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| www..com EMIF01-TV01F3 Single line IPADTM, EMI filter and ESD protection Features EMI symmetrical (I/O) low-pass filter High efficiency EMI filtering Lead-free package 400 m pitch Very low PCB space occupation: 0.6 mm2 Very thin package: 0.6 mm High reliability offered by monolithic integration Reduction of parasitic elements through CSP integration Figure 1. Pin configuration (bump side) Flip Chip (4 bumps) A B 1 2 Complies with the following standards IEC 61000-4-2 level 4 on internal and external pins: - 15 kV (air discharge) - 8 kV (contact discharge) MIL STD 883F - Method 3015.7 Class 3 Pin A1 A2 Description TV OUT internal GND Pin B1 B2 Description TV OUT external GND Application TV analog signal in TV_OUT interface Figure 2. Device configuration R TV out External B1 Description The EMIF01-TV01F3 is a highly integrated array designed to suppress EMI/RFI noise and provide impedance matching for mobile phone and portable applications. The EMIF01-TV01F3 is in a Flip Chip package to offer space saving and high RF performance. This low pass filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV. TV out Internal A1 GND GND TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 2 1/8 www.st.com 8 Characteristics www..com EMIF01-TV01F3 1 Characteristics Table 1. Symbol Absolute maximum ratings Parameter and test conditions Internal pins (A1) and external pin (B1): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge Maximum junction temperature Operating temperature range Maximum power dissipation Storage temperature range Value Unit VPP Tj Top P Tstg 15 8 125 -30 to +85 80 -55 to 150 kV C C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM R Cline Electrical characteristics (Tamb = 25 C) Parameters Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between Input & Output Input capacitance per line Test conditions IR = 1 mA VRM = 3 V Tolerance 5 % @0V 75 30 35 Min 6 Typ Max 8 0.2 Unit V A pF IPP VCL VBR VRM IR IRM IRM IR VRM VBR VCL V I IPP 2/8 EMIF01-TV01F3 www..com Characteristics Figure 3. db 0.00 S21 (db) attenuation measurement Figure 4. ESD response to IEC 61000-4-2 (+15 kV air discharge) TV out internal 10 V/d -10.00 -20.00 -30.00 TV out external 10 V/d -40.00 f (Hz) -50.00 100.0k 1.0M 10.0M 100.0M 1.0G 100 ns/d Figure 5. ESD response to IEC 61000-4-2 (-15 kV air discharge) Figure 6. CLINE (pF) 35 30 Line capacitance versus applied voltage F=1MHz Vosc=30mVRMS Tj=25C TV out internal 10 V/d 25 20 15 10 TV out external 10 V/d 100 ns/d 5 VLINE (V) 0 0 1 2 3 4 5 6 3/8 Application information www..com EMIF01-TV01F3 2 Application information Figure 7. Aplac model I1 Lbump Rbump Rline Rbump Lbump O1 model = d1 model = d2 Rbump Rbump Lbump Lbump 75p Rs Ls I1 O1 Ls Rs Port1 Port2 Figure 8. Aplac parameters Variables aplacvar Rline 75 aplacvar C_d1 17.5p aplacvar C_d2 17.5p aplacvar Ls 950pH aplacvar Rs 150m aplacvar Lbump96pH aplacvar Rbump 20m aplacvar Lgnd 75pH Diode D1 BV=7 IBV=1m CJO=C_d1 M=0.28 RS=0.48 VJ=0.6 TT=100n Diode D2 BV=7 IBV=1m CJO=C_d2 M=0.28 RS=0.7 VJ=0.6 TT=100n 4/8 EMIF01-TV01F3 www..com Ordering information scheme 3 Ordering information scheme Figure 9. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 (pF) or 2 letters = application 2 digits = version Package F = Flip Chip x = 3: Lead-free, pitch = 400 m, bump = 255 m yy - xx zz Fx 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 10. Package dimensions 400 m 40 400 m 40 605 m 55 185 m 10 m 770 m 30 m 185 m 10 m 255 m 40 770 m 30m 5/8 Ordering information www..com EMIF01-TV01F3 Figure 11. Footprint Copper pad Diameter: 220 m recommended 260 m maximum Solder mask opening: 300 m minimum Figure 12. Marking Dot xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder stencil opening : 220 m recommended xxz y ww Figure 13. Flip Chip tape and reel specification Dot identifying Pin A1 location 4 0.1 O 1.5 0.1 1.75 0.1 3.5 0.1 0.87 xxz yww xxz yww xxz yww 8 0.3 0.71 0.05 All dimensions in mm User direction of unreeling 0.87 4 0.1 Note: More information is available in the application notes: AN2348: "STMicroelectronics 400 micro-metre Flip Chip: Package description and recommendation for use" AN1751: "EMI filters: Recommendations and measurements" 5 Ordering information Table 3. Ordering information Marking HC Package Flip Chip Weight 0.79 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EMIF01-TV01F3 6/8 EMIF01-TV01F3 www..com Revision history 6 Revision history Table 4. Date 09-Feb-2006 28-Apr-2008 Document revision history Revision 1 2 Initial release. Updated ECOPACK statement. Updated Figure 9, Figure 10, and Figure 13. Reformatted to current standards. Changes 7/8 www..com EMIF01-TV01F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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