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MN101E29G
Type Internal ROM type ROM (byte) RAM (byte) Package (Lead-free) Minimum Instruction Execution Time MN101E29G Mask ROM 128K 6K QFP100-P-1818B (Under development) 50 ns (at 2.2 V to 5.5 V, 20 MHz) 50 ns (at 2.2 V to 5.5 V, 20 MHz) * at internal 2 , 3 , 4 , 5 , 6 , 8 , 10 times oscillation used MN101EF29G FLASH
Interrupts
6 external interrupts, 28 internal interrupts RESET, Watchdog, External 0 to 4, Timer 0 to 4, Timer 6, Timer 7 (2 systems), Timer 8 (2 systems), Timer 9 (2 systems), Time base, Serial 0 (2 systems), Serial1 (2 systems), Serial 2 (2 systems), Serial 3 (2 systems), Serial 4, Serial 5, A/ conversion finish, Automatic transfer (2 systems), Key interrupts Timer counter 0 : 8-bit x 1 (timer pulse output, event count, added pulse (2-bit) system PWM output, generation of remote control carrier, simple pulse measurement, real time output control) Timer counter 1 : 8-bit x 1 (timer pulse output, event count, 16-bit cascade connected (timer 0, 1) timer synchronous output event) Timer counter 2 : 8-bit x 1 (timer pulse output, event count, added pulse (2-bit) system PWM output, simple pulse measurement, 24-bit cascade connected (timer 0, 1, 2), timer synchronous output event, real timer output control) Timer counter 3 : 8-bit x 1 (timer pulse output, event count, generation of remote control carrier, 16-bit cascade connected (timer 2, 3), 32-bit cascade connected (timer 0, 1, 2, 3)) Timer counter 4 : 8-bit x 1 (timer pulse output, added pulse (2-bit) system PWM output, event count, serial transfer clock, simple pulse measurement) Timer counter 6 : 8-bit free run timer, time base timer
Timer Counter
Timer counter 7 : 16-bit x 1 (timer pulse output, event count, High accuracy PWM, High performance IGBT output (cycle/duty continuous variable) timer synchronous output event, input capture (Both edge available), real timer output control), double buffer compare register Timer counter 8 : 16-bit x 1 (timer pulse output, event count, High accuracy PWM output (cycle/duty continuous variable) pulse width measurement, input capture (Both edge available), 32-bit cascade connected (Timer 7 , 8), 32-bitPWM output, synchronous output event), double buffer compare register Timer counter 9 : 16-bit x 1 (timer pulse output, event count, High accuracy PWM output (cycle/duty continuous variable), pulse width measurement, input capture (Both edge available), real timer output control), double buffer compare register Timer counter A : 8-bit x 1 (event count, Serial transfer clock timer, clock for function (timer, serial, LCD)) Watchdog timer
Serial interface
Serial 0 ~ 3 : UART (full duplex) / synchronous x 1 Serial : multi master IC / synchronous x 1 Serial 5 : IC slave x 1 2 systems (External request/internal event request/software request maximum transfer cycles are 255)
DMA controller I/O Pins
I/O
90
common use, Specified pull-up/pull-down resistor available, Input/output selectable (bit-unit)
MAD00062AEM
MN101E29G
A/D converter D/A converter
8-bit x 4-ch.
10-bit x 16-ch.
Display control function
LCD 55 segments x 4 commons (static, 1/2, 1/3, 1/4 duty) 1/3 bias, Usable if VLC1 VDD Buzzer output, remote control carrier signal output, high-current drive port Correcting address designation : up to 7 addresses possible In-circuit Emulator PX-ICE101E PRBV101E29-QFP100-P-1818B (Under development)
Special Ports
ROM Correction
Development tools
Pin Assignment
P50, SBO0A, TXD0A, KEY0, D0, SEG20 P51, SBI0A, RXD0A, KEY1, D1, SEG21 P52, SBT0A, KEY2, D2, SEG22 P54, NBUZZERA, KEY4, D4, SEG24 P53, BUZZERA, KEY3, D3, SEG23 P70, SBO2A, TXD2A, A6, SEG11 P66, SBO4A, SDA4A, A4, SEG13 P67, SBT4A, SCL4A, A5, SEG12 P71, SBI2A, RXD2A, A7, SEG10 P43, SBO0B, TXD0B, SEG32 52
P44, SBI0B, RXD0B, SEG31 53
P64, TM4IOB, A2, SEG15
P63, TM3IOB, A1, SEG16
P72, SBT2A, NWE, SEG9
P65, SBI4A, A3, SEG14
P62, TM1IOB, A0, SEG17
P55, KEY5, D5, SEG25
P56, KEY6, D6, SEG26
P57, KEY7, D7, SEG27
P46, SDA5B, SEG29
P47, SCL5B, SEG28
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
P45, SBT0B, SEG30
P73, SDA5A, NRE, SEG8 P74, SCL5A, NCS, SEG7 P75, SBO1B, TXD1B, A8, SEG6 P76, SBI1B, RXD1B, A9, SEG5 P77, SBT1B, A10, SEG4 P80, TM9OD0, PWM00, SDO0, A11, SEG3 P81, TM9OD1, PWMN00, SDO1, A12, SEG2 P82, TM9OD2, PWM01, SDO2, A13, SEG1 P83, TM9OD3, PWMN01, SDO3, A14, SEG0 P84, TM9OD4, PWM02, SDO4, A15, COM0 P85, TM9OD5, PWMN02, SDO5, A16, COM1 P86, SDO6, A17, COM2 P87, SDO7, A18, COM3 P92, A19, VLC3 P93, NDK, VLC2 P94, DA_C, SYSCLK, VLC1 P95, DA_D PB7, AN15 PB6, AN14 PB5, AN13 PB4, AN12 PB3, AN11 PB2, AN10 PB1, AN9 PB0, AN8
76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 10 12 13 14 15 16 17 18 19 20 21 22 23 24 11 1 2 3 4 5 6 7 8 9
51
P42, SBT3B, SEG33
P61, DA_B, SEG18
P60, SEG19
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
P41, SBI3B, RXD3B, SEG34 P40, SBO3B, TXD3B, SEG35 P36, SEG36 P35, SBI4B, SEG37 P34, SBT4B, SCL4B, SEG38 P33, SBO4B, SDA4B, SEG39 P32, SBT2B, SEG40 P31, SBI2B, RXD2B, SEG41 P30, SBO2B, TXD2B, SEG42 P16, TM8IOC, NBUZZERB, SEG43 P15, TM7IOC, BUZZERB, SEG44 P14, TM4IOC, SEG45 P13, TM3IOC, SEG46 P12, TM1IOC, SEG47 P11, TM2IOC, SEG48 P10, TM0IOC, RMOUTC, SEG49 P24, IRQ4, SEG50 P23, IRQ3, SEG51 P22, IRQ2, SEG52 P21, IRQ1, ACZ1, SEG53 P20, IRQ0, ACZ0, SEG54 P07, LED7, DA_A P06, LED6, SBT3A P05, LED5, SBI3A, RXD3A P04, LED4, SBO3A, TXD3A
MN101E29G
VDD5
P96
P02, LED2, TM9IOB, SBT1A
VREF+
P27, NRST
VSS
OSC1
P91, XO
P90, XI
OSC2
QFP100-P-1818B
MAD00062AEM
P03, LED3, TM0IOB, TM2IOB, RMOUTB
MMOD
VDD18
DMOD
P01, LED1, TM8IOB, SBO1A, TXD1A
P00, LED0, TM7IOB, SBI1A, RXD1A
PA1, AN1, TM1IOA
PA2, AN2, TM2IOA
PA3, AN3, TM3IOA
PA4, AN4, TM4IOA
PA5, AN5, TM7IOA
PA6, AN6, TM8IOA
PA7, AN7, TM9IOA
PA0, AN0, TM0IOA, RMOUTA
ATRST
Request for your special attention and precautions in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: - Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. - Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Industrial Co., Ltd.

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