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| PR IM EL SURFACE MOUNT ULTRA LOW VF SILICON SCHOTTKY RECTIFIER TM TINY LEADLESS MODULE Y CTLSH3-2M322HL AR IN Central TM Semiconductor Corp. DESCRIPTION: The CENTRAL SEMICONDUCTOR CTLSH3-2M322HL is a high performance HiLoTM 3.0A Schottky rectifier designed for applications where small size and operational efficiency are the prime requirements. With a maximum power dissipation of 1.45W, and a very small package footprint (smaller than the SOT-23), this leadless package design is capable of dissipating up to 4 times the power of similar devices in comparable sized surface mount packages. * HiLoTM Device Characteristics (High Current/Low VF) * Ultra Low Forward Voltage Drop (VF=0.35V Typ. @ 3.0A) TLM322 CASE MARKING CODE: CBB FEATURES: * High Thermal Efficiency * Small TLM 2x2mm case * High Current (IF=3.0A) APPLICATIONS: * DC/DC Converters * Voltage Clamping * Protection Circuits MAXIMUM RATINGS: (TA=25C) Continuous Reverse Voltage Average Forward Current Power Dissipation Operating and Storage Junction Temperature Thermal Resistance SYMBOL ELECTRICAL CHARACTERISTICS PER DIODE: SYMBOL IR BVR VF VF VF VF VF CT TEST CONDITIONS P E R IM L VR IO PD IN MIN 20 RY A 20 3.0 1.45 -65 to +150 86.2 TYP 2.0 * Battery Powered Portable Equipment UNITS V A W* C C/W * TJ, Tstg JA (TA=25C unless otherwise noted) MAX 3.0 UNITS mA V 0.14 0.19 0.24 0.29 0.35 0.18 0.23 0.28 0.33 0.40 TBD V V V V V pF VR=10V IR=5.0mA IF=100mA IF=500mA IF=1.0A IF=2.0A IF=3.0A * FR-4 Epoxy PCB with copper mounting pad area of 21mm2. R0 (6-January 2006) Central TM Semiconductor Corp. P L RE F SILICON SCHOTTKY RECTIFIER TM TINY LEADLESS MODULE IM SURFACE MOUNT ULTRA LOW V Y AR IN CTLSH3-2M322HL TLM322 CASE - MECHANICAL OUTLINE Suggested mounting pad layout for maximum power dissipation (Dimensions in mm) LEAD CODE: 1) Cathode 2) Anode 3) Anode MARKING CODE: CBB R0 (6-January 2006) For standard mounting refer to TLM322 Package Details |
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