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MSP
Vishay Sfernice
Precision Surface Mount Resistors Wirewound or Metal Film Technologies
FEATURES
Approved according CECC 40402-801 (wirewound) Wide range of ohmic values (0.04 to 1 M) Low temperature coefficient ( 25 ppm/C available) Good electrical insulation All welded construction and molded encapsulant High power ratings (up to 2.5 W) Stability class 0.5 Pure matte tin termination Compliant to RoHS Directive 2002/95/EC Specially designed for surface mounting, the MSP series uses either wirewound or metal film technology. The molded package ensures mechanical and climatic protection as well as high dielectric insulation. The MSP design is compatible with surface mounting equipment and can withstand wave and reflow soldering techniques.
DIMENSIONS in millimeters
Recommended Soldering Areas E A C Z
B
W
F
F
D
X
X
SERIES AND STYLES MSP 1 MSP 2 MSP 3
A 6.9 11.4 14.8
B 3.8 5 6.6
C 3.8 7 7
D 2.5 5 5
E 6.5 11 14.4
F 1.4 2.4 2.4
W 2.7 5.2 5.2
X 2.9 4.1 4.1
Z 6 9.4 12.7
AVERAGE MASS (g) 0.2 0.8 1.5
Note * General tolerance: 0.2 mm
TECHNICAL SPECIFICATIONS
RESISTIVE TECHNOLOGY Vishay Sfernice Series CECC 40402-801 Metric Size Rated Dissipation at + 25 C, P25 5 % E24 Series Ohmic Range in Relation to Tolerance (with Prefered Ohmic Value Series) Approved Range CECC 40402-801 2 % E48 Series 1 % E96 Series 0.5 % E96 Series 1 % or Class 0.5 MSP 1 B RW1 0704M 1W 0.04 to 2.2K 0.04 to 2.2K 0.04 to 2.2K 0.4 to 2.2K 0.5 1K 50 V WIREWOUND MSP 2 B RW2 1107M 2W 0.04 to 4.7K 0.04 to 4.7K 0.04 to 4.7K 0.4 to 4.7K 0.5 2.2K 120 V MSP 3 B RW3 1607M 2.5 W 0.04 to 13K 0.05 to 13K 0.05 to 13K 0.3 to 13K 0.1 4.12K 200 V MSP 1 C 0704M 0.5 W 10 to 332K 10 to 332K 300 V METAL FILM MSP 2 C 1107M 1W 10 to 1M 10 to 1M 350 V
Limiting Element Voltage, Umax. AC/DC
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For technical questions, contact: sfer@vishay.com
Document Number: 50003 Revision: 01-Feb-11
MSP
Precision Surface Mount Resistors Wirewound or Metal Film Technologies
TECHNICAL SPECIFICATIONS (continued)
RESISTIVE TECHNOLOGY Series Critical Resistance MSP 1 B Wirewound MSP 2 B MSP 3 B Metal Film MSP 1 C MSP 2 C 180K 122.5K - 55 C/+ 155 C 10 k to 332 k K3: 50 ppm/C K4: 25 ppm/C > 332 k K3: 50 ppm/C -
Vishay Sfernice
Temperature Coefficient
CECC 40402-801 - 55 C/+ 200 C <1 100 ppm/C 1 to < 10 50 ppm/C 10 25 ppm/C E6 10-6/h E6 10-6/h E0 or A 10-4/h
Failure Rate with CECC Approval
MECHANICAL SPECIFICATIONS
RESISTIVE TECHNOLOGY Encapsulant Resistive Element Ceramic Substrate Termination CuNi or NiCr Alumina or Steatite Electrolytic pure matte tin Wirewound Thermoset NiCr or NiP Alumina Metal Film
ENVIRONMENTAL SPECIFICATIONS
RESISTIVE TECHNOLOGY Temperature Range Climatic Category (LCT/UCT/days) Wirewound - 55 C to 275 C 55/200/56 Metal Film - 55 C to 155 C 55/125/10
PERFORMANCE
CONDITIONS TESTS Short Time Overload Wirewound Metal Film REQUIREMENTS Wirewound Metal Film CECC 40402-801 (0.25 % + 0.05 ) 0.25 %
Load Life
Dielectric w/s Voltage Rapid Change of Temperature
IEC 60115-1 5 Pr or U = 2 Umax./5 s IEC 60115-1 90'/30' cycles 1000 h Pr + 25 C 8000 h Pr IEC 60115-1 URMS = 500 V/60 s IEC 60115-1 IEC 60068-2-14 Test Na 5 cycles (30' at LCT/30' at UCT) - 55 C/+ 200 C - 55 C/+ 125 C IEC 60115-1 - 55 C/+ 200 C - 55 C/+ 125 C IEC 60115-1 IEC 60068-2-3 Test Ca 95 % HR/40 C 56 days 10 days IEC 60115-1 IEC 60068-2-21 Test Ue3 2 mm/10 times IEC 60115-1 IEC 60068-2-27 Test Ea 50 g's/half sine/3 times by direction (i.e. 18 shocks) IEC 60115-1 IEC 60068-2-6 Test Fc 10 Hz/2000 Hz 10 Hz/500 Hz IEC 60115-1 IEC 60068-2-58 Solder bath 260 C/10 s
(0.5 % + 0.05 ) 1% (3 % + 0.05 ) No flashover or breakdown Leakage current < 10 A (0.25 % + 0.05 ) 0.25 %
Climatic Sequence
(0.5 % + 0.05 )
0.5 %
Humidity (Steady State)
(0.5 % + 0.05 )
1%
Substrate Bending Test
(0.25 % + 0.05 ) (0.25 % + 0.05 )
0.25 %
Shock
n/a
Vibration Resistance to Soldering Heat Document Number: 50003 Revision: 01-Feb-11
(0.25 % + 0.05 )
0.25 %
(0.5 % + 0.05 )
N/A
For technical questions, contact: sfer@vishay.com
www.vishay.com 15
MSP
Vishay Sfernice
POWER RATING
125
Precision Surface Mount Resistors Wirewound or Metal Film Technologies
TEMPERATURE RISE
250
HOT SPOT TEMPERATURE IN C
RATED POWER IN %
100
MSP B
200
M
SP
3
B
75
150
1B MS P
M
SP
2
B
50
MSP C
100
25
50
0 - 100
- 55
0
25 50
100
155
200
250 275
0
0
0.5
M
SP
1
C
M
SP
2
C
1
1.5
2
2.5
3
AMBIENT TEMPERATURE IN C
RATED POWER IN W
SURFACE MOUNTING OF MSP B
Soldering cycle: 2 min at 215 C or 10 s at 260 C or with an iron 40 W: 3 s at 350 C. Soldering is possible by wave, reflow and vapor phase.
NON INDUCTIVE WINDING FOR MSP B
Non inductive (Ayrton Perry) winding available. Please consult Vishay Sfernice.
PACKAGING
In bulk (plastic bag of 100 units or multiples) In tube: MSP1 70 units per tube MSP2 50 units per tube MSP3 40 units per tube In reel of 500 units for MSP1 and MSP2
DIMENSIONS in millimeters - Informative Data
P0 T1 W T4 T2 T
T3 Cross section of tube
P
A0
B0 K0
Tube
TUBE PACKAGING T1 MSP 1 MSP 2 MSP 3 6.6 9.2 T2 6.8 8.7 T3 4.6 8 T4 4.8 7.5 Length 530 615
Reel
REEL PACKAGING A0 3.9 7.43 B0 7.35 11.91 K0 4.25 5.36 P0 4 4 N/A W 12 24 T 0.254 0.368 P 8 12
MARKING
Vishay Sfernice trademark, ohmic value (in ), tolerance (in %), series and style, technology, manufacturing date.
www.vishay.com 16 For technical questions, contact: sfer@vishay.com Document Number: 50003 Revision: 01-Feb-11
MSP
Precision Surface Mount Resistors Wirewound or Metal Film Technologies
ORDERING INFORMATION
MSP SERIES 1 STYLE B 48U7 1% TC Applicable only in "C" technology BA100 e3
Vishay Sfernice
TECHNOLOGY NON INDUCTIVE OHMIC VALUE TOLERANCE WINDING Optional B: Wirewound C: Metal Film
PACKAGING LEAD (Pb)-FREE
SAP PART NUMBERING GUIDELINES
M S P 1 B 4 8 R 7 0 F T 2 0 E 3
GLOBAL MODEL MSP
OPTION Blank or N (Non inductive winding)
SIZE 1B 2B 3B 1C 2C B= Wirewound C= Metal film
OHMIC VALUE The first four digits are significant figures and the last digit specifies the number of zeros to follow. R designates decimal point. 48R70 = 48.7 48701 = 48 700 10002 = 100 000 R0100 = 0.01 R4700 = 0.47 ...
TOL. B = 0.1 % F=1% G=2% J=5% K = 10 %
TEMP. COEF. Blank or Applicable only on metal film technologies 1C and 2C: E K3 or H K4
PACKAGING S14 = Bag (100 pieces) R10 = Reel (500 pieces) T25 = Tube (70 pieces) T17 = Tube (40 pieces) T20 = Tube (50 pieces)
SPECIAL As applicable
RoHS E3 = Pure tin
Document Number: 50003 Revision: 01-Feb-11
For technical questions, contact: sfer@vishay.com
www.vishay.com 17
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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