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FEATURES 0.4 Max ON Resistance @ 125 C 0.08 Max ON Resistance Flatness @ 125 C 1.8 V to 5.5 V Single Supply Automotive Temperature Range -40 C to +125 C 400 mA Current Carrying Capability Tiny 6-Lead SOT-23 and 8-Lead SOIC Packages 35 ns Switching Times Low Power Consumption TTL/CMOS-Compatible Inputs Pin Compatible with ADG701/ADG702 APPLICATIONS Power Routing Cellular Phones Modems PCMCIA Cards Hard Drives Data Acquisition Systems Communication Systems Relay Replacement Battery-Powered Systems
< 0.4
CMOS 1.8 V to 5.5 V, SPST Switches ADG801/ADG802
ADG801
S D
FUNCTIONAL BLOCK DIAGRAMS
IN
ADG802
S D
IN
SWITCHES SHOWN FOR A LOGIC "1" INPUT
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG801/ADG802 are monolithic CMOS, SPST (Single Pole, Single Throw) switches with On Resistance of less than 0.4 . These switches are designed on an advanced submicron process that provides extremely low On Resistance, high switching speed, and low leakage currents. The low On Resistance of < 0.4 means these parts are ideal for applications where low On Resistance switching is critical. The ADG801 is a normally open (NO) switch, while the ADG802 is normally closed (NC). Each switch conducts equally well in both directions when On. The ADG801 and ADG802 are available in 6-lead SOT-23 and 8-lead SOIC packages.
1. Low On Resistance (0.25 typical) 2. 1.8 V to 5.5 V single-supply operation 3. Tiny 6-lead SOT-23 and 8-lead SOIC packages 4. 400 mA current carrying capability 5. Automotive temperature range -40 C to +125 C 6. Pin-compatible with ADG701 (ADG801) Pin-compatible with ADG702 (ADG802)
REV. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 (c) Analog Devices, Inc., 2002
V 10%, GND = ADG801/ADG802-SPECIFICATIONS1 (V = 5otherwise noted.)0 V. All specifications -40 C to +125 C, unless
DD
Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tON tOFF Charge Injection Off Isolation Bandwidth -3 dB CS (OFF) CD (OFF) CD, CS (ON) POWER REQUIREMENTS IDD
3
25 C
-40 C to +85 C
-40 C to +125 C2 0 V to VDD
Unit V typ max typ max nA typ nA max nA typ nA max nA typ nA max V min V max A typ A max pF typ ns typ ns max ns typ ns max pC typ
Test Conditions/Comments
0.25 0.3 0.05
0.35 0.07
0.4 0.08
VS = 0 V to VDD, IS = 100 mA; Test Circuit 1 VS = 0 V to VDD, IS = 100 mA VDD = 5.5 V VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test Circuit 2 VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test Circuit 2 VS = VD = 1 V, or 4.5 V; Test Circuit 3
0.01 0.25 0.01 0.25 0.01 0.25
3 3 3
30 30 30 2.0 0.8
0.005 0.1 5 35 45 9 15 50 -61 12 180 180 420 0.001 1.0 2.0
VIN = VINL or VINH
50 18
55 21
RL = 50 , CL = 35 pF VS = 3 V; Test Circuit 4 RL = 50 , CL = 35 pF VS = 3 V; Test Circuit 4 VS = 2.5 V, RS = 0 ; CL = 1 nF; Test Circuit 5 dB typ RL = 50 , CL = 5 pF; f = 100 kHz; Test Circuit 6 MHz typ RL = 50 , CL = 5 pF; Test Circuit 7 pF typ f = 1 MHz pF typ f = 1 MHz pF typ f = 1 MHz A typ A max VDD = 5.5 V Digital Inputs = 0 V or 5.5 V
NOTES 1 Temperature range is as follows: Automotive Temperature Range: -40 C to +125C. 2 On Resistance parameters tested with I S = 10 mA. 3 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
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REV. 0
ADG801/ADG802
SPECIFICATIONS1 (V
Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) Channel On Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tON tOFF Charge Injection Off Isolation Bandwidth -3 dB CS (OFF) CD (OFF) CD, CS (ON) POWER REQUIREMENTS IDD
3
DD
= 2.7 V to 3.6 V, GND = 0 V. All specifications -40 C to +125 C, unless otherwise noted.)
-40 C to +85 C -40 C to +125 C2 0 V to VDD 0.4 0.6 0.1 0.01 0.25 0.01 0.25 0.01 0.25 0.65 0.1 0.7 0.1
25 C
Unit V typ max typ nA typ nA max nA typ nA max nA typ nA max V min V max A typ A max pF typ ns typ ns max ns typ ns max pC typ dB typ MHz typ pF typ pF typ pF typ A typ A max
Test Conditions/Comments
VS = 0 V to VDD, IS = 100 mA; Test Circuit 1 VS = 0 V to VDD, IS = 100 mA VDD = 3.6 V VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2 VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2 VS = VD = 1 V, or 3.3 V; Test Circuit 3
3 3 3
30 30 30 2.0 0.8
0.005 0.1 5 40 55 9 15 10 -61 12 180 180 420 0.001 1.0 2.0
VIN = VINL or VINH
60 18
65 21
RL = 50 , CL = 35 pF VS = 1.5 V; Test Circuit 4 RL = 50 , CL = 35 pF VS = 1.5 V; Test Circuit 4 VS = 1.5 V, RS = 0 , CL = 1 nF; Test Circuit 5 RL = 50 , CL = 5 pF, f = 100 kHz, Test Circuit 6 RL = 50 , CL = 5 pF; Test Circuit 7 f = 1 MHz f = 1 MHz f = 1 MHz VDD = 3.6 V Digital Inputs = 0 V or 3.6 V
NOTES 1 Temperature range is as follows: Automotive Temperature Range: -40 C to +125C. 2 On Resistance parameters tested with I S = 10 mA. 3 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
REV. 0
-3-
ADG801/ADG802
ABSOLUTE MAXIMUM RATINGS 1
(TA = 25C unless otherwise noted.)
Table I. Truth Table
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +7 V Analog Inputs2 . . . . . . . . . . . . . . . . . . . . -0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First Digital Inputs2 . . . . . . . . . . . . . . . . . . . . -0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 400 mA Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 800 mA (Pulsed at 1 ms, 10% Duty Cycle Max) Operating Temperature Range Automotive . -40C to +125C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Junction Temperature (TJmax) . . . . . . . . . . . . . . . . . . . 150C Package Power Dissipation . . . . . . . . . . . . . . (TJmax - TA)/ JA SOIC Package JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206C/W JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44C/W SOT-23 Package (4-Layer Board) JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 119C/W Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300C IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235C
NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.
ADG801 In 0 1
ADG802 In 1 0
Switch Condition OFF ON
PIN CONFIGURATIONS 6-Lead Plastic Surface-Mount (SOT-23) (RT-6)
D1 S2 GND 3
ADG801/ ADG802
6
VDD
5 NC
TOP VIEW 4 IN (Not to Scale)
NC = NO CONNECT
8-Lead Small Outline SOIC (RM-8)
D1 NC 2
8
S GND
ADG801/ ADG802
7
NC 3 TOP VIEW 6 IN (Not to Scale) 5 VDD 4 NC NC = NO CONNECT
ORDERING GUIDE
Model ADG801BRT ADG801BRM ADG802BRT ADG802BRM
1 2
Temperature Range -40C to +125C -40C to +125C -40C to +125C -40C to +125C
Brand1 SLB SLB SMB SMB
Package Descriptions SOT-23 (Plastic Surface-Mount) SOIC (Small Outline) SOT-23 (Plastic Surface-Mount) SOIC (Small Outline)
Package Options RT-62 RM-8 RT-62 RM-8
Branding on SOT-23 and SOIC packages is limited to three characters due to space constraints. Contact factory for availability.
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG801/ADG802 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
-4-
REV. 0
ADG801/ADG802
TERMINOLOGY
VDD IDD GND S D IN VD (VS) RON RFLAT(ON) IS (OFF) ID (OFF) ID, IS (ON) VINL VINH IINL (IINH) CS (OFF) CD (OFF) CD, CS (ON) CIN tON tOFF Charge Injection Off Isolation Bandwidth On Response Insertion Loss
Most Positive Power Supply Potential Positive Supply Current Ground (0 V) Reference Source Terminal. May be an input or output. Drain Terminal. May be an input or output. Logic Control Input Analog Voltage on Terminals D and S Ohmic Resistance Between D and S The difference between the maximum and minimum value of On Resistance as measured over the specified analog signal range. Source Leakage Current with the Switch OFF Drain Leakage Current with the Switch OFF Channel Leakage Current with the Switch ON Maximum Input Voltage for Logic "0" Minimum Input Voltage for Logic "1" Input Current of the Digital Input OFF Switch Source Capacitance. Measured with reference to ground. OFF Switch Drain Capacitance. Measured with reference to ground. ON Switch Capacitance. Measured with reference to ground. Digital Input Capacitance Delay between applying the Digital Control Input and the Output Switching ON. See Test Circuit 4. Delay between applying the Digital Control Input and the Output Switching OFF. A measure of the glitch impulse transferred from the Digital Input to the Analog Output during switching. A measure of unwanted signal coupling through an OFF switch. The frequency at which the output is attenuated by 3 dBs. The frequency response of the ON switch The loss due to the On Resistance of the switch
REV. 0
-5-
ADG801/ADG802-Typical Performance Characteristics
0.50 0.45 0.40
ON RESISTANCE -
0.50
0.50 0.45 0.40
ON RESISTANCE -
+125 C +85 C +25 C
TA = 25 C
0.45
VDD = 2.7V VDD = 3.0V VDD = 3.3V ON RESISTANCE - VDD = 5.5V
+125 C
0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 V = 5V DD -40 C
0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 0 1.0
0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 0 VDD = 3V 0.5 1.0 1.5 2.0 VD (VS) - V 2.5 3.0 -40 C +85 C
+25 C
VDD = 4.5V
VDD = 5.0V
2.0 3.0 VD (VS) - V
4.0
5.0 5.5
0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VD (VS) - V
TPC 1. On Resistance vs. VD (VS)
TPC 2. On Resistance vs. VD (VS) for Different Temperatures
TPC 3. On Resistance vs. VD (VS) for Different Temperatures
3.5 VDD = 5V, 3V 3.0
400 TA = 25 C 300 VDD = 5V
50 45 40 35
TIME - ns
tON
VDD = 3V VDD = 5V
2.5 CURRENT - nA 2.0 1.5 ID (OFF) 1.0 0.5 0 -0.5 0 20 40 60 80 100 TEMPERATURE - C 120 IS (OFF)
CHARGE INJECTION - pC
200
IS, ID (ON)
30 25 20 15 10 5
100 VDD = 3V 0
tOFF
VDD = 3V, 5V
-100
-200 0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VS - V
0 -40 -20
0
20 40 60 80 TEMPERATURE - C
100 120
TPC 4. Leakage Currents vs. Temperature
TPC 5. Charge Injection vs. Source Voltage
TPC 6. tON /tOFF Times vs. Temperature
-10 TA = 25 C VDD = 3V, 5V -20
0
1.8
LOGIC THRESHOLD VOLTAGE - V
-1 -2
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 1 2 3 VDD - V 4 5 6 VIN RISING VIN FALLING
ATTENUATION - dB
-30
ATTENUATION - dB
-3 -4 -5 -6 -7
-40
-50
-60 -8 -70 0.1 1 FREQUENCY - MHz 10 -9 0.2 VDD = 3V, 5V TA = 25 C 1 FREQUENCY - MHz 10 20
TPC 7. Off Isolation vs. Frequency
TPC 8. On Response vs. Frequency
TPC 9. Logic Threshold Voltage vs. Supply Voltage
-6-
REV. 0
ADG801/ADG802 Test Circuits
IDS V1
IS (OFF)
S D
ID (OFF) S D A VD NC S D
ID (ON) A VD
A
VS RON = V1/IDS
NC = NO CONNECT
Test Circuit 1. On Resistance
Test Circuit 2. Off Leakage
Test Circuit 3. On Leakage
VDD 0.1 F VIN VDD S VS D RL 50 GND VOUT VIN IN CL 35pF VOUT
ADG801
50%
50%
ADG802
50% 90%
50% 90%
tON
tOFF
Test Circuit 4. Switching Times
VDD
VDD RS VS IN GND S D VOUT CL 1nF
VIN
ADG801
ON OFF
VIN VOUT
ADG802
QINJ = CL VOUT VOUT
Test Circuit 5. Charge Injection
VDD 0.1 F NETWORK ANALYZER
VDD 0.1 F NETWORK ANALYZER
VDD S
IN
VDD S IN
50 50 D VS RL 50 VOUT
50 VS D VOUT
VIN GND
VIN GND
RL 50
OFF ISOLATION = 20 LOG
VOUT VS
INSERTION LOSS = 20 LOG
VOUT WITH SWITCH VOUT WITHOUT SWITCH
Test Circuit 6. Off Isolation
Test Circuit 7. Bandwidth
REV. 0
-7-
ADG801/ADG802
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm)
8-Lead SOIC (RM-8)
0.1220 (3.10) 0.1063 (2.70)
6-Lead SOT-23 (RT-6)
C02800-0-5/02(0)
0.0217 (0.55) 0.0138 (0.35)
0.1220 (3.10) 0.1142 (2.90)
0.0709 (1.80) 0.0591 (1.50)
8 5
6
5
4
0.1181 (3.00) 0.0984 (2.50)
1 2 3
0.1220 (3.10) 0.1142 (2.90)
1 4
0.1988 (5.05) 0.1870 (4.75)
PIN 1 0.0748 (1.90) BSC 0.0374 (0.95) BSC
PIN 1 0.0256 (0.65) BSC 0.1201 (3.05) 0.1118 (2.84) COPLANARITY 0.0059 (0.15) 0.0020 (0.05) 0.0429 (1.09) 0.0370 (0.94) 0.0181 (0.46) 0.0079 (0.20) 0.0110 (0.28) 0.0031 (0.08)
0.1201 (3.05) 0.1118 (2.84) 33 27
0.0512 (1.30) 0.0354 (0.90)
0.0571 (1.45) 0.0354 (0.90) 10 0 0.0197 (0.50) SEATING 0.0091 (0.23) 0.0098 (0.25) PLANE 0.0031 (0.08)
SEATING PLANE
0.0280 (0.71) 0.0161 (0.41)
0.0059 (0.15) 0.0000 (0.00) COPLANARITY
-8-
REV. 0
PRINTED IN U.S.A.


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