 - 0.4
Dimensions (mm) W T +0.6 0.8 to 1.65 1.4 - 0.4 +0.6 2.8 - 0.4 2.0 to 2.8
e +0.25 0.25 - 0.15 +0.4 0.4 - 0.3
s Application
High-frequency and high-power circuits.
s Features(RPN100 Series)
1. The dielectric is composed of low dielectric loss ceramics. This series is perfectly suited to highfrequency applications (VHS-microwave band). 2. The series is ultraminiature, yet has a high-power .com capacity. This is the best capacitor available for transmitter and amplifier circuits such as those in broadcasting equipment and mobile base stations. Part Number L 3. RPN type capacitors withstand high temperatures 1.6 0.4 RPN110 because ribbon leads are attached with silver 3.2 0.4 RPN111 paste. 4. RPN type capacitors are easily soldered and t4U.com especially well suited in applications where only a soldering iron can be used.
R
L
W
***
T
Silver ribbon leads. 0.1 - 0.2 *** : Capacitance Code
Dimensions (mm) W T max. R w 1.4 0.4 1.6 5.0 min. 1.3 0.4 2.8 0.4 3.0 9.0 2.0 2.35 0.15
w
T
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s Application
High-frequency and high-power circuits.
Part Number L x W(mm) TC Code Rated Volt.(Vdc) 0.5pF 0.6pF 0.7pF 0.8pF 0.9pF 1.0pF 1.1pF 1.2pF 1.3pF 1.4pF .com 1.5pF GRH110 GRH111 RPN110 RPN111
1.40x1.40 C0G 50
1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20
2.80x2.80 C0G 50 100 200 300 500
2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40
1.60x1.40 C0G 50
1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60
3.20x2.80 C0G 50 100 200 300 500
3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00
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Part Number L x W(mm) TC Code Rated Volt.(Vdc) 1.6pF 1.7pF 1.8pF 1.9pF 2.0pF 2.1pF 2.2pF 2.4pF 2.7pF 3.0pF 3.3pF 3.6pF 3.9pF 4.3pF 4.7pF 5.1pF 5.6pF 6.2pF 6.8pF 7.5pF 8.2pF 9.1pF 10.0pF 11pF 12pF 13pF 15pF 16pF 18pF 20pF 22pF 24pF 27pF 30pF 33pF 36pF 39pF 43pF 47pF 51pF 56pF 62pF 68pF 75pF 82pF 91pF 100pF 110pF 120pF 130pF 150pF 160pF 180pF .com 200pF
GRH110
GRH111
RPN110
RPN111
1.40x1.40 C0G 50
1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20
2.80x2.80 C0G 50 100 200 300 500
2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40
1.60x1.40 C0G 50
1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60 1.60
3.20x2.80 C0G 50 100 200 300 500
3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00
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Capacitance and T(mm)
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Part Number L x W(mm) TC Code Rated Volt.(Vdc) 220pF 240pF 270pF 300pF 330pF 360pF 390pF 430pF 470pF 510pF 560pF 620pF 680pF 750pF 820pF 910pF 1000pF
GRH110
GRH111
RPN110
RPN111
1.40x1.40 C0G 50 50 100
2.80x2.80 C0G 200
2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40 2.40
1.60x1.40 C0G 300 500 50 50 100
3.20x2.80 C0G 200
3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00
300
500
Capacitance and T(mm)
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Specifications and Test Methods Specifications and Test Methods
No. 1 Item Operating Temperature Range Y55D to W125D The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, shall be maintained within the rated voltage range. Visual inspection. Using calipers. No failure shall be observed when 250% of the rated voltage is applied between the terminations for 1 to 5 seconds, provided the charge/discharge current is less than 50mA. The insulation resistance shall be measured with a DC voltage not exceeding the rated voltage at 25D and 125D standard humidity and within 2 minutes of charging. The capacitance/Q shall be measured at 25D at the frequency and voltage shown in the table. Char. Item C0G (1,000pF and below) Frequency 1T0.1MHz Voltage 0.5 to 5Vr.m.s. The temperature coefficient is determined using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5, the capacitance shall be within the specified tolerance for the temperature coefficient and capacitance change as Table A. The capacitance drift is calculated by dividing the differences between the maximum and minimum measured values in the step 1, 3 and 5 by the cap. value in step 3. The capacitance change shall be measured after 5 min. at each specified temperature stage. Step Temperature(D) 1 25T2 2 Y55T3 3 4 5 25T2 125T3 25T2 Specification Test Method
2
Rated Voltage
See the previous pages.
3 4 5
Appearance Dimensions Dielectric Strength
No defects or abnormalities. Within the specified dimension. No defects or abnormalities. 470pFFCV1,470pF :1,000,000M min. 470pFFCV1,000pF :1,100,000M min. 470pFFCV1,470pF :1,100,000M min. 470pFFCV1,000pF :1,110,000M min. Within the specified tolerance. 220pF6
Insulation Resistance (I.R.)
25D 125D
7
Capacitance
8
Q
Capacitance Variation Rate Temperature Coefficient
Within the specified tolerance. (Table A-7)
Within the specified tolerance. (Table A-7)
9
Capacitance Temperature Characteristics Capacitance Drift Within T0.2% or T0.05pF (Whichever is larger)
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Adhesive Strength of No removal of the terminations or other defects shall occur. Termination (for chip type)
Solder the capacitor to the test jig (alumina substrate) shown in Fig.1 using solder containing 2.5% silver. The soldering shall be done either with an iron or in furnace and be conducted with care so the soldering is uniform and free of defects such as heat shock. Then apply a 10N force in the direction of the arrow.
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10
Terminal Strength
Fig.1 Tensile Strength (for microstrip type) Bending Strength of lead wire terminal (for microstrip type) The capacitor body is fixed and a load is applied gradually in the axial direction until its value reaches 10N (5N for RPN110).
Capacitor shall not be broken or damaged.
Lead wire shall not be cut or broken.
Position the main body of the capacitor so the lead wire terminal is perpendicular, and load 2.5N to the lead wire terminal. Bend the main body by 90 degrees, bend back to original position, bend 90 degrees in the reverse direction, and then bend back to original position.
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item Appearance Capacitance
Specification No defects or abnormalities. Within the specified tolerance.
Test Method Solder the capacitor to the test jig (alumina substrate) shown in Fig.2 using solder containing 2.5% silver. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so the soldering is uniform and free of defects such as heat shock.The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours).
11
Vibration Resistance Q
Satisfies the initial value. 220pFFCV1,220pF : QU10,000 220pFFCV1,470pF : QU15,000 470pFFCV1,000pF : QU13,000 C : Nominal Capacitance (pF)
Solder resist Ag/Pd Alumina substrate
Fig. 2 Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at 80 to 120D for 10 to 30 seconds. After preheating immerse in solder containing 2.5% silver for 5T0.5 seconds at 230T5D. The dipping depth for microstrip type capacitors is up to 1 mm from the root of the terminal.
12
Solderability of Termination
95% of the terminations is to be soldered evenly and continuously.
13
Resistance to Soldering Heat
The measured and observed characteristics shall satisfy the specifications in the following table. Specification Item No marked defect Appearance Within T2.5% or T0.25pF Capacitance (Whichever is larger) Change 220pFFCV1,220pF : QU10,000 220pFFCV1,470pF : QU15,000 Q 470pFFCV1,000pF : QU13,000 .com More than 30% of the initial specI.R. ification value at 25D. No failure Dielectric Strength C : Nominal Capacitance (pF) The measured and observed characteristics shall satisfy the specifications in the following table. Item Appearance Capacitance Change Q I.R. Dielectric Strength Specification No marked defect Within T1% or T0.25pF (Whichever is larger) 220pFFCV1,220pF : QU10,000 220pFFCV1,470pF : QU15,000 470pFFCV1,000pF : QU13,000 More than 30% of the initial specification value at 25D. No failure C : Nominal Capacitance (pF)
Preheat the capacitor at 80 to 100D for 2 minutes and then at 150 to 200D for 5 minutes. Immerse in solder containing 2.5% silver for 3T0.5 seconds at 270T5D. Set at room temperature for 24T2 hours, then measure. The dipping depth for microstrip type capacitors is up to 2mm from the root of the terminal.
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Temperature Cycle
Fix the capacitor to the supporting jig in the same manner and under the same conditions as (11). Perform the five cycles according to the four heat treatments listed in the following table. Then, repeat twice the successive cycles of immersion, each cycle consisting of immersion in a fresh water at 65 W5 D for 15 Y0 minutes and immersion in a saturated uqueous solution of salt at 0T3D for 15 minutes. The cpapcitor is promptly washed with running water, dried with a dry cloth, and allowed to sit at room temperature for 24T2 hours. Step Temp.(D) Time(min.) 1 Y55 W0 Y3 30T3 2 RoomTemp. 2 to 3 3 125 W3 Y0 30T3 4 RoomTemp. 2 to 3
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11
Apply the 24-hour heat (Y10 to W65D) and humidity (80 to 98%) treatment shown below, 10 consecutive times. Remove, set for 24T2 hours at room temperature, and measure. The measured and observed characteristics shall satisfy the specifications in the following table. Item Appearance Capacitance Change Q I.R. Specification No marked defect Within T5% or T0.5pF (Whichever is larger) 220pFFCV1,220pF : QU10,000 220pFFCV1,470pF : QU15,000 470pFFCV1,000pF : QU13,000 More than 30% of the initial specification value at 25D. C : Nominal Capacitance (pF)
D 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 Humidity Humidity Humidity 80-98% Humidity 80-98% 90-98% Humidity90-98% 90-98%
15
Humidity
Temparature
+10 D -2 Initial measurement Applied voltage 50Vdc
One cycle 24 hours
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0 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 17 18 19 2021 22 23 24 Hours
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specification The measured and observed characteristics shall satisfy the specifications in the following table. Specification Item No marked defect Appearance Within T2.5% or T0.25pF Capacitance (Whichever is larger) Change 220pFFCV1,220pF : QU10,000 220pFFCV1,470pF : QU15,000 Q 470pFFCV1,000pF : QU13,000 More than 30% of the initial specI.R. ification value at 25D. C : Nominal Capacitance (pF)
Test Method
16
High Temperature Load
Apply 150% of the rated voltage for 2,000T12 hours at 125T3D. Remove and set for 24T2 hours at room temperature, then measure. The charge/discharge current is less than 50mA.
Table A
Capacitance Change from 25D Value (%) Char. Temp. Coeff. (ppm/D) Note 1 Y55D Max. 0.40 Y30D Min. Y0.17 Max. 0.25 Y10D Min. Y0.11 Max. Min. 0T30 Y0.24 0.58 C0G Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.
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CHIP MONOLITHIC CERAMIC CAPACITOR
High-frequency GRH/RPN700 Series
e g e
s Features(GRH700 Series)
1. Negligible inductance is achieved by its monolithic structure so the series can be used at frequencies above 1GHz. 2. Nickel barriered terminations of GRH type improve solderability and decrease solder leaching. 3. GRH706/GRH708 type is designed for both flow and reflow soldering and GRH710 type is designed for reflow soldering.
L
W
Part Number GRH706 GRH708 GRH710
s Application
High-frequency and high-power circuits.
L +0.5 1.25 - 0.3 +0.5 2.0 - 0.3 +0.6 3.2 - 0.4
Dimensions (mm) W T max. e g min. +0.5 1.2 0.15 min. 0.3 1.0 - 0.3 +0.5 1.45 0.2 max. 0.5 1.25 - 0.3 +0.5 1.9 0.3 max. 0.5 2.5 - 0.3
s Features(RPN700 Series)
1. Negligible inductance is achieved by its monolithic structure so the series can be used at frequencies above 1GHz. 2. RPN type capacitors withstand at high temperatures because ribbon leads are attached with silver paste. 3. RPN type capacitors are easily soldered and are especially well suited in applications where Part Number .com only a soldering iron can be used.
RPN710
L 2T0.3
***
10T1 T 10T1
0.1 *** : Capacitance Code
L max. 4.0
Dimensions (mm) W max. 3.0
s Application
High-frequency and high-power circuits.
Part Number L x W(mm) TC Code Rated Volt.(Vdc) 0.5pF 0.6pF 0.7pF 0.8pF 0.9pF 1.0pF 1.1pF 1.2pF 1.3pF 1.4pF 1.5pF 1.6pF 1.7pF 1.8pF 1.9pF 2.0pF 2.1pF 2.2pF 2.4pF .com 2.7pF GRH706 GRH708 GRH710 RPN710
1.25x1.00 C0G 50 100 200
1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20
2.00x1.25 C0G 50 100 200
1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45
3.20x2.50 C0G 50 100 200
1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90
4.00x3.00 C0G 50 100 200
2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30
Continued on the following page.
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w Silver ribbon leads.
T max. 2.3
T
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Part Number L x W(mm) TC Code Rated Volt.(Vdc) 3.0pF 3.3pF 3.6pF 3.9pF 4.3pF 4.7pF 5.1pF 5.6pF 6.2pF 6.8pF 7.5pF 8.2pF 9.1pF 10pF 11pF 12pF 13pF 15pF 16pF 18pF 20pF 22pF 24pF 27pF 30pF 33pF 36pF 39pF 43pF 47pF 51pF 56pF 62pF 68pF 75pF 82pF 91pF 100pF 110pF 120pF 130pF 150pF 160pF 180pF 200pF 220pF 240pF 270pF 300pF 330pF 360pF 390pF 430pF .com 470pF 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20
GRH706
GRH708
GRH710
RPN710
1.25x1.00 C0G 50 100 200
1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20
2.00x1.25 C0G 50 100 200
1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 .com 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45
3.20x2.50 C0G 50 100 200
1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90
4.00x3.00 C0G 50 100 200
2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30 2.30
Continued on the following page.
Capacitance and T(mm)
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Part Number L x W(mm) TC Code Rated Volt.(Vdc) 510pF 560pF 620pF 680pF 750pF 820pF 910pF 1000pF
GRH706
GRH708
GRH710
RPN710
1.25x1.00 C0G 50 100 200 50
2.00x1.25 C0G 100 200 50
3.20x2.50 C0G 100
1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 2.30 2.30 2.30 2.30 2.30 2.30 2.30
4.00x3.00 C0G 200 50 100
2.30
200
Capacitance and T(mm)
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Specifications and Test Methods Specifications and Test Methods
No. 1 Item Operating Temperature Range Y55D to W125D The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, shall be maintained within the rated voltage range. Visual inspection. Using calipers. No failure shall be observed when 300% of the rated voltage is applied between the terminations for 1 to 5 seconds, provided the charge/discharge current is less than 50mA. The insulation resistance shall be measured with a DC voltage not exceeding the rated voltage at 25D and standard humidity and within 2 minutes of charging. The capacitance/Q shall be measured at 25D at the frequency and voltage shown in the table. Char. C0G (1,000pF and below) Item Frequency 1T0.1MHz Voltage 0.5 to 5Vr.m.s. The temperature coefficient is determined using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5, the capacitance shall be within the specified tolerance for the temperature coefficient and capacitance change as Table A. The capacitance drift is calculated by dividing the differences between the maximum and minimum measured values in the step 1, 3 and 5 by the cap. value in step 3. The capacitance change shall be measured after 5 min. at each specified temperature stage. Step Temperature(D) 1 25T2 2 Y55T3 3 4 5 25T2 125T3 25T2 Specification Test Method
2
Rated Voltage
See the previous pages.
3 4 5
Appearance Dimensions Dielectric Strength
No defects or abnormalities. Within the specified dimension. No defects or abnormalities.
6 7
Insulation Resistance 10,000M min. (I.R.) Capacitance Within the specified tolerance. 220pF8
Q
Within the specified tolerance. (Table A-6)
9
Capacitance Temperature Characteristics Capacitance Drift Within T0.2% or T0.05pF (Whichever is larger)
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Adhesive Strength of No removal of the terminations or other defects shall occur. Termination (for chip type)
Solder the capacitor to the test jig (alumina substrate) shown in Fig.1 using solder containing 2.5% silver. The soldering shall be done either with an iron or in furnace and be conducted with care so the soldering is uniform and free of defects such as heat shock. Then apply a 10N* force in the direction of the arrow. *5N (GRH 706)
10N* Alumina substrate
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10
Terminal Strength
Fig.1 Tensile Strength (for microstrip type) Bending Strength of lead wire terminal (for microstrip type) The capacitor body is fixed and a load is applied gradually in the axial direction until its value reaches 5N.
Capacitor shall not be broken or damaged.
Lead wire shall not be cut or broken.
Position the main body of the capacitor so the lead wire terminal is perpendicular, and load 2.5N to the lead wire terminal. Bend the main body by 90 degrees, bend back to original position, bend 90 degrees in the reverse direction, and then bend back to original position.
Continued on the following page.
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item Appearance Capacitance
Specification No defects or abnormalities. Within the specified tolerance.
Test Method Solder the capacitor to the test jig (alumina substrate) shown in Fig.2 using solder containing 2.5% silver. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so the soldering is uniform and free of defects such as heat shock.The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours).
11
Vibration Resistance Q
Satisfies the initial value. 220pFFCV1,220pF : QU10,000 220pFFCV1,470pF : QU15,000 470pFFCV1,000pF : QU13,000 C : Nominal Capacitance (pF)
Solder resist Ag/Pd Alumina substrate
Fig.2 Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at 80 to 120D for 10 to 30 seconds. After preheating immerse in solder containing 2.5% silver for 5T0.5 seconds at 230T5D. The dipping depth for microstrip type capacitors is up to 1 mm from the root of the terminal. Preheat according to the conditions listed in the table below. Immerse in solder containing 2.5% silver for 3T0.5 seconds at 270T5D. Set at room temperature for 24T2 hours, then measure. The dipping depth for microstrip type capacitors is up to 2mm from the root of the terminal. Chip Size Preheat Condition 2.0Z1.25mm max. 1minute at 120 to 150D 3.2Z2.5mm Each 1 minute at 100 to 120D and then 170 to 200D
12
Solderability of Termination
75% of the terminations is to be soldered evenly and continuously.
13
Resistance to Soldering Heat
The measured and observed characteristics shall satisfy the specifications in the following table. Specification Item No marked defect Appearance Within T2.5% or T0.25pF Capacitance (Whichever is larger) Change 220pFFCV1,220pF : QU10,000 220pFFCV1,470pF : QU15,000 Q 470pFFCV1,000pF : QU13,000 .com No failure Dielectric Strength C : Nominal Capacitance (pF) The measured and observed characteristics shall satisfy the specifications in the following table. Item Specification No marked defect Appearance Within T5% or T0.5pF Capacitance (Whichever is larger) Change 10pFVCU30pF : QU350 10pFVCF30pF : QU275W 5 C 2 Q 10pFVCF10pF : QU200W10C 1,000M min. I.R. No failure Dielectric Strength C : Nominal Capacitance (pF)
14
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Temperature Cycle
Fix the capacitor to the supporting jig in the same manner and under the same conditions as (11). Perform the five cycles according to the four heat treatments listed in the following table. Let sit for 24T2 hours at room temperature, then measure. Step Temp.(D) Time(min.) 1 Y55 W0 Y3 30T3 2 RoomTemp. 2 to 3 3 125 W3 Y0 30T3 4 RoomTemp. 2 to 3
DataShee
Apply the 24-hour heat (Y10 to W65D) and humidity (80 to 98%) treatment shown below, 10 consecutive times. Remove, set for 24T2 hours at room temperature, and measure. The measured and observed characteristics shall satisfy the specifications in the following table. Item Specification No marked defect Appearance Within T5% or T0.5pF Capacitance (Whichever is larger) Change 10pFVCU30pF : QU350 10pFVCF30pF : QU275W 5 C 2 Q 10pFVCF10pF : QU200W10C 1,000M min. I.R. C : Nominal Capacitance (pF)
D 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 Humidity Humidity Humidity 80-98% Humidity 80-98% 90-98% Humidity90-98% 90-98%
12
15
Humidity
Temparature
+10 D -2 Initial measurement Applied voltage 50Vdc
One cycle 24 hours 0 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 17 18 19 2021 22 23 24 Hours
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specification The measured and observed characteristics shall satisfy the specifications in the following table. Item Specification No marked defect Appearance Within T3% or T0.3pF Capacitance (Whichever is larger) Change 10pFVCU30pF : QU350 10pFVCF30pF : QU275W 5 C 2 Q 10pFVCF10pF : QU200W10C 1,000M min. I.R. C : Nominal Capacitance (pF)
Test Method
16
High Temperature Load
Apply 200% of the rated voltage for 1,000T12 hours at 125T3D. Remove and set for 24T2 hours at room temperature, then measure. The charge/discharge current is less than 50mA.
Table A
Capacitance Change from 25D Value (%) Char. Temperature Coefficient (ppm/D) Note 1 Y55D Max. 0.40 Y30D Min. Y0.17 Max. 0.25 Y10D Min. Y0.11 Max. Min. 0T30 Y0.24 0.58 C0G Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.
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GRH/RPN Series Data
s Q-Frequency Characteristics
GRH100 Series
100000 GRH110 100000
GRH700 Series
GRH708
10000
10000
1000 1pF
1000 1pF 100 10pF 100pF
Q
10
Q
100
10pF
10
100pF
1 measured by BOONTON RESONANT COAXIAL-LINE 34A 0.1 100M 1G Frequency [Hz] 10G
1 measured by BOONTON RESONANT COAXIAL-LINE 34A 0.1 100M 1G Frequency [Hz] 10G
s Impedance-Frequency Characteristics
GRH100 Series
GRH110 100k 100k
GRH700 Series
GRH708
10k
10k
1k
PARALLEL RESONANCE
1k
PARALLEL RESONANCE
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100 Impedance [Ohm]
100 Impedance [Ohm]
10
10
1 1pF 100m 100pF 10pF
1 1pF 100m 100pF 10m 10pF
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10m
DataShee
10M 100M Frequency [Hz] 1G 10G
1m 1M
10M
100M Frequency [Hz]
1G
10G
1m 1M
s ESR-Frequency Characteristics
GRH100 Series
GRH110 1 1
GRH700 Series
GRH708
ESR [Ohm]
0.1
1pF 10pF 100pF
ESR [Ohm]
1pF 10pF 100pF 0.1
measured by BOONTON RESONANT COAXIAL-LINE 34A 0.01 100M 1G Frequency [Hz] 10G 0.01 100M 1G Frequency [Hz]
measured by BOONTON RESONANT COAXIAL-LINE 34A 10G
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GRH/RPN Series Data
Continued from the preceding page.
s Resonant Frequency-Capcitance
GRH100 Series
100G Series Resonant Frequency fo [Hz] 100G
GRH700 Series
Series Resonant Frequency fo [Hz]
10G
10G
GRH110 1G
GRH708 1G GRH710
GRH111
100M 0.1
1
10 Capacitance [pF]
100
1000
100M 0.1
1
10 Capacitance [pF]
100
1000
s Allowable Voltage-Frequency
[T=20C] 100 50V SERIES
s Allowable Current-Frequency
[T=20C] 10
GRH110
10
GR
p 00
F
GRH710
50V SERIES
GRH11
0
GRH110 GRM40
10 Va [Vrms]
GR
GR
G R
40
Ia [Arms]
H7 1 M4 0 0
H
11
1
GR
GR
M
H7
G
08
RH
1
10 0 pF
GRM40
GRH708
GRM40
10 H1
G RM
11 0
40
1
10pF
F 100p
100m
pF
10
F 1000p
0.1 10M
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1G Frequency [Hz] 10G 10M 100M Frequency [Hz] 1G 10G
100M
s Allowable Appearent Power-Frequency
[T=20C] 100
s Allowable Effcteve Power-Frequency
1 [T=20C] 50V SERIES
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10 Pa [VA]
pF 00 10
GR
50V SERIES
G R H 1 11
71 0 H G R
DataShee
G 11 RH
H GR
R G
GR M GR 40 H GR 710 H1 11
M4 0
GR M 4 GR 0 H7 08
Pe [W]
GR
G
F 0p 10
40 RM G
0p
F
pF 10
10
1
10m
00
pF
10
0.1 10M
100M Frequency [Hz]
1G
10G
1m 10M
100M Frequency [Hz]
10
pF
G
M 40
RM 40 RH 11 0
H1
G R
10
H
0
11
8 70
100m
0
1G
10G
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PACKAGE
Packaging Code
Packaging Type Packaging Code Tape Carrier Packaging PT Bulk Case Packaging PC Bulk Packaging Bulk Packaging in a bag PB
Package
Bulk Packaging in a tray PM
Minimum Quantity Guide
Part Number Dimensions (mm) L Ultra-miniaturized GRM33 GRM36 GRM39 GRM40 0.6 1.0 1.6 2.0 W 0.3 0.5 0.8 1.25 T 0.3 0.5 0.8 0.6 For Flow/Reflow 0.85 1.25 0.85 GRM42-6 3.2 1.6 1.15 1.6 1.15 GRM42-2 For Reflow GRM43-2 GRM44-1 High-power Type GRM615 GRM420 GRM425 Low-distortion Series GRM430 GRM435 3.2 4.5 1.6 2.0 1.25 2.0 3.2 1.4 2.8 2.0 0.5 0.8 3.2 0.8 1.25 1.6 1.6 2.5 0.8 1.25 1.0 1.25 2.5 1.4 2.8 1.25 0.5 0.8 1.6 1.6 2.0 3.2 4.5 5.7 1.0 1.6 2.0 3.2 5.0 0.5 0.8 1.25 3.2 2.5 1.35 1.8 2.5 2.0 2.0 0.5 0.8 0.7 1.0 0.7 1.0 1.25 2.0 0.8 1.0 1.2 1.45 1.9 1.65 2.8 0.85 0.35 0.5 0.8 0.6 1.0 0.7 1.25 GRQ706 GRQ708 GRH706 High-frequency GRH708 GRH710 GRH110 GRH111 For Ultrasonic Micro Chip Array GRM40 GM250 GM260 GNM30-401 LL0306 Low ESL LL0508 LL0612 Quantity (pcs.) 180mm reel Paper Tape 15,000 10,000 4,000 4,000 4,000 4,000 10,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 Plastic Tape 3,000 3,000 2,000 3,000 2,000 1,000 1,000 1,000 1,000 3,000 1,000 3,000 2,000 2,000 1,000 4,000
4)
330mm reel Paper Tape 50,000 10,000 10,000 10,000 10,000 50,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 Plastic Tape 10,000 10,000 6,000 10,000 8,000 4,000 4,000 4,000 4,000 10,000 4,000 10,000 10,000 10,000
2) 2)
Bulk Case 50,000 15,000 5,000 50,000 1)
Bulk Bag 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 400 400
3) 3) 1)
10,000
4,000 .com
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1,000 1,000 1,000 1,000 1,000
4,000 3,000
1) 0.15 F and 0.22 F of X7R, 10V rated are available by taping packages only. (Applied to neither bulk case nor bag package.) 560pF of C0G, 50V rated and 0.47F or 1.0F of X5R, 6.3V rated are not availalble by bulk case. (Applied to taping or bag packages only.) 2) Depending on capacitance, some products are supplied on the 5,000pcs./reel basis. 3) Tray 4) Depending on capacitance, some products are supplied on the 3,000 pcs./reel basis. Continued on the following page.
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Package
Continued from the preceding page.
PACKAGE
Tape Carrier Packaging
(1) Dimensions of Reel
180mm Reel 330mm Reel
2.50.5
2.00.5 2.00.5 1782.0 50 min. 13.00.5 13.00.5 50 min. 21.00.8 101.5 for 8mm wide tape 141.5 for 12mm wide tape 3282.0
21.00.8
101.5 for 8mm wide tape 141.5 for 12mm wide tape
(in mm)
(2) Dimensions of Paper Tape
8mm width 4mm pitch Tape 8mm width 2mm pitch Tape
0.5 max. (GRM33) 0.8 max. (GRM36/GRM615) 3.50.05
4.00.1 4.00.1 1.5 -0
+0.1
2.00.05
1.750.1 3.50.05
1.1 max.
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4.00.1 1.5
+0.1 -0
2.00.05
2.00.05
1.750.1
8.00.3
A B
A B
Direction of Feed
Direction of Feed
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Part Number GR(M)39 GRM420 LL0306 GRQ706 GR(M)40 GRM425 (TV1.0mm) GRQ708 GR(M)42-6 GRM430 GNM30-401 (TV1.0mm) GRM42-2 (T=0.85mm) A B Part Number GRM33 1.050.1 1.850.1 GRM615 GR(M)36 A* 0.37 0.65 B* 0.67 1.15 *Nominal Value 1.550.15 2.30.15
8.00.3
DataShee
2.00.2
3.60.2
2.80.2
3.60.2 (in mm)
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Package PACKAGE
Continued from the preceding page.
(3) Dimensions of Plastic Tape
8mm width 4mm pitch Tape
4.00.1 4.00.1 1.5 -0
+0.1
12mm width 8mm pitch Tape
8.00.1 2.00.1 4.00.1 A B 1.5 -0 1.750.1 5.50.1 12.00.3 2.5 max. for GR(M)43-2/GR(M)44-1 (3.7 max. for TU2.5mm)
+0.1
2.00.1
1.750.1 3.50.05
0.20.1
0.30.1
A B
Direction of feed
8.00.3
2.5 max. (3.0 max. T=1.8/2.0 rank) (3.7 max. for TV2.5 mm)
Direction of feed
Part Number GR(M)40 (T=1.25mm) LL0508 GR(M)42-6 GRM430 (TU1.15mm) LL0612 GRM435 GR(M)42-2 (TU1.15mm) GRH708 GRH710 GRH110 GRH111
A
B
Part Number GR(M)43-2 GR(M)44-1
A*
B*
1.450.2
2.250.2
3.6 5.2
4.9 6.1 *Nominal Value
1.90.2
3.50.2
2.80.2 1.8* 2.8* 2.0* 3.1*
3.50.2 2.6* 3.5* 2.1* 3.2* *Nominal Value (in mm)
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(4) Taping Method q Tapes for capacitors are wound clockwise. The sprocket holes are to the right as the tape is pulled toward the user. w Part of the leader and part of the empty tape shall be attached to the end of the tape as follows. t4U.com e The top tape and base tape are not atteached at the end of the tape for a minimum of 5 pitches. r Missing capacitors number within 0.1% of the number per reel or 1 pc, whichever is greater, and are not continuous. t The top tape and bottom tape shall not protrude beyond the edges of the tape and shall not cover sprocked holes. y Cumulative tolerance of sprocket holes, 10 pitches : 0.3mm. u Peeling off force : 0.1 to 0.6N* in the direction shown below. *GRM33:0.05 to 0.5N
Vacant Section Chip-mounting Unit Vacant Section Leader unit
160 min. Direction of Feed
190 min.
210 min. (Top Tape or Cover Taper alone)
DataShee
(in mm)
165 to
180
Top Tape Base Tape
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Package
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PACKAGE
Dimensions of Bulk Case Packaging
6.8 8.8 12.0 1.5 2.0 3.0 110 31.5 36.0
The bulk case used antistatic materials. Please contact Murata for details.
(in mm)
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Notice
s Storage and Operating Conditions
Chip monolithic ceramic capacitors (chips) can experience degradation of termination solderability when subjected to high temperature or humidity, or if exposed to sulfur or chlorine gases. (Reference Data 1. Solderability)
s Rating
Die Bonding/Wire Bonding (GM Series) (1) Die Bonding of Capacitors * Use the following materials Braze alloy : Au-Si (98/2) 400 to 420D in N2 atmosphere Au-Sn (80/20) 300 to 320D in N2 atmosphere Au-Ge (88/12) 380 to 400D in N2 atmosphere * Mounting 1. Control the temperature of the substrate so that it matches the temperature of the braze alloy. 2. Place braze alloy on substrate and place the capacitor on the alloy. Hold the capacitor and gently apply the load. Be sure to complete the operation in 1 minute. (2) Wire Bonding * Wire Gold wire : 20mm (0.0008 inch), 25mm (0.001 inch) diameter * Bonding 1. Thermocompression, ultrasonic wedge or ball bond ing. Required stage temperature : 150 to 250D. 2. Required wedge or capillary weight : 0.2N to 0.5N. 3. Bond the capacitor and base substrate or other devices with gold wire.
s Handling
1. Inspection Thrusting force of the test probe can flex the PCB,resulting in cracked chips or open solder .com joints. Provide support pins on the back side of the PCB to prevent warping or flexing. 2. Board Separation (or Depane-lization) * Board flexing at the time of separation causes cracked chips or broken solder. * Severity of stresses imposed on the chip at the time of board break is in the order of : PushbackFSlitterFV SlotFPerforator. t4U.com * Board separation must be performed using special jigs, not with hands.
DataShee
s Others
1. Resin Coating When selecting resin materials, select those with low contraction. 2. Circuit Design These capacitors on this catalog are not safety recognized products 3. Remarks The above notices are for standard applications and conditions. Contact us when the products are used in special mounting conditions. Select optimum conditions for operation as they determine the reliability of the product after assembly. The data here in are given in typical values, not guaranteed ratings.
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sNOTICE Notice(Soldering and Mounting) Notice
Soldering and Mounting
1. PCB Design (1) Notice for Pattern Forms Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height. Pattern Forms
Placing Close to Chassis Placing of Chip Components and Leaded Components Placing of Leaded Components after Chip Component
Soldering Iron Lead Wire Lead Wire
Lateral Mounting
Chassis Solder (ground)
Incorrect
Electrode Pattern
Solder Resist
Correct
Solder Resist
Solder Resist
Solder Resist
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Notice NOTICE
Continued from the preceding page.
(2) Land Dimensions
Chip Capacitor c Land Solder Resist
b
a
Table 1 Flow Soldering Method
Dimensions Part Number GRM39 GRM420 GRQ706 GRM40 GRM425 GRQ708 GRM42-6 GRM430 LL0508 LL0612 GRH706 GRH708 GRH110 Dimensions (LgW) a b c
1.6g0.8
0.6e1.0
0.8e0.9
0.6e0.8
2.0g1.25
1.0e1.2
0.9e1.0
0.8e1.1
3.2g1.6 1.25g2.0 1.6g3.2 1.25g1.0 2.0g1.25 1.4g1.4
2.2e2.6 0.4e0.7 0.6e1.0 0.4e0.6 1.0e1.2 0.5e0.8
1.0e1.1 0.5e0.7 0.8e0.9 0.6e0.8 0.9e1.0 0.8e0.9
1.0e1.4 1.4e1.8 2.6e2.8 0.8e1.0 0.8e1.0 1.0e1.2 (in mm)
Table 2 Reflow Soldering Method
Dimensions Part Number GRM33 GRM36 GRM615 GRM39 GRM420 GRQ706 GRM40 GRM425 GRQ708 GRM42-6 GRM430 GRM42-2 GRM435 GRM43-2 GRM44-1 LL0306 LL0508 LL0612 GRH706 GRH708 GRH710 GRH110 GRH111 GR530 GR535 GR540 GR545 GR550 GR555 GR580 .com Dimensions (LgW) 0.6g0.3 1.0g0.5 1.6g0.8
.com a
0.2e0.3 0.3e0.5 0.6e0.8
b 0.2e0.35 0.35e0.45 0.6e0.7
c 0.2e0.4 0.4e0.6 0.6e0.8
t4U.com
2.0g1.25 3.2g1.6 3.2g2.5 4.5g3.2 5.7g5.0 0.8g1.6 1.25g2.0 1.6g3.2 1.25g1.0 2.0g1.25 3.2g2.5 1.4g1.4 2.8g2.8 4.5g3.8 5.6g5.0 10.6g5.0 10.6g10.0 11.8g10.6 16.0g5.0 28.1g13.2
1.0e1.2 2.2e2.4 2.0e2.4 3.0e3.5 4.0e4.6 0.2e0.4 0.4e0.6 0.6e0.8 0.4e0.6 1.0e1.2 2.2e2.5 0.4e0.8 1.8e2.1 3.2e3.4 4.2e4.5 8.5e9.0 8.5e9.0 9.0e9.5 13.0e13.5 25.0e25.5
0.6e0.7 0.8e0.9 1.0e1.2 1.2e1.4 1.4e1.6 0.3e0.4 0.3e0.5 0.6e0.7 0.6e0.8 0.6e0.8 0.8e1.0 0.6e0.8 0.7e0.9 0.9e1.2 0.9e1.2 1.3e1.5 1.3e1.5 1.8e2.0 1.8e2.0 2.2e2.4
0.8e1.1 1.0e1.4 1.8e2.3 2.3e3.0 3.5e4.8 1.0e1.4 1.4e1.8 2.6e2.8 0.8e1.0 0.8e1.0 1.9e2.3 1.0e1.2 2.2e2.6 3.0e3.8 4.0e5.0 4.0e5.0 8.0e10.0 8.0e10.0 4.0e5.0 10.0e13.0 (in mm)
Continued on the following page.
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Notice NOTICE
Continued from the preceding page.
GNM Series for reflow soldering method
Chip Capacitor
a b Land
c
d
Table 3
Part Number L GNM30-401 3.2 W 1.6 Dimensions (mm) a 0.8e1.0 b 0.7e0.9 c 0.3e0.4 d 0.4e0.5
(3) Mounting Position Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
Locate chip horizontal to the direction in which stress acts
[Chip Mounting Close to Board Separation Point]
Perforation C B D Slit
Chip arrangement Worst A-C-(B~D) Best
A
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(Reference Data 2. Board bending strength for solder fillet height) (Reference Data 3. Temperature cycling for solder fillet height) (Reference Data 4. Board bending strength for board material)
t4U.com
2. Solder Paste Printing
Overly thick application of solder paste results in excessive fillet height solder. This makes the chip more susceptible to mechanical and thermal stress on the board and may cause cracked chips. Too little solder paste results in a lack of adhesive strength on the outer electrode, which may result in chips breaking loose from the PCB. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm min. [Optimum Solder Amount for Reflow Soldering]
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T R RQ ,
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0.2mm min.
Continued on the following page.
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Notice NOTICE
Continued from the preceding page.
3. Chip Placing
An excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting, causing cracked chips. So adjust the suction nozzle's bottom dead point by correcting warp in the board. Normally, the suction nozzle's bottom dead point must be set on the upper surface of the board. Nozzle pressure for chip mounting must be a 1 to 3N static load. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving smoothly. This imposes great force on the chip during mounting, causing cracked chips. And the locating claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained, checked and replaced periodically.
(Reference Data 5. Break strength)
[Incorrect]
Suction Nozzle
Deflection Board
[Correct]
Board Guide
Support Pin
4. Reflow Soldering
Sudden heating of the chip results in distortion due to [Standard Conditions for Reflow Soldering] excessive expansion and construction forces within the Infrared Reflow chip causing cracked chips. So when preheating, keep temperature differential,T, within the range shown in Soldering Table 4. The smaller the T, the less stress on the chip. Gradual cooling When components are immersed in solvent after 200D (in the air) .com mounting, be sure to maintain the temperature difference (T) between the component and solvent within the range shown in the above table. Preheating
Temperature(D) T Time
Table 4
Part Number GRM33/36/39/40/42-6
Temperature Differential
t4U.com
GRM420/425/430/615 LL0306/0508/0612 GRH706/708/110 GRQ706/708 GRM42-2/43-2/44-1/435 GNM30-401 GRH710/111 GR530/535/540/545/550/555/580
T RR R QQ Q QR ,,, , TR T S SQ S R R T Q R TQT , S,S, TQ S S S, T S
20-40 seconds 120 seconds max. GR500 Series 20 seconds max. 60 seconds min.
Vapor Reflow
TV190D
DataShee
Soldering
Temperature(D)
T
TV130D
Gradual cooling (in the air)
Preheating
Time
60 seconds min. 20 seconds max.
120 seconds max.
[Allowable Soldering Temperature and Time]
Soldering temperature(D) 270 260 250 240 230 GR500 Series
GRM -/LL-/GNM- Series GRH - Series
0
30
60
Inverting the PCB
the PCB. .com
90 Soldering time (sec.)
Make sure not to impose an abnormal mechanical shock on
In case of repeated soldering, the accumulated soldering time must be within the range shown above.
Continued on the following page.
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Notice NOTICE
Continued from the preceding page.
5. Adhesive Application Thin or insufficient adhesive causes chips to loosen or become disconnected when flow soldered. The amount of adhesive must be more than dimension C shown in the drawing below to obtain enough bonding strength. The chip's electrode thickness and land thickness must be taken into consideration. Low viscosity adhesive causes chips to slip after mounting. Adhesive must have a viscosity of 5000pa-s (500ps)min. (at 25D)
Chip Capacitor
S R Q ,
Board Adhesive Land
a : 20 to 70 m b : 30 to 35 m c : 50 to 105 m a c b
GR500 Series a : 40 to 70 m b : 30 to 35 m c : 70 to 105 m
6. Adhesive Curing Insufficient curing of the adhesive causes chips to disconnect during flow soldering and causes deteriorated insulation resistance between outer electrodes due to moisture absorption. Control curing temperature and time in order to prevent insufficient hardening.
Inverting the PCB
Make sure not to impose an abnormal mechanical shock on the PCB.
7. Leaded Component Insertion
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If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted, chips may crack and solder joints may break. Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping.
t4U.com 8. Flux Application
An excessive amount of flux generates a large quantity of flux gas, causing deteriorated solderability. So apply flux thinly and evenly throughout. (A foaming system is generally used for flow soldering). Flux containing too high a percentage of halide may cause corrosion of the outer electrodes unless sufficiently cleaned.Use flux with a halide content of 0.2wt% max. But do not use strongly acidix flux. Wash thoroughly because water soluble flux causes deteriorated insulation resistance between outer electrodes unless sufficiently cleaned.
Continued on the following page.
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Notice NOTICE
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9. Flow Soldering
Sudden heating of the chip results in thermal distortion causing cracked chips. And an excessively long soldering time or high soldering temperature results in leaching of the outer electrodes, causing poor adhesion or a reduction in capacitance value due to loss of contact between electrodes and end termination. When preheating, keep the temperature differential between solder temperature and chip surface temperature, T, within the range shown in Table 5. The smaller the T, the less stress on the chip. When components are immersed in solvent after mounting, be sure to maintain the temperature difference between the component and solvent within the range shown in Table 5. Do not apply flow soldering to chips not listed in Table 5. Table 5
Part Number GRM39/40/42-6 GRM420/425/430 LL0508/0612 GRH706/708/110 GRQ706/708
[Standard Conditions for Flow Soldering]
Temperature Differential
Optimum Solder Amount for Flow Soldering
t4U.com
RQ RQR , ,,, T R S Q R S Q R RTQ Q,, S TST TS S S
T Gradual Cooling (in the air) Preheating Time 60 -120 seconds 5 seconds max.
[Allowable Soldering Temperature and Time]
Soldering Temperature(D) 270 260 250 240 230
TV150D
0
Temperature(D)
Soldering
10
20
30 Soldering Time (sec.)
In case of repeated soldering, the accumulated soldering time must be within the range shown above.
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Up to Chip Thickness
Adhesive
DataShee
Set temperature and time to ensure that leaching of the outer electrode does not exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D shown below) and 25% of the length A-B shown below as mounted on substrate.
(Reference Data 6. Thermal shock) (Reference Data 7. Solder heat resistance)
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DataSheet 4 U .com
RQS ,, T S QT R T R
A B D C Outer Electrode
[As a Single Chip]
[As Mounted on Substrate]
B
A
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Notice NOTICE
Continued from the preceding page.
10. Correction with a Soldering Iron
(1) For Chip Type Capacitors Sudden heating of the chip results in distortion due to a high internal temperature differential, causing cracked chips. When preheating, keep temperature differential, T, within the range shown in Table 6. The smaller theT, the less stress on the chip. Table 6
Part Number GRM36/39/40/42-6 GRM420/425/430/615 LL0306/0508/0612 GRQ706/708 GRH706/708/110 GRM42-2/43-2/44-1/435 GNM30-401 GRH710/111 GR530/535/540/545/550/555/580
[Standard Conditions for Soldering lron Temperature]
Temperature Differential
Optimum Solder Amount when Corrections Are Made Using a Soldering lron
t4U.com
S R Q R TR , , S R Q R RQQ Q S , ,, , TTS R SSR Q T S
Temperature(D) Soldering T Gradual Cooling (in the air) Preheating Time 60 -120 seconds
TV190D
20 seconds max. GR500 Series 5 seconds max.
[Allowable Time and Temperature for Making Corrections with a Soldering lron]
Soldering Temperature(D) 270 260 250 240 230
TV130D
0
30
60
90
Soldering Time (sec.)
The accumulated soldering Time / temperature including reflow /
.com soldering must be within the range shown above. flow
Up to Chip Thickness
DataShee
When correcting chips with a soldering iron, no preheating is required if the chip is listed in Table 7 and the following conditions (Table 7) are met. Preheating should be performed on chips not listed in Table 7.
(Reference Data 8. Thermal shock when making a correction with a soldering iron)
Table 7 Correction with a Soldering Iron
Part Number GRM36/39/40 GRM420/425/615 LL0306/0508 GRQ706/708 GRH706/708/110 GRM42-6 GRM430 LL0612 GNM30-401 .com
Continued on the following page.
Temperature of Iron Tip
Soldering Iron Wattage
Diameter of Iron Tip
Restriction
300D max. 20W max. 3mm max. Do not allow the iron tip to directly touch the ceramic element.
270D max.
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Notice NOTICE
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(2) For Microstrip Types Solder 1mm away from the ribbon terminal base, being careful that the solder tip does not directly contact the capacitor. Preheating is unnecessary. Complete soldering within 3 seconds with a soldering tip less than 270D in temperature.
11. Washing
Excessive output of ultrasonic oscillation during cleaning causes PCBs to resonate, resulting in cracked chips or broken solder. Take note not to vibrate PCBs.
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Reference Data GRM SERIES REFERENCE DATA
1. Solderability (1) Test Method Subject the chip capacitor to the following conditions. Then apply flux (a ethanol solution of 25% rosin) to the chip and dip it in 230D eutectic solder for 2 seconds. Conditions : Expose prepared at room temperature (for 6 months and 12 months, respectively) Prepared at high temperature (for 100 hours at 85D) Prepared left at high humidity (for 100 hours under 90%RH to 95%RH at 40D) Table 1
Sample Initial State Prepared at Room Temperature 6 months GRM40 for flow/reflow soldering 95 to 100% 95 to 100% 12 months 95% Prepared at High Temperature for 100 Hours at 85D 90 to 95% Prepared at High Humidity for 100 Hours at 90 to 95% RH and 40D 95%
(2) Test Samples GRM40 : Products for flow/reflow soldering. (3) Acceptance Criteria With a 60-power optical microscope, measure the surface area of the outer electrode that is covered with solder. (4) Results Refer to Table 1.
2. Board Bending Strength for Solder Fillet Height (1) Test Method Solder the chip capacitor to the test PCB with the amount of solder paste necessary to achieve the fillet heights. Then bend the PCB using the method illustrated and measure capacitance.
Capacitor
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R230
45
45
Supporting Base
Pressurizing Speed : 1.0mm/sec. Pressurize Note : The material of pressure application jig and support is the quenched metal. (hardness HB 183-255 or superhardness HRA90 or more) Flexure
TS RQ Q , R , TR SQ Q ,, T S, TS Q
1.0 40
Capacitance Meter
t4U.com
1.2
1.65
Solder Amount
Larger Fillet. Fillet up to Chip Thickness
DataShee
4.0 100 Material : Glass Epoxy : Copper Foil (0.35mm thick) : Solder Resist
1.6
(in mm)
(2) Test Samples GRM40 C0G/X7R/Y5V Characteristics T=0.6mm
(3) Acceptance Criteria Products shall be determined to be defective if the change in capacitance has exceeded the values specified in Table 2. Table 2
1 Characteristics
C0G X7R Y5V .com Change in Capacitance Within T5% or T0.5pF, whichever is greater Within T12.5% Within T20%
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Reference Data GRM SERIES REFERENCE DATA
Continued from the preceding page.
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q Solder Amount Alumina substrates are typically designed for reflow soldering. Glass epoxy or paper phenol substrates are typically used for flow soldering. w Material Alumina (Thickness : 0.64mm) Glass epoxy (Thickness : 1.6 mm) Paper phenol (Thickness : 1.6 mm) [Solder Amount]
Substrate Alumina
0.5T
TS R RR Q QQ R ,,, T S R STST S R , TQ ,, T S R Q T S Q
GRM40 C0G (T=0.6) GRM40 X7R (T=0.6)
100 80 60 40 20 0 100 80 60 40 20 0 Survival Rate (%) Survival Rate (%) Fillet up to Chip Thickness Fillet up to Chip Thickness Larger Fillet Larger Fillet 0 2 4 Flexure (mm) 6 8 0 2 4 Flexure (mm) 6 8
(4) Results
GRM40 Y5V (T=0.6)
100 80 60 40 20 0
Survival Rate (%)
Fillet up to Chip Thickness
Larger Fillet
0
2
4 Flexure (mm)
6
8
3. Temperature Cycling for Solder Fillet Height
(1) Test Method .com [Temperature Cycling] Solder the chips to the substrate various test fixtures +125D using sufficient amounts of solder to achieve the required fillet height. Then subject the fixtures to the cycle Room Temperature illustrated below 200 times.
-55D 5 30 5 30
Time (min.)
DataShee
Glass Epoxy or Paper Phenol
T
Solder Amount
q w e
0.7T
Solder to be used
6Z4 Eutectic solder
e Land Dimension
[Land Dimension]
Land Pattern 1.5
Alumina Substrate
1.5 1.2 1.5
Ag/Pd=72/28 Thickness : 10 to 12m
Glass Epoxy Substrate Paper Phenol Substrate
(in mm)
Cu Thickness : 35m
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Continued on the following page.
1.6T
T
1.3T
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Reference Data GRM SERIES REFERENCE DATA
Continued from the preceding page.
(2) Test Samples GRM40 C0G/X7R/Y5V Characteristics T=0.6mm (3) Acceptance Criteria Products shall be determined to be defective if the change in capacitance has exceeded the values specified in Table 3. Table 3
Characteristics C0G X7R Y5V Change in Capacitance Within T2.5% or T0.25pF, whichever is greater Within T7.5% Within T20%
(4) Results
Alumina Substrate
GRM40 C0G (T=0.6)
100 Accumulated Percent Defective (%) 80 60 40 20 0 0 50 e qw 100 150 200 Number of Cycles Accumulated Percent Defective (%)
GRM40 X7R (T=0.6)
100 80 60 40 20 0 0 50 w q 100 150 200 Number of Cycles e Accumulated Percent Defective (%)
GRM40 Y5V (T=0.6)
100 80 60 40 20 0 0 50 100 w q 150 200 Number of Cycles e
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Glass Epoxy Substrate
GRM40 C0G (T=0.6)
100 Accumulated Percent Defective (%) 80 60 40 20 0 0 50 qw 100 150 200 Number of Cycles e 100 Accumulated Percent Defective (%) 80 60 40 20
GRM40 X7R (T=0.6)
100 Accumulated Percent Defective (%) 80 60 40 20
GRM40 Y5V (T=0.6)
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DataShee
e 50 100 qw 150 200 Number of Cycles
e 50 qw 100 150 200 Number of Cycles
0 0
0 0
Paper Phenol Substrate
GRM40 C0G (T=0.6)
100 Accumulated Percent Defective (%) 80 60 40 20 0 0 50 qwe 100 150 200 Number of Cycles 100 Accumulated Percent Defective (%) 80 60 40 20
GRM40 X7R (T=0.6)
100 Accumulated Percent Defective (%) 80 60 40 20
GRM40 Y5V (T=0.6)
0 0
50
qw 100 150 200 Number of Cycles
e
0 0
50
100
e qw 150 200 Number of Cycles
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Reference Data GRM SERIES REFERENCE DATA
Continued from the preceding page.
4. Board Bending Strength for Board Material
(1) Test Method Solder the chip to the test board. Then bend the board using the method illustrated below, as measure capacitance.
Capacitor R230 45 45 Supporting Base 20 50 Pressurizing Speed : 1.0mm/sec. Pressurize Note : Material of the pressurizing jig and the supporting base must be hardened steel (Hardness : HB183 to 255 or carbide Hardness : HRA90 min.) Flexure
TSQ RQ Q ,,, T R T R , T S RQ Q, T S
1.65 1.0 1.2 40 4.0 1.6 100 : Copper Foil (0.035mm thick) : Solder Resist
Capacitance Meter
Solder Amount Up to Chip Thickness
(in mm)
(2) Test Samples GRM40 C0G/X7R/Y5V Characteristics T=0.6mm typical
(3) Acceptance Criteria Products shall be determined to be defective if the change in capacitance has exceeded the values specified .com in Table 4. Table 4
Characteristics
C0G X7R Y5V
Change in Capacitance Within T5% or T0.5pF, whichever is greater Within T12.5% Within T20%
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DataShee
GRM40 C0G (T=0.6) GRM40 X7R (T=0.6)
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RRRQ , TT SS S RRTR QQSQ ,,, T S RS S R , TS SRS Q RR ,Q TQ , T SS
100 80 60 40 20 0 100 80 60 40 20 0 Paper Phenol Paper Phenol Survival Rate (%) Glass Epoxy Survival Rate (%) Glass Epoxy 0 2 4 Flexure (mm) 6 8 0 2 4 Flexure (mm) 6 8
GRM40 Y5V (T=0.6)
100
Survival Rate (%)
80 60 40 20 0
Paper Phenol
Glass Epoxy
0
2
4 Flexure (mm)
6
8
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Reference Data GRM SERIES REFERENCE DATA
Continued from the preceding page.
5. Break Strength
(1) Test Method Place the chip on a steel plate as illustrated on the right. Increase load applied to a point near the center of the test sample. (2) Test Samples GRM40 C0G/X7R/Y5V Characteristics GRM42-6 C0G/X7R/Y5V Characteristics
Storage scope P Pressurizing speed : 2.5mm/sec. Amplifier Load cell Loading Jig End 1.0mm
T R Q , T , T S Q
Sample Steel plate W
P0.5mm
(3) Acceptance Criteria Define the load that has caused the chip to break or crack, as the bending force.
Chip Size L
W
(4) Explanation Break strength, P, is proportionate to the square of the thickness of the ceramic element and is expressed as a curve of secondary degree. The formula is : 2WT2 P= (N) 3L W : Width of ceramic element (mm) T : Thickness of element (mm) L : Distance between fulcrums (mm) : Bending stress (N/mm2) (5) Results
GRM40
140 Bending-break Strength (N)
T
C0G X7R Y5V Charac- Charac- Characteristics teristics teristics
L
GRM40
1.5 1.2
GRM42-6 2.7 1.5
300
180
160 (in mm)
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GRM42-6
Bending-break Strength (N) C0G X7R 140 120 100 80 60 40 20 0 0 0.4 0.8 1.2 Thickness of Ceramic Element (mm) 1.6 Y5V C0G
120 100 80 60 40 20 0 0
X7R
Y5V
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DataShee
0.4 0.8 1.2 Thickness of Ceramic Element (mm)
1.6
T , S Q
Chip Capacitor Solder Bath
(1) Test method After applying flux (an ethanol solution of 25% rosin), dip the chip in a solder bath (6Z4 eutectic solder) in accordance with the following conditions : (2) Test samples GRM40 C0G/X7R/Y5V Characteristics T=0.6mm typical (3) Acceptance criteria Visually inspect the test sample with a 60-power optical microscope. Chips exhibiting breaks or cracks shall be determined to be defective. .com
Dipping Speed : 25mm/sec.
Temperature
6. Thermal Shock
Solder Temperature Natural Cooling
Q , Q , S S
T 25D
2 sec.
Time
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Reference Data GRM SERIES REFERENCE DATA
Continued from the preceding page.
(4) Results
100 Incidence of Cracks (%) 80 60 40 20 0 200 Y5V X7R C0G 240 280 320 360
Temperature Differential T (D)
7. Solder Heat Resistance
(1) Test Method q Reflow soldering : Apply about 300 m of solder paste over the alumina substrate. After reflow soldering, remove the chip and check for leaching that may have occurred on the outer electrode. w Flow soldering : After dipping the test sample with a pair of tweezers in wave solder (eutectic solder), check for leaching that may have occurred on the outer electrode. (2) Test samples GRM40 : For flow/reflow soldering T=0.6mm e Dip soldering : After dipping the test sample with a pair of tweezers in static solder (eutectic solder), check for leaching that may have occurred on the outer electrode. r Flux to be used : An ethanol solution of 25 % rosin.
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(3) Acceptance criteria The starting time of leaching shall be defined as the time when the outer electrode has lost 25 % of the total edge length of A-B-C-D as illustrated :
A B D C Outer Electrode
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Reflow Soldering
Soldering Temperature (D) 280 270 260 250 240 230 220 210 0 60 120 180 240 Leaching Starting Time (sec.) Soldering Temperature (D) 280 270 260 250 240 230 220 210 0 10 20 30 40 50 60 Leaching Starting Time (sec.)
DataShee
Flow Soldering
Dip Soldering
Soldering Temperature (D) 280 270 260 250 240 230 220 210 0 10 20 30 40 50 60 Leaching Starting Time (sec.)
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Reference Data GRM SERIES REFERENCE DATA
Continued from the preceding page.
8. Thermal Shock when Making Corrections with a Soldering Iron
(1) Test Method Apply a soldering iron meeting the conditions below to the soldered joint of a chip that has been soldered to a paper phenol board, while supplying wire solder. (Note: the soldering iron tip shall not directly touch the ceramic element of the chip.) (2) Test Samples GRM40 C0G/X7R/Y5V Characteristics T=0.6mm (3) Acceptance Criteria for Defects Observe the appearance of the test sample with a 60-power optical microscope. Those units displaying any breaks cracks shall be determined to be defective. (4) Results
GRM40 C0G (T=0.6)
Incidence of Cracks (D) Incidence of Cracks (D) 100 80 60 40 20 0 200 240 280 320 Soldering Iron Tip Temperature (D) 360 100 80 60 40 20 0 200 240 280 320 Soldering Iron Tip Temperature (D) 360 Soldering lron Duration of Touching : Approx. 3 sec. Paper Phenol Substrate
Mounting Solder
Wire Solder
Soldering Iron Ceramic heater 20W
Tip diameter 3mm
GRM40 X7R (T=0.6)
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GRM40 Y5V (T=0.6)
Incidence of Cracks (D) 100 80 60 40 20 0 200 240 280 320 Soldering Iron Tip Temperature (D) 360
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CHIP MONOLITHIC CERAMIC CAPACITOR
for High-voltage Low Dissipation Type GHM1000 Series
e g e
s Features
1. Murata's original internal electrode structure realizes high Flash-over Voltage. 2. A new monolithic structure for small, surface-mountable devices capable of operating at high-voltage levels. 3. Sn-plated external electrodes allow mounting without silver compound solder. 4. The GHM1030 type for flow and reflow soldering, and other types for reflow soldering. 5. Low-loss and suitable for high-frequency circuits. 6. The temperature characteristics R is high dielectric constant type, and SL is temperature compensating type.
L
W
Part Number
L 3.2 0.2 3.2 0.2 4.5 0.3 4.5 0.3
GHM1030 GHM1035 GHM1038 GHM1040
Dimensions (mm) T e min. +0 1.0 - 0.3 1.6 0.2 +0 1.25 - 0.3 +0 2.5 0.2 1.5 - 0.3 0.3 2.0 0.2 2.0 0.3 +0 2.0 - 0.3 3.2 0.3 +0 2.5 - 0.3 W
g min. 1.5*
s Application
1. Ideal use on high-frequency pulse circuit such as snubber circuit for switching power supply, DC-DC converter, ballast(inverter fluorescent lamp), and so on. (R Characteristics) 2. Ideal for use as the ballast in liquid crystal back lighting inverters. (SL Characteristics)
* SL 2kV : 1.8mm min.
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Part Number GHM1030R101K630 GHM1030R151K630 GHM1030R221K630 GHM1030R331K630 GHM1030R471K630 GHM1030R681K630 GHM1030R102K630 GHM1030R470K1K GHM1030R680K1K GHM1030R101K1K GHM1030R151K1K GHM1030R221K1K GHM1030R331K1K GHM1030R471K1K GHM1030SL100D2K GHM1030SL120J2K GHM1030SL150J2K GHM1030SL180J2K GHM1030SL220J2K GHM1035SL270J2K GHM1035SL330J2K GHM1035SL390J2K GHM1035SL470J2K GHM1035SL560J2K GHM1035SL680J2K GHM1035SL820J2K .com GHM1040SL121J2K Rated Voltage (V) DC630 DC630 DC630 DC630 DC630 DC630 DC630 DC1000 DC1000 DC1000 DC1000 DC1000 DC1000 DC1000 DC2000 DC2000 DC2000 DC2000 DC2000 DC2000 DC2000 DC2000 DC2000 DC2000 DC2000 DC2000 DC2000 TC Code R R R R R R R R R R R R R R SL SL SL SL SL SL SL SL SL SL SL SL SL Capacitance (pF) 100 +10,-10% 150 +10,-10% 220 +10,-10% 330 +10,-10% 470 +10,-10% 680 +10,-10% 1000 +10,-10% 47 +10,-10% 68 +10,-10% 100 +10,-10% 150 +10,-10% 220 +10,-10% 330 +10,-10% 470 +10,-10% 10 +0.5,-0.5pF 12 +5,-5% 15 +5,-5% 18 +5,-5% 22 +5,-5% 27 +5,-5% 33 +5,-5% 39 +5,-5% 47 +5,-5% 56 +5,-5% 68 +5,-5% 82 +5,-5% 120 +5,-5% Length L Width W Thickness T (mm) (mm) (mm) 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 4.5 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 2.5 2.5 2.5 2.5 2.5 2.5 2.5 3.2 1.0 1.0 1.0 1.0 1.25 1.25 1.25 1.0 1.0 1.0 1.0 1.0 1.0 1.25 1.25 1.25 1.25 1.25 1.25 1.5 1.5 1.5 1.5 1.5 1.5 1.5 2.0 Electrode g (mm) 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.8 min. 1.8 min. 1.8 min. 1.8 min. 1.8 min. 1.8 min. 1.8 min. 1.8 min. 1.8 min. 1.8 min. 1.8 min. 1.8 min. 2.9 min. Electrode e (mm) 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min.
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1.8
2.9
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C02E6.pdf 00.7.18
Part Number GHM1040SL151J2K GHM1040SL181J2K GHM1040SL221J2K GHM1038SL100D3K GHM1038SL120J3K GHM1038SL150J3K GHM1038SL180J3K GHM1038SL220J3K GHM1038SL270J3K GHM1038SL330J3K GHM1038SL390J3K GHM1038SL470J3K GHM1038SL560J3K GHM1038SL680J3K GHM1038SL820J3K GHM1040SL101J3K
Rated Voltage (V) DC2000 DC2000 DC2000 DC3150 DC3150 DC3150 DC3150 DC3150 DC3150 DC3150 DC3150 DC3150 DC3150 DC3150 DC3150 DC3150
TC Code SL SL SL SL SL SL SL SL SL SL SL SL SL SL SL SL
Capacitance (pF) 150 +5,-5% 180 +5,-5% 220 +5,-5% 10 +0.5,-0.5pF 12 +5,-5% 15 +5,-5% 18 +5,-5% 22 +5,-5% 27 +5,-5% 33 +5,-5% 39 +5,-5% 47 +5,-5% 56 +5,-5% 68 +5,-5% 82 +5,-5% 100 +5,-5%
Length L Width W Thickness T (mm) (mm) (mm) 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 3.2 3.2 3.2 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 3.2 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.5
Electrode g (mm) 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min. 2.9 min.
Electrode e (mm) 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min.
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Specifications and Test Methods
Specification No. Item Temperature Compensating Type (SL Char.) Y55 to W125D No defects or abnormalities. Within the specified dimension. High Dielectric Constant Type (R Char.)
Specifications and Test Methods
Test Method
1 2 3
Operating Temperature Range Appearance Dimensions
Visual inspection. Using calipers. No failure shall be observed when voltage in Table is applied between the terminations for 1 to 5 s, provided the charge/ discharge current is less than 50mA. Rated voltage Test voltage More than DC 1kV 120% of the rated voltage Less than DC 1kV 150% of the rated voltage The insulation resistance shall be measured with 500T50V and within 60T5 s of charging. The capacitance/Q/D.F. shall be measured at 20D at the frequency and voltage shown as follows. (1) Temperature Compensating Type Frequency : 1T0.2MHz Voltage : 0.5 to 5V (r.m.s.) (2) High Dielectric Constant Type Frequency : 1T0.2kHz Voltage : 1T0.2V (r.m.s.) (1) Temperature Compensating Type The temperature coefficient is determined using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5 (W20 to W85 D) the capacitance shall be within the specified tolerance for the temperature coefficient. Step 1 Temperature(D) 20T2 Min. Operating Temp.T3 20T2 Max. Operating Temp.T2
4
Dielectric Strength
No defects or abnormalities.
5 6
Insulation Resistance (I.R.) Capacitance
More than 10,000M Within the specified tolerance.
7
Q/ Dissipation Factor (D.F.)
CU30pF : QU1,000 CF30pF : QU400W20C C : Nominal Capacitance (pF)
D.F.V0.01
8
Capacitance Temperature Characteristics
Temp. Coefficient W350 to Y1,000 ppm/D (Temp. Range : W20 to W85D)
Cap. Change .com Within T15%
2 3 4
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5 20T2 (2) High Dielectric Constant Type The range of capacitance change compared to the 20D value within Y55 to W125D shall be within the specified range. #Pretreatment Perform a heat treatment at 150 W0 D for 60T5 min and Y10 then let sit for 24T2 h at room condition. Solder the capacitor to the testing jig (glass epoxy board) shown in Fig.1 using a eutectic solder. Then apply 10N force in the direction of the arrow. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
10N, 10T1s Speed : 1.0mm/s Glass Epoxy Board
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Adhesive Strength of Termination
No removal of the terminations or other defect shall occur.
Fig.1 Appearance Capacitance No defects or abnormalities. Within the specified tolerance. Solder the capacitor to the test jig (glass epoxy board). The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 min. This motion shall be applied for a period of 2 h in each 3 mutually perpendicular directions (total of 6 h). D.F.V0.01
13
10
Vibration Resistance Q/D.F.
30pF min. : QU1,000 30pF max. : QU400W20C C : Nominal Capacitance (pF)
Solder resist Cu Glass Epoxy Board
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Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
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Specifications and Test Methods
Continued from the preceding page.
Specifications and Test Methods
Specification No. Item Temperature Compensating Type (SL Char.) High Dielectric Constant Type (R Char.) Test Method
No cracking or marking defects shall occur.
TR S QT S Q , R , T S
d c 40
b
4.5
Solder the capacitor to the testing jig (glass epoxy board) shown in Fig.2 using a eutectic solder. Then apply a force in the direction shown in Fig.3. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
20 50 Pressurizing speed : 1.0mm/s Pressurize R230 Flexure=1 Capacitance meter 45 45
11
Deflection
a
100
t : 1.6
LZW (mm) 3.2Z1.6 3.2Z2.5 4.5Z2.0 4.5Z3.2
a 2.2 2.2 3.5 3.5
Dimension (mm) b c 2.0 5.0 2.9 5.0 2.4 7.0 3.7 7.0
d
1.0
(in mm)
Fig.3
Fig.2 Solderability of Termination Appearance Capacitance Change Resistance 13 to Soldering Heat Q/D.F. I.R. Dielectric Strength Appearance Capacitance Change Q/D.F. 75% of the terminations are to be soldered evenly and continuously. No marking defects. Within T2.5% or T0.25pF (Whichever is larger) CU30pF : QU1,000 CF30pF : QU400W20C C : Nominal Capacitance (pF) More than 10,000M Within T10% Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in eutectic solder solution for 2T0.5 s at 235T5D. Immersing speed : 25T2.5mm/s Preheat the capacitor at 120 to 150D* for 1 min. Immerse the capacitor in eutectic solder solution at 260T5D for 10T1 s. Let sit at room condition for 24T2 h, then measure. #Immersing speed : 25T2.5mm/s #Pretreatment for high dielectric constant type Perform a heat treatment at 150 W0 D for 60T5 min and then Y10 let sit for 24T2 h at room condition. *Preheating for more than 3.2Z2.5mm Step 1 2 Temperature 100D to 120D 170D to 200D Time 1 min. 1 min.
12
D.F.V0.01
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Pass the item No.4. No marking defects. Within T2.5% or T0.25pF (Whichever is larger) CU30pF : QU1,000 CF30pF : QU400W20C C : Nominal Capacitance (pF) More than 10,000M Within T10%
D.F.V0.01
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I.R. Temperature Cycle
Fix the capacitor to the supporting jig (glass epoxy board) shown in Fig.4 using a eutectic solder. Perform the five cycles according to the four heat treatments listed in the following table. Let sit for 24T2 h at room condition, then measure. Time (min) Temperature (D) Step 1 Min. Operating Temp.T3 30T3 2 Room Temp. 2 to 3 3 Max. Operating Temp.T2 30T3 4 Room Temp. 2 to 3 #Pretreatment for high dielectric constant type Perform a heat treatment at 150 W0 D for 60T5 min and then Y10 let sit for 24T2 h at room condition.
DataShee
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Dielectric Strength
Pass the item No.4.
Solder resist Cu
13
Appearance Capacitance Change 15 Humidity (Steady State) Q/D.F. I.R. Dielectric Strength No marking defects. Within T5.0% or T0.5pF (Whichever is larger) CU30pF : QU350 CF30pF : QU275W 5 C 2 C : Nominal Capacitance (pF) More than 1,000M Pass the item No.4. Within T10%
Glass Epoxy Board
Fig.4
D.F.V0.01
Sit the capacitor at 40T2D and relative humidity 90 to 95% for 500 W24 h. Y00 Remove and let sit for 24T2 h at room condition, then measure. #Pretreatment for high dielectric constant type Perform a heat treatment at 150 W00 D for 60T5 min and then Y10 let sit for 24T2 h at room condition.
"Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
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Specifications and Test Methods
Continued from the preceding page.
Specifications and Test Methods
Specification No. Item Temperature Compensating Type (SL Char.) No marking defects. Within T3.0% or T0.3pF (Whichever is larger) CU30pF : QU350 CF30pF : QU275W 5 C 2 C : Nominal Capacitance (pF) More than 1,000M Pass the item No.4. Within T10% High Dielectric Constant Type (R Char.) Test Method
Appearance Capacitance Change 16 Life Q/D.F. I.R. Dielectric Strength
D.F.V0.02
Apply the voltage in following table for 1,000 W48 at maximum Y00 operating temperatureT3D. Remove and let sit for 24T2 h at room condition, then measure. The charge/discharge current is less than 50mA. #Pretreatment for high dielectric constant type Apply test voltage for 60T5 min at test temperature. Remove and let sit for 24T2 h at room condition. Rated voltage Test voltage More than DC 1kV Rated voltage Less than DC 1kV 120% of the rated voltage
"Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
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CHIP MONOLITHIC CERAMIC CAPACITOR
for High-voltage High-capacitance Type GHM1500 Series
0.3 min. g 0.3 min.
s Features
1. A new monolithic structure for small, high-capacitance capable of operating at high-voltage levels. 2. Sn-plated external electrodes allow mounting without silver compound solder. 3. The GHM1525 and GHM1530 type for flow and reflow soldering, and other types for reflow soldering.
T L W
Part Number GHM1525 GHM1530 GHM1535
L 2.0 0.2 3.2 0.2 3.2 0.3
s Application
1. Ideal use as hot-cold coupling for DC-DC converter. 2. Ideal use on line filter and ringer detector for telephone, facsimile and modem. 3. Ideal use on diode-snubber circuit for switching power supply.
GHM1540
4.5 0.4
GHM1545
5.7 0.4
Dimensions (mm) W T 1.0 +0,-0.3 1.25 0.2 1.25 0.2 1.0 +0,-0.3 1.25 +0,-0.3 1.6 0.2 1.6 0.2 1.5 +0,-0.3 2.5 0.2 2.0 +0,-0.3 1.5 +0,-0.3 2.0 +0,-0.3 3.2 0.3 2.5 +0,-0.3 2.6 +0,-0.3 2.0 +0,-0.3 5.0 0.4 2.7 +0,-0.3
g min. 0.7
1.5
2.5
3.5
Part Number GHM1525B102K250 GHM1525B152K250 GHM1525B222K250 GHM1525B332K250 GHM1525B472K250 GHM1525B682K250 GHM1525B103K250 GHM1530B153K250 GHM1530B223K250 GHM1530B333K250 GHM1530B473K250 GHM1535B683K250 GHM1535B104K250 GHM1540B154K250 GHM1540B224K250 GHM1545B334K250 GHM1545B474K250 GHM1530B102K630 GHM1530B152K630 GHM1530B222K630 GHM1530B332K630 GHM1530B472K630 GHM1530B682K630 GHM1530B103K630
Rated Voltage (V) DC250 DC250 DC250 DC250 DC250 DC250 DC250 DC250 DC250 DC250 DC250 DC250 DC250 DC250 DC250 DC250 DC250 DC630 DC630 DC630 DC630 DC630 DC630 DC630 DC630 DC630 DC630 DC630 DC630 DC630 DC630 DC630
TC Code B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B
Capacitance 1000pF +10,-10% 1500pF +10,-10% 2200pF +10,-10% 4700pF +10,-10% 6800pF +10,-10% 10000pF +10,-10% 15000pF +10,-10% 22000pF +10,-10% 33000pF +10,-10% 47000pF +10,-10% 68000pF +10,-10% 0.1F +10,-10% 0.15F +10,-10% 0.22F +10,-10% 0.33F +10,-10% 0.47F +10,-10% 1000pF +10,-10% 1500pF +10,-10% 2200pF +10,-10% 3300pF +10,-10% 4700pF +10,-10% 6800pF +10,-10% 10000pF +10,-10% 15000pF +10,-10% 22000pF +10,-10% 33000pF +10,-10% 47000pF +10,-10% 68000pF +10,-10% 0.1F +10,-10% 0.15F +10,-10% 0.22F +10,-10%
Length L Width W Thickness T (mm) (mm) (mm) 2.0 2.0 2.0 2.0 2.0 2.0 3.2 3.2 3.2 3.2 3.2 3.2 4.5 4.5 5.7 5.7 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 3.2 4.5 4.5 4.5 4.5 5.7 5.7 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.6 1.6 1.6 1.6 2.5 2.5 3.2 3.2 5.0 5.0 1.6 1.6 1.6 1.6 1.6 1.6 1.6 2.5 2.5 3.2 3.2 3.2 3.2 5.0 5.0 1.0 1.0 1.0 1.0 1.0 1.0 1.25 1.0 1.0 1.25 1.6 1.5 2.0 2.0 2.5 2.0 2.0 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.5 1.5 1.5 1.5 2.0 2.6 2.0 2.7
Electrode g (mm) 0.7 min. 0.7 min. 0.7 min. 0.7 min. 0.7 min. 0.7 min. 0.7 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 2.9 min. 2.9 min. 3.5 min. 3.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 1.5 min. 2.5 min. 2.5 min. 2.5 min. 2.5 min. 3.5 min. 3.5 min.
Electrode e (mm) 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min.
3300pF +10,-10% .com 2.0
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DataShee
14
GHM1535B153K630 GHM1535B223K630 GHM1540B333K630 GHM1540B473K630 GHM1540B683K630 GHM1540B104K630 GHM1545B154K630
GHM1545B224K630 .com
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This is the PDF file of catalog No.C02E-6
C02E6.pdf 00.7.18
Specifications and Test Methods
No. 1 2 3 Item Operating Temperature Range Appearance Dimensions Y55 to W125D No defects or abnormalities. Within the specified dimensions. Specification
Specifications and Test Methods
Test Method Y Visual inspection. Using calipers. No failure shall be observed when 150% of the rated voltage (200% of the rated voltage in case of rated voltage: DC 250V) is applied between the terminations for 1 to 5 s, provided the charge/discharge current is less than 50mA. The insulation resistance shall be measured with 500T50V (250T50V in case of rated voltage: DC 250V) and within 60T5 s of charging. The capacitance/D.F. shall be measured at 20D at a frequency of 1T0.2kHz and a voltage of 1T0.2V (r.m.s.) The range of capacitance change compared with the 20D value within Y25 to W85D shall be within the specified range. #Pretreatment Perform a heat treatment at 150 W0 D for 60T5 min and then Y10 let sit for 24T2 h at room condition. Solder the capacitor to the testing jig (glass epoxy board) shown in Fig.1 using a eutectic solder. Then apply 10N force in the direction of the arrow. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
10N, 10T1s Speed : 1.0mm/s Glass Epoxy Board
4
Dielectric Strength
No defects or abnormalities.
5 6 7
Insulation Resistance (I.R.) Capacitance Dissipation Factor (D.F.) Capacitance Temperature Characteristics
CU0.01F : More than 100M * F CF0.01F : More than 10,000M Within the specified tolerance. 0.025 max.
8
Cap. Change Within T10% (Temp. Range : Y25 to W85D)
9
Adhesive Strength of Termination
No removal of the terminations or other defect shall occur.
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Appearance Capacitance No defects or abnormalities. Within the specified tolerance.
Fig.1 Solder the capacitor to the test jig (glass epoxy board). The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 min. This motion shall be applied for a period of 2 h in each 3 mutually perpendicular directions (total of 6 h).
10
Vibration Resistance D.F. 0.025 max.
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DataShee
Solder resist Cu Glass Epoxy Board
No cracking or marking defects shall occur.
TR S QT S Q , R , T S
d c
b
4.5
Solder the capacitor to the testing jig (glass epoxy board) shown in Fig.2 using a eutectic solder. Then apply a force in the direction shown in Fig.3. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
20 50 Pressurizing speed : 1.0mm/s Pressurize R230 Flexure=1 Capacitance meter 45 45
11
Deflection
a
100
t : 1.6
LZW (mm) 2.0Z1.25 3.2Z1.60 3.2Z2.50 4.5Z3.20 5.7Z5.00
a 1.2 2.2 2.2 3.5 4.5
Dimension (mm) b c 1.65 4.0 2.05 5.0 2.95 5.0 3.75 7.0 5.65 8.0
40
d
14
(in mm)
1.0
Fig.3
Fig.2 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
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C02E6.pdf 00.7.18
Specifications and Test Methods
Continued from the preceding page.
Specifications and Test Methods
Test Method Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in eutectic solder solution for 2T0.5 s at 235T5D. Immersing speed : 25T2.5mm/s Preheat the capacitor at 120 to 150D* for 1 min. Immerse the capacitor in eutectic solder solution at 260T5D for 10T1 s. Let sit at room condition for 24T2 h, then measure. #Immersing speed : 25T2.5mm/s #Pretreatment Perform a heat treatment at 150 W00 D for 60T5 min and then Y10 let sit for 24T2 h at room condition. *Preheating for more than 3.2Z2.5mm
No.
Item
Specification
12
Solderability of Termination Appearance Capacitance Change D.F.
75% of the terminations is to be soldered evenly and continuously.
No marking defects. Within T10% 0.025 max. CU0.01F : More than 100M * F CF0.01F : More than 10,000M
Resistance 13 to Soldering Heat
I.R.
Dielectric Strength
Pass the item No.4.
Step 1 2
Temperature 100D to 120D 170D to 200D
Time 1 min. 1 min.
Appearance Capacitance Change D.F. I.R.
No marking defects. Within T7.5% 0.025 max. CU0.01F : More than 100M * F CF0.01F : More than 10,000M
14
Temperature Cycle
Fix the capacitor to the supporting jig (glass epoxy board) shown in Fig.4 using a eutectic solder. Perform the five cycles according to the four heat treatments listed in the following table. Let sit for 24T2 h at room condition, then measure. Time (min) Temperature (D) Step 30T3 Min. Operating Temp.T3 1 2 to 3 Room Temp. 2 30T3 Max. Operating Temp.T2 3 2 to 3 Room Temp. 4 #Pretreatment Perform a heat treatment at 150 W00 D for 60T5 min and then Y10 let sit for 24T2 h at room condition.
Dielectric Strength
Pass the item No.4.
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Glass Epoxy Board
Solder resist Cu
Fig.4 Appearance Capacitance Change No marking defects. Within T15% 0.05 max. CU0.01F : More than 10M * F CF0.01F : More than 1,000M Pass the item No.4. No marking defects. Within T15% 0.05 max. CU0.01F : More than 10M * F CF0.01F : More than 1,000M Pass the item No.4. No marking defects. Within T15% 0.05 max. CU0.01F : More than 10M * F CF0.01F : More than 1,000M Pass the item No.4. Apply the rated voltage at 40T2D and relative humidity 90 to 95% for 500 W24 h. Y00 Remove and let sit for 24T2 h at room condition, then measure. #Pretreatment Apply test voltage for 60T5 min at test temperature. Remove and let sit for 24T2 h at room condition. Apply 120% of the rated voltage (150% of the rated voltage in case of rated voltage: DC250V) for 1,000 W48 h at maximum Y00 operating temperatureT3D. Remove and let sit for 24 T2 h at room condition, then measure. The charge/discharge current is less than 50mA. #Pretreatment Apply test voltage for 60T5 min at test temperature. Remove and let sit for 24T2 h at room condition. Sit the capacitor at 40T2D and relative humidity 90 to 95% for 500 W24 h. Y00 Remove and let sit for 24T2 h at room condition, then measure. #Pretreatment Perform a heat treatment at 150 W00 D for 60T5 min and then Y10 let sit for 24T2 h at room condition.
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Humidity (Steady State)
D.F. I.R. Dielectric Strength Appearance Capacitance Change
DataShee
16
Life
D.F. I.R. Dielectric Strength Appearance
14
17 Humidity Loading
Capacitance Change D.F. I.R. Dielectric Strength
"Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
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This is the PDF file of catalog No.C02E-6
C02E6.pdf 00.7.18
CHIP MONOLITHIC CERAMIC CAPACITOR
for High-voltage GHM2000 Series AC250V r.m.s.
s Features
1. Chip monolitic ceramic capacitor for AC line. 2. A new monolithic structure for small, high-capacitance capable of operating at high-voltage levels. 3. Sn-plated external electrodes allow mounting without silver compound solder. 4. Only for Reflow soldering. 5. Capacitance 0.01 to 0.1 uF for connecting lines and 470 to 4700 pF for connecting line to earth.
e g e
L
W
Part Number GHM2143 GHM2145 GHM2243
L 5.7 0.4
s Application
Noise suppression filters for switching power supplies, telephones, facsimiles, modems.
Dimensions (mm) W T e min. 2.8 0.3 5.0 0.4 2.0 0.3 0.3 2.8 0.3
g min. 3.5
s Reference Standard
JIS C 5102 JIS C 5150 The standards of the electrical appliance and material control law of Japan, separated table 4.
Rated Voltage (V) Length L Width W Thickness T (mm) (mm) (mm) 2.8 2.8 2.8 2.8 2.8 2.8 2.8 5.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 Electrode g (mm) 3.5 min. 3.5 min. 3.5 min. 3.5 min. 3.5 min. 3.5 min. 3.5 min. 3.5 min. Electrode e (mm) 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min.
Part Number
TC Code B B B B B B B B
Capacitance
GHM2243B471MAC250 AC250 (r.m.s.) GHM2243B102MAC250 AC250 (r.m.s.) GHM2243B222MAC250 AC250 (r.m.s.) GHM2243B472MAC250 AC250 (r.m.s.) GHM2143B103MAC250 AC250 (r.m.s.) GHM2143B223MAC250 AC250 (r.m.s.) GHM2143B473MAC250 AC250 (r.m.s.) GHM2145B104MAC250 AC250 (r.m.s.)
470pF +20,-20% .com 5.7 1000pF +20,-20% 2200pF +20,-20% 4700pF +20,-20% 10000pF +20,-20% 22000pF +20,-20% 47000pF +20,-20% 0.1F +20,-20% 5.7 5.7 5.7 5.7 5.7 5.7 5.7
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DataShee
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This is the PDF file of catalog No.C02E-6
C02E6.pdf 00.7.18
Specifications and Test Methods Specifications and Test Methods
No. 1 2 3 Item Operating Temperature Range Appearance Dimensions Y25 to W85D No defects or abnormalities. Within the specified dimensions. Visual inspection. Using calipers. No failure shall be observed when voltage as table is applied between the terminations for 60T1 s, provided the charge/discharge current is less than 50mA. Test voltage AC575V (r.m.s.) GHM21xx AC1500V (r.m.s.) GHM22xx The insulation resistance shall be measured with 500T50V and within 60T5 s of charging. The capacitance/D.F. shall be measured at 20D at a frequency of 1T0.2kHz and a voltage of 1T0.2V (r.m.s.) The range of capacitance change compared with the 20D value within Y25 to W85D shall be within the specified range. #Pretreatment Perform a heat treatment at 150 W00 D for 60T5 min and then Y10 let sit for 24T2 h at room condition. As in Fig., discharge is made 50 times at 5 s intervals from the capacitor(Cd) charged at DC voltage of specified.
R3 R1
Specification
Test Method Y
4
Dielectric Strength
No defects or abnormalities.
5 6 7
Insulation Resistance (I.R.) Capacitance Dissipation Factor (D.F.) Capacitance Temperature Characteristics
More than 2,000M Within the specified tolerance. 0.025 max.
8
Cap. Change Within T10%
9
Discharge Test (Application: GHM22xx)
Appearance
No defects or abnormalities.
10kV V Cd
Ct
R2
.com
Ct : Capacitor under test Cd : 0.001F R1 : 1,000 R2 : 100M R3 : Surge resistance Solder the capacitor to the testing jig (glass epoxy board) shown in Fig.1 using a eutectic solder. Then apply 10N force in the direction of the arrow. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
10N, 10T1s Speed : 1.0mm/s Glass Epoxy Board
10
Adhesive Strength of Termination
No removal of the terminations or other defect shall occur.
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Fig.1 Appearance Capacitance No defects or abnormalities. Within the specified tolerance.
DataShee
11
Vibration Resistance D.F. 0.025 max.
Solder the capacitor to the test jig (glass epoxy board). The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 min. This motion shall be applied for a period of 2 h in each 3 mutually perpendicular directions (total of 6 h).
Solder resist Cu Glass Epoxy Board
"Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
Continued on the following page.
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This is the PDF file of catalog No.C02E-6
C02E6.pdf 00.7.18
Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specification
Test Method Solder the capacitor to the testing jig (glass epoxy board) shown in Fig.2 using a eutectic solder. Then apply a force in the direction shown in Fig. 3. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
20 50 Pressurizing speed : 1.0mm/s Pressurize R230 Flexure=1 Capacitance meter 45 45
No cracking or marking defects shall occur.
12
TR S QT S Q , R , T S
d c
b
4.5
Deflection
a
100
t : 1.6
LZW (mm) 5.7Z2.8 5.7Z5.0
a 4.5 4.5
Dimension (mm) b c 8.0 3.2 8.0 5.6
40
d
1.0
(in mm)
Fig.2 Solderability of Termination Appearance Capacitance Change 14 Humidity Insulation D.F. I.R. Dielectric Strength Appearance Capacitance Change D.F. Resistance 15 to Soldering Heat I.R.
Fig.3 Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in eutectic solder solution for 2T0.5 s at 235T5D. Immersing speed : 25T2.5mm/s
13
75% of the terminations is to be soldered evenly and continuously.
No marking defects. Within T15% 0.05 max. More than 1,000M Pass the item No.4. No marking defects. Within T10% 0.025 max. More than 2,000M Preheat the capacitor as table. Immerse the capacitor in eutectic solder solution at 260T5D for 10T1 s. Let sit at room condition for 24T2 h, then measure. #Immersing speed : 25T2.5mm/s #Pretreatment Perform a heat treatment at 150 W00 D for 60T5 min and then Y10 let sit for 24T2 h at room condition. *Preheating Pass the item No.4. Step 1 2 Temperature 100D to 120D 170D to 200D Time 1 min. 1 min. The capacitor shall be subjected to 40T2D, relative humidity of 90 to 98% for 8 h, and then removed in room condition for 16 h until 5 cycles.
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Dielectric Strength
Appearance
No marking defects. Within T7.5% 0.025 max. More than 2,000M
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Capacitance Change D.F. I.R.
16
Temperature Cycle Dielectric Strength
Fix the capacitor to the supporting jig (glass epoxy board) shown in Fig.4 using a eutectic solder. Perform the five cycles according to the four heat treatments listed in the following table. Let sit for 24T2 h at room condition, then measure. Time (min) Temperature (D) Step 1 Min. Operating Temp.T3 30T3 2 Room Temp. 2 to 3 3 Max. Operating Temp.T2 30T3 4 Room Temp. 2 to 3 #Pretreatment Perform a heat treatment at 150 W00 D for 60T5 min and then Y10 let sit for 24T2 h at room condition.
DataShee
Pass the item No.4.
Solder resist Cu Glass Epoxy Board
Fig.4 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
Continued on the following page.
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C02E6.pdf 00.7.18
Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item Appearance Capacitance Change D.F. I.R. Dielectric Strength Appearance Capacitance Change D.F. No marking defects. Within T15% 0.05 max. More than 1,000M Pass the item No.4. No marking defects. Within T15% 0.05 max. More than 1,000M
Specification
Test Method
17
Humidity (Steady State)
Sit the capacitor at 40T2D and relative humidity 90 to 95% for 500 W24 h. Y00 Remove and let sit for 24T2 h at room condition, then measure. #Pretreatment Perform a heat treatment at 150 W00 D for 60T5 min and then Y10 let sit for 24T2 h at room condition.
Apply voltage and time as Table at 85T2D. Remove and let sit for 24 T2 h at room condition, then measure. The charge / discharge current is less than 50mA. GHM21xx GHM22xx Test Time 1,000W48 h Y10 1,500W48 h Y10 Test voltage AC300V (r.m.s.) AC500V (r.m.s.) *
18
Life
I.R.
* Except that once each hour the voltage is increased to AC1,000V (r.m.s.) for 0.1 s Dielectric Strength Pass the item No.4. #Pretreatment Apply test voltage for 60T5 min at test temperature. Remove and let sit for 24T2 h at room condition.
Appearance Capacitance Change 19 Humidity Loading D.F. I.R. Dielectric Strength
No marking defects. Within T15% 0.05 max. More than 1,000M Pass the item No.4. Apply the rated voltage at 40T2D and relative humidity 90 to 95% for 500 W24 h. Y00 Remove and let sit for 24T2 h at room condition, then measure. #Pretreatment Apply test voltage for 60T5 min at test temperature. Remove and let sit for 24T2 h at room condition.
"Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
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C02E6.pdf 00.7.18
CHIP MONOLITHIC CERAMIC CAPACITOR
for High-voltage GHM3000 Series Safety Recognized
s Features
1. Chip monolitic ceramic capacitor (certified as conforming to safety standards) for AC line. 2. A new monolithic structure for small, high-capacitance capable of operating at high-voltage levels. 3. Compared to lead type capacitors, this new capacitor is greatly downsized and low-profiled to 1/10 or less in volume, and 1/4 or less in height. 4. The type GB can be used as an X2-class capacitor. 5. The type GC can be used as an X1-class and Y2-class capacitor. 6. +125 degree C guaranteed. 7. Only for reflow soldering.
e g e
L
W
Part Number GHM3045 GHM3145
L 5.7 0.4
Dimensions (mm) T e min. 2.0 0.3 5.0 0.4 2.0 0.3 0.3 2.7 0.3 W
g min. 4.0
s Standard Recognition
Status of Recognition Standard No. Type GB UL BSI VDE EN132400 SEV AC250V (r.m.s.) UL1414 Type GC Rated Voltage
s Application
1. Ideal use as Y capacitor or X capacitor for various switching power supply. 2. Ideal use as linefilter for MODEM.
SEMKO .com EN132400 Class
: Line By Pass only
X2
X1, Y2
GC Type
Part Number Rated Voltage (V) AC250 (r.m.s.) AC250 (r.m.s.) AC250 (r.m.s.) AC250 (r.m.s.) AC250 (r.m.s.) AC250 (r.m.s.) AC250 (r.m.s.) AC250 (r.m.s.) AC250 (r.m.s.) AC250 (r.m.s.) AC250 (r.m.s.) TC Code X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R Capacitance (pF) 100 +10,-10% 150 +10,-10% 220 +10,-10% 330 +10,-10% 470 +10,-10% 680 +10,-10% 1000 +10,-10% 1500 +10,-10% 2200 +10,-10% 3300 +10,-10% 4700 +10,-10% Length L Width W Thickness T (mm) (mm) (mm) 5.7 5.7 5.7 5.7 5.7 5.7 5.7 5.7 5.7 5.7 5.7 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 Electrode g (mm) 4.0 min. 4.0 min. 4.0 min. 4.0 min. 4.0 min. 4.0 min. 4.0 min. 4.0 min. 4.0 min. 4.0 min. 4.0 min. Electrode e (mm) 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min. 0.3 min.
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GHM3045X7R101K-GC GHM3045X7R151K-GC GHM3045X7R221K-GC GHM3045X7R331K-GC GHM3045X7R471K-GC GHM3045X7R681K-GC GHM3045X7R102K-GC GHM3045X7R152K-GC GHM3045X7R222K-GC GHM3045X7R332K-GC GHM3045X7R472K-GC
DataShee
GB Type
Part Number GHM3145X7R103K-GB GHM3145X7R153K-GB GHM3145X7R223K-GB GHM3145X7R333K-GB .com Rated Voltage (V) AC250 (r.m.s.) AC250 (r.m.s.) AC250 (r.m.s.) AC250 (r.m.s.) TC Code X7R X7R X7R X7R Capacitance (pF) 10000 +10,-10% 15000 +10,-10% 22000 +10,-10% 33000 +10,-10% Length L Width W Thickness T (mm) (mm) (mm) 5.7 5.7 5.7 5.7 5.0 5.0 5.0 5.0 2.0 2.0 2.0 2.7 Electrode g (mm) 4.0 min. 4.0 min. 4.0 min. 4.0 min. Electrode e (mm) 0.3 min. 0.3 min. 0.3 min. 0.3 min.
Dielectric Strength: DC1075V, 60+/- 1s.
16
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This is the PDF file of catalog No.C02E-6
C02E6.pdf 00.7.18
Specifications and Test Methods Specifications and Test Methods
No. 1 2 3 Item Operating Temperature Range Appearance Dimensions Y55 to W125D No defects or abnormalities. Within the specified dimensions. Visual inspection. Using calipers. No failure shall be observed when voltage as table is applied between the terminations for 60T1 s, provided the charge/discharge current is less than 50mA. Test voltage DC1075V Type GB AC1500V (r.m.s.) Type GC The insulation resistance shall be measured with 500T50V and within 60T5 s of charging. The capacitance/D.F. shall be measured at 20D at a frequency of 1T0.2kHz and a voltage of 1T0.2V (r.m.s.) The range of capacitance change compared with the 25D value within Y55 to W125D shall be within the specified range. #Pretreatment Perform a heat treatment at 150 W00 D for 60T5 min and then Y10 let sit for 24T2 h at room condition. As in Fig., discharge is made 50 times at 5 s intervals from the capacitor(Cd) charged at DC voltage of specified.
R3 R1
Specification
Test Method Y
4
Dielectric Strength
No defects or abnormalities.
5 6 7
Insulation Resistance (I.R.) Capacitance Dissipation Factor (D.F.) Capacitance Temperature Characteristics Appearance I.R. Discharge Test (Application: Type GC)
More than 6,000M Within the specified tolerance. 0.025 max.
8
Cap. Change Within T15%
No defects or abnormalities. More than 1,000M
9
Dielectric Strength
10kV
Pass the item No.4.
V
Ct Cd
R2
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Ct : Capacitor under test Cd : 0.001F R1 : 1,000 R2 : 100M R3 : Surge resistance Solder the capacitor to the testing jig (glass epoxy board) shown in Fig.1 using a eutectic solder. Then apply 10N force in the direction of the arrow. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
10N, 10T1s Speed : 1.0mm/s Glass Epoxy Board
10
Adhesive Strength of Termination
No removal of the terminations or other defect shall occur.
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Fig.1 Appearance Capacitance No defects or abnormalities. Within the specified tolerance.
DataShee
11
Vibration Resistance D.F. 0.025 max.
Solder the capacitor to the test jig (glass epoxy board). The capacitor shall be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 min. This motion shall be applied for a period of 2 h in each 3 mutually perpendicular directions (total of 6 h).
Solder resist Cu Glass Epoxy Board
"Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
Continued on the following page.
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specification
Test Method Solder the capacitor to the testing jig (glass epoxy board) shown in Fig.2 using a eutectic solder. Then apply a force in the direction shown in Fig. 3. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock.
20 50 Pressurizing speed : 1.0mm/s Pressurize R230 Flexure=1 Capacitance meter 45 45
No cracking or marking defects shall occur.
12
TR S QT S Q , R , T S
d c
b
4.5
Deflection
a
100
t : 1.6
LZW (mm) 5.7Z5.0
a 4.5
Dimension (mm) b c 8.0 5.6
40
d 1.0
(in mm)
Fig.2
Fig.3 Solderability of Termination Appearance Capacitance Change I.R. Resistance 14 to Soldering Heat Dielectric Strength Pass the item No.4. Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in eutectic solder solution for 2T0.5 s at 235T5D. Immersing speed : 25T2.5mm/s Preheat the capacitor as table. Immerse the capacitor in eutectic solder solution at 260T5D for 10T1 s. Let sit at room condition for 24T2 h, then measure. #Immersing speed : 25T2.5mm/s #Pretreatment Perform a heat treatment at 150 W00 D for 60T5 min and then Y10 let sit for 24T2 h at room condition. *Preheating Step 1 2 No marking defects. Within T15% 0.05 max. More than 3,000M Temperature 100D to 120D 170D to 200D Time 1 min. 1 min.
13
75% of the terminations is to be soldered evenly and continuously.
No marking defects. Within T10% More than 1,000M
Appearance Capacitance Change D.F. I.R.
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Temperature Cycle Dielectric Strength
Fix the capacitor to the supporting jig (glass epoxy board) shown in Fig.4 using a eutectic solder. Perform the five cycles according to the four heat treatments listed in the following table. Let sit for 24T2 h at room condition, then measure. Time (min) Temperature (D) Step 1 Min. Operating Temp.T3 30T3 2 Room Temp. 2 to 3 3 Max. Operating Temp.T2 30T3 4 Room Temp. 2 to 3 #Pretreatment Perform a heat treatment at 150 W00 D for 60T5 min and then Y10 let sit for 24T2 h at room condition.
DataShee
Pass the item No.4.
Solder resist Cu Glass Epoxy Board
Fig.4 Appearance Capacitance Change D.F. I.R. Dielectric Strength No marking defects. Within T15% 0.05 max. More than 3,000M Pass the item No.4. Sit the capacitor at 40T2D and relative humidity 90 to 95% for 500T12 h. Remove and let sit for 24T2 h at room condition, then measure.
16
Humidity (Steady State)
"Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
Continued on the following page.
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Specifications and Test Methods Specifications and Test Methods
Continued from the preceding page.
No.
Item Appearance Capacitance Change D.F. I.R. No marking defects. Within T20% 0.05 max. More than 3,000M
Specification
Test Method Impulse Voltage Each individual capacitor shall be subjected to a 2.5kV (Type GC:5kV) Impulses (the voltage value means zero to peak) for three times. Then the capacitors are applied to life test.
100 (%) 90 50 30 0 T T2
T1=1.2s=1.67T T2=50s
t
17
Life
Dielectric Strength
Pass the item No.4.
Apply voltage as Table for 1,000 h at 125 W2 D, relative humidity Y0 50% max. Type Applied voltage AC312.5V (r.m.s.), except that once each hour the GB voltage is increased to AC1,000V (r.m.s.) for 0.1s. AC425V (r.m.s.), except that once each hour the GC voltage is increased to AC1,000V (r.m.s.) for 0.1s.
Appearance Capacitance Change 18 Humidity Loading D.F. I.R. Dielectric Strength
No marking defects. Within T15% 0.05 max. More than 3,000M Pass the item No.4. Apply the rated voltage at 40T2D and relative humidity 90 to 95% for 500 W24 h. Remove and let sit for 24T2 h at room Y00 condition, then measure.
"Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
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GHM Series Data
s Capacitance-Temperature Characteristics
GHM1000/1500/2000 Series
20 15 20 10 Cap. Change [%] Cap. Change (%) 10 Type G C ( 681) 0 Type G B Type G C (102 ) -10 X7R Char. Spec.(lower) -20 -15 -20 -60 -30 -40 -20 0 20 40 60 Temperature [] 80 100 120 140 -60 -40 -20 0 20 40 60 Temperature (C) 80 100 120 140 5 0 -5 X7R Char. Spec.(upper) 30
GHM3000 Series
B SL R
-10
s Impedance-Frequency Characteristics
GHM1000 Series(SL)
100k 10k
GHM1000 Series(R)
10k 10pF 22pF 47pF Z [ohm]
1k 100pF 220pF 100
1k Z [ohm]
100 100pF 220pF 10
10 470pF 1000pF 1
1
100m
100m 1M
10M
100M Frequency [Hz]
1G
3G
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10m 1M
10M 100M Frequency [Hz]
1G
GHM1500 Series
1k 1k
GHM2000 Series
100
100 1000pF 1000pF
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10 Z [ohm]
DataShee
10 10000pF 100000pF Z [ohm] 100000pF 1 10000pF
1
100m
100m
10m 1M
10M
100M Frequency [Hz]
1G
10m 1M
10M
100M Frequency [Hz]
1G
Continued on the following page.
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GHM Series Data
Continued from the preceding page.
s Impedance-Frequency Characteristics
GHM3000 Series(GC Type)
1000 1000
GHM3000 Series(GB Type)
100
100
10 Z (ohm) Z (ohm) 1 4.7nF 0.1 0.68nF
10
1
10nF 0.1 33nF
0.01 1 10 Frequency (MHz) 100 1000
0.01 1 10 Frequency (MHz) 100 1000
s Capacitance-AC Voltage Characteristics
GHM3000 Series(GC Type)
60 at Room Condition (25C) 4.7nF 40 40 60
GHM3000 Series(GB Type)
at Room Condition (25C)
Cap. Change (%)
0.68nF 0
Cap. Change (%)
20
20
0
-20
-20
-40
-40
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-60 0 100 200 300 AC-Voltage [V(r.m.s.)] 400 500 -60 0 100 200 300 AC-Voltage [V(r.m.s.)] 400 500
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PACKAGE
Taping is standard packaging method.
Package
s Minimum Quantity Guide
Part Number L GHM1030 GHM1035 GHM1038 GHM1040 GHM1525 3.2 3.2 4.5 4.5 2.0 Dimensions (mm) W 1.6 2.5 2.0 3.2 1.25 T 1.0 1.25 1.5 2.0 2.0 2.5 1.0 1.25 1.0 High-voltage GHM1530 3.2 1.6 1.25 1.6 GHM1535 3.2 2.5 1.5 2.0 1.5 GHM1540 4.5 3.2 2.0 2.5 2.6 GHM1545 GHM2143 AC250V GHM2145 GHM2243 Safty Std. Recognition GHM3045 GHM3145 5.7 5.7 5.7 5.7 5.7 5.7 5.0 2.8 5.0 2.8 5.0 5.0 2.0 2.7 2.0 2.0 .com 2.0 2.0 2.0 2.7 Paper Tape 4,000 4,000 4,000 Quantity (pcs.) 180mm reel Plastic Tape 3,000 2,000 2,000 1,000 500 3,000 3,000 2,000 2,000 1,000 1,000 1,000 500 500 1,000 500 1,000 1,000 1,000 1,000 1,000 500
s Tape Carrier Packaging t4U.com (1) Appearance of Taping
q Plastic Tape w Paper Tape
DataShee
Cover Tape : 0.06mm in thickness
Top Tape : 0.05mm in thickness
Sprocket Hole : As specified in (2) Cavity for Chip : As specified in (2)
Sprocket Hole : As specified in (2) Cavity for Chip : As specified in (2)
Bottom Tape : 0.05mm in thickness Base Tape : As specified in (2) Base Tape : As specified in (2)
Packed Chips Chip
Packed Chips Chip Continued on the following page.
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Package
Continued from the preceding page.
PACKAGE
(2) Dimensions of Tape q Plastic Tape
8mm width 4mm pitch Tape (TU1.25 rank)
4.0T0.05 4.0T0.1
W0.1 1.5 Y0
12mm width 8mm/4mm pitch Tape
1.5 Y0
W0.1
2.0T0.1
0.25T0.1 1.75T0.1
8.0T0.1*1
2.0T0.05 4.0T0.1
1.75T0.1
0.3T0.1
3.5T0.05
5.5T0.05
8.0T0.3
A B
A B
Direction of Feed
2.5 max.
Direction of Feed
12.0T0.3 3.7 max.
Part Number GHMxx25 GHMxx30 GHMxx35
A* 1.45 2.0 2.9
B* 2.25 3.6 3.6 *Nominal Value
Part Number GHMxx38 GHMxx40 GHMxx43 GHMxx45
A* 2.5 3.6 3.2 5.4
B* 5.1 4.9 6.1 6.1 *Nominal Value (in mm)
*1 4.00.1mm in case of GHM1038
w Paper Tape
8mm width 4mm pitch Tape (T=1.0 rank)
(3) Dimensions of Reel
.com
4.0T0.1 4.0T0.1
W0.1 1.5 Y0
2.0T0.05
1.1 max. 1.75T0.1 2.0T0.5 3.5T0.05 13T0.2 8.0T0.3 180 +0 -3
+1 60 -0
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A B
DataShee
21T0.8
Direction of Feed
9.0 -0 (Tape width 8mm)
+1.0
Part Number GHMxx25 GHMxx30
A* 1.45 2.0
B* 2.25 3.6 *Nominal value (in mm)
13.0
+1.0 -0 (Tape
width 12 mm)
(in mm)
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PACKAGE
(4) Taping Method q Tapes for capacitors are wound clockwise. The sprocket holes are to the right as the tape is pulled toward the user. w Part of the leader and part of the empty tape shall be attached to the end of the tape as follows. e The top tape or cover tape and base tape are not attached at the end of the tape for a minimum of 5 pitches. r Missing capacitors number within 0.1% of the number per reel or 1 pc, whichever is greater, and are not continuous. t The top tape or cover tape and bottom tape shall not protrude beyond the edges of the tape and shall not cover sprocket holes. y Cumulative tolerance of sprocket holes, 10 pitches : T0.3mm. u Peeling off force : 0.1 to 0.7N in the direction shown on the right.
Package
Vacant section
Chip-mounting unit Vacant section Leader unit
40 to 200 Direction of feed
100 to 200 250 to 560 (Top Tape or Cover Tape alone)
(in mm)
165 to
180
Top Tape or Cover Tape Base Tape
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! Caution
s Storage and Operating Conditions
Do not use or store capacitorsin a corrosive atmosphere, especially where chloride gas, sulfide gas, acid, alkali, salt or the like are present and avoid exposure to moisture. Before cleaning, bonding or molding this product,verify that these processes do not affect product quality by testing the performance of a cleaned, bonded or molded product in the intended equipment. Store the capacitors where the temperature and relative humidity do not exceed 5 to 40 degrees centigrade and 20 to 70%. Use capacitors within 6 months. Failure to follow the above cautions may result, worst case,in a short circuit and fuming when the product is used.
s Handling
Vibration and impact Do not expose a capacitor to excessive shock or vibration during use. Failure to follow the above cautions may result, worst case,in a short circuit and fuming when the product is used.
Caution (Rating)
1. Operating Voltage Be sure to use a capacitor only within its rated operating voltage range. When DC-rated capacitors are to be used in AC or ripple voltage circuits, be sure to maintain the Vp-p value of the applied voltage within the rated voltage range.
specified voltage value is applied, the defective may be caused. (2) Voltage Applied Method When the withstanding voltage is applied, capacitor's lead or terminal shall be firmly connected to the out-put of the withstanding voltage test equipment, and then the voltage shall be raised from near zero to the test voltage. If the test voltage without the raise from near zero voltage would 2. Operating Temperature and Self-generated Heat .com be applied directly to capacitor, test voltage should Keep the surface temperature of a capacitor within the be applied with the *zero cross. At the end of the test rated operating temperature range. time, the test voltage shall be reduced to near zero, and Be sure to take into account the heat produced by the then capacitor's lead or terminal shall be taken off the capacitor itself. When a capacitor is used in a high-freout-put of the withstanding voltage test equipment. quency circuit, pulse voltage circuit or the like, it may If the test voltage without the produce heat due to dielectric loss. raise from near zero voltage Voltage Sine Wave Keep such self-generated temperature below 20C in would be applied directly to t4U.com B(X7R) characteristic products. DataShee capacitor, the surge voltage 0V Regarding R and SL characteristic products, the applied may arise, and therefore, the Zero Cross voltage should be limited in high frequency circuit. defective may be caused. Please contact our sales representatives or engineers for *ZERO CROSS is the point more details. where voltage sine wave pass 0V. -See the right figure3. Test Condition for AC Withstanding Voltage (1) Test Equipment Failure to follow the above cautions may result, worst Test equipment for AC withstanding voltage shall be used case, in a short circuit and fuming when the product is with the performance of the wave similar to 50/60 Hz sine used. wave. If the distorted sine wave or over load exceeding the
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CAUTION
Caution (Soldering and Mounting)
1. Vibration and Impact Do not expose a capacitor to excessive shock or vibration during use.
! Caution
3. Land Layout for Cropping PC Board Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. [Component Direction]
2. Circuit Board Material Please contact our sales representatives or engineers in case that GHM products (size 4.5g3.2mm and over) are to be mounted upon a metal-board or metal-frame. Soldering heat causes the expansion and shrinkage of a board or frame. which may result in chip-cracking.
Locate chip horizontal to the direction in which stress acts.
[Chip Mounting Close to Board Separation Point]
C B D Slit
Perforation
Chip arrangement Worst AGCGB=D Best
A
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! Caution
Continued from the preceding page.
CAUTION
4. Soldering (Prevention of the thermal shock) If a chip component is heated or cooled abruptly during soldering, it may crack due to the thermal shock. To prevent this, adequate soldering condition should be taken following our recommendation below. Carefully perform pre-heating so that temperature difference (T) between the solder and component surface should be in the following range. When components are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100C.
Chip Size Soldering Method Reflow Method or Soldering Iron Method Flow Method or Dip Soldering Method 3.2g1.6mm and under TV190C 3.2g2.5mm and over TV130C
When soldering chips with a soldering iron, it should be performed in following conditions.
Item Chip Size Temperature of Iron-tip Soldering Iron Wattage Diameter of Iron-tip Soldering Time Caution Conditions V2.0g1.25mm 300C max. 3.2g1.6mm 270C max.
20W max. 3.0mm max. 3 sec. max. Do not allow the iron-tip to directly touch the ceramic element.
TV150C
Infrared Reflow Soldering Conditions (Example)
220 to 230D Within 10 sec. Temperature (D) Temperature(D)
,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, , , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, , ,, ,, ,, ,, ,, ,, ,, ,, ,, , ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, , , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, , , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, , ,, ,, ,, ,, ,, ,, ,, ,, ,, , ,, ,,, ,, ,, ,,, ,, ,, ,, ,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, , ,, , ,, ,, , , ,, ,, , ,
Vapor Reflow Soldering (VPS) Conditions (Example)
215D
,, , , ,, ,, , , ,, , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,,, ,, ,, ,,, ,, ,, ,, ,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, ,, ,, ,, ,, ,, ,, ,, ,, , ,,, ,,, ,
T
200D
T
Pre-heating
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Pre-heating
60 sec. min. Within120 sec.
Within 20 sec.
60 sec. min. Within120 sec.
Within 20 sec.
Flow Soldering Conditions (Example)
Dip Soldering/Soldering Iron Conditions (Example)
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Temperature (D)
,, , , ,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,,, ,, ,, ,,, ,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, ,, , , ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, ,
230 to 240D Temperature (D)
T
Pre-heating
,, ,,, ,, ,,, ,,, ,,, ,, ,,, ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, , ,, ,, , , ,, , , , , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,,, ,, ,, ,,, ,, ,, ,, , , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, , , , ,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, ,, ,, ,, ,, ,, ,, ,, ,, ,, ,, , , , ,,,
DataShee
T
Pre-heating
60 to 120 sec.
Within 5 sec.
60 to 120 sec.
Within 20 sec.
5. Soldering Method GHM products whose sizes are 3.2Z1.6mm and under for flow and reflow soldering, and other sizes for reflow soldering. Be sure to contact our sales representatives or engineers in case that GHM products (size 3.2Z2.5mm and over) are to be mounted with flow soldering. It may crack due to the thermal shock. Failure to follow the above cautions may result, worst case, in .com a short circuit and fuming when the product is used.
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NOTICE (Mounting)
1. Mounting of Chips Mechanical shock of the chip placer When the positioning claws and pick up nozzle are worn, the load is applied to the chip while positioning is concentrated to one position, thus causing cracks, breakage, faulty positioning accuracy, etc. Careful checking and maintenance are necessary to prevent unexpected trouble. An excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting, causing cracked chips. Please set the suction nozzle's bottom dead point on the upper surface of the board.
Notice
Termination Thickness of Chip Capacitor and Desirable Thickness of Adhesives Applied
Chip Capacitor a : 20 to 70m b : 30 to 35m c : 50 to 105m a c b
2. Construction of Board Pattern After installing chips, if solder is excessively applied to the circuit board, mechanical stress will cause destruction resistance characteristics to lower. To pre-vent this, be extremely careful in determining shape and dimension before designing the circuit board diagram. Construction and Dimensions of Pattern (Example)
Chip Capacitor c d e
Slit Solder Resist
L W
T R QQ ,, T S
Base Board Adhesive Land 0.3mm min. 0.3mm min. Adhesive Land
100 to 120m
Flow Soldering
LgW 2.0g1.25 3.2g1.6 a 1.0-1.2 2.2-2.6 b 0.9-1.0 1.0-1.1 c 0.8-1.1 1.0-1.4
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Reflow Soldering
LgW 2.0g1.25 3.2g1.6 3.2g2.5 4.5g2.0 4.5g3.2 5.7g2.8 5.7g5.0 a
b
a
Land
b 0.9-1.0 0.8-0.9 1.0-1.2 1.2-1.4 1.2-1.4 1.4-1.6 1.4-1.6
c 0.8-1.1 1.0-1.4 1.8-2.3 1.4-1.8 2.3-3.0 2.1-2.6 3.5-4.8
d 1.0-2.0 1.0-2.0 1.0-2.8 1.0-2.8 1.0-4.0 1.0-4.0
e 3.2-3.7 4.1-4.6 3.6-4.1 4.8-5.3 4.4-4.9 6.6-7.1 (in mm)
1.0-1.2 2.2-2.4 2.0-2.4 2.8-3.4 2.8-3.4 4.0-4.6 4.0-4.6
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Preparing slit help flux cleaning and resin coating on the back of the capacitor.
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Land Layout to Prevent Excessive Solder
Mounting Close to a Chassis
d1 Chassis
Mounting with Leaded Components
Lead Wire Connected to a Part Provided with Lead Wires.
Mounting Leaded Components Later
Soldering Iron Lead Wire of Component to be Connected Later.
Solder (Ground solder)
Examples of Arrangements to be Avoided
Adhesive Base board in section Land Pattern d2
in section
in section
d1Solder Resist
Solder Resist
Examples of Improvements by the Land Division
Solder Resist
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in section
in section
in section
Continued on the following page.
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Notice
Continued from the preceding page.
NOTICE (Mounting)
3. Soldering
(Care for minimizing loss of the terminations.) Limit of losing effective area of the terminations and conditions needed for soldering. Depending on the conditions of the soldering temperature and/or immersion (melting time), effective areas may be lost in some part of the terminations. To prevent this, be careful in soldering so that any possible loss of the effective area on the terminations will securely remain minimum 25% on all edge length A-B-C-D of part with A, B, C, D, shown in the Figure below.
A B
C
(2) Flux and Solder Use rosin-type flux and do not use a highly acidic flux (any containing a minimum of 0.2wt% chlorine). Please use 6Z4 eutectic solder, or 5Z5 solder. (Do not use solder with silver.)
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w Reflow soldering When soldering, confirm that the solder is placed over 0.2mm of the surface of the terminations.
4. Cleaning
To perform ultrasonic cleaning, observe the following conditions on the right.
5. Resin Coating
When selecting resin materials, select those with low contraction and low moisture absorption coefficient (generally epoxy resin is used). Buffer .comcoat can decrease the influence of the resin shrinking (generally silicone resin).
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R Q RQ ,, ,, RT QS TR R TRS Q T S, TQ Q, R T TS QS , TR S R T S
Soldering Allowance Time
Soldering Temperature (D) Solder : 6Z4 Eutectic Solder 270 260 250 240 230 0 Flow Dip Soldering Reflow Soldering and Soldering (Static Solder) Soldering Iron Methods 30 60 90 Time (sec.) D
In case of repeated soldering, the accumulated soldering time must be within the range shown above.
Termination
[Solder Buildup by Flow Method and Soldering Iron Method]
Max. Buildup
Min. Buildup
Adhesive
Excessive Solder Buildup
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[Solder Buildup by Reflow Method]
Chip Capacitor
0.2mm min.
Rinse bath capacity : Output of 20 watts per liter or less. Rinsing time : 5 minutes maximum.
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!ISO9000 CERTIFICATIONS
Manufacturing plants of these products in this catalog have obtained the ISO9001 or ISO9002 certificate. Plant Fukui Murata Manufacturing Co.,Ltd. Izumo Murata Manufacturing Co.,Ltd. Murata Electronics Singapore (Pte.) Ltd. Murata Manufacturing (UK) Ltd. Murata Amazonia Industria Comercio Ltda. Murata Electronics North America State College Plant RCJ SISIR BSI UL Certified Date Mar. 31, '95 May. 11, '95 Aug. 13, '92 Nov. 18, '92 Sep. '93 Jun. '94 Organization RCJ ISO9001 SISIR ISO9002 BSI ISO9002 RCJ ISO9002 UL ISO9002 Registration NO. RCJ-85M-01C RCJ-93M-05A SG MES 91M001A FM 22169 RCJ-(B)-93M-01 A1734
: Reliability Center for Electronic Components of Japan : Singapore Institute of Standards and Industrial Research : British Standards Institution : Underwriters Laboratories Inc.
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Note:
1. Export Control For customers outside Japan Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons. t4U.com For customers in Japan For products which are controlled items subject to the "Foreign Exchange and Foreign Trade Law" of Japan, the export license specified by the law is required for export.
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2. Please contact our sales representatives or product engineers before using our products listed in this catalog for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property, or when intending to use one of our products for other applications than specified in this catalog. q Aircraft equipment w Aerospace equipment e Undersea equipment r Power plant equipment t Medical equipment y Transportation equipment (vehicles, trains, ships, etc.) u Traffic signal equipment i Disaster prevention / crime prevention equipment o Data-processing equipment !0 Application of similar complexity and/or reliability requirements to the applications listed in the above 3. Product specifications in this catalog are as of July 2000. They are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before your ordering. If there are any questions, please contact our sales representatives or product engineers. 4. The parts numbers and specifications listed in this catalog are for information only. You are requested to approve our product specification or to transact the approval sheet for product specification, before your ordering. 5. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect of our and/or third party's intellectual property rights and other related rights in consideration of your using our products and/or information described or contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned above under licenses without our consent. 6. None of ozone depleting substances (ODS) under the Montreal Protocol is used in manufacturing process of us.
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Head Office 2-26-10, Tenjin Nagaokakyo-shi, Kyoto 617-8555, Japan Phone:81-75-955-6502
http://www.murata.co.jp/products/
International Division 3-29-12, Shibuya, Shibuya-ku, Tokyo 150-0002, Japan Phone:81-3-5469-6123 Fax:81-3-5469-6155 E-mail:intl@murata.co.jp
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