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Sanken Power Devices from Allegro MicroSystems STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators www..com S Re w it gu chi lat ng ors Package DIP-8 Approximate Scale 1:1 FEATURES AND BENEFITS 67 kHz PWM with 5% frequency jittering for EMI noise filtering and cost reduction Rugged 650 V avalanche-rated MOSFET: * Simplified surge absorption * No VDSS derating required Low RDS(on) : 2.8 maximum Auto-burst mode for stand-by operation or light loads; less transformer audible noise Built-in leading edge blanking Soft start and low start-up current; start-up circuit disabled in operation Auto-burst stand-by (intermittent operation) input power <0.1 W at no load Built-in constant-voltage/constant current (CV/CC) Multiple protections: * Pulse-by-pulse overcurrent protection (OCP) * Overload protection (OLP) with auto restart * Latching overvoltage protection (OVP) * Undervoltage lockout (UVLO) with hysteresis * Latching thermal shutdown (TSD) The STR-A6252M is a 67 kHz PWM topology (with 5% frequency jittering for minimum EMI) regulator specifically designed to satisfy the requirements for increased integration and reliability in flyback converters. It incorporates a primary control and drive circuit with an avalanche-rated power MOSFET. This is a higher-frequency version of the STR-A6252. Covering the power range from below 24 watts for a 230 VAC input, or to 20 watts for a universal (85 to 264 VAC) input, this device can be used in a wide range of applications, from DVD players and VCR player/recorders to ac adapters for cellular phones and digital cameras. An auto-burst standby function reduces power consumption at light load, while multiple protections, including the avalanche-energy guaranteed MOSFET, provide high reliability of system design. Cycle-by-cycle current limiting, undervoltage lockout with hysteresis, overvoltage protection, and thermal shutdown protect the power supply during the normal overload and fault conditions. Overvoltage protection and thermal shutdown are latched after a short delay. The latch may be reset by cycling the input supply. Low start-up current and a low-power standby mode selected from the secondary circuit completes a comprehensive suite of features. It is provided in an 8-pin mini-DIP plastic package with pin 6 removed. The leadframe plating is pure Sb, and the package complies with RoHS. All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature of +25C, unless otherwise stated. Datasheet 28103.44-5a Always order by complete part number, e.g.: STR-A6252M STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators FUNCTIONAL BLOCK DIAGRAM AND TERMINAL ASSIGNMENTS www..com Vcc 5 8 D D RESET OVP 32V 7.2V R Internal BIAS UVLO 13.4V/10V Istartup =1.1mA 7 TSD 125C Delay 10 s SQ Drive PWM OSC RQ S 1 S/OCP CV/CC Feedback Control Soft Start FM/SS 2 OCP Frequency Modulation OLP LEB 4 FB/CC /OLP 3 GND Number 1 2 3 4 Name S/OCP FM/SS GND FB /CC/OLP Description Source/OCP terminal FM/Soft start terminal Ground terminal FB/CC/OLP terminal Functions MOSFET Source/Overcurrent protection Capacitor connection terminal for frequency jitter and soft start. Ground Input of constant voltage control signal / constant current operation control signal / over load protection signal Input of power supply for control circuit MOSFET drain / Input of startup current 5 7 8 VCC D Power supply terminal Drain terminals 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors 2 STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators www..com ABSOLUTE MAXIMUM RATINGS at TA = 25C Characteristic Drain Current1 Maximum Switching Current Single Pulse Avalanche Energy2 S/OCP Terminal Voltage Controller (MIC) Input Voltage FB/CC/OLP Terminal Voltage FM Terminal Voltage MOSFET Power Dissipation3,4 Controller (MIC) Power Dissipation5 Operating Internal Frame Storage Temperature Channel Junction Temperature to figure 1 2Refer to figure 3 3Refer to figure 5 4Mounted on 15 x 15 mm printed circuit board 5Refer to figure 6 6Measured at the root of terminal 3 1Refer Symbol IDpeak IDMAX EAS VOCP Vcc VFB VFM PD1 PD2 TF Top Tstg TJ Terminal 8-1 8-1 8-1 1-3 5-3 4-3 2-3 8-1 5-3 For VccxIcc Refer to TOP Single Pulse Note VS/OCP = 0.81 V with reference to GND, TA = -20 to 125C Single Pulse VDD = 99 V, L = 20 mH, IL = 3.0 A Temperature6 Operating Ambient Temperature Figure 1 - MOSFET Safe Operating Area Derating Curve 100 Figure 2 - MOSFET Safe Operating Area Drain Current versus Voltage 10.00 Safe Operating Area Temperature Derating Coefficient (%) 80 Drain Current, ID (A) 1.00 60 it lim (on) nt R DS re ur to C ue d 40 0.10 20 Refer to figure 1 for MOSFET SOA temperature derating coefficient 0 0 25 50 75 100 125 150 Temperature, TF (C) 0.01 1 10 100 1000 Drain-to-Source Voltage, VDS (V) 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors Max. 3.0 3.0 123 123 -0.3 to 6 36 -0.3 to 12 -0.3 to 6 1.35 0.15 -20 to 125 -20 to 125 -40 to 125 150 Unit A A mJ mJ V V V V W W C C C C 0.1 ms 1 m s 3 STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators www..com Figure 3 - MOSFET Avalanche Energy Derating Curve 100 Transient Thermal Resistance, RJC (C/W) Figure 4 - Transient Thermal Resistance 10.00 80 EAS Derating Coefficient (%) 1.00 60 40 0.10 20 0 25 50 75 100 125 150 Channel Junction Temperature, TJ (C) 0.01 1 10 100 t (s) 1m Figure 5 - MOSFET Power Dissipation versus Temperature 1.6 1.4 Power Dissipation, PD1 (W) Figure 6 - MIC Power Dissipation versus Temperature 1.6 1.4 Power Dissipation, PD2 (W) 1.2 1.0 0.8 0.6 0.4 PD2 = 0.15 W at TA 0.2 0 1.2 PD1 = 1.35 W at TA 1.0 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 120 140 160 Ambient Temperature, TA (C) 0 20 40 60 80 100 120 Internal Frame Temperature, TF (C) 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors 10m 100m 140 160 4 STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators www..com ELECTRICAL CHARACTERISTICS for Controller (MIC), valid at TA = 25C, VCC = 18 V, unless otherwise specified Characteristic Operation Start Voltage Operation Stop Voltage Circuit Current In Operation Initialization Circuit Current Center Switching Frequency Frequency Jitter Deviation Maximum Duty Cycle Symbol VCC(ON) VCC(OFF) ICC(ON) ICC(OFF) fosc(av) f DMAX Terminal 5-3 5-3 5-3 5-3 8-3 8-3 8-3 Test Conditions (Power supply voltage at which device starts operating) Measurement circuit 1, VCC = 0 through 12.9 to 15.7 V (Power supply voltage at which device stops operating) Measurement circuit 1, VCC = 15.7 through 9 to 11 V (Inflow current into power supply terminal, in operation) Measurement circuit 1 (Inflow current into power supply terminal,, while subject to UVLO prior to operation) Measurement circuit 1, VCC = 12 V (Center oscillation frequency of D terminal) Measurement circuit 2 Maximum frequency - minimum frequency Measurement circuit 2 (Maximum width of the low portion of the D terminal waveform) Measurement circuit 2 (VFM at which the FM current is changed from 10 A to -10 A) Measurement circuit 2 (VFM at which the FM current is changed from -10 A to 10 A) Measurement circuit 2 Outflow current from FM terminal at VFM = VLFM (3.7 V typ.) Measurement circuit 2 Inflow current into FM terminal at VFM = VHFM (4.4 V typ.) Measurement circuit 2 (The drain current at which the low portion of the D terminal waveform becomes shorter than the high portion, with VOCP increasing) Measurement circuit 3 (The low portion of the D terminal waveform with VOCP = 1 V) Measurement circuit 3 (FB/CC/OLP terminal voltage at which D terminal waveform oscillation stops due to VFB decreasing from 5 V) Measurement circuit 4 (FB/CC/OLP terminal voltage at which D terminal waveform oscillation stops due to VFB increasing from 5 V) Measurement circuit 4 (Outflow current from FB/CC/OLP terminal at VFB = 8 V) Measurement circuit 4 (Time between surpassing VOLP(th) and stop of oscillation) Measurement circuit 4 (Outflow current from FB/CC/OLP terminal at VFB = 0 V) Measurement circuit 4 Min. 12.9 9 - - 60 4.0 70 FM High Voltage VHFM 2-3 4.0 FM Low Voltage FM Outflow Current FM Inflow Current VLFM IsorcFM IsinkFM 2-3 2-3 2-3 3.2 7.7 -15.4 OCP Threshold Voltage VOCP(th) 1-3 0.67 Leading Edge Blanking Time twb 8-3 240 Burst Threshold Voltage Vburst(th) 4-3 1.0 OLP Threshold Voltage Output Current at OLP Operation OLP Delay Time Maximum Feedback Current VOLP(th) IOLP TOLP IFB(MAX) 4-3 4-3 4-3 4-3 7.3 12 0.84 220 Continued on next page... 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors Typ. 14.3 10 - - 67 6.7 76 Max. 15.7 11 4 25 74 9.4 82 Unit V V mA A KHz kHz % 4.5 5.0 V 3.6 11 -11 4.0 15.4 -7.7 V A A 0.74 0.81 V 350 460 ns 1.12 1.24 V 8.6 18 1.2 310 9.9 25 1.56 430 V A s A 5 STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators www..com ELECTRICAL CHARACTERISTICS for Controller (MIC) continued, valid at TA = 25C, VCC = 18 V, unless otherwise specified Constant Current Set Voltage Constant Current Reset Voltage Start-Up Current OVP Threshold Voltage Latch Circuit Sustaining Current1 Latch Circuit Release Voltage1 Thermal Shutdown Operating Temperature Drain-to-Source Breakdown Voltage Drain Leakage Current On-Resistance Switching Time Thermal Resistance 1Latch VSET(CC) 4-3 (FB/CC/OLP terminal voltage at which IFB changes from 310 A to 16 A due to VFB increasing from 5 V) Measurement circuit 4 (FB/CC/OLP terminal voltage at which IFB changes from 16 A to 310 A due to VFB decreasing from 8 V) VRES(CC) x VCC = 25 V, Measurement circuit 4, VCC = 25 V (Outflow current from VCC terminal at VDD = 600 V) Measurement circuit 5, VCC = 13 V (VCC at which the oscillation of the D terminal waveform stops due to VCC increasing from 18 V) Measurement circuit 1, VCC = 18 through 31 to 35.2 V (Inflow current into VCC at VCC = 8.4 V, after OVP operation) Measurement circuit 1, VCC = 35.2 to 8.6 V (VCC at which ICC drops below 20 A due to decreasing VCC after OVP operation) Measurement circuit 1, VCC = 35.2 through 5.9 to 8.6 V 4.9 VRES(CC) Istartup VCC(OVPth) 4-3 6-3 5-3 3.5 0.77 28.8 ICC(H) 5-3 - VCC(LaOFF) TJ(TSD) 5-3 5.9 125 ELECTRICAL CHARACTERISTICS for MOSFET, valid at TA = 25C, VCC = 18 V, unless otherwise specified VDSS IDSS RDS(ON) tf Rch-F 8-1 8-1 8-1 8-1 Measurement circuit 6, ID = 300 A (Inflow current into D terminal at VDD = 650 V) Measurement circuit 5 Measurement circuit 3, ID = 0.4 A Measurement circuit 2 Between channel and internal frame; measured at the root of terminal 3 650 - - - - - - - - - - 300 2.8 250 52 V A ns C/W circuit enabled when OVP and TSD in operation 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors 5.8 6.7 V 3.9 1.1 32 4.3 1.43 35.2 V mA V - 270 A 7.2 140 8.6 - V C 6 STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators www..com VD 8 7 5 Measurement Circuit 1 Vcc(ON) 18V Vcc(OFF) Vcc(OVP) 36V 8.4V Vcc(La.OFF) 100 D D VCC 13V Vcc 0V VD A Vcc 18V STR-A6252M S/OCP FM/SS GND FB/CC /OLP 4 10V VDD 1 2 3 VD 47nF Icc 5.1V Vcc + Icc Icc(OFF) Icc 1F Icc 150A typ. Icc(H) Measurement Circuit 2 VD 8 7 5 18V VCC VHFM VFM IFM 0A + VCC 100 D D STR-A6252M S/OCP FM/SS GND FB/CC /OLP 4 VL FM IsinkFM V L FM+(VH FM-VL FM)/2 10V VDD 1 2 3 IFM A VFM 5.1V 18V Vcc 1F *f =fosc(Hi)-fosc(Lo) IsorcFM *Dmax=T2/T1 100 T2 VD 0V fosc(Hi) fosc(Lo) fosc(av) T1 tf 10% VD Measurement Circuit 3 VD 8 7 5 18V Vcc Vocp VOCP 0V 1V D D VCC ID 0.4A STR-A6252M S/OCPFM/SS GND 1 2 3 FB/CC /OLP 4 VD VOCP 47nF 5.1V 18V Vcc + 1F VD(Lo) *RDS(ON)=VD(Lo) / 0.4 Tbw 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors 4A typ. 10V 90% 7 STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators www..com Measurement Circuit 4 18V 25V VOLP 8V VRST(CC) 7 5 8 Vcc VSET(CC) V(HYS) VFB Vburst 0V 100 D D VCC STR-A6252M S/OCP FM/SS GND FB/CC /OLP 4 10V VDD 1 2 3 TOLP IFB A 47nF Vcc VFB + VD 310A typ. IFB(MAX) IOLP 18A typ. 1F IFB 310A typ. Measurement Circuit 5 Measurement Circuit 6 8 7 5 8 7 5 A ID D D VCC A Icc VD V D D VCC STR-A6252M S/OCP FM/SS GND FB/CC /OLP 4 STR-A6252M ID S/OCP FM/SS GND 1 2 3 FB/CC /OLP 4 Icc VDD 1 2 3 Vcc + 300 A Vcc 18V + 1F 1F Measurement Circuit 7 L Vcc 18V 8 7 5 D D VCC STR-A6252M VDS VDD S/OCP FM/SS GND 1 2 3 FB/CC /OLP 4 Icc VGS 8V VDSpeak Vcc + IL VDS VDD VGS 18V 1F T V peak 2 DS EAS = L (ILpeak ) 2 V peak - VDD DS Adjust T such that ILpeak = 3.0 A 8 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators TYPICAL APPLICATION CIRCUIT www..com For improved thermal dissipation, connect terminals 7 and 8 to as large an area of exposed copper as possible 85~ 265VAC PC OUT 8 D 7 D 5 VCC GND STR-A6252 S/OCP FM/SS GND 1 2 3 FB/CC /OLP 4 R4 PC R5 Function of External Parts Mode CV/CC OLP R4 1 to 1.8 M None R5 82 to 150 k None 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors 9 STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators PACKAGE DIMENSIONS, DIP-8 www..com Dimens ions in Inc hes (for reference only) Dimens ions in Millimeters (controlling dimens ions ) 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors 10 STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators www..com PACKING SPECIFICATIONS Minimum packing option: Tubes Orientation of Devices in Shipping Tubes Stopper, with no tab 50 pieces Type A Type B Shipping Tube Dimensions 130 63 Inner Carton Dimensions Capacity: 50 tubes per inner carton 69 0 51 140 Outer Carton Dimensions Capacity: 4 inner cartons per outer carton; 10,000 devices maximum per outer carton 145 135 0 52 265 290 All dimensions: mm 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors Stopper, with attached tab 4 52 5 53 11 STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators www..com WARNING -- These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Precautions must be taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment. The use of an isolation transformer is recommended during circuit development and breadboarding. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage * Ensure that storage conditions comply with the standard temperature (5C to 35C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. * Avoid locations where dust or harmful gases are present and avoid direct sunlight. * Reinspect for rust in leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. Remarks About Using Silicone Grease with a Heatsink * When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress. * Volatile-type silicone greases may produce cracks after long periods of time, resulting in reduced heat radiation effect. Silicone grease with low consistency (hard grease) may cause cracks in the mold resin when screwing the product to a heatsink. * Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type G746 YG6260 Suppliers Shin-Etsu Chemical Co., Ltd. Toshiba Silicone Co., Ltd. SC102 Dow Corning Toray Silicone Co., Ltd. Soldering * When soldering the products, please be sure to minimize the working time, within the following limits: 2605C 10 s 3505C 3 s * Soldering iron should be at a distance of at least 1.5 mm from the body of the products Electrostatic Discharge * When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 M of resistance to ground to prevent shock hazard. * Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. * When using measuring equipment such as a curve tracer, the equipment should be grounded. * When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. * The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors 12 STR-A6252M Universal-Input 20 W 67 kHz Flyback Switching Regulators www..com The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc. Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this publication is current before placing any order. When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users responsibility. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to society due to device failure or malfunction. Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation hardness assurance (e.g., aerospace equipment) is not supported. When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written confirmation of your specifications. The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited. The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property rights, or any other rights of Sanken or Allegro or any third party that may result from its use. Copyright (c) 2006 Allegro MicroSystems, Inc. This datasheet is based on Sanken datasheet SSE-23421 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 S Re w it gu chi lat ng ors 13 |
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