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| Fiber Optics Small Form Factor Single Mode 1300 nm Multirate up to 2.5 Gbit/s Transceiver 2x5/2x10 Pinning with LCTM Connector V23818-N15-Lxx/Lxxx Features * * * * * * * * * * * * * * * * * Small Form Factor transceiver RJ-45 style LCTM connector system Half the size of SC Duplex 1x9 transceiver Optimized for SDH STM-16 / SONET OC-48 Single power supply (3.3 V) Extremely low power consumption Loss of optical signal indicator Laser disable input LVPECL differential inputs and outputs Suitable for multirate applications up to 2.5 Gbit/s Distance up to 2 km on single mode fiber (SMF) Class 1 FDA and IEC laser safety compliant Multisource footprint Small footprint for high channel density UL 94 V-0 certified Compliant with FCC (Class B) and EN 55022 Tx and Rx power monitor File: 1119 File: 1120 For ordering information see next page. LCTM is a trademark of Lucent. Data Sheet 1 2003-08-18 V23818-N15-Lxx/Lxxx Ordering Information Ordering Information Part Number V23818-N15-L17 V23818-N15-L16 V23818-N15-L353 V23818-N15-L356 V23818-N15-L354 V23818-N15-L355 V23818-N15-L37 V23818-N15-L36 V23818-N15-L47 V23818-N15-L46 V23818-N15-L457 1) Pinning Signal Detect 2x10 Operating Data Outputs Temperature if SD is Low -40...85C Collar In- Output put DC AC DC AC LVPECL -5...70C LVTTL LVTTL -5...70C -40...85C -5...70C Switched to Low yes no 2x5 LVPECL -5...70C -40...85C LVTTL 2x10 LVTTL LVTTL -5...70C -40...85C -5...70C -40...85C Active yes AC AC AC AC Switched to Low yes1) AC AC Switched to Low yes DC DC V23818-N15-L356-C 2x10 Incorporates non-standard collar type (see Figure 20 on Page 26). Data Sheet 2 2003-08-18 V23818-N15-Lxx/Lxxx Pin Configuration Pin Configuration HL HL 20 19 18 17 16 15 14 13 12 11 Tx MS TOP VIEW Rx MS HL 1 2 3 4 5 6 7 8 9 10 HL File: 1335 Figure 1 2x10 Pin Connect Diagram 2x10 Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 MS HL 1) Symbol PDBias Level/Logic DC current Ground Ground Description PIN photo detector bias current Receiver signal ground Receiver signal ground Not connected Not connected Receiver signal ground Receiver power supply Receiver optical input level monitor Receiver data out bar Receiver data out Transmitter power supply Transmitter signal ground Transmitter disable Transmitter data in Transmitter data in bar Transmitter signal ground Laser diode bias current monitor Laser diode bias current monitor Laser diode optical power monitor Laser diode optical power monitor Mounting studs Housing leads VEEr VEEr NC NC VEEr VCCr SD RD- RD+ VCCt VEEt TDis TD+ TD- VEEt BMon- BMon+ PMon- PMon+ Ground Power supply LVTTL or LVPECL output1) LVPECL output LVPECL output Power supply Ground LVTTL input LVPECL input LVPECL input Ground DC voltage DC voltage DC voltage DC voltage LVPECL output active high for V23818-N15-L17/L16/L417/L373. LVTTL output active high for V23818-N15-L353/L356/L457/L355/L354. Data Sheet 3 2003-08-18 V23818-N15-Lxx/Lxxx Pin Configuration Tx MS HL HL 10 9 8 7 6 TOP VIEW Rx MS HL 12345 HL File: 1331 Figure 2 2x5 Pin Connect Diagram 2x5 Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 MS HL 1) Symbol Level/Logic Ground Power supply LVTTL or LVPECL output1) LVPECL output LVPECL output Power supply Ground LVTTL input LVPECL input LVPECL input Description Receiver signal ground Receiver power supply Receiver optical input level monitor Receiver data out bar Receiver data out Transmitter power supply Transmitter signal ground Transmitter disable Transmitter data in Transmitter data in bar Mounting studs Housing leads VEEr VCCr SD RD- RD+ VCCt VEEt TDis TD+ TD- 2) 2) LVPECL output active high for V23818-N15-L37/L36. LVTTL output active high for V23818-N15-L47/L46. Housing leads removed for V23818-N15-L46WH. Due to possible EMI performance issues, use of this transceiver should be restricted to applications where the chassis is completely sealed and the transceiver encapsulated within. VEEr / VEEt For 2x10 transceivers, connect pins 2, 3, 6, 12 and 16 to signal ground. For 2x5 transceivers, connect pins 1 and 7 to signal ground. Data Sheet 4 2003-08-18 V23818-N15-Lxx/Lxxx Pin Configuration VCCr / VCCt For 2x10 transceivers a 3.3 V DC power supply must be applied at pins 7 and 11. For 2x5 transceivers a 3.3 V DC power supply must be applied at pins 2 and 6. A recommended power supply filter network is given in the termination scheme. Locate power supply filtering directly at the transceiver power supply pins. Proper power supply filtering is essential for good EMI performance. TD+ / TD- Transmitter data LVPECL level inputs. For V23818-N15-L353/L356/L457/L354/L355/ L47/L46/L373 terminated and AC coupled internally. For V23818-N15-L17/L16/L417/ L37/L36 use termination and coupling as shown in the termination scheme. RD- / RD+ Receiver data LVPECL level outputs. For V23818-N15-L353/L356/L457/L354/L355/ L47/L46/L373 biased and AC coupled internally. For V23818-N15-L17/L16/L417/L37/ L36 use termination and coupling as shown in the termination scheme. TDis A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input must be applied. Leave pin unconnected if feature not required. SD LVTTL output for V23818-N15-L353/L356/L457/L354/L355/L47/L46. LVPECL output for V23818-N15-L17/L16/L417/L37/L36/L373. A logical high output indicates normal optical input levels to the receiver. Low optical input levels at the receiver result in a low output. Signal Detect can be used to determine a definite optical link failure; break in fiber, unplugging of a connector, faulty laser source. However it is not a detection of a bad link due to data-related errors. MS Mounting studs are provided for transceiver mechanical attachment to the circuit board. They also provide an optional connection of the transceiver to the equipment chassis ground. The holes in the circuit board must be tied to chassis ground. HL Housing leads are provided for additional signal grounding. The holes in the circuit board must be included and tied to signal ground. Data Sheet 5 2003-08-18 V23818-N15-Lxx/Lxxx Pin Configuration 2x10 Transceiver Additional Functionality PDBias Connect pin 1 to VCC through a bias resistor, of a value not exceeding 2 k, as shown in Figure 3 to monitor PIN photo detector bias current. Leave pin floating if not used. Typical behaviour is shown in Figure 4 and Figure 5 using a 2 k load. VCC 2 k Pin 1 Vbias File: 1307 Figure 3 Photo Detector Bias Interface Data Sheet 6 2003-08-18 V23818-N15-Lxx/Lxxx Pin Configuration Typical Responsitivity of PIN Photo Detector Bias Current Monitor 400 Photo Detector Monitor Current (A) 300 200 100 0 0 100 200 300 400 Received Optical Power (W) File: 1308 Figure 4 Linear Response 400 Photo Detector Monitor Current (A) 300 200 100 0 -30 -24 -18 -12 -6 0 Received Optical Power (dBm) File: 1309 Figure 5 Logarithmic Response Data Sheet 7 2003-08-18 V23818-N15-Lxx/Lxxx Pin Configuration BMon- / BMon+ The DC voltage measured across pins 17 and 18 is proportional to the laser bias current. Use the equation: Ibias = Vbias /10 Use this output to monitor laser performance and EOL conditions. A schematic and typical behaviour are shown in Figure 6 and Figure 7. Ibias @ ambient 25C < 60 mA. Leave pins floating if function is not required. VCC Pin 18 3 k 10 Pin 17 3 k VEE File: 1310 Figure 6 Bias Monitor - Transceiver Internal 0.36 0.32 BMon Output Voltage (V) 0.28 0.24 0.2 0.16 0.12 0.08 0.04 0 0 10 20 30 40 50 60 70 File: 1312 Temperature (C) Figure 7 Data Sheet Typical Variations of Bias Monitor Voltage over Temperature 8 2003-08-18 V23818-N15-Lxx/Lxxx Pin Configuration PMon- / PMon+ The DC voltage that can be measured across pins 19 and 20 is proportional to the laser monitor diode current through a 200 resistor in its path. This output remains constant and can be used to monitor correct operation of laser control circuitry, a deviation indicates faulty behaviour. A schematic and typical behaviour are shown in Figure 8 and Figure 9. The SFF MSA defines that Vmon must be in the range of 0.01 V and 0.2 V. The Infineon OC-48 transceiver has a nominal range of 0.04 to 0.08 V. Leave pins unconnected if feature is not required. VCC Pin 20 3 k 200 Pin 19 3 k R VEE File: 1311 Figure 8 Power Monitor - Transceiver Internal 0.08 0.07 PMon Output Voltage (V) 0.06 0.05 0.04 0.03 0.02 0.01 0.00 0 10 20 30 40 50 60 70 File: 1313 Temperature (C) Figure 9 Data Sheet Typical Behaviour of Power Monitor Voltage over Temperature 9 2003-08-18 V23818-N15-Lxx/Lxxx Description Description The Infineon 2.5 Gigabit single mode transceiver - part of the Infineon Small Form Factor transceiver family - is based on the Physical Medium Depend (PMD) sublayer and baseband medium, type 2000 Base-LX, compliant with ITU-T G.957 STM-16, S-16.1 and SONET OC-48 SR-1. This transceiver is also suitable for multirate applications. The performance at lower datarates may vary from application to application and is link dependent. Refer to Infineon Application Note 97 for more information. The appropriate fiber optic cable is 9 m single mode fiber with LC connector. The Infineon OC-48 single mode transceiver is a single unit comprised of a transmitter, a receiver, and an LC receptacle. This design frees the customer from many alignment and PC board layout concerns. This transceiver supports the LC connectorization concept, which competes with UTP/ CAT 5 solutions. It is compatible with RJ-45 style backpanels for fiber-to-the-desktop applications while providing the advantages of fiber optic technology. The transmission distance is up to 2 km. The module is designed for low cost LAN, WAN, and up to 2.5 Gbit/s applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at up to 2.5 Gbit/s from a single power supply (+3.3 V). The full differential data inputs and outputs are LVPECL compatible. Data Sheet 10 2003-08-18 V23818-N15-Lxx/Lxxx Description Functional Description of SFF Transceiver This transceiver is designed to transmit serial data via single mode fiber. BMonBMon+ Automatic Shut-Down TDis 3k TDTD+ Laser Driver Power Control PMonPMon+ RDRD+ SD PDBias Receiver 3k 10 3k e/o Tx Coupling Unit Laser o/e 200 3k Monitor Rx Coupling Unit o/e Single Mode Fiber File: 1357 Figure 10 Functional Diagram 2x10 Pin Rows Automatic Shut-Down TDis TD- TD+ Laser Driver Power Control Tx Coupling Unit e/o Laser o/e Monitor Rx Coupling Unit Single Mode Fiber RD- RD+ SD Limiting Amp TIA o/e File: 1351 Figure 11 Data Sheet Functional Diagram 2x5 Pin Rows 11 2003-08-18 V23818-N15-Lxx/Lxxx Description The receiver component converts the optical serial data into an electrical data (RD+ and RD-). The Signal Detect output (SD) shows whether an optical signal is present. The transmitter part converts electrical LVPECL compatible serial data (TD+ and TD-) into optical serial data. The module has an integrated shutdown function that switches the laser off in the event of an internal failure. Reset is only possible if the power is turned off, and then on again. (VCCt switched below VTH). The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Data Sheet 12 2003-08-18 V23818-N15-Lxx/Lxxx Description Regulatory Compliance Feature ESD: Electrostatic Discharge to the Electrical Pins Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle Immunity: Against Radio Frequency Electromagnetic Field Emission: Electromagnetic Interference (EMI) Standard EIA/JESD22-A114-B (MIL-STD 883D Method 3015.7) EN 61000-4-2 IEC 61000-4-2 Comments Class 1C Discharges ranging from 2 kV to 15 kV on the receptacle cause no damage to transceiver (under recommended conditions). With a field strength of 3 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Noise frequency range: 30 MHz to 18 GHz EN 61000-4-3 IEC 61000-4-3 FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22 (13.97) *) .550 *) min. pitch between SFF transceiver according to MSA. Dimensions in (mm) inches File: 1501 Figure 12 Transceiver Pitch Data Sheet 13 2003-08-18 V23818-N15-Lxx/Lxxx Technical Data Technical Data Absolute Maximum Ratings Parameter Package Power Dissipation Supply Voltage Data Input Levels Differential Data Input Voltage Swing PIN PDBias Voltage Storage Ambient Temperature Hand Lead Soldering Temp/Time Wave Soldering Temp/Time Aqueous Wash Pressure -40 Symbol Limit Values min. max. 0.9 W V V V V C C/s C/s psi 4 Unit VCC-VEE VCC+0.5 VIDpk-pk VEE-0.5 5 4 85 260/10 260/10 < 110 Exceeding any one of these values may destroy the device immediately. Data Sheet 14 2003-08-18 V23818-N15-Lxx/Lxxx Technical Data Recommended Operating Conditions Parameter Ambient Temperature Ambient Temperature Transmitter Supply Current Tx Data Input High Voltage Differential Data Input Voltage Swing 4) Data Input Low Voltage Data Input Rise/Fall Time (20% - 80%) Receiver Supply Current Rx Input Center Wavelength 1) 2) 3) 4) Symbol min. 1), 3) 2), 3) Limit Values typ. max. 85 70 3.3 3.46 110 -1165 500 -1810 -880 3200 -1475 120 -40 -5 3.14 Unit C V mA mV mV mV ps TAMB VCC-VEE ICCt VIH-VCC VIDpk-pk VIL-VCC ti Power Supply Voltage ICCr Rx 1260 120 1580 mA nm Only for V23818-N15-Lx6/Lxx6. Not for V23818-N15-Lx6/Lxx6. Ambient operating temperature requires a 2 ms-1 airflow over the device. V23818-N15-L353/L356/L457/L354/L355/L47/L46/L373 are internally AC coupled. External coupling capacitors required only for V23818-N15-L17/L16/L417/L37/L36. The electro-optical characteristics described in the following tables are valid only for use under the recommended operating conditions. Data Sheet 15 2003-08-18 V23818-N15-Lxx/Lxxx Technical Data Transmitter Electro-Optical Characteristics Transmitter Output Power (Average) Output Power (Average) Center Wavelength Spectral Width (RMS) Side Mode Suppression Ratio Extinction Ratio (Dynamic) Optical Eye Mask Reset Threshold for VCCt 3) Power on Delay 3) Jitter Generation4) Jitter Generation4) Rise Time 5) Fall Time 5) 1) 2) Symbol min. Limit Values typ. max. -3 -3 1360 4 30 8.2 2.2 30 0.04 0.004 70 225 2 0.8 0.4 0.06 1 10 2.99 -10 -8 1266 Unit dBm nm nm dB dB PO C SMSR ER ED Compliant with ITU-T G.957 V ms UI UI ps ps V V ms s TDis Assert Voltage TTL TDis Deassert Voltage TTL TDis Assert Time 6) TDis Deassert Time 7) 1) 2) 3) 4) 5) 6) 7) VTH tDEL JGEp-p JGERMS tR tF VTDH VTDL tASS tDAS Not for V23818-N15-L354/L355. Only for V23818-N15-L354/L355. Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tDEL. Jitter Generation under worst case conditions reaches a maximum value of 0.06 UI pk-pk/0.006 UI RMS. Measured using 20% - 80% levels without bandwidth filtering. TDis assertion to laser shutdown. TDis reassertion to laser startup. Data Sheet 16 2003-08-18 V23818-N15-Lxx/Lxxx Technical Data Jitter The transceiver is specified to meet the SONET Jitter performance as outlined in ITU-T G.958 and Telcordia GR-253. Jitter Generation is defined as the amount of jitter that is generated by the transceiver. The Jitter Generation specifications are referenced to the optical OC-48 signals. If no or minimum jitter is applied to the electrical inputs of the transmitter, then Jitter Generation can simply be defined as the amount of jitter on the Tx optical output. The SONET specifications for Jitter Generation are 0.01 UI RMS, maximum and 0.1 UI pk-pk, maximum. Both are measured with a 12 kHz - 20 MHz filter in line. A UI is a Unit Interval, which is equivalent to one bit slot. At OC-48, the bit slot is 400 ps, so the Jitter Generation specification translates to 4 ps RMS, max. and 40 ps pk-pk, max. Data Sheet 17 2003-08-18 V23818-N15-Lxx/Lxxx Technical Data Receiver Electro-Optical Characteristics Receiver Sensitivity (Average Power) Saturation (Average Power) Signal Detect Assert Level 2) Signal Detect Deassert Level 3) Signal Detect Hysteresis Signal Detect Assert Time 2) Signal Detect Deassert Time3) Data Output High Voltage 4) Differential Data Output Voltage Swing Data Output Low Voltage 4) Signal Detect Output High Voltage PECL 5), 6) Signal Detect Output Low Voltage PECL 5), 6) Signal Detect Output High Voltage TTL 5), 7) Signal Detect Output Low Voltage TTL 5), 7) Photo Detector Bias Responsivity 8) Photo Detector Bias Offset Reflectance 1) Symbol min. 1) Limit Values typ. max. -19 -3 -19 -30 3 0.1 0.35 -1110 500 -1800 -650 1000 -1300 Unit dBm dBm dBm dBm dB ms ms mV mV mV mV mV V PIN PSAT PSDA PSDD PSDA -PSDD tASS tDAS VOH-VCC VODpk-pk VOL-VCC VSDH-VEE VSDL-VEE VSDH VSDL VCC -1200 VCC -820 VCC -1900 2.4 VCC -1580 0.5 1 15 -33 -27 V A/W A dB PDBiasRES 0.5 PDBiasOFF 5 PREF 2) 3) 4) 5) 6) 7) 8) Minimum average optical power at which the BER is less than 1x10-10. Measured with a 223-1 NRZ PRBS as recommended by ANSI T1E1.2, SONET OC-48, and ITU-T G.957 S-16.1. An increase in optical power above the specified level will cause the Signal Detect to switch from a low state to a high state (high active output). A decrease in optical power below the specified level will cause the Signal Detect to switch from a high state to a low state. Load is 100 differential. Internal load is 510 to GND, no external load necessary. Signal Detect is a high active output. High level means signal is present, low level means loss of signal. For V23818-N15-L17/L16/L417/L37/L36/L373. For V23818-N15-L353/L356/L457/L354/L355/L47/L46. Monitor current needs to be sunk to VCC. Data Sheet 18 2003-08-18 V23818-N15-Lxx/Lxxx Eye Safety Eye Safety This laser based single mode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11. The transceiver has been certified with FDA under accession number 9520890. To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of "manufacturing", and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength Total Output Power (as defined by IEC: 7 mm aperture at 14 mm distance) Total Output Power (as defined by FDA: 7 mm aperture at 20 cm distance) Beam Divergence 1300 nm < 2 mW < 180 W 6 FDA Complies with 21 CFR 1040.10 and 1040.11 IEC Class 1 Laser Product File: 1401 Figure 13 Required Labels Indication of laser aperture and beam Tx Rx 20 19 18 17 16 15 14 13 12 11 Top view 1 2 3 4 5 6 7 8 9 10 File: 1334 Figure 14 Data Sheet Laser Emission 19 2003-08-18 V23818-N15-Lxx/Lxxx EMI-Recommendations EMI-Recommendations To avoid electromagnetic radiation exceeding the required limits please take note of the following recommendations. When Gigabit switching components are found on a PCB (multiplexers, clock recoveries etc.) any opening of the chassis may produce radiation also at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as possible. On the board itself every data connection should be an impedance matched line (e.g. strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should be avoided. A terminating resistor of 100 should be placed at the end of each matched line. An alternative termination can be provided with a 50 resistor at each (D, Dn). In DC coupled systems a thevenin equivalent 50 resistance can be achieved as follows: for 3.3 V: 125 to VCC and 82 to VEE, for 5 V: 82 to VCC and 125 to VEE at Data and Datanot. Please consider whether there is an internal termination inside an IC or a transceiver. In certain cases signal GND is the most harmful source of radiation. Connecting chassis GND and signal GND at the plate/bezel/chassis rear e.g. by means of a fiber optic transceiver may result in a large amount of radiation. Even a capacitive coupling between signal GND and chassis may be harmful if it is too close to an opening or an aperture. If a separation of signal GND and chassis GND is not planned, it is strongly recommended to provide a proper contact between signal GND and chassis GND at every location where possible. This concept is designed to avoid hotspots. Hotspots are places of highest radiation which could be generated if only a few connections between signal and chassis GND exist. Compensation currents would concentrate at these connections, causing radiation. By use of Gigabit switching components in a design, the return path of the RF current must also be considered. Thus a split GND plane of Tx and Rx portion may result in severe EMI problems. A recommendation is to connect the housing leads to signal GND. However, in certain applications it may improve EMI performance by connecting them to chassis GND. The cutout should be sized so that all contact springs make good contact with the face plate. Please consider that the PCB may behave like a waveguide. With an r of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. In this scenario even the smallest PCBs may have unexpected resonances. Data Sheet 20 2003-08-18 V23818-N15-Lxx/Lxxx Recommended Termination Schemes Recommended Termination Schemes 2x10 DC/DC Transceiver PMon+ 20 19 17 BMon+ 18 VEEt TD+ Laser Driver 100 TD- TDis VCCt 15 13 11 12,16 14 C6 VCC SerDes VCC SerDat Out + PMon- BMon- C8 TDis C7 SerDat Out - ECL/ PECL Driver R4 SFF Transceiver VCCr 7 C1 L2 C3 C2 SD 8 1 PDBias SD C10 Serializer/ Deserializer Signal Detect PreAmp Limiting Amplifier RD- RD- 9 C4 R1 R5 SerDat In - Receiver PLL etc. SerDat In + L1 VCC 3.3 V RD+ RD+ 10 2,3,6 C9 C5 C1/2/3 = 4.7 ... 10 F C4/5/6/7 = 100 nF C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 H L1/2*) R1 = 100 (depending on SerDes chip used, ensure proper 50 termination to VEE or 100 differential is provided. Check for termination inside of SerDes chip). R2/3 = 150 R4/5 = Biasing (depends on SerDes chip). Place R1/4/5 close to SerDes chip. Place R2/3 close to Infineon transceiver. *) The inductors may be replaced by appropriate Ferrite beads. File: 1390 Figure 15 Data Sheet 21 R2 R3 VEEr 2003-08-18 V23818-N15-Lxx/Lxxx Recommended Termination Schemes 2x10 AC/AC Transceiver PMon+ BMon+ PMon- BMon- 20 19 17 18 VEEt TD+ Laser Driver 100 TD- TDis VCCt 15 13 11 C1 VCCr 7 L2 C3 C2 SD 8 1 PDBias PreAmp Limiting Amplifier RD- 9 SD 12,16 14 VCC SerDes VCC SerDat Out + C4 TDis R5 R6 L1 VCC 3.3 V SerDat Out - ECL/ PECL Driver SFF Transceiver C6 Serializer/ Deserializer Signal Detect R1 R2 SerDat In - RD+ 10 2,3,6 C5 SerDat In + Receiver PLL etc. C1/2/3 C4/5/6 = 4.7 ... 10 F = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 H L1/2*) R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 termination to VEE or 100 differential is provided. Check for termination inside of SerDes chip. R5/6 = Biasing (depends on SerDes chip). Place R1/2/3/4/5/6 close to SerDes chip. *) The inductors may be replaced by appropriate Ferrite beads. File: 1391 Figure 16 Data Sheet 22 R3 R4 VEEt 2003-08-18 V23818-N15-Lxx/Lxxx Recommended Termination Schemes 2x5 DC/DC Transceiver VEEt TD+ Laser Driver 100 TD- TDis VCCt 7 9 C6 VCC SerDes VCC SerDat Out + 10 C8 8 6 C1 TDis C7 SerDat Out - ECL/ PECL Driver R4 SFF Transceiver VCCr 2 R5 L1 VCC 3.3 V L2 C3 C2 C10 Serializer/ Deserializer Signal Detect SD 3 SD PreAmp Limiting Amplifier RD- RD- 4 C4 R1 SerDat In - Receiver PLL etc. RD+ RD+ 5 C9 C5 SerDat In + C1/2/3 = 4.7 ... 10 F C4/5/6/7 = 100 nF C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 H L1/2*) R1 = 100 (depending on SerDes chip used, ensure proper 50 termination to VEE or 100 differential is provided. Check for termination inside of SerDes chip). R2/3 = 150 R4/5 = Biasing for outputs depending on Serializer. Place R1/4/5 close to SerDes chip. Place R2/3 close to Infineon transceiver. *) The inductors may be replaced by appropriate Ferrite beads. File: 1392 Figure 17 Data Sheet R2 23 R3 VEEr 1 2003-08-18 V23818-N15-Lxx/Lxxx Recommended Termination Schemes 2x5 AC/AC Transceiver VCC SerDes VEEt TD+ Laser Driver 100 TD- TDis VCCt 7 9 VCC SerDat Out + 10 C4 8 6 C1 TDis R5 R6 L1 VCC 3.3 V SerDat Out - ECL/ PECL Driver SFF Transceiver VCCr 2 L2 C3 C2 C6 Serializer/ Deserializer Signal Detect SD 3 SD R1 R2 SerDat In - C5 SerDat In + Receiver PLL etc. R4 PreAmp Limiting Amplifier RD- RD- 4 RD+ RD+ 5 VEEr 1 R3 C1/2/3 C4/5/6 = 4.7 ... 10 F = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 H L1/2*) R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 termination to VEE or 100 differential is provided. Check for termination inside of SerDes chip. = Biasing (depends on SerDes chip). R5/6 Place R1/2/3/4/5/6 close to SerDes chip. *) The inductors may be replaced by appropriate Ferrite beads. File: 1393 Figure 18 Data Sheet 24 2003-08-18 V23818-N15-Lxx/Lxxx Package Outlines Package Outlines a) recommended bezel position Drawing shown is 2x10 pinning with collar Dimensions in mm [inches] File: 1213 Figure 19 Data Sheet 25 2003-08-18 V23818-N15-Lxx/Lxxx Package Outlines Advanced Collar Dimensions in mm [inches] File: 1505 Figure 20 Non-standard Collar Data Sheet 26 2003-08-18 V23818-N15-Lxx/Lxxx Revision History: Previous Version: Page 2003-08-18 2003-03-10 DS1 Subjects (major changes since last revision) "Preliminary Data Sheet" deleted V23818-N15-L373, V23818-N15-L417, V23818-N15-L46WH deleted For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com. Edition 2003-08-18 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 Munchen, Germany (c) Infineon Technologies AG 2003. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. |
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