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| TB2923HQ TOSHIBA Bi-CMOS Linear Integrated Circuit Silicon Monolithic TB2923HQ 50 W x 4-ch BTL Audio Power IC The TB2923HQ is a four-channel BTL power amplifier for car audio applications. This IC has a pure complementary P-ch and N-ch DMOS output stage, offering maximum output power (POUT MAX) of 50 W. It includes a standby switch, mute function and various protection features. Features * High output power * * * * * * * * * * * * POUT MAX (1) = 50 W (typ.) (VCC = 15.2 V, f = 1 kHz, JEITA max, RL = 4 ) POUT MAX (2) = 43 W (typ.) (VCC = 13.7 V, f = 1 kHz, JEITA max, RL = 4 ) POUT MAX (3) = 80 W (typ.) (VCC = 14.4 V, f = 1 kHz, JEITA max, RL = 2 ) POUT (1) = 29 W (typ.) (VCC = 14.4 V, f = 1 kHz, THD = 10%, RL = 4 ) POUT (2) = 25 W (typ.) (VCC = 13.2 V, f = 1 kHz, THD = 10%, RL = 4 ) Weight: 7.7 g (typ.) Low THD: 0.005% (typ.) (VCC = 13.2 V, f = 1 kHz, POUT = 5 W, RL = 4 ) Low noise: VNO = 50 Vrms (typ.) (VCC = 13.2 V, Rg = 0 , BW = 20 Hz to 20 kHz, RL = 4 ) Standby switch (pin 4) Mute function (pin 22) Output DC offset detection (pin 25) Various protection features Thermal overload; overvoltage; output short-circuits to GND, VCC and across the load; speaker current limiting Operating supply voltage: VCC (opr) = 8.0 to 18 V (RL = 4 ) Note 1: Install the device correctly. Otherwise, the device or system may be degraded, damaged or even destroyed. Note 2: The protection features are intended to avoid output short-circuits or other abnormal conditions temporarily. It is not guaranteed that they will prevent the IC from being damaged. Exposure to conditions beyond the guaranteed operating ranges may not activate the protection features, resulting in an IC damage due to output short-circuits. 1 2006-11-30 TB2923HQ Block Diagram +B C5 C2 10 Ripple C1 11 IN1 1 TAB 6 VCC2 20 VCC1 9 8 7 Out1 (+) PW-GND1 Out1 (-) C1 12 IN2 5 2 Out2 (+) PW-GND2 Out2 (-) 13 Pre-GND 3 C1 15 IN3 17 18 Out3 (+) PW-GND3 C6 16 AC-GND 19 Out3 (-) C1 14 IN4 21 24 Out4 (+) PW-GND4 Out4 (-) 5V Play Mute 4 Stby R1 C4 23 22 Mute Offset/short 25 Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for explanatory purposes. C3 RL RL RL RL 2 2006-11-30 TB2923HQ Detailed Description 1. Standby Switch (pin 4) The power supply can be turned on or off via pin 4 (Stby). The threshold voltage of pin 4 is set at about 3 VBE (typ.). The power supply current is about 0.01 A (typ.) in the standby state. VCC ON OFF Power 4 10 k 2 VBE to Bias filter network Standby Control Voltage (VSB): Pin 4 Standby ON OFF Power OFF ON VSB (V) 0 to 0.9 2.9 to VCC Figure 1 Setting Pin 4 High Turns on Power Check the pop levels when the time constant of pin 4 is changed. Benefits of the Standby Switch (1) (2) VCC can be directly turned on or off by a microcontroller, eliminating the need for a switching relay. Since the control current is minuscule, a low-current-rated switching relay can be used. Relay Battery High-current-rated switch Battery VCC VCC - Conventional Method - From microcontroller Low-current-rated switch Battery From microcontroller Battery Standby VCC Standby - Using the Standby Switch - VCC Figure 2 Standby Switch 3 2006-11-30 TB2923HQ 2. Mute Function (pin 22) The audio mute function is enabled by setting pin 22 Low. R1 and C4 determine the time constant of the mute function. The time constant affects pop noise generated when power or the mute function is turned on or off; thus, it must be determined on a per-application basis. (Refer to Figures 4 and 5.) The value of the external pull-up resistor is determined, based on pop noise value. For example, when the control voltage is changed from 5 V to 3.3 V, the pull-up resistor should be: 3.3 V/5 V x 47 k = 31 k ATT - VMUTE 20 VCC = 13.2 V f = 1 kHz RL = 4 VO = 20dBm -20 BW = 400 Hz to 30 kHz 0 -40 -60 -80 -100 -120 0 5V 1 k Mute On/Off control R1 22 C4 Mute attenuation ATT (dB) 0.5 1 1.5 2 2.5 3 Pin 22 control voltage: VMUTE (V) Figure 3 Mute Function Figure 4 Mute Attenuation - VMUTE (V) 4 2006-11-30 TB2923HQ 3. DC Offset Detection The purpose of the integrated DC offset detector is to avoid an anomalous DC offset on the outputs, produced by the input capacitor due to leakage current or short-circuit. V Positive DC offset (+) (caused by RS1) VCC/2 (normal DC voltage) Vref Leakage current or short-circuit RS1 Elec. vol RS2 - Vbias 25 A LPF B 5V Vref/2 + Negative DC offset (-) (caused by RS2) To a microcontroller The microcontroller shuts down the system if the output is lower than the specified voltage. Figure 5 DC Offset Detection Mechanism OUT(+) Amp output VCC/2 Offset detection threshold (RS2) OUT(-) GND Time Voltage at (A) (pin 25) GND Time Voltage at (B) (LPF output) GND Time 5 2006-11-30 TB2923HQ 4. Layer Short Detection The TB2923HQ may be properly connected to a load such as a 4- speaker, but one of the speaker lines may be shorted to ground through a low-impedance path. The TB2923HQ can detect such a condition. VCC IC out SP = 4 out GND The negative (-) speaker connection is shorted to ground through a low-impedance path due to some irregularities. Figure 6 Layer Short As is the case with output DC offset detection, pin 25 is also activated when there is a short on one of the speaker lines as shown above. The detection impedance is 2.5 (typ.). This feature allows detection of a short-circuit through a low-impedance path other than the speaker impedance. It helps to avoid speaker damage in case of anomalous system conditions and improve system reliability. 6 2006-11-30 TB2923HQ 5. Pop Noise Suppression Since the TB2923HQ uses the AC-GND pin (pin 16) as the common input reference voltage pin for all amplifiers, the ratio of the input capacitance (C1) to the AC-to-GND capacitance (C6) should be 1:4. Also, if power is removed before C1 and C6 are completely charged, pop noise will be generated because of unbalanced DC currents. To avoid this problem, it is recommended to use a larger capacitor as C2 to increase the charging times of C1 and C6. Note, however, that C2 also affects the time required from power-on to audio output. The pop noise generated by the muting and unmuting of the audio output varies with the time constant of C4. A larger capacitance reduces the pop noise, but increases the time from when the mute control signal is applied to C4 to when the mute function is enabled. 6. External Component Constants Component Recommended Value Effects Purpose When lower than recommended value Cut-off frequency is increased. Powering on/off is faster. When higher than recommended value Notes C1 0.22 F 47 F 0.1 F To eliminate DC Cut-off frequency is reduced. Pop noise is generated when VCC is turned on. C2 C3 To reduce ripple To provide sufficient oscillation margin To reduce pop noise Ripple filter Common reference voltage for all input Powering on/off is slower. Reduces noise and provides sufficient oscillation margin High pop noise. Duration until Low pop noise. Duration until mute function is turned on/off mute function is turned on/off is short. is long. Power supply humming and ripple filtering. Pop noise is suppressed when C1: C6 = 1:4. Pop noise is generated when VCC is turned on. C4 C5 1 F 3900 F 1 F C6 7 2006-11-30 TB2923HQ Absolute Maximum Ratings (Ta = 25C) Characteristics Peak supply voltage (0.2 s) DC supply voltage Operating supply voltage Output current (peak) Power dissipation Operating temperature Storage temperature Symbol VCC (surge) VCC (DC) VCC (opr) IO (peak) PD (Note 7) Topr Tstg Rating 50 25 18 9 125 -40 to 85 -55 to 150 Unit V V V A W C C Note 5: Package thermal resistance j-T = 1C/W (typ.) (Ta = 25C, with infinite heat sink) The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other equipment. Applications using the device should be designed so that no absolute maximum rating will ever be exceeded under any operating conditions. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this document. Electrical Characteristics Characteristics Quiescent supply current (VCC = 13.2 V, f = 1 kHz, RL = 4 , Ta = 25C unless otherwise specified) Symbol ICCQ POUT MAX (1) POUT MAX (2) Output power POUT MAX (3) POUT (1) POUT (2) Total harmonic distortion Voltage gain Channel-to-channel voltage gain THD GV GV VNO (1) Output noise voltage VNO (2) Ripple rejection ratio Crosstalk Output offset voltage Input resistance Standby current Standby control voltage R.R. C.T. VOFFSET RIN ISB VSB H VSB L Mute control voltage VM H VM L Test Circuit VIN = 0 VCC = 15.2 V, max POWER VCC = 13.7 V, max POWER VCC = 14.4 V, RL=2, max POWER VCC = 14.4 V, THD = 10% THD = 10% POUT = 5 W VOUT = 0.775 Vrms VOUT = 0.775 Vrms Rg = 0 , DIN45405 Rg = 0 , BW = 20 Hz to 20 kHz frip = 100 Hz, Rg = 620 Vrip = 0.775 Vrms Rg = 620 POUT = 4 W Standby condition, V4=0,V22=0 POWER: ON POWER: OFF MUTE: OFF MUTE: ON, R1 = 47 k Test Condition Min 23 25 -1.0 50 -90 2.9 0 2.9 0 Typ. 180 50 43 80 29 25 0.005 26 0 60 55 65 80 0 90 0.1 Max 300 0.07 27 1.0 Vrms 70 90 1 VCC V 0.9 VCC V 0.9 dB dB mV k A % dB dB W Unit mA 8 2006-11-30 TB2923HQ Characteristics Mute attenuation Upper cut-off frequency DC offset threshold voltage Symbol ATT M Fth Voff-set Test Circuit Test Condition MUTE: ON*A DIN_AUDIO VOUT = 7.75 Vrms Mute: OFF GV = 26dB, -3dB Rpull-up = 10 k, +V = 5.0 V OUT(+)-OUT(-) Rpull-up = 10 k, +V = 5.0 V channel (+) or (-) shorted to GND, when between Rs impedance output to GND. Rpull-up = 10 k, +V = 5.0 V (pin 25 = low) Min 85 1.0 Typ. 100 250 1.5 Max 2.0 Unit dB kHz V Layer short detection impedance R half-short 2.5 Pin 25 saturation voltage (at each detector ON condition) P25-Sat 100 500 mV Test Circuit C2: 47 F C3: 0.1 F +B 10 Ripple 1 TAB 6 VCC2 20 VCC1 9 8 7 C1: 0.22 F IN1 11 Out1 (+) PW-GND1 Out1 (-) C5: 3900 F RL = 4 ohm C1: 0.22 F IN2 12 5 2 Out2 (+) PW-GND2 Out2 (-) RL = 4 ohm 13 Pre-GND 3 C1: 0.22 F IN3 15 17 18 Out3 (+) PW-GND3 C6: 1 F 16 AC-GND RL = 4 ohm Out3 (-) 19 C1: 0.22 F IN4 14 21 24 Out4 (+) PW-GND4 Out4 (-) 5V Play Mute 4 Stby R1: 47 k C4: 1 F RL = 4 ohm 23 22 Mute Offset/short 25 Components in the test circuit are only used to determine the device characteristics. It is not guaranteed that the system will work properly with these components. 9 2006-11-30 TB2923HQ THD - POUT (ch1) 100 50 30 VCC = 13.2 V RL = 4 Filter 100 Hz : to 30 kHz 10 5 1kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to 10 5 100 50 30 VCC = 13.2 V RL = 4 Filter THD - POUT (ch2) 100 Hz : to 30 kHz 1kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to Total harmonic distortion THD (%) 3 20 kHz 1 0.5 0.3 10 kHz Total harmonic distortion THD (%) 3 20 kHz 1 0.5 0.3 10 kHz 0.1 0.05 0.03 1 kHz 0.01 f = 100 Hz 0.005 0.003 0.1 0.05 0.03 1 kHz 0.01 0.005 0.003 f = 100 Hz 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 Output power POUT (W) Output power POUT (W) THD - POUT (ch3) 100 50 30 VCC = 13.2 V RL = 4 Filter 100 Hz : to 30 kHz 10 5 1kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to 10 5 100 50 30 VCC = 13.2 V RL = 4 Filter THD - POUT (ch4) 100 Hz : to 30 kHz 1kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to Total harmonic distortion THD (%) 3 20 kHz 1 0.5 0.3 10 kHz Total harmonic distortion THD (%) 3 20 kHz 1 (%) 0.5 0.3 10 kHz 0.1 0.05 0.03 1 kHz 0.01 f = 100 Hz 0.005 0.003 0.1 0.05 0.03 1 kHz 0.01 0.005 0.003 f = 100 Hz 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 Output power POUT (W) Output power POUT (W) 10 2006-11-30 TB2923HQ THD - POUT (ch1) 100 VCC = 13.2 V 50 RL = 4 30 f = 1 kHz Filter 400 Hz to 30 kHz 10 5 10 5 100 VCC = 13.2 V 50 RL = 4 30 f = 1 kHz Filter THD - POUT (ch2) 13.2 V 13.2 V 400 Hz to 30 kHz Total harmonic distortion THD (%) 3 VCC = 9 V 1 0.5 0.3 16 V Total harmonic distortion THD (%) 3 VCC = 9 V 1 0.5 0.3 16 V 0.1 0.05 0.03 0.1 0.05 0.03 0.01 0.005 0.003 0.01 0.005 0.003 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 Output power POUT (W) Output power POUT (W) THD - POUT (ch3) 100 VCC = 13.2 V 50 RL = 4 30 f = 1 kHz Filter 400 Hz to 30 kHz 10 5 10 5 100 VCC = 13.2 V 50 RL = 4 30 f = 1 kHz Filter THD - POUT (ch4) 13.2 V 13.2 V 400 Hz to 30 kHz Total harmonic distortion THD (%) 3 VCC = 9 V 1 0.5 0.3 16 V Total harmonic distortion THD (%) 3 VCC = 9 V 1 0.5 0.3 16 V 0.1 0.05 0.03 0.1 0.05 0.03 0.01 0.005 0.003 0.01 0.005 0.003 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 Output power POUT (W) Output power POUT (W) 11 2006-11-30 TB2923HQ muteATT - f 0 VCC = 13.2 V 3 VCC = 13.2 V RL = 4 POUT = 5 W 0.3 0.1 No filter THD - f Total harmonic distortion THD (%) Mute attenuation muteATT (dB) RL = 4 -20 VOUT = 7.75 Vrms (20dBm) -40 1 -60 0.03 0.01 1 ch~3 ch -80 1 ch~4 ch -100 0.003 0.001 0.01 2 ch -120 10 100 1k 10 k 100 k 0.1 1 10 100 frequency f (Hz) frequency f (Hz) GV - f 40 0 VCC = 13.2 V R.R. - f (dB) RL = 4 Vrip = 0.775 Vrms (0dBm) -20 Voltage gain GV (dB) 30 1 ch~4 ch Ripple rejection ratio R.R. -40 -60 20 10 VCC = 13.2 V RL = 4 VOUT = 0.775 Vrms (0dBm) 0 0.01 0.1 1 10 100 1 ch~4 ch -80 0.01 0.1 1 10 100 frequency f (Hz) frequency f (Hz) 12 2006-11-30 TB2923HQ VIN - POUT (ch1) 100Hz,-20kHz VIN - POUT (ch2) 100Hz,-20kHz (W) POUT POUT Output power VCC = 13.2 V RL = 4 No filter (W) 40 40 30 30 Output power 20 20 10 10 VCC = 13.2 V RL = 4 No filter 0 0 2 4 6 8 10 0 0 2 4 6 8 10 Input voltage VIN (Vrms) Input voltage VIN (Vrms) VIN - POUT (ch3) 100Hz,-20kHz 40 40 VIN - POUT (ch4) 100Hz,-20kHz (W) POUT 30 POUT Output power VCC = 13.2 V RL = 4 No filter (W) 30 Output power 20 20 10 10 VCC = 13.2 V RL = 4 No filter 0 0 2 4 6 8 10 0 0 2 4 6 8 10 Input voltage VIN (Vrms) Input voltage VIN (Vrms) ICCQ - VCC 200 RL = VIN = 0 V 160 120 PDMAX - Ta Allowable power dissipation PDMAX (W) (1) INFINITE HEAT SINK RJC = 1C/W 100 (2) HEAT SINK (RHS = 3.5C/W RJC + RHS = 4.5C/W (3) NO HEAT SINK RJA = 39C/W (1) 60 ICCQ (mA) 80 120 Quiescent Current 80 40 40 20 (3) 0 0 25 50 75 (2) 0 0 5 10 15 20 25 100 125 150 Supply voltage VCC (V) Ambient temperature Ta (C) 13 2006-11-30 TB2923HQ C.T. - f (ch1) 0 VCC = 13.2 V RL = 4 VOUT = 0.775 Vrms (0dBm) RG = 620 0 C.T. - f (ch2) VCC = 13.2 V RL = 4 VOUT = 0.775 Vrms (0dBm) RG = 620 (dB) Cross talk C.T. -40 CT (1-2) -60 Cross talk C.T. (dB) -20 -20 -40 CT (2-1) -60 CT (2-4) CT (2-3) CT (1-3) CT (1-4) -80 10 100 1k 10 k 100 k -80 10 100 1k 10 k 100 k frequency f (Hz) frequency f (Hz) C.T. - f (ch3) 0 VCC = 13.2 V RL = 4 VOUT = 0.775 Vrms (0dBm) RG = 620 0 C.T. - f (ch4) VCC = 13.2 V RL = 4 VOUT = 0.775 Vrms (0dBm) RG = 620 (dB) Cross talk C.T. -40 Cross talk C.T. (dB) -20 -20 -40 CT (4-1) -60 CT (4-2) -60 CT (3-1) CT (3-4) CT (3-2) -80 10 100 1k 10 k 100 k CT (4-3) -80 10 100 1k 10 k 100 k frequency f (Hz) frequency f (Hz) VNO - Rg 300 VCC = 13.2 V 80 f = 1 kHz RL = 4 4ch drive 60 RL = 4 Filter: 20 Hz~20 kHz 200 PD - POUT (Vrms) (W) 18 V Output noise voltage VNO Power dissipation PD 40 100 1ch~4ch 13.2 V 20 VCC = 9.0 V 0 10 100 1k 10 k 100 k 0 0 5 10 15 20 25 30 Signal source resistance Rg () Output power POUT (W) 14 2006-11-30 TB2923HQ Package Dimensions Weight: 7.7 g (typ.) 15 2006-11-30 TB2923HQ * Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. * If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. For details on how to connect a protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition. * Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. * Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. * Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. * Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. * Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. * Installation to Heat Sink Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks. 16 2006-11-30 TB2923HQ RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 021023_D 060116EBA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux 17 2006-11-30 |
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