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INTEGRATED CIRCUITS DATA SHEET TDA8001 Smart card interface Product specification Supersedes data of 1995 Feb 01 File under Integrated Circuits, IC02 1996 Dec 12 Philips Semiconductors Product specification Smart card interface FEATURES * Protected I/O line * VCC regulation (5 V 5%, 100 mA max. with controlled rise and fall times) * VPP generation (12.5, 15 or 21 V 2.5%, 50 mA max., with controlled rise and fall times) (only at TDA8001 and TDA8001T) * Clock generation (up to 10 MHz), with synchronous frequency doubling * Overload, thermal and card extraction protections * Current limitation in case of short-circuit * Idle mode and special circuitry for spikes killing during powering on and off * Two voltage supervisors (digital and analog supplies) * Automatic activation and deactivation sequences through an independent internal clock * Enhanced ESD protections on card side (4 kV min.) * Easy chaining for multiple card readers * ISO 7816 compatibility. ORDERING INFORMATION TYPE NUMBER TDA8001; TDA8001A TDA8001T; TDA8001AT PACKAGE NAME DIP28 SO28 DESCRIPTION plastic dual in-line package; 28 leads (600 mil) plastic small outline package; 28 leads; body width 7.5 mm APPLICATIONS TDA8001 * Pay TV (multistandards conditional access system, videoguard, newscript) * Multi-application smart card readers (banking, vending machine, electronic payment identification). GENERAL DESCRIPTION The TDA8001 is a complete, low-cost analog interface which can be positioned between an asynchronous smart card (ISO 7816) and a microcontroller. It is directly compatible with the new Datacom chip verifier. The complete supply, protection and control functions are realized with only a few external components, making this product very attractive for consumer applications (see Chapter "Application information"). VERSION SOT117-1 SOT136-1 1996 Dec 12 2 Philips Semiconductors Product specification Smart card interface QUICK REFERENCE DATA SYMBOL VDD IDD Vth2 Vth4 VCC ICC PARAMETER supply voltage supply current threshold voltage on VSUP threshold voltage on VDD card supply voltage card supply current including static and dynamic loads on 100 nF capacitor operating detection limitation VH VPP high voltage supply for VPP card programming voltage (only at TDA8001 and TDA8001T) (P = 5, 12.5, 15 and 21 V) programming current (read or write mode) including static and dynamic loads on 100 nF capacitor idle mode; VDD = 12 V active modes; unloaded CONDITIONS - - 4.5 6 4.75 - - - - MIN. 6.7 - 32 45 - - 5.0 - -150 - - TYP. - - TDA8001 MAX. 18 UNIT V mA mA V V V mA mA mA V 4.72 6.5 5.25 -100 - -200 30 P - 2.5% - P + 2.5% V IPP operating detection limitation - - - - -75 - 0.38 100 - - - - -50 - -100 - 125 8 0.92 2 +70 mA mA mA V/s s MHz W W C SR tde fclk Ptot slew rate on VCC and VPP (rise and fall) deactivation cycle duration clock frequency continuous total power dissipation maximum load capacitor 150 nF - 75 0 TDA8001; Tamb = +70 C; see Fig.10 TDA8001T; Tamb = +70 C; see Fig.11 - - 0 Tamb operating ambient temperature 1996 Dec 12 3 Philips Semiconductors Product specification Smart card interface BLOCK DIAGRAM TDA8001 handbook, full pagewidth VSUP 15 ALARM ALARM 17 18 DELAY 16 VDD 13 GND1 12 22 VOLTAGE SUPERVISOR MAIN SUPPLY CVNC I/O(C) 28 PROTECTIONS AND ENABLE 3 I/O RSTIN 26 4 RST TDA8001 19 OFF 2 DETECT INTERNAL CLOCK 20 27 CMD7 25 GND2 23 CMD3.5 CLKOUT2 VPP12.5 VPP15 VPP21 24 6 7 21 VPP GENERATOR CLOCK CIRCUITRY CLOCK ENABLE PROTECTIONS LOGIC 9 8 PRES PRES CMDVCC VCC GENERATOR 14 VCC 5 CLK 10 VPP OSCILLATOR 1 XTAL 11 MBH813 VH Fig.1 Block diagram. 1996 Dec 12 4 Philips Semiconductors Product specification Smart card interface PINNING PIN SYMBOL XTAL DETECT I/O RST CLK VPP12.5 n.c. VPP15 n.c. PRES PRES VPP n.c. VH GND1 VDD VCC VSUP DELAY ALARM ALARM OFF CMDVCC VPP21 n.c. CVNC CMD3.5 or CDMTC CLKOUT2 GND2 RSTIN CMD7 or CDMS I/O(C) TDA8001 TDA8001T 1 2 3 4 5 6 - 7 - 8 9 10 - 11 12 13 14 15 16 17 18 19 20 21 - 22 23 24 25 26 27 28 TDA8001A TDA8001AT 1 2 3 4 5 - 6 - 7 8 9 - 10 11 12 13 14 15 16 17 18 19 20 - 21 22 23 24 25 26 27 28 crystal connection card extraction open collector output (active LOW) data line to/from the card card reset output clock output to the card DESCRIPTION TDA8001 control input for applying the 12.5 V programming voltage (active LOW) not connected control input for applying the 15 V programming voltage (active LOW) not connected card presence contact input (active LOW) card presence contact input (active HIGH) card programming voltage output not connected HIGH voltage supply for VPP generation ground 1 positive supply voltage card supply output voltage voltage supervisor input external capacitor connection for delayed reset timing open-collector reset output for the microcontroller (active HIGH) open-collector reset output for the microcontroller (active LOW) open-collector interrupt output to the microcontroller (active LOW) control input for applying supply voltage to the card (active LOW) control input for applying the 21 V programming voltage (active LOW) not connected internally generated 5 V reference, present when VDD is on; to be decoupled externally (100 nF) control input for having the crystal frequency divided-by-4 at pin CLK clock output to the microcontroller, or any other R4590 (crystal frequency divided by two) ground 2 card reset input from the microcontroller (active HIGH) control input for having the crystal frequency divided by 2 at pin CLK data line to/from the microcontroller 1996 Dec 12 5 Philips Semiconductors Product specification Smart card interface TDA8001 handbook, halfpage handbook, halfpage XTAL 1 DETECT 2 I/O 3 RST 4 CLK 5 VPP12.5 6 VPP15 7 PRES 8 PRES 9 VPP 10 VH 11 GND1 12 VDD 13 VCC 14 MBH811 28 I/O(C) 27 CMD7 or CDMS 26 RSTIN 25 GND2 24 CLKOUT2 23 CMD3.5 or CDMTC 22 CVNC TDA8001 TDA8001T 21 VPP21 20 CMDVCC 19 OFF 18 ALARM 17 ALARM 16 DELAY 15 VSUP XTAL 1 DETECT 2 I/O 3 RST 4 CLK 5 n.c. 6 n.c. 7 28 I/O(C) 27 CMD7 or CDMS 26 RSTIN 25 GND2 24 CLKOUT2 23 CMD3.5 or CDMTC 22 CVNC TDA8001A TDA8001AT 21 n.c. PRES 8 PRES 9 n.c. 10 VH 11 GND1 12 VDD 13 VCC 14 MBH812 20 CMDVCC 19 OFF 18 ALARM 17 ALARM 16 DELAY 15 VSUP Fig.2 Pin configuration. Fig.3 Pin configuration. 1996 Dec 12 6 Philips Semiconductors Product specification Smart card interface FUNCTIONAL DESCRIPTION Power supply The circuit operates within a supply voltage range of 6.7 to 18 V. VDD and GND are the supply pins. All card contacts remain inactive during power up or down. POWER UP The logic part is powered first and is in the reset condition until VDD reaches Vth1. The sequencer is blocked until VDD reaches Vth4 + Vhys4. POWER DOWN When VDD falls below Vth4, an automatic deactivation of the contacts is performed. Voltage supervisor This block surveys the 5 V supply of the microcontroller (VSUP) in order to deliver a defined reset pulse and to avoid any transients on card contacts during power up or down of VSUP. The voltage supervisor remains active even if VDD is powered-down. POWER ON As long as VSUP is below Vth2 + Vhys2 the capacitor CDEL, connected to pin DELAY, will be discharged. When VSUP rises to the threshold level, CDEL will be recharged. ALARM and ALARM remain active, and the sequencer is blocked until the voltage on the DELAY line reaches Vth3. POWER DOWN (see Fig.4) If VSUP falls below Vth2, CDEL will be discharged, ALARM and ALARM become active, and an automatic deactivation of the contacts is performed. Clock circuitry (see Fig.5) The clock signal (CLK) can be applied to the card in two different methods: 1. Generation by a crystal oscillator: the crystal, or the ceramic resonator (4 to 16 MHz) is connected to the XTAL pin. 2. Use of a signal frequency (up to 20 MHz), already present in the system and connected to the XTAL pin via a 10 nF capacitor (see Fig.14). In both cases the frequency is first divided-by-two. If CMD7 (respectively CMD3.5) is LOW, the clock signal (its frequency again divided by two) is enabled and buffered before being fed to the CLK pin. 1996 Dec 12 7 TDA8001 CMD3.5 and internal ENRST are sampled in order to give the first clock pulse the correct width, and to avoid false pulses during frequency change. The CLKOUT2 pins may be used to clock a microcontroller or an other TDA8001. The signal 12 fxtal is available when the circuit is powered up. State diagram Once activated, the circuit has six possible modes of operation: * Idle * Activation * Read * Write * Deactivation * Fault. Figure 6 shows the way these modes are accessible. IDLE MODE After reset, the circuit enters the IDLE state. A minimum number of circuits are active while waiting for the microcontroller to start a session. * All card contacts are inactive * I/O(C) is high impedance * Voltage generators are stopped * Oscillator or XTAL input is running, delivering CLKOUT2 * Voltage supervisors are active. The DETECT line is HIGH if a card is present (PRES and PRES active) and LOW if a card is not present. The OFF line is HIGH if no hardware problem is detected. ACTIVATION SEQUENCE From the IDLE mode, the circuit enters the ACTIVATION mode when the microcontroller sets the CMDVCC line (active LOW). The I/O(C) signal must not be LOW. The internal circuitry is activated, the internal clock starts and the sequence according to ISO7816 is performed: * VCC rises from 0 to 5 V * VPP rises from 0 to 5 V and I/O is enabled * CLK and RST are enabled. The time interval between steps 1 and 2 is 16 s, and 64 s between steps 2 and 3 (see Fig.7). Philips Semiconductors Product specification Smart card interface READ MODE When the activation sequence is completed and, after the card has replied its Answer-to-Reset, the TDA8001 will be in the READ mode. Data is exchanged between the card and the microcontroller via the I/O line. WRITE MODE Cards with EPROM memory need a programming voltage (VPP). When it is required to write to the internal memory of the card, the microcontroller sets one of the VPP12.5, VPP15 and VPP21 lines LOW, according to the programming value given in the Answer-to-Reset. VPP rises from 5 V to the selected value with a typical slew rate of 0.38 V/s. In order to respect the ISO 7816 slopes, the circuit generates VPP by charging and discharging an internal capacitor. The voltage on this capacitor is then amplified by a power stage gain of 5, powered via an external supply pin VH (30 V max). DEACTIVATION SEQUENCE (see Fig.8) When the session is completed, the microcontroller sets the CMDVCC line to its HIGH state. The circuit then executes an automatic deactivation sequence by counting the sequencer back: * RST falls to LOW and CLK is stopped * I/O(C) becomes high impedance and VPP falls to 0 V * VCC falls to 0 V. TDA8001 The circuit returns to the IDLE mode on the next rising edge of the clock. PROTECTIONS Main fault conditions are monitored by the circuit: * Short-circuit or overcurrent on VCC * Short-circuit or overcurrent on VPP * Card extraction during transaction * Overheating problem * VSUP drop-out * VDD drop-out. When one of these fault conditions is detected, the circuit pulls the interrupt line OFF to its active LOW state and returns to the FAULT mode. The current on I/O is internally limited to 5 mA. FAULT MODE (see Fig.9) When a fault condition is written to the microcontroller via the OFF line, the circuit initiates a deactivation sequence. After the deactivation sequence has been completed, the OFF line is reset to its HIGH state after the microcontroller has reset the CMDVCC line HIGH. handbook, full pagewidth Vth2 + Vhys2 Vth2 VSUP VDELAY Vth3 td ALARM MGG818 Fig.4 Alarm and delay as a function of VSUP (CDEL fixes the pulse width). 1996 Dec 12 8 Philips Semiconductors Product specification Smart card interface TDA8001 handbook, full pagewidth ENCLK S S QH CDMS CDMTC S S QB QI QD D Q QE CK Q QG D Q QC QF QCA CK Q QAA D Q QA CLK XTAL QBA CK Q CMD7 or CDMS = Z Z 1 1 0 0 CMD3.5 or CDMTC = 1 0 1 0 1 0 CLK = 2 4 0 4 2 4 1/2 CLKOUT QB QC QD ENCLK QF CLK MGG827 Fig.5 Clock circuitry. 1996 Dec 12 9 Philips Semiconductors Product specification Smart card interface TDA8001 handbook, full pagewidth ACTIVATION PDOWN IDLE FAULT WRITE READ DEACTIVATION MGG820 Fig.6 State diagram. handbook, full pagewidth 0 1 2 3 OFF PRES DETECT CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK VCC I/O VPP CMD3.5 CLK ENRST (INTERNAL) RSTIN RST t2 tact MGG828 Fig.7 Activation sequence. 1996 Dec 12 10 Philips Semiconductors Product specification Smart card interface TDA8001 handbook, full pagewidth 3 2 1 0 CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK VCC I/O VPP CMD3.5 CLK ENRST (INTERNAL) RSTIN RST MGG829 tde Fig.8 Deactivation sequence. handbook, full pagewidth 3 2 1 0 PRES DETECT CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK VCC I/O VPP CMD3.5 CLK ENRST (INTERNAL) RSTIN RST tde MGG830 Fig.9 Deactivation after a card extraction during write mode. 1996 Dec 12 11 Philips Semiconductors Product specification Smart card interface LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Vx1 VH VPP VSUP Vx2 Vx3 Vx4 Ptot supply voltage voltage on pins VPP21, VPP15, VPP12.5, PRES, PRES, CMDVCC, OFF, ALARM, DETECT and RSTIN voltage on pin VH voltage on pin VPP voltage on pin VSUP voltage on pins ALARM and DELAY voltage on pins XTAL, I/O(C), CLKOUT2, CMD7, CMD3.5 and CVNC voltage on pins I/O, RST, CLK and VCC continuous total power dissipation duration < 1 ms TDA8001; Tamb = +70 C; note 1; see Fig.10 TDA8001T; Tamb = +70 C; note 1; see Fig.11 Tstg Ves storage temperature electrostatic voltage on pins I/O, VCC, VPP, RST, CLK, PRES and PRES electrostatic voltage on other pins Note PARAMETER CONDITIONS MIN. -0.3 0 0 0 0 0 0 0 - TDA8001 MAX. 18 VDD 30 VH 12 VSUP 6.0 7.0 2 UNIT V V V V V V V V W - 0.92 W -55 -6 -2 +150 +6 +2 C kV kV 1. Ptot = VDD x (IDD(unloaded) + Isignals) + ICC x (VDD - VCC) + max.{(VH - VPP) x IPP(read) + (VH - VPP) x IPP(write)} + VH x IH(unloaded) + VSUP x ISUP + (VDD - CVNC) x ICVNC, where `signals' means all signal pins, except supply pins. 1996 Dec 12 12 Philips Semiconductors Product specification Smart card interface TDA8001 handbook, halfpage 4 MBE256 handbook, halfpage 3 MBE255 P tot (W) 3 P tot (W) 2 2 1 1 0 50 0 50 100 150 Tamb ( o C) 0 50 0 50 100 150 Tamb ( o C) Fig.10 Power derating curve (DIP28). Fig.11 Power derating curve (SO28). HANDLING Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining. Method 3015 (HBM 1500 , 100 pF) 3 pulses positive and 3 pulse negative on each pin referenced to ground. THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT117-1 SOT136-1 PARAMETER thermal resistance from junction to ambient in free air 30 70 K/W K/W VALUE UNIT 1996 Dec 12 13 Philips Semiconductors Product specification Smart card interface CHARACTERISTICS VDD = 12 V; VH = 25 V; VSUP = 5 V; Tamb = 25 C; unless otherwise specified. SYMBOL Supply VDD IDD supply voltage supply current idle mode; VDD = 8 V idle mode; VDD = 18 V active mode; unloaded Vth1 Vth4 Vhys4 VSUP ISUP Vth2 Vhys2 Vth3 IDEL VDEL IOH VOL IOL VOH td tpulse IOH VOL VIL VIH IIL threshold voltage for power-on reset threshold voltage on VDD (falling) hysteresis on Vth4 voltage supply for the supervisor input current at VSUP threshold voltage on VSUP (falling) hysteresis on Vth2 threshold voltage on DELAY output current at DELAY voltage on pin DELAY VOH = 5 V IOL = 2 mA VOL = 0 V IOH = -2 mA CDEL = 47 nF; see Fig.4 CDEL = 47 nF VOH = 5 V IOL = 1 mA pin grounded (charge) VDEL = 4 V (discharge) ALARM, ALARM (open-collector outputs) HIGH level output current on pin ALARM LOW level output voltage on pin ALARM LOW level output current on pin ALARM HIGH level output voltage on pin ALARM delay between VSUP and ALARM ALARM pulse width - - - VSUP - 1 - 15 - - - 1.5 VIL = 0 V - - - - - - - - - - - - 6.7 20 22 35 - 6.0 50 - - 4.5 10 2.35 -5 6 - - 30 34 45 3.0 - - PARAMETER CONDITIONS MIN. TYP. TDA8001 MAX. UNIT 18 38 42 55 4.0 6.5 200 - 2.4 4.72 80 2.65 -2 - 3.5 V mA mA mA V V mV Voltage supervisor 5.0 1.8 - - - - - - V mA V mV V A mA V A V A V s ms A V 25 0.4 -25 - 10 50 Interrupt lines OFF and DETECT (open-collector) HIGH level output current LOW level output voltage 25 0.4 Logic inputs (CMDVCC, VPP21, VPP15, VPP12.5, CMD7, CMD3.5, PRES, PRES and RSTIN); note 1 LOW level input voltage HIGH level input voltage LOW level input current 0.8 - -10 V V A 1996 Dec 12 14 Philips Semiconductors Product specification Smart card interface TDA8001 SYMBOL IIH VIDLE VOL VOH tRST VIDLE VOL VOH PARAMETER HIGH level input current CONDITIONS VIH = 5 V - - IOL = 200 A IOH = -200 A IOH = -10 A RST enabled; see Fig.7 - 4.3 MIN. - - - - - - - - - - - - - - - - TYP. 10 MAX. UNIT A Reset output to the card (RST) output voltage in IDLE LOW level output voltage HIGH level output voltage delay between RSTIN and RST 0.4 0.45 VCC VCC 2 V V V V s VCC - 0.7 - - Clock output to the card (CLK) output voltage in IDLE LOW level output voltage HIGH level output voltage IOL = 200 A IOH = -200 A IOH = -20 A IOH = -10 A tr tf rise time fall time duty factor CL = 30 pF; note 2 CL = 30 pF; note 2 CL = 30 pF; note 2 0.4 0.4 VCC VCC VCC 14 14 55 V V V V V ns ns % - 2.4 0.7VCC VCC - 0.7 - - 45 - VCC - 4% Card programming voltage (VPP) VPP output voltage idle mode read mode write mode; IPP < 50 mA IPP/t < 40 mA/100 ns; note 4 IPP SR output current slew rate active; from 0 to P (3) VPP shorted to GND up or down High voltage input (VH) VH IH input voltage input current at VH idle mode; active mode; unloaded P=5V P = 12.5 V P = 15 V P = 21 V VH-VPP voltage drop - 4 5 6.5 7 8 - - - - - - - - 30 6 9 10.5 11 12 2.2 V mA mA mA mA mA V 0.4 VCC + 4% V V P - 2.5%(3) - P - 2.5%(3) - - - 0.3 - - 0.4 P + 2.5%(3) V P + 2.5%(3) V -50 -100 0.5 mA mA V/s 1996 Dec 12 15 Philips Semiconductors Product specification Smart card interface TDA8001 SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Card supply voltage (VCC) VCC output voltage idle mode; active mode ICC < 100 mA IPP/t < 100 mA/100 ns; note 4 ICC SR output current slew rate VCC from 0 to 5 V VCC shorted to GND up or down 5 V reference output voltage (CVNC) VCVNC ICVNC Rxtal(neg) Vxtal fxtal output voltage at pin CVNC output current at pin CVNC 4.5 - - 3.0 4 0 5.0 - - - - - - - - - - - - 5.5 -50 V mA V MHz MHz - 4.75 4.75 - - 0.3 - - - - - 0.4 0.4 5.25 5.25 -100 -200 0.5 V V V mA mA V/s Crystal connection (XTAL) negative resistance at pin XTAL DC voltage at pin XTAL resonant frequency external frequency Clock output (CLKOUT2) fCLKOUT2 VOL VOH tr, tf frequency on CLKOUT2 LOW level output voltage HIGH level output voltage rise and fall times duty factor IOL = 2 mA IOH = -200 A IOH = -10 A CL = 15 pF; note 2 CL = 15 pF; note 2 4.5 V < VSUP < 5.5 V; 4.5 V < VI/O(C) < 5.5 V; IOH = -20 A 4.5 V < VSUP < 5.5 V; 4.5 V < V I/O(C) < 5.5 V; IOH = -200 A VOL IIL VOH VOL IIL LOW level output voltage on pin I/O LOW level input current on pin I/O(C) HIGH level output voltage on pin I/O(C) LOW level output voltage on pin I/O(C) II/O = 1 mA; I/O(C) grounded I/O(C) grounded 4.5 V < VI/O < 5.5 V II/O(C) = 1 mA; I/O grounded 1 - 3.0 4.0 - 40 8 0.4 - - 25 60 MHz V V V ns % 2 MHz < fi < 16 MHz; note 5 300 4.0 16 20 Data line [I/O, I/O(C)] VOH HIGH level output voltage on pin I/O 4.0 VCC + 0.1 V 2.4 - - V - - 4.0 - - - - - - - 100 -500 VSUP + 0.2 70 -500 mV A V mV A LOW level input current on pin I/O I/O grounded 1996 Dec 12 16 Philips Semiconductors Product specification Smart card interface TDA8001 SYMBOL VIDLE ZIDLE Rpu tr, tf Protections Tsd ICC(sd) IPP(sd) II/O(lim) Timing tact tde t3 t5 tst Notes PARAMETER voltage on pin I/O outside a session impedance on pin I/O(C) outside a session internal pull-up resistance between pin I/O and VCC rise and fall times CONDITIONS - 10 8 Ci = Co = 30 pF - - - - from I/O to I/O(C) 3 - - - 80 - MIN. - - TYP. MAX. 0.4 - 12 0.5 - - - 5 - - 70 - 30 UNIT V M k s C mA mA mA s s s s s 10 - shut-down local temperature shut-down current at VCC shut-down current at VPP current limitation on pin I/O 135 -150 -75 - activation sequence duration deactivation sequence duration start of the window for sending CLK to the card end of the window for sending CLK to the card maximum pulse width on CMDVCC before VCC starts rising see Fig.7 see Fig.8 110 100 - - - 1. Pins CMDVCC, VPP21, VPP15, VPP12.5, CMD7, CMD3.5 and PRES are active LOW; pins RSTIN and PRES are active HIGH. t1 2. The transition time and duty cycle definitions are shown in Fig.12; = -------------- . t1 + t2 3. P is the card programming voltage set by pin VPP12.5, VPP15 or VPP21. 4. The tests for dynamic response of both VPP and VCC are performed at 1 Hz, 10 kHz, 100 kHz and 1 MHz, with a capacitive load of 100 nF. 5. This condition ensures proper starting of the oscillator with crystals having a series resistance up to 100 . handbook, full pagewidth tr 90% tf 90% VOH 1.5 V 10% t1 10% t2 MBH856 VOL Fig.12 Definition of transition times. 1996 Dec 12 17 Philips Semiconductors Product specification Smart card interface INTERNAL PIN CONFIGURATION TDA8001 handbook, full pagewidth VSUP XTAL 100 A DETECT VCC VCC 100 A 5V I/O VCC 5 k 100 VCC 100 A as VPP12.5 as VPP12.5 CMD7 RSTIN GND2 CLKOUT2 100 A 100 A I/O(C) RST VCC 10 k 50 VCC TDA8001 VDD as VPP12.5 CMD3.5 CVNC 1350 650 as VPP12.5 as VPP12.5 VPP21 CMDVCC OFF CLK 20 A 1.25 V VPP12.5 ALARM VSUP VSUP VPP15 PRES PRES as VPP12.5 as VPP12.5 as VPP12.5 VH 2.5 V 100 A ALARM 2.5 V 2.5 A DELAY VPP VH GND1 VDD 1.25 V VCC as VPP12.5 20 A 100 A 20 A VSUP 4690 5310 MBE257 Fig.13 Internal pin configuration. 1996 Dec 12 18 Philips Semiconductors Product specification Smart card interface APPLICATION INFORMATION TDA8001 +5 handbook, full pagewidth V to 8805 microcontroller (1) 100 nF 12 V 25 V (2) VDD RST ALARM ALARM VSUP CVNC VDD OFF VH PRES INT0 DETECT PRES I/O(C) CMDVCC VPP15 RST C2 VCC 100 nF C1 PORT 1 VPP12.5 VPP21 RSTIN TDA8001 C4 CLK C3 12 V 10 F PORT 2 25 V 10 F XTAL1 XTAL2 80C52 MICROCONTROLLER GND CLKOUT2 I/O GND2 VPP CMD7 CMD3.5 C5 C6 100 nF C7 GND C8 DELAY GND1 XTAL 1 k 14 MHz 47 nF CARD SOCKET MGG831 47 nF (1) The capacitor should be placed as close as possible to the IC. (2) If pin VH is not connected to 25 V, it should be connected to VDD. Fig.14 Application in a pay TV decoder. 1996 Dec 12 19 Philips Semiconductors Product specification Smart card interface PACKAGE OUTLINES handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth TDA8001 SOT117-1 seating plane D ME A2 A L A1 c Z e b1 b 28 15 MH wM (e 1) pin 1 index E 1 14 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 1996 Dec 12 20 Philips Semiconductors Product specification Smart card interface TDA8001 SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE vMA Z 28 15 Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.9 0.4 0.035 0.016 0.012 0.096 0.004 0.089 0.019 0.013 0.014 0.009 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION ISSUE DATE 91-08-13 95-01-24 1996 Dec 12 21 Philips Semiconductors Product specification Smart card interface SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. TDA8001 Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 1996 Dec 12 22 Philips Semiconductors Product specification Smart card interface DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values TDA8001 This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Dec 12 23 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 247 9145, Fax. +7 095 247 9144 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996 Internet: http://www.semiconductors.philips.com SCA52 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 537021/1200/02/pp24 Date of release: 1996 Dec 12 Document order number: 9397 750 01384 |
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