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| 24AA00/24LC00/24C00 24AA014/24LC014 24AA02/24LC02B 24AA024/24LC024 24AA04/24LC04B 24AA16/24LC16B 24AA64/24LC64/24FC64 24AA256/24LC256/24FC256 24AA01/24LC01B 24C01C/24C02C 24AA025/24LC025 24AA08/24LC08B 24AA32A/24LC32A 24AA128/24LC128/24FC128 24AA512/24LC512/24FC512 24AA1025/24LC1025/24FC1025 I2CTM Serial EEPROM Family Data Sheet Features: * 128-bit through 1024 Kbit Devices * Single Supply with Operation Down to 1.7V for 24AAXX Devices * Low-Power CMOS Technology: - 1 mA active current, typical - 1 A standby current, typical (I-temp) * 2-Wire Serial Interface Bus, I2CTM Compatible * Schmitt Trigger Inputs for Noise Suppression * Output Slope Control to Eliminate Ground Bounce * 400 kHz ( 2.5V): 24LCXX and 24AAXX * 1 MHz ( 2.5V) and 400 kHz (1.7V): 24FCXX * Self-Timed Write Cycle (including Auto-Erase) * Page Write Buffer * Hardware Write-Protect Available on Most Devices * Factory Programming (QTP) Available * ESD Protection >4,000V * 1 Million Erase/Write Cycles * Data Retention >200 years * 8-lead PDIP, SOIC, TSSOP and MSOP Packages * 5-lead SOT-23 Package (Most 1-16 Kbit Devices) * 8-lead 2x3mm and 5x6mm DFN Packages Available * Pb-Free and RoHS Compliant * Available for Extended Temperature Ranges: - Industrial (I): -40C to +85C - Automotive (E): -40C to +125C Description: The Microchip Technology Inc. 24CXX, 24LCXX, 24AAXX and 24FCXX (24XX*) devices are a family of 128-bit through 1024 Kbit Electrically Erased PROMs. The devices are organized in blocks of x8-bit memory with 2-wire serial interfaces. Low-voltage design permits operation down to 1.7V (for 24AAXX devices), with standby and active currents of only 1 A and 1 mA, respectively. Devices 1 Kbit and larger have page write capability. Parts having functional address lines allow connection of up to 8 devices on the same bus. The 24XX family is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP and MSOP packages. Most 128-bit through 16 Kbit devices are also available in the 5-lead SOT-23 package. DFN packages (2x3mm or 5x6mm) are also available. All packages are Pb-free (Matte Tin) finish. Note: This document is an overview. For detailed specifications, please consult the individual product data sheet, available at www.microchip.com. *24XX is used in this document as a generic part number for 24 series devices in this data sheet. 24XX64, for example, represents all voltages of the 64 Kbit device. Package Types(1) PDIP/SOIC A0 A1 A2 VSS 1 2 3 4 8 7 6 5 VCC WP (3) TSSOP/MSOP(2) A0 A1 A2 VSS 1 2 3 4 8 7 6 5 VCC WP(3) SCL SDA Note 1: SCL VSS SDA SOT-23-5 (24XX00) 1 2 3 4 NC 5 VCC SCL SDA SOT-23-5 (all except 24XX00) SCL VSS SDA 1 2 3 4 VCC 5 WP A0 1 A1 2 A2 3 VSS 4 DFN 8 VCC 7 WP(3) 6 SCL 5 SDA 2: 3: Pins A0, A1, A2 and WP are not used by some devices (no internal connections). See Table 1-1, Device Selection Table, for details. Pins A0 and A1 are no-connects for the 24XX128 and 24XX256 MSOP devices. Pin 7 is "not used" for 24XX00, 24XX025 and 24C01C. (c) 2007 Microchip Technology Inc. DS21930C-page 1 24AAXX/24LCXX/24FCXX TABLE 1-1: Part Number 128-bit devices 24AA00 24LC00 24C00 1 Kb devices 24AA01 24LC01B 24AA014 24LC014 24AA01H(6) 24LC01H 24C01C 2 Kb devices 24AA02 24LC02B 24AA024 24LC024 24AA025 24LC025 24AA02H(6) 24LC02H(6) 24C02C 4 Kb devices 24AA04 24LC04B 8 Kb devices 24AA08 24LC08B 16 Kb devices 24AA16 24LC16B 32 Kb devices 24AA32A 24LC32A 1.7-5.5V 2.5-5.5V 400 kHz (2) 400 kHz 32 bytes Entire Array A0, A1, A2 I I, E P, SN, SM, ST, MS, MC 1.7-5.5V 2.5-5.5V 400 kHz (2) 400 kHz 16 bytes Entire Array None I I, E P, SN, ST, MS, OT, MC 1.7-5.5V 2.5-5.5V 400 kHz (2) 400 kHz 16 bytes Entire Array None I I, E P, SN, ST, MS, OT, MC 1.7-5.5V 2.5-5.5V 400 kHz (2) 400 kHz 16 bytes Entire Array None I I, E P, SN, ST, MS, OT, MC 1.7-5.5V 2.5-5.5V 1.7-5.5V 2.5-5.5V 1.7-5.5V 2.5-5.5V 1.7-5.5v 2.5-5.5v 4.5-5.5V 400 kHz (2) 400 kHz 400 kHz(2) 400 kHz 400 kHz(2) 400 kHz 400 kHz(1) 400 kHz(1) 8 bytes 16 bytes 16 bytes 16 bytes 16 bytes 16 bytes Entire Array Entire Array None Upper Half Upper Half Upper Half of Array None A0, A1, A2 A0, A1, A2 A0, A1, A2 A0, A1, A2 A0, A1, A2 I I, E I I I I I I, E I, E P, SN, ST, MS, OT, MC P, SN, ST, MS, OT, MC P, SN, ST, MC P, SN, ST,MS, MC P, SN, ST, MS, MC P, SN, ST, MS, OT, MC (6) DEVICE SELECTION TABLE VCC Range Max. Clock Frequency Page Size WriteProtect Array Functional Address Pins Temp. Range Packages(5) 1.7-5.5V 2.5-5.5V 4.5-5.5V 1.7-5.5V 2.5-5.5V 1.7-5.5V 2.5-5.5V 1.7-5.5v 2.5-5.5v 400 kHz(1) 400 kHz(1) 400 kHz 400 kHz (2) 400 kHz 400 kHz(2) 400 kHz 400 kHz(1) 400 kHz(1) -- None None I I I, E I I, E I I I I, E I, E P, SN, ST, OT, MC 8 bytes 16 bytes 16 bytes 16 bytes 16 bytes Entire Array Entire Array Upper Half Upper Half None None A0, A1, A2 A0, A1, A2 A0, A1, A2 A0, A1, A2 P, SN, ST, MS, OT, MC P, SN, ST, MS, MC P, SN, ST, MS, OT, MC P, SN, ST, MS, OT, MC P, SN, ST, MC 4.5V-5.5V 400 kHz 400 kHz Note 1: 100 kHz for VCC <4.5V. 2: 100 kHz for VCC <2.5V. 3: 400 kHz for VCC <2.5V. 4: Pins A0 and A1 are no-connects for the 24XX128 and 24XX256 in the MSOP package. 5: P = 8-PDIP, SN = 8-SOIC (3.90 mm JEDEC), ST = 8-TSSOP, OT = 5 or 6-SOT23, MC = 2x3mm DFN, MS = 8-MSOP, SM = 8-SOIC (200 mil EIAJ), MF = 5x6mm DFN. 6: Available Q4 2007. DS21930C-page 2 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX TABLE 1-1: Part Number 64 Kb devices 24AA64 24LC64 24FC64 128 Kb devices 24AA128 24LC128 24FC128 256 Kb devices 24AA256 24LC256 24FC256 512 Kb devices 24AA512 24LC512 24FC512 24AA1025 24LC1025 24FC1025 1.7-5.5V 2.5-5.5V 400 kHz (2) 400 kHz 128 bytes I Entire Array A0, A1, A2 I, E I I 128 bytes Entire Array A0, A1 I, E I P, SM P, SM, MF, 1.7-5.5V 2.5-5.5V 1.7-5.5V 400 kHz (2) 400 kHz 1 MHz(3) 64 bytes Entire Array A0, A1, A2(4) I I, E I P, SN, SM, ST, MS, MF 1.7-5.5V 2.5-5.5V 1.7-5.5V 400 kHz (2) 400 kHz 1 MHz(3) 64 bytes Entire Array A0, A1, A2(4) I I, E I P, SN, SM, ST, MS, MF 1.7-5.5V 2.5-5.5V 1.7-5.5V 400 kHz (2) 400 kHz 1 MHz(3) 32 bytes Entire Array A0, A1, A2 I I, E I P, SN, SM, ST, MS, MC DEVICE SELECTION TABLE (CONTINUED) VCC Range Max. Clock Frequency Page Size WriteProtect Array Functional Address Pins Temp. Range Packages(5) 1.7-5.5V(3) 1 MHz 1.7-5.5V 2.5-5.5V 400 kHz (2) 400 kHz 1024 Kb devices 1.7-5.5V(3) 1 MHz Note 1: 100 kHz for VCC <4.5V. 2: 100 kHz for VCC <2.5V. 3: 400 kHz for VCC <2.5V. 4: Pins A0 and A1 are no-connects for the 24XX128 and 24XX256 in the MSOP package. 5: P = 8-PDIP, SN = 8-SOIC (3.90 mm JEDEC), ST = 8-TSSOP, OT = 5 or 6-SOT23, MC = 2x3mm DFN, MS = 8-MSOP, SM = 8-SOIC (200 mil EIAJ), MF = 5x6mm DFN. 6: Available Q4 2007. (c) 2007 Microchip Technology Inc. DS21930C-page 3 24AAXX/24LCXX/24FCXX 2.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings () VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ...............................................................................................................................-65C to +150C Ambient temperature with power applied ................................................................................................-40C to +125C ESD protection on all pins ...................................................................................................................................................... 4 kV NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 2-1: DC CHARACTERISTICS Electrical Characteristics: Industrial (I): VCC = +1.7V to 5.5V TA = -40C to +85C Automotive (E): VCC = +2.5V to 5.5V TA = -40C to 125C Characteristic A0, A1, A2, SCL, SDA and WP pins: High-level input voltage Low-level input voltage Hysteresis of Schmitt Trigger inputs (SDA, SCL pins) Low-level output voltage Input leakage current Output leakage current Pin capacitance (all inputs/outputs) Min. -- 0.7 VCC -- 0.05 VCC -- -- -- -- -- Max. -- -- 0.3 VCC 0.2 VCC -- 0.40 1 1 10 500 400 1 Units -- V V V V V A A pF A A mA -- -- VCC 2.5V VCC < 2.5V (Note 1) IOL = 3.0 mA @ VCC = 2.5V VIN = VSS or VCC VOUT = VSS or VCC VCC = 5.0V (Note 1) TA = 25C, FCLK = 1 MHz 24XX1025 24XX128, 256, 512: All except 24XX128, 256, 512, 1025: (VCC = 5.5V, SCL = 400 kHz) All except 24XX512 and 24XX1025 24XX512 and 24XX1025 (VCC = 5.5V) All except 24XX1025 24XX1025 24C01C and 24C02C only (TA = -40C to +85C) All except 24XX1025 (TA = -40C to +125C) SCL = SDA = VCC = 5.5V A0, A1, A2, WP = VSS or VCC Conditions DC CHARACTERISTICS Param. No. D1 D2 D3 D4 D5 D6 D7 D8 D9 Sym. -- VIH VIL VHYS VOL ILI ILO CIN, COUT ICC Read Operating current ICC Write -- 3 5 mA mA A A A A D10 ICCS Standby current -- -- -- -- 1 5 50 5 Note 1: This parameter is periodically sampled and not 100% tested. DS21930C-page 4 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX TABLE 2-2: AC CHARACTERISTICS - ALL EXCEPT 24XX00, 24C01C AND 24C02C Electrical Characteristics: Industrial (I): VCC = +1.7V to 5.5V TA = -40C to +85C Automotive (E): VCC = +2.5V to 5.5V TA = -40C to 125C Characteristic Clock frequency Min. -- -- -- -- 4000 600 600 500 4700 1300 1300 500 -- -- -- -- -- 4000 600 600 250 4700 600 600 250 0 250 100 100 4000 600 600 250 4000 600 600 4700 1300 1300 Max. 100 400 400 1000 -- -- -- -- -- -- -- -- 1000 300 300 300 100 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Units kHz Conditions 1.7V VCC < 2.5V 2.5V VCC 5.5V 1.7V VCC < 2.5V 24FCXXX 2.5V VCC 5.5V 24FCXXX 1.7V VCC < 2.5V 2.5V VCC 5.5V 1.7V VCC < 2.5V 24FCXXX 2.5V VCC 5.5V 24FCXXX 1.7V VCC < 2.5V 2.5V VCC 5.5V 1.7V VCC < 2.5V 24FCXXX 2.5V VCC 5.5V 24FCXXX 1.7V VCC < 2.5V 2.5V VCC 5.5V 1.7V VCC 5.5V 24FCXXX All except 24FCXXX 1.7V VCC 5.5V 24FCXXX 1.7V VCC < 2.5V 2.5V VCC 5.5V 1.7V VCC < 2.5V 24FCXXX 2.5V VCC 5.5V 24FCXXX 1.7V VCC < 2.5V 2.5V VCC 5.5V 1.7V VCC < 2.5V 24FCXXX 2.5V VCC 5.5V 24FCXXX (Note 2) 1.7V VCC < 2.5V 2.5V VCC 5.5V 1.7V VCC 5.5V 24FCXXX 1.7 V VCC < 2.5V 2.5 V VCC 5.5V 1.7V VCC < 2.5V 24FCXXX 2.5 V VCC 5.5V 24FCXXX 1.7V VCC < 2.5V 2.5V VCC 5.5V 1.7V VCC 5.5V 24FCXXX 1.7V VCC < 2.5V 2.5V VCC 5.5V 1.7V VCC 5.5V 24FCXXX AC CHARACTERISTICS Param. No. 1 Sym. FCLK 2 THIGH Clock high time ns 3 TLOW Clock low time ns 4 TR SDA and SCL rise time (Note 1) SDA and SCL fall time (Note 1) ns 5 6 TF ns ns THD:STA Start condition hold time 7 TSU:STA Start condition setup time ns 8 9 THD:DAT Data input hold time TSU:DAT Data input setup time ns ns 10 TSU:STO Stop condition setup time ns 11 TSU:WP WP setup time (32K and above only) THD:WP WP hold time (32K and above only) ns 12 ns Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 3: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total EnduranceTM Model, which can be obtained from Microchip's web site: www.microchip.com. 4: 24FCXXX denotes the 24FC64, 24FC128, 24FC256, 24FC512 and 24FC1025 devices. (c) 2007 Microchip Technology Inc. DS21930C-page 5 24AAXX/24LCXX/24FCXX TABLE 2-2: AC CHARACTERISTICS - ALL EXCEPT 24XX00, 24C01C AND 24C02C (CONTINUED) Electrical Characteristics: Industrial (I): VCC = +1.7V to 5.5V TA = -40C to +85C Automotive (E): VCC = +2.5V to 5.5V TA = -40C to 125C Characteristic Output valid from clock (Note 2) Min. -- -- -- -- 4700 1300 1300 500 10 + 0.1CB Max. 3500 900 900 400 -- -- -- -- 250 250 50 5 -- Units ns Conditions 1.7V VCC < 2.5V 2.5V VCC 5.5V 1.7V VCC < 2.5V 24FCXXX 2.5V VCC 5.5V 24FCXXX 1.7V VCC < 2.5V 2.5V VCC 5.5V 1.7V VCC < 2.5V 24FCXXX 2.5V VCC 5.5V 24FCXXX All except 24FCXXX (Note 1) 24FCXXX (Note 1) All except 24FCXXX (Note 1) AC CHARACTERISTICS Param. No. 13 Sym. TAA 14 TBUF Bus free time: Time the bus must be free before a new transmission can start Output fall time from VIH minimum to VIL maximum CB 100 pF Input filter spike suppression (SDA and SCL pins) Write cycle time (byte or page) Endurance ns 15 TOF ns 16 17 18 TSP TWC -- -- -- 1,000,000 ns ms cycles 25C (Note 3) Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 3: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total EnduranceTM Model, which can be obtained from Microchip's web site: www.microchip.com. 4: 24FCXXX denotes the 24FC64, 24FC128, 24FC256, 24FC512 and 24FC1025 devices. DS21930C-page 6 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX TABLE 2-3: AC CHARACTERISTICS - 24XX00, 24C01C AND 24C02C Industrial (I): Automotive (E): Symbol FCLK Min. -- -- -- 4000 4000 600 4700 4700 1300 -- -- -- -- 4000 4000 600 4700 4700 600 0 250 250 100 4000 4000 600 -- -- -- 4700 4700 1300 20+0.1 CB -- -- 1,000,000 TA = -40C to +85C, VCC = 1.7V to 5.5V TA = -40C to +125C, VCC = 4.5V to 5.5V Max. 100 100 400 -- -- -- -- -- -- 1000 1000 300 300 -- -- -- -- -- -- -- -- -- -- -- -- -- 3500 3500 900 -- -- -- 250 50 4 1.5 -- Units kHz Conditions 4.5V Vcc 5.5V (E Temp range) 1.7V Vcc 4.5V 4.5V Vcc 5.5V 4.5V Vcc 5.5V (E Temp range) 1.7V Vcc 4.5V 4.5V Vcc 5.5V 4.5V Vcc 5.5V (E Temp range) 1.7V Vcc 4.5V 4.5V Vcc 5.5V 4.5V Vcc 5.5V (E Temp range) 1.7V Vcc 4.5V 4.5V Vcc 5.5V (Note 1) 4.5V Vcc 5.5V (E Temp range) 1.7V Vcc 4.5V 4.5V Vcc 5.5V 4.5V Vcc 5.5V (E Temp range) 1.7V Vcc 4.5V 4.5V Vcc 5.5V (Note 2) 4.5V Vcc 5.5V (E Temp range) 1.7V Vcc 4.5V 4.5V Vcc 5.5V 4.5V Vcc 5.5V (E Temp range) 1.7V Vcc 4.5V 4.5V Vcc 5.5V 4.5V Vcc 5.5V (E Temp range) 1.7V Vcc 4.5V 4.5V Vcc 5.5V 4.5V Vcc 5.5V (E Temp range) 1.7V Vcc 4.5V 4.5V Vcc 5.5V (Note 1), CB 100 pF (Note 1) 24XX00 24C01C, 24C02C (Note 3) All Parameters apply across all recommended operating ranges unless otherwise noted Parameter Clock frequency Clock high time THIGH ns Clock low time TLOW ns SDA and SCL rise time (Note 1) SDA and SCL fall time Start condition hold time TR ns TF THD:STA ns ns Start condition setup time TSU:STA ns Data input hold time Data input setup time THD:DAT TSU:DAT ns ns Stop condition setup time TSU:STO ns Output valid from clock (Note 2) TAA ns Bus free time: Time the bus must TBUF be free before a new transmission can start Output fall time from VIH minimum to VIL maximum Input filter spike suppression (SDA and SCL pins) Write cycle time Endurance Note 1: 2: 3: TOF TSP TWC ns ns ns ms cycles Not 100% tested. CB = total capacitance of one bus line in pF. As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total EnduranceTM Model which can be obtained from Microchip's web site: www.microchip.com. (c) 2007 Microchip Technology Inc. DS21930C-page 7 24AAXX/24LCXX/24FCXX FIGURE 2-1: EXAMPLE BUS TIMING DATA 5 2 D4 4 SCL SDA IN 7 6 16 3 8 9 10 13 SDA OUT (protected) (unprotected) 14 WP 11 12 DS21930C-page 8 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 3.0 PIN DESCRIPTIONS PIN FUNCTION TABLE 8-Pin TSSOP and MSOP 1(1) 2(1) 3 4 5 6 -- 7(2) 8 5-Pin SOT-23 24XX00 -- -- -- 2 3 1 4 -- 5 5-Pin SOT-23 8-Pin All except 5x6 DFN and 24XX00 2x3 DFN -- -- -- 2 3 1 -- 5 4 1 2 3 4 5 6 -- 7 8 Function User configurable Chip Select(3)(4) User configurable Chip Select(3)(4) User configurable Chip Select(3)(4) Ground Serial Data Serial Clock Not Connected Write-Protect Input Power Supply The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin Name A0 A1 A2 VSS SDA SCL (NC) WP VCC Note 1: 2: 3: 4: 8-Pin PDIP and SOIC 1 2 3 4 5 6 -- 7(2) 8 Pins 1 and 2 are not connected for the 24XX128 and 24XX256 MSOP packages. Pin 7 is not used for 24XX00, 24XX025 and 24C01C. Pins A0, A1 and A2 are not used by some devices (no internal connections). See Table 1-1 for details. Pin A2 should be tied to a Logic High in the 24XX1025 for proper operation. 3.1 A0, A1, A2 Chip Address Inputs 3.2 Serial Data (SDA) The A0, A1 and A2 pins are not used by the 24XX01 through 24XX16 devices. The A0, A1 and A2 inputs are used by the 24C01C, 24C02C, 24XX014, 24XX024, 24XX025 and the 24XX32 through 24XX1025 for multiple device operations. The levels on these inputs are compared with the corresponding bits in the slave address. The chip is selected if the compare is true. For the 24XX128 and 24XX256 in the MSOP package only, pins A0 and A1 are not connected. Up to eight devices (two for the 24XX128 and 24XX256 MSOP package) may be connected to the same bus by using different Chip Select bit combinations. In most applications, the chip address inputs A0, A1 and A2 are hard-wired to logic `0' or logic `1'. For applications in which these pins are controlled by a microcontroller or other programmable device, the chip address pins must be driven to logic `0' or logic `1' before normal device operation can proceed. Note: In the 24XX1025, the A2 pin is not configurable, it must be tied to VCC in order for this device to operate properly. This is a bidirectional pin used to transfer addresses and data into and out of the device. It is an open drain terminal. Therefore, the SDA bus requires a pull-up resistor to VCC (typical 10 k for 100 kHz, 2 k for 400 kHz and 1 MHz). For normal data transfer, SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the Start and Stop conditions. 3.3 Serial Clock (SCL) This input is used to synchronize the data transfer to and from the device. 3.4 Write-Protect (WP) This pin must be connected to either VSS or VCC. If tied to VSS, write operations are enabled. If tied to VCC, write operations are inhibited but read operations are not affected. See Table 1-1 for the write-protect scheme of each device. 3.5 Power Supply (VCC) A VCC threshold detect circuit is employed which disables the internal erase/write logic if VCC is below 1.5V at nominal conditions. For the 24C00, 24C01C and 24C02C devices, the erase/write logic is disabled below 3.8V at nominal conditions. (c) 2007 Microchip Technology Inc. DS21930C-page 9 24AAXX/24LCXX/24FCXX 4.0 FUNCTIONAL DESCRIPTION Each 24XX device supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter, while a device receiving data is defined as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. Block Diagram A0*A1*A2* WP* HV Generator I/O Control Logic Memory Control Logic XDEC EEPROM Array Page Latches* I/O SCL YDEC SDA VCC VSS Sense Amp. R/W Control * A0, A1, A2, WP and page latches are not used by some devices. See Table 1-1, Device Selection Table, for details. DS21930C-page 10 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 5.0 BUS CHARACTERISTICS The following bus protocol has been defined: * Data transfer may be initiated only when the bus is not busy. * During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as a Start or Stop condition. Accordingly, the following bus conditions have been defined (Figure 5-1). 5.1 Bus Not Busy (A) Both data and clock lines remain high. 5.2 Start Data Transfer (B) A high-to-low transition of the SDA line while the clock (SCL) is high determines a Start condition. All commands must be preceded by a Start condition. 5.3 Stop Data Transfer (C) A low-to-high transition of the SDA line while the clock (SCL) is high determines a Stop condition. All operations must be ended with a Stop condition. 5.4 Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a Start condition and terminated with a Stop condition. The number of data bytes transferred between Start and Stop conditions is determined by the master device. (c) 2007 Microchip Technology Inc. DS21930C-page 11 24AAXX/24LCXX/24FCXX 5.5 Acknowledge Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. Note: During a write cycle, the 24XX will not acknowledge commands. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end-ofdata to the slave by not generating an Acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24XX) will leave the data line high to enable the master to generate the Stop condition (Figure 5-2). FIGURE 5-1: (A) SCL (B) DATA TRANSFER SEQUENCE ON THE SERIAL BUS (D) (D) (C) (A) SDA Start Condition Address or Acknowledge Valid Data Allowed to Change Stop Condition FIGURE 5-2: ACKNOWLEDGE TIMING Acknowledge bit SCL 1 2 3 4 5 6 7 8 9 1 2 3 SDA Data from transmitter Transmitter must release the SDA line at this point, allowing the Receiver to pull the SDA line low to acknowledge the previous eight bits of data. Data from transmitter Receiver must release the SDA line at this point so the Transmitter can continue sending data. DS21930C-page 12 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 5.6 Device Addressing For Devices Without Functional Address Pins The last bit of the control byte defines the operation to be performed. When set to `1', a read operation is selected. When set to `0' a write operation is selected. Following the Start condition, the 24XX monitors the SDA bus. Upon receiving a `1010' code, the block select bits and the R/W bit, the slave device outputs an Acknowledge signal on the SDA line. The address byte follows the acknowledge. A control byte is the first byte received following the Start condition from the master device (Figure 5-3). The control byte begins with a four-bit control code. For the 24XX, this is set as `1010' binary for read and write operations. The next three bits of the control byte are the block-select bits (B2, B1, B0). They are used by the master device to select which of the 256-word blocks of memory are to be accessed. These bits are in effect the three Most Significant bits of the word address. Note that B2, B1 and B0 are "don't care" for the 24XX00, the 24XX01 and 24XX02. B2 and B1 are "don't care" for the 24XX04. B2 is "don't care" for the 24XX08. FIGURE 5-3: CONTROL AND ADDRESS BYTE ASSIGNMENTS FOR DEVICES WITHOUT ADDRESS PINS Control Byte Address Byte R/W R/W R/W R/W R/W R/W ACK ACK ACK ACK ACK ACK Acknowledge bit Read/Write bit (Read = 1, Write = 0) A3 . . . . . . . . . . . . . . . . . A0 A0 A0 A0 A0 A0 24XX00 24XX01 24XX02 24XX04 24XX08 24XX016 S S S S S S 1 1 1 1 1 1 0 0 0 0 0 0 1 1 1 1 1 1 0 0 0 0 0 0 x x x x x x x x x x x x B0 x x A7 A7 A7 A7 x A6 . . . . x . . . . . x . . . . . B1 B0 B2 B1 B0 Start bit x = "don't care" bit Control Code Block Select bits (c) 2007 Microchip Technology Inc. DS21930C-page 13 24AAXX/24LCXX/24FCXX 5.7 Device Addressing For Devices With Functional Address Pins For higher density devices (24XX32 through 24XX1025), the next two bytes received define the address of the first data byte. Depending on the product density, not all bits in the address high byte are used. A15, A14, A13 and A12 are "don't care" for 24XX32. A15, A14 and A13 are "don't care" for 24XX64. A15 and A14 are "don't care" for 24XX128. A15 is "don't care" for 24XX256. All address bits are used for the 24XX512 and 24XX1025. The upper address bits are transferred first, followed by the Less Significant bits. Following the Start condition, the 24XX monitors the SDA bus. Upon receiving a `1010' code, appropriate device select bits and the R/W bit, the slave device outputs an Acknowledge signal on the SDA line. The address byte(s) follow the acknowledge. The 24XX1025 has an internal address boundary limitation that is divided into two segments of 512 Kbits. Block select bit `B0' is used to control access to each segment. Contiguous writes cannot be performed across this boundary. A control byte is the first byte received following the Start condition from the master device (Figure 5-4). The control byte begins with a 4-bit control code. For the 24XX, this is set as `1010' binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24XX devices on the same bus and are used to select which device is accessed. The Chip Select bits in the control byte must correspond to the logic levels on the corresponding A2, A1 and A0 pins for the device to respond. These bits are, in effect, the three Most Significant bits of the word address. For 24XX128 and 24XX256 in the MSOP package, the A0 and A1 pins are not connected. During device addressing, the A0 and A1 Chip Select bits (Figure 5-4) should be set to `0'. Only two 24XX128 or 24XX256 MSOP packages can be connected to the same bus. The last bit of the control byte defines the operation to be performed. When set to a `1', a read operation is selected. When set to a `0', a write operation is selected. FIGURE 5-4: CONTROL AND ADDRESS BYTE ASSIGNMENTS FOR DEVICES WITH ADDRESS PINS Control Byte Address Byte 24C01C 24C02C 24XX024/025 S S S 1 1 1 0 0 0 1 1 1 0 0 0 A2 A2 A2 A1 A1 A1 A0 A0 A0 R/W R/W R/W ACK ACK ACK x A7 A7 A6 . . . . . . . . . . . . . . . . . A0 A0 A0 Control Byte Address High Byte Address Low Byte 24XX32 24XX64 24XX128 24XX256 24XX512 24XX1025 S S S S S S 1 1 1 1 1 1 0 0 0 0 0 0 1 1 1 1 1 1 0 A2 A1 A0 R/W ACK 0 A2 A1 A0 R/W ACK 0 A2 A1 A0 R/W ACK 0 A2 A1 A0 R/W ACK 0 A2 A1 A0 R/W ACK 0 B0 A1 A0 R/W ACK x x x x x x x x x x A11 A10 A10 A10 A10 A10 A10 A9 A8 A9 A8 A9 A8 A9 A8 A9 A8 A9 A8 A7 A7 A7 A7 A7 A7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A0 A0 A0 A0 A0 A0 A12 A11 A13 A12 A11 A14 A13 A12 A11 A15 A14 A13 A12 A11 A15 A14 A13 A12 A11 Start bit Control Code Chip Select bits* Read/Write bit Acknowledge bit (Read = 1, Write = 0) x = "don't care" bit * Chip Select bits A1 and A0 must be set to `0' for 24XX128/256 devices in the MSOP package. DS21930C-page 14 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 5.7.1 CONTIGUOUS ADDRESSING ACROSS MULTIPLE DEVICES Chip Select bits A2, A1 and A0 can be used to expand the contiguous address space by adding up to eight 24XXs on the same bus. Software can use the three address bits of the control byte as the three Most Significant bits of the address byte. For example, in the 24XX32 devices, software can use A0 of the control byte as address bit A12; A1 as address bit A13; and A2 as address bit A14 (Table 5-1). It is not possible to sequentially read across device boundaries. TABLE 5-1: CONTROL BYTE ADDRESS BITS Maximum Devices Maximum Contiguous Address Space 8 Kb 8 Kb 16 Kb 16 Kb 256 Kb 512 Kb 1 Mb 2 Mb 4 Mb 4 Mb Chip Select Bit A2 A10 A10 A10 A10 A14 A15 A16* A17* A18 B0(3) Chip Select Bit Chip Select Bit A1 A0 A9 A9 A9 A9 A13 A14 A15* A16* A17 A17 A8 A8 A8 A8 A12 A13 A14 A15 A16 A16 1K (24C01C) 1K (24XX014) 2K (24C02C) 2K (24XX024/025) 32K (24XX32) 64K (24XX64) 128K (24XX128) 256K (24XX256) 512K (24XX512) 1024K (24XX1025) Note 1: 2: 3: 8 8 8 8 8 8 8(1) 8(1) 8 4(2) Up to two 24XX128 or 24XX256 devices in the MSOP package can be added for up to 256 kb or 512 kb of address space, respectively. Bits A0 and A1 must be set to `0'. Using the block select bit `B0', up to four 24XX1025 devices can be cascaded together. For proper operation of the 24XX1025 the A2 pin must be tied to a logic high. Software addressing uses B0 to select between upper and lower 512 Kbit segments of memory. (c) 2007 Microchip Technology Inc. DS21930C-page 15 24AAXX/24LCXX/24FCXX 6.0 6.1 WRITE OPERATIONS Byte Write For the 24XX00 devices, only the lower four address bits are used by the device. The upper four bits are "don't cares." After receiving the ACK from the 24XX acknowledging the final address byte, the master device transmits the data word to be written into the addressed memory location. The 24XX acknowledges again and the master generates a Stop condition, which initiates the internal write cycle. If an attempt is made to write to an array with the WP pin held high, the device will acknowledge the command, but no write cycle will occur, no data will be written, and the device will immediately accept a new command. After a byte Write command, the internal address counter will increment to the next address location. During a write cycle, the 24XX will not acknowledge commands. A byte write operation begins with a Start condition from the master followed by the four-bit control code (see Figure 6-1 and Figure 6-2). The next 3 bits are either the Block Address bits (for devices without address pins) or the Chip Select bits (for devices with address pins). Then the master transmitter clocks the R/W bit (which is a logic low) onto the bus. The slave then generates an Acknowledge bit during the ninth clock cycle. The next byte transmitted by the master is the address byte (for 128-bit to 16 Kbit devices) or the high-order address byte (for 32-1024 Kbit devices). For 32 through 1024 Kbit devices, the high-order address byte is followed by the low-order address byte. In either case, each address byte is acknowledged by the 24XX and the address bits are latched into the internal address counter of the 24XX. FIGURE 6-1: Bus Activity Master S T A R T S BYTE WRITE: 128-BIT TO 16 KBIT DEVICES Control Byte Address Byte Data Byte S T O P P A C K A C K A C K SDA Line Bus Activity FIGURE 6-2: Bus Activity Master BYTE WRITE: 32 TO 1024 KBIT DEVICES S T A R T S A C K A C K A C K A C K Control Byte High Order Address Byte Low Order Address Byte Data Byte S T O P P SDA Line Bus Activity DS21930C-page 16 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 6.2 Page Write 6.3 Write-Protection The write control byte, word address byte(s), and the first data byte are transmitted to the 24XX in much the same way as in a byte write (see Figure 6-3 and Figure 6-4). The exception is that instead of generating a Stop condition, the master transmits up to one page of bytes(1), which is temporarily stored in the on-chip page buffer. This data is then written into memory once the master has transmitted a Stop condition. Upon receipt of each word, the internal address counter is incremented by one. If the master should transmit more than one page of data prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the Stop condition is received, an internal write cycle begins. During the write cycle, the 24XX will not acknowledge commands. Page writes can be any number of bytes within a page (up to the page size), starting at any address. Only the data bytes being addressed will be changed within the page. If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command, but no write cycle will occur, no data will be written and the device will immediately accept a new command. Note 1: See Device Selection Table 1-1 for the page size of each device. The WP pin allows the user to write-protect the array when the pin is tied to VCC. See Device Selection Table 1-1 for the write-protect scheme of each device. If tied to VSS, the write protection is disabled. Please refer to the product data sheet for complete details. Note: Page write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or `page size') and end at addresses that are integer multiples of [page size - 1]. If a Page Write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page, as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary. FIGURE 6-3: Bus Activity Master SDA Line Bus Activity S T A R T S PAGE WRITE: 1 KB TO 16 KBIT DEVICES Control Byte Address Byte Initial Data Byte Second Data Byte Final Data Byte* S T O P P A C K A C K A C K A C K A C K FIGURE 6-4: Bus Activity Master SDA Line Bus Activity S T A R T S PAGE WRITE: 32 TO 1024 KBIT DEVICES Control Byte High Order Address Byte Low Order Address Byte Initial Data Byte Final Data Byte* S T O P P A C K A C K A C K A C K A C K * See Table 1-1 for maximum number of data bytes in a page. (c) 2007 Microchip Technology Inc. DS21930C-page 17 24AAXX/24LCXX/24FCXX 7.0 ACKNOWLEDGE POLLING FIGURE 7-1: Since the device will not acknowledge commands during a write cycle, this can be used to determine when the cycle is complete (This feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally timed write cycle. ACK polling can be initiated immediately. This involves the master sending a Start condition, followed by the control byte for a Write command (R/W = 0). If the device is still busy with the write cycle, then no ACK will be returned. If no ACK is returned, the Start bit and control byte must be re-sent. If the cycle is complete, then the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 7-1 for flow diagram. ACKNOWLEDGE POLLING FLOW Send Write Command Send Stop Condition to Initiate Write Cycle Send Start Send Control Byte with R/W = 0 Did Device Acknowledge (ACK = 0)? Yes Next Operation No DS21930C-page 18 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 8.0 READ OPERATION 8.2 Random Read Read operations are initiated in much the same way as write operations with the exception that the R/W bit of the control byte is set to `1'. There are three basic types of read operations: current address read, random read and sequential read. Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the byte address must first be set. This is done by sending the byte address to the 24XX as part of a write operation (R/W bit set to `0'). Once the byte address is sent, the master generates a Start condition following the acknowledge. This terminates the write operation, but not before the internal address counter is set. The master then issues the control byte again, but with the R/W bit set to a `1'. The 24XX will then issue an acknowledge and transmit the 8-bit data byte. The master will not acknowledge the transfer but does generate a Stop condition, which causes the 24XX to discontinue transmission (Figure 8-2 and Figure 8-3). After a random Read command, the internal address counter will increment to the next address location. 8.1 Current Address Read The 24XX contains an address counter that maintains the address of the last byte accessed, internally incremented by `1'. Therefore, if the previous read or write operation was to address `n' (n is any legal address), the next current address read operation would access data from address n + 1. Upon receipt of the control byte with R/W bit set to `1', the 24XX issues an acknowledge and transmits the 8-bit data byte. The master will not acknowledge the transfer, but does generate a Stop condition and the 24XX discontinues transmission (Figure 8-1). FIGURE 8-1: S T A R T S CURRENT ADDRESS READ Control Byte Data Byte S T O P P A C K N O A C K Bus Activity Master SDA Line Bus Activity FIGURE 8-2: Bus Activity Master S T A R T S RANDOM READ: 128-BIT TO 16 KBIT DEVICES Control Byte Address Byte (n) S T A R T S A C K A C K A C K N O A C K Control Byte Data Byte S T O P P SDA Line Bus Activity FIGURE 8-3: Bus Activity Master SDA Line Bus Activity S T A R T S RANDOM READ: 32 TO 1024 KBIT DEVICES Control Byte High Order Address Byte Low Order Address Byte S T A R T S A C K A C K A C K A C K N O A C K Control Byte Data Byte S T O P P (c) 2007 Microchip Technology Inc. DS21930C-page 19 24AAXX/24LCXX/24FCXX 8.3 Sequential Read Sequential reads are initiated in the same way as a random read except that after the 24XX transmits the first data byte, the master issues an acknowledge as opposed to the Stop condition used in a random read. This acknowledge directs the 24XX to transmit the next sequentially addressed data byte (Figure 8-4). Following the final byte transmitted to the master, the master will NOT generate an acknowledge but will generate a Stop condition. To provide sequential reads, the 24XX contains an internal Address Pointer which is incremented by one at the completion of each operation. This Address Pointer allows the entire memory contents to be serially read during one operation. If the last address byte in the array is acknowledged, the Address Pointer will roll over to address 0x00. FIGURE 8-4: Bus Activity Master SDA Line Bus Activity SEQUENTIAL READ Control Byte Initial Data Byte Second Data Byte Third Data Byte Final Data Byte S T O P P A C K A C K A C K A C K N O A C K DS21930C-page 20 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX APPENDIX A: Revision A Original release of document. Combined Serial EEPROM 24XXX device data sheets. REVISION HISTORY Revision B (02/2007) Change 1.8V to 1.7V; Removed 14-Lead TSSOP Package; Replaced Package Drawings; Revised Product ID Section. Updates throughout. Revision C (07/2007) Added 24AA1025/LC1025/FC1025 part; Updates throughout; Replaced Package Drawings (Rev. AP). (c) 2007 Microchip Technology Inc. DS21930C-page 21 24AAXX/24LCXX/24FCXX 9.0 9.1 PACKAGING INFORMATION Package Marking Information 8-Lead PDIP XXXXXXXX XXXXXNNN YYWW Example: 24LC01B I/P e3 1L7 0528 8-Lead PDIP Package Marking Device 24AA00 24AA01 24AA014 24AA02 24AA024 24AA025 24AA04 24AA08 24AA16 24AA32A 24AA64 24AA128 24AA256 24AA512 24AA1025 Line 1 Marking 24AA00 24AA01 24AA014 24AA02 24AA024 24AA025 24AA04 24AA08 24AA16 24AA32A 24AA64 24AA128 24AA256 24AA512 24AA1025 Device 24LC00 24LC01B 24LC014 24LC02B 24LC024 24LC025 24LC04B 24LC08B 24LC16B 24LC32A 24LC64 24LC128 24LC256 24LC512 24LC1025 Line 1 Marking 24LC00 24LC01B 24LC014 24C01C 24LC02B 24LC024 24LC025 24C02C 24LC04B 24LC08B 24LC16B 24LC32A 24LC64 24LC128 24LC256 24LC512 24LC1025 24FC64 24FC128 24FC256 24FC512 24FC1025 24FC64 24FC128 24FC256 24FC512 24FC1025 24C02C 24C01C Device 24C00 Line 1 Marking 24C00 Device Line 1 Marking Legend: XX...X Y YY WW NNN e3 Note: Part number or part number code Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) plated devices For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion. DS21930C-page 22 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 8-Lead SOIC XXXXXXXX XXXXXYYWW NNN Example: 24LC01BI SN e3 0528 1L7 8-Lead SOIC Package Marking Device 24AA00 24AA01 24AA014 24AA02 24AA024 24AA025 24AA04 24AA08 24AA16 24AA32A 24AA64 24AA128 24AA256 24AA512 24AA1025 Note: Line 1 Marking 24AA00T 24AA01T 24AA014T 24AA02T 24AA024T 24AA025T 24AA04T 24AA08T 24AA16T 24AA32AT 24AA64T 24AA128T 24AA256T 24AA512T 24AA1025 Device 24LC00 24LC01B 24LC014 24LC02B 24LC024 24LC025 24LC04B 24LC08B 24LC16B 24LC32A 24LC64 24LC128 24LC256 24LC512 24LC1025 Line 1 Marking 24LC00T 24LC01BT 24LC014T 24C01C 24LC02BT 24LC024T 24LC025T 24C02C 24LC04BT 24LC08BT 24LC16BT 24LC32AT 24LC64T 24LC128T 24LC256T 24LC512T 24LC1025 24FC64 24FC128 24FC256 24FC512 24FC1025 24FC64T 24FC128T 24FC256T 24FC512T 24FC1025 24C02CT 24C01CT Device 24C00 Line 1 Marking 24C00T Device Line 1 Marking T = Temperature range: I = Industrial, E = Extended Legend: XX...X Y YY WW NNN Part number or part number code Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) plated devices e3 Note: For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion. (c) 2007 Microchip Technology Inc. DS21930C-page 23 24AAXX/24LCXX/24FCXX 8-Lead 2x3 DFN XXX YWW NN Example: 244 506 L7 8-Lead 2x3mm DFN Package Marking Device 24AA00 24AA01 24AA014 24AA02 24AA024 24AA025 24AA04 24AA08 24AA16 24AA32A 24AA64 Industrial Line 1 Marking 201 211 2N1 221 2P1 2R1 231 241 251 261 271 Device 24LC00 24LC01B 24LC014 24LC02B 24LC024 24LC025 24LC04B 24LC08B 24LC16B 24LC32A 24LC64 Industrial Line 1 Marking 204 214 2N4 224 2P4 2R4 234 244 254 264 274 E-Temp Line 1 Marking 205 215 2N5 24C01C 225 2P5 2R5 24C02C 235 245 255 265 275 24FC64 27A 27B 2P7 2P8 2N7 2N8 Device 24C00 Industrial Line 1 Marking 207 E-Temp Line 1 Marking 208 Legend: XX...X Y YY WW NNN e3 Note: Part number or part number code Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) plated devices For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Note: DS21930C-page 24 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 8-Lead DFN Example: XXXXXXX T/XXXXX YYWW NNN 24AA128 I/MF e3 0528 1L7 8-Lead 5x6mm DFN Package Marking Device 24AA128 24AA256 24AA512 Note: Line 1 Marking 24AA128 24AA256 24AA512 Device 24LC128 24LC256 24LC512 Line 1 Marking 24LC128 24LC256 24LC512 Device 24FC128 24FC256 24FC512 Line 1 Marking 24FC128 24FC256 24FC512 Temperature range (T) listed on second line. I = Industrial, E = Extended Legend: XX...X Y YY WW NNN e3 Note: Part number or part number code Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) plated devices For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2007 Microchip Technology Inc. DS21930C-page 25 24AAXX/24LCXX/24FCXX 5-Lead SOT-23 XXNN Example: 5EL7 5-Lead SOT-23 Package Marking Device 24AA00 24AA01 24AA02 24AA04 24AA08 24AA16 Comm. Indust. Marking Marking A0NN A1NN A2NN A3NN A4NN A5NN B0NN B1NN B2NN B3NN B4NN B5NN Device 24LC00 24LC01B 24LC02B 24LC04B 24LC08B 24LC16B Comm. Marking L0NN L1NN L2NN L3NN L4NN L5NN Indust. E-Temp Comm. Indust. E-Temp Device Marking Marking Marking Marking Marking M0NN M1NN M2NN M3NN M4NN M5NN N0NN N1NN N2NN N3NN N4NN N5NN 24C00 C0NN D0NN E0NN Legend: XX...X Y YY WW NNN e3 Note: Part number or part number code Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) plated devices For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS21930C-page 26 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 8-Lead MSOP (150 mil) XXXXXXT YWWNNN Example: 4L8BI 2281L7 8-Lead MSOP Package Marking Device 24AA01 24AA014 24AA02 24AA024 24AA025 24AA04 24AA08 24AA16 24AA32A 24AA64 24AA128 24AA256 Note: Line 1 Marking 4A01T 4A14T 4A02T 4A24T 4A25T 4A04T 4A08T 4A16T 4A32AT 4A64T 4A128T 4A256T Device 24LC01B 24LC014 24LC02B 24LC024 24LC025 24LC04B 24LC08B 24LC16B 24LC32A 24LC64 24LC128 24LC256 Line 1 Marking 4L1BT 4L14T 24C01C 4L2BT 4L24T 4L25T 24C02C 4L4BT 4L8BT 4L16T 4L32AT 4L64T 4L128T 4L256T 24FC64 24FC128 24FC256 4F64T 4F128T 4F256T 4C2CT 4C1CT Device Line 1 Marking Device Line 1 Marking T = Temperature range: I = Industrial, E = Extended Legend: XX...X Y YY WW NNN e3 Note: Part number or part number code Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) plated devices For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2007 Microchip Technology Inc. DS21930C-page 27 24AAXX/24LCXX/24FCXX 8-Lead TSSOP XXXX TYWW NNN Example: 4L08 I228 1L7 8-Lead TSSOP Package Marking Device 24AA00 24AA01 24AA014 24AA02 24AA024 24AA025 24AA04 24AA08 24AA16 24AA32A 24AA64 24AA128 24AA256 Note: Line 1 Marking 4A00 4A01 4A14 4A02 4A24 4A25 4A04 4A08 4A16 4AA 4AB 4AC 4AD Device 24LC00 24LC01B 24LC014 24LC02B 24LC024 24LC025 24LC04B 24LC08B 24LC16B 24LC32A 24LC64 24LC128 24LC256 Line 1 Marking 4L00 4L1B 4L14 24C01C 4L02 4L24 4L25 24C02C 4L04 4L08 4L16 4LA 4LB 4LC 4LD 24FC64 24FC128 24FC256 4FB 4FC 4FD 4C2C 4C1C Device 24C00 Line 1 Marking 4C00 Device Line 1 Marking T = Temperature range: I = Industrial, E = Extended Legend: XX...X Y YY WW NNN e3 Note: Part number or part number code Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) plated devices For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS21930C-page 28 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 2 D 3 E A2 A A1 e b1 b L c eB Units Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing N e A A2 A1 E E1 D L c b1 b eB - .115 .015 .290 .240 .348 .115 .008 .040 .014 - MIN INCHES NOM 8 .100 BSC - .130 - .310 .250 .365 .130 .010 .060 .018 - .210 .195 - .325 .280 .400 .150 .015 .070 .022 MAX .430 Notes: 1. Pin 1 visual index feature may vary, but must be located with the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-018B (c) 2007 Microchip Technology Inc. DS21930C-page 29 24AAXX/24LCXX/24FCXX 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D e N E E1 NOTE 1 1 2 3 b h c h A A2 A1 L L1 Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom N e A A2 A1 E E1 D h L L1 c b 0 0.17 0.31 5 5 0.25 0.40 - 1.25 0.10 MIN MILLIMETERS NOM 8 1.27 BSC - - - 6.00 BSC 3.90 BSC 4.90 BSC - - 1.04 REF - - - - - 8 0.25 0.51 15 0.50 1.27 1.75 - 0.25 MAX 15 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-057B DS21930C-page 30 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging e N L D N b K E E2 EXPOSED PAD NOTE 1 1 2 D2 TOP VIEW BOTTOM VIEW 2 1 NOTE 1 A A3 A1 NOTE 2 Units Dimension Limits MIN MILLIMETERS NOM 8 0.50 BSC 0.80 0.00 0.90 0.02 0.20 REF 2.00 BSC 3.00 BSC 1.30 1.50 0.18 0.30 0.20 - - 0.25 0.40 - 1.75 1.90 0.30 0.50 - 1.00 0.05 MAX Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length Overall Width Exposed Pad Length Exposed Pad Width Contact Width Contact Length Contact-to-Exposed Pad N e A A1 A3 D E D2 E2 b L K Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-123B (c) 2007 Microchip Technology Inc. DS21930C-page 31 24AAXX/24LCXX/24FCXX 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging e b L N D N K E EXPOSED PAD NOTE 1 1 2 TOP VIEW E2 2 D2 1 NOTE 1 BOTTOM VIEW A A3 A1 NOTE 2 Units Dimension Limits Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length Overall Width Exposed Pad Length Exposed Pad Width Contact Width Contact Length N e A A1 A3 D E D2 E2 b L 3.90 2.20 0.35 0.50 0.80 0.00 MIN MILLIMETERS NOM 8 1.27 BSC 0.85 0.01 0.20 REF 5.00 BSC 6.00 BSC 4.00 2.30 0.40 0.60 4.10 2.40 0.48 0.75 - 1.00 0.05 MAX Contact-to-Exposed Pad K 0.20 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-122B DS21930C-page 32 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 5-Lead Plastic Small Outline Transistor (OT) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging b N E E1 1 e 2 3 e1 D A A2 c A1 L L1 Units Dimension Limits Number of Pins Lead Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness N e e1 A A2 A1 E E1 D L L1 c 0.90 0.89 0.00 2.20 1.30 2.70 0.10 0.35 0 0.08 MIN MILLIMETERS NOM 5 0.95 BSC 1.90 BSC - - - - - - - - - - 1.45 1.30 0.15 3.20 1.80 3.10 0.60 0.80 30 0.26 MAX Lead Width b 0.20 - 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-091B (c) 2007 Microchip Technology Inc. DS21930C-page 33 24AAXX/24LCXX/24FCXX 8-Lead Plastic Micro Small Outline Package (MS) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 b A A2 c e A1 Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness N e A A2 A1 E E1 D L L1 c L1 MILLIMETERS MIN NOM 8 0.65 BSC - 0.75 0.00 - 0.85 - 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0 0.08 0.60 0.95 REF - - 8 0.23 0.80 1.10 0.95 0.15 MAX L Lead Width b 0.22 - 0.40 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-111B DS21930C-page 34 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 b 2 e c A A2 A1 L1 L Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Footprint Foot Angle Lead Thickness N e A A2 A1 E E1 D L L1 c 0 0.09 4.30 2.90 0.45 - 0.80 0.05 MIN MILLIMETERS NOM 8 0.65 BSC - 1.00 - 6.40 BSC 4.40 3.00 0.60 1.00 REF - - 8 0.20 4.50 3.10 0.75 1.20 1.05 0.15 MAX Lead Width b 0.19 - 0.30 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-086B (c) 2007 Microchip Technology Inc. DS21930C-page 35 24AAXX/24LCXX/24FCXX NOTES: DS21930C-page 36 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: * * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. (c) 2007 Microchip Technology Inc. DS21930C-page 37 24AAXX/24LCXX/24FCXX READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Literature Number: DS21930C FAX: (______) _________ - _________ Device: 24AAXX/24LCXX/24FCXX Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21930C-page 38 (c) 2007 Microchip Technology Inc. 24AAXX/24LCXX/24FCXX PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device Part Number (Table 1-1) X X /XX Examples: a) b) 24AA014-I/SN: 1 Kbit, Industrial Temperature, 1.7V, SOIC package 24AA02T-I/OT: 2 Kbit, Industrial Temperature, 1.7V, SOT-23 package, Tape and Reel 24LC16B-I/P: 16 Kbit, Industrial Temperature, 2.5V, PDIP package 24LC32A-E/MS: 32 Kbit, Extended Temperature, 2.5V, MSOP package 24LC64T-I/MC: 64 Kbit, Industrial Temperature, 2.5V 2x3 mm DFN package, Tape and Reel 24FC512T-I/SM: 512 Kbit, Industrial Temperature, 1 MHz, SOIC package, Tape and Reel Packaging Temperature Package Medium Range c) Device: See Table 1-1 d) Temperature I Range: E Packaging Medium: Package: = = -40C to +85C -40C to +125C e) T = Tape and Reel Blank = Tube P SN SM ST MS OT MC MF = = = = = = = = Plastic DIP (300 mil body), 8-lead Plastic SOIC (3.90 mm body), 8-lead Plastic SOIC (208 mil body), 8-lead Plastic TSSOP (4.4 mm), 8-lead MSOP (3.0 mm), 8-lead SOT-23, 5-lead (Tape and Reel only) 2x3 mm DFN, 8-lead (Tape and Reel only) 5x6 mm DFN, 8-lead f) (c) 2007 Microchip Technology Inc. DS21930C-page 39 24AAXX/24LCXX/24FCXX NOTES: DS21930C-page 40 (c) 2007 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2007 Microchip Technology Inc. DS21930C-page 41 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 ASIA/PACIFIC India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 06/25/07 DS21930C-page 42 (c) 2007 Microchip Technology Inc. |
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