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Si1054X Vishay Siliconix N-Channel 12 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 12 RDS(on) () 0.095 at VGS = 4.5 V 0.104 at VGS = 2.5 V 0.114 at VGS = 1.8 V ID (A) 1.32 1.26 0.88 5.25 a FEATURES Qg (Typ.) * Halogen-free According to IEC 61249-2-21 Definition * TrenchFET(R) Power MOSFET * 100 % Rg Tested * Compliant to RoHS Directive 2002/95/EC APPLICATIONS SC-89 (6-LEADS) D 1 6 D * Load Switch for Portable Devices Marking Code D 2 D D R XX YY Lot Traceability and Date Code 5 G 3 4 S Part # Code G Top View S Ordering Information: SI1054X-T1-GE3 (Lead (Pb)-free and Halogen-free) N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 C) Pulsed Drain Current Continuous Source-Drain Diode Current Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25 C TA = 25 C TA = 70 C TA = 25 C TA = 70 C Symbol VDS VGS ID IDM IS PD TJ, Tstg Limit 12 8 1.32b, c 1.05b, c 6 0.2b, c 0.236b, c 0.151b, c - 55 to 150 W C A Unit V THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambientb, d Notes: a. Based on TA = 25 C. b. Surface mounted on 1" x 1" FR4 board. c. t = 5 s. d. Maximum under steady state conditions is 650 C/W. t 5 s Steady State Symbol RthJA Typical 440 540 Maximum 530 650 Unit C/W Document Number: 69579 S10-2542-Rev. C, 08-Nov-10 www.vishay.com 1 Si1054X Vishay Siliconix SPECIFICATIONS (TJ = 25 C, unless otherwise noted) Parameter Static Drain-Source Breakdown Voltage VDS Temperature Coefficient VGS(th) Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductance Dynamic b Symbol VDS VDS/TJ VGS(th)/TJ VGS(th) IGSS IDSS ID(on) RDS(on) gfs Ciss Coss Crss Qg Qgs Qgd Rg td(on) tr td(off) tf ISM VSD trr Qrr ta tb Test Conditions VGS = 0 V, ID = 250 A ID = 250 A VDS = VGS, ID = 250 A VDS = 0 V, VGS = 8 V VDS = 12 V, VGS = 0 V VDS = 12 V, VGS = 0 V, TJ = 85 C VDS = 5 V, VGS = 4.5 V VGS = 4.5 V, ID = 1.32 A VGS = 2.5 V, ID = 1.26 A VGS = 1.8 V, ID = 0.88 A VDS = 4.5 V, ID = 1.32 A Min. 12 Typ. Max. Unit V 12.23 - 2.76 0.4 1 100 1 10 6 0.079 0.087 0.095 6.25 480 0.095 0.104 0.114 mV/C V nA nA A A S Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Drain-Source Body Diode Characteristics Pulse Diode Forward Currenta Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Reverse Recovery Fall Time Reverse Recovery Rise Time VDS = 6 V, VGS = 0 V, f = 1 MHz VDS = 6 V, VGS = 5 V, ID = 1.32 A VDS = 6 V, VGS = 4.5 V, ID = 1.32 A f = 1 MHz VDD = 6 V, RL = 5.71 ID 1.05 A, VGEN = 4.5 V, Rg = 1 142 92 5.71 5.25 0.83 1.54 3.5 5.5 13 37 14 5.25 8.25 19.5 55.5 21 6 8.57 7.9 pF nC ns A V ns nC ns IS = 1.0 A 0.8 19.3 5.8 7.4 11.9 1.2 28.95 8.7 IF = 1.0 A, dI/dt = 100 A/s Notes: a. Pulse test; pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 2 Document Number: 69579 S10-2542-Rev. C, 08-Nov-10 Si1054X Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise noted) 6 VGS = 5 V thru 2 V 5 I D - Drain Current (A) I D - Drain Current (A) 3 4 2 3 VGS = 1.5 V 2 1 TC = 25 C TC = 125 C 1 VGS = 1 V 0 0 0.6 1.2 1.8 2.4 3.0 0 0 TC = - 55 C 0.4 0.8 1.2 1.6 2.0 VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V) Output Characteristics 0.20 Transfer Characteristics 800 RDS(on) - On-Resistance () 0.15 VGS = 1.8 V 600 C - Capacitance (pF) Ciss 0.10 VGS = 2.5 V 400 VGS = 4.5 V 0.05 200 Crss Coss 0.00 0 1 2 3 4 5 6 ID - Drain Current (A) 0 0 3 6 9 12 VDS - Drain-to-Source Voltage (V) On-Resistance vs. Drain Current 5 ID = 1.32 A VGS - Gate-to-Source Voltage (V) 4 VDS = 6 V 3 R DS(on) - On-Resistance (Normalized) 1.4 1.6 Capacitance VGS = 2.5 V, ID = 1.26 A 1.2 2 VDS = 9.6 V 1.0 VGS = 4.5 V, ID = 1.32 A VGS = 1.8 V, ID = 0.88 A 1 0.8 0 0 1 2 3 4 5 6 0.6 - 50 - 25 0 25 50 75 100 125 150 Qg - Total Gate Charge (nC) TJ - Junction Temperature (C) Qg - Gate Charge On-Resistance vs. Junction Temperature Document Number: 69579 S10-2542-Rev. C, 08-Nov-10 www.vishay.com 3 Si1054X Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise noted) 10 0.15 ID = 1.32 A R DS(on) - On-Resistance () 0.12 TA = 125 C 0.09 I S -- Source Current (A) 1 TJ = 150 C 0.1 TJ = 25 C 0.06 TA = 25 C 0.01 0 0.2 0.4 0.6 0.8 1.0 0.03 0 1 2 3 4 5 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage 0.9 0.8 ID = 250 A 0.7 Power (W) VGS(th) (V) 0.6 0.5 0.4 1 0.3 0.2 - 50 0 0.01 3 4 5 RDS(on) vs. VGS vs. Temperature 2 - 25 0 25 50 75 100 125 150 0.1 1 Time (s) 10 100 1000 TJ - Temperature (C) Threshold Voltage 100 Limited by R DS(on)* 10 I D - Drain Current (A) 1 ms 10 ms 100 ms 1 1s 10 s TA = 25 C Single Pulse BVDSS Limited 0.01 0.1 1 10 100 VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which R DS(on) is specified DC Single Pulse Power 0.1 Safe Operating Area, Junction-to-Ambient www.vishay.com 4 Document Number: 69579 S10-2542-Rev. C, 08-Nov-10 Si1054X Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise noted) 1 Duty Cycle = 0.5 0.2 Normalized Effective Transient Thermal Impedance 0.1 0.1 0.05 0.02 Notes: 0.01 PDM Single Pulse 0.001 t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 540 C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted 0.0001 10-4 10-3 10-2 10-1 1 Square Wave Pulse Duration (s) 10 100 1000 Normalized Thermal Transient Impedance, Junction-to-Ambient Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?69579. Document Number: 69579 S10-2542-Rev. C, 08-Nov-10 www.vishay.com 5 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1 |
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