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? 2004 microchip technology inc. ds21796d-page 1 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c device selection table features ? low-power cmos technology org pin to select word size for ?76c? version 1024 x 8-bit organization ?a? devices (no org) 512 x 16-bit organization ?b? devices (no org) program enable pin to write-protect the entire array (except on sot-23 packages) self-timed erase/write cycles (including auto-erase) automatic eral before wral power-on/off data protection circuitry industry standard 3-wire serial i/o device status signal (ready/busy ) sequential read function 1,000,000 e/w cycles data retention > 200 years temperature ranges supported: pin function table description the microchip technology inc. 93xx76a/b/c devices are 8k bit, low-voltage, serial electrically erasable proms (eeprom). word-selectable devices such as the 93xx76c are dependent upon external logic levels driving the org pin to set word size. for dedicated 8-bit communication, the 93xx76a devices are available, while the 93xx76b devices provide dedicated 16-bit communication, available on sot-23 devices only. a program enable (pe) pin allows the user to write-protect the entire memory array. advanced cmos technology makes these devices ideal for low-power, nonvolatile memory applications. the 93xx series is available in standard packages including 8-lead pdip and soic, and advanced packaging including 8-lead msop, 6-lead sot-23, and 8-lead tssop. pb-free (pure matte sn) finish is also available. package types (not to scale) part number v cc range org pin pe pin word size temp ranges packages 93aa76a 1.8-5.5 no no 8-bit i ot 93aa76b 1.8-5-5 no no 16-bit i ot 93lc76a 2.5-5.5 no no 8-bit i, e ot 93lc76b 2.5-5.5 no no 16-bit i, e ot 93c76a 4.5-5.5 no no 8-bit i, e ot 93C76B 4.5-5.5 no no 16-bit i, e ot 93aa76c 1.8-5.5 yes yes 8 or 16-bit i p, sn, st, ms 93lc76c 2.5-5.5 yes yes 8 or 16-bit i, e p, sn, st, ms 93c76c 4.5-5.5 yes yes 8 or 16-bit i, e p, sn, st, ms - industrial (i) -40c to +85c - automotive (e) -40c to +125c name function cs chip select clk serial data clock di serial data input do serial data output v ss ground pe program enable org memory configuration v cc power supply cs clk di do 1 2 3 4 8 7 6 5 v cc pe org v ss pdip/soic (p, sn) tssop/msop cs clk di do 1 2 3 4 8 7 6 5 v cc pe org v ss (st, ms ) sot-23 do v ss di 1 2 3 6 5 4 v cc cs clk (ot) 8k microwire compatible serial eeprom
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 2 ? 2004 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings (?) v cc ............................................................................................................................... ..............................................7.0v all inputs and outputs w.r.t. v ss ......................................................................................................... -0.6v to v cc +1.0v storage temperature ............................................................................................................ ...................-65c to +150c ambient temperature with power applied ......................................................................................... .......-40c to +125c esd protection on all pins ............................................................................................................................... ....................... 4kv table 1-1: dc characteristics ? notice: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. all parameters apply over the specified ranges unless otherwise noted. v cc = 1.8v to 5.5v industrial (i): t a = -40c to +85c automotive (e): t a = -40c to +125c param. no. symbol parameter min typ max units conditions d1 v ih 1 v ih 2 high-level input voltage 2.0 0.7 v cc ? ? v cc +1 v cc +1 v v v cc 2.7v v cc < 2.7v d2 v il 1 v il 2 low-level input voltage -0.3 -0.3 ? ? 0.8 0.2 v cc v v v cc 2.7v v cc < 2.7v d3 v ol 1 v ol 2 low-level output voltage ? ? ? ? 0.4 0.2 v v i ol = 2.1 ma, v cc = 4.5v i ol = 100 a, v cc = 2.5v d4 v oh 1 v oh 2 high-level output voltage 2.4 v cc - 0.2 ? ? ? ? v v i oh = -400 a, v cc = 4.5v i oh = -100 a, v cc = 2.5v d5 i li input leakage current ? ? 1 av in = v ss to v cc d6 i lo output leakage current ? ? 1 av out = v ss to v cc d7 c in , c out pin capacitance (all inputs/ outputs) ??7 pfv in /v out = 0v (note 1) t a = 25c, f clk = 1 mhz d8 i cc write write current ? ? ? 500 3 ? ma a f clk = 3 mhz, v cc = 5.5v f clk = 2 mhz, v cc = 2.5v d9 i cc read read current ? ? ? ? ? 100 1 500 ? ma a a f clk = 3 mhz, v cc = 5.5v f clk = 2 mhz, v cc = 3.0v f clk = 2 mhz, v cc = 2.5v d10 i ccs standby current ? ? ? ? 1 5 a a i ? temp e ? temp clk = cs = 0v org = di = v ss or v cc (note 2) (note 3) d11 v por v cc voltage detect 93aa76a/b/c, 93lc76a/b/c 93c76a/b/c ? ? 1.5v 3.8v ? ? v v (note 1) note 1: this parameter is periodically sampled and not 100% tested. 2: org pin not available on ?a? or ?b? versions. 3: ready/busy status must be cleared from do, see section 3.4 ?data out (do)? .
? 2004 microchip technology inc. ds21796d-page 3 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c table 1-2: ac characteristics all parameters apply over the specified ranges unless otherwise noted. v cc = 1.8v to 5.5v industrial (i): t a = -40c to +85c automotive (e): t a = -40c to +125c param. no. symbol parameter min max units conditions a1 f clk clock frequency ? 3 2 1 mhz mhz mhz 4.5v v cc < 5.5v 2.5v v cc < 4.5v 1.8v v cc < 2.5v a2 t ckh clock high time 200 250 450 ?ns ns ns 4.5v v cc < 5.5v 2.5v v cc < 4.5v 1.8v v cc < 2.5v a3 t ckl clock low time 100 200 450 ?ns ns ns 4.5v v cc < 5.5v 2.5v v cc < 4.5v 1.8v v cc < 2.5v a4 t css chip select setup time 50 100 250 ?ns ns ns 4.5v v cc < 5.5v 2.5v v cc < 4.5v 1.8v v cc < 2.5v a5 t csh chip select hold time 0 ? ns 1.8v v cc < 5.5v a6 t csl chip select low time 250 ? ns 1.8v v cc < 5.5v a7 t dis data input setup time 50 100 250 ?ns ns ns 4.5v v cc < 5.5v 2.5v v cc < 4.5v 1.8v v cc < 2.5v a8 t dih data input hold time 50 100 250 ?ns ns ns 4.5v v cc < 5.5v 2.5v v cc < 4.5v 1.8v v cc < 2.5v a9 t pd data output delay time ? 100 250 400 ns ns ns 4.5v v cc < 5.5v, cl = 100 pf 2.5v v cc < 4.5v, cl = 100 pf 1.8v v cc < 2.5v, cl = 100 pf a10 t cz data output disable time ? 100 200 ns ns 4.5v v cc < 5.5v, (note 1) 1.8v v cc < 4.5v, (note 1) a11 t sv status valid time ? 200 300 500 ns ns ns 4.5v v cc < 5.5v, cl = 100 pf 2.5v v cc < 4.5v, cl = 100 pf 1.8v v cc < 2.5v, cl = 100 pf a12 t wc program cycle time ? 5 ms erase/write mode (aa and lc versions) a13 t wc ? 2 ms erase/write mode (93c versions) a14 t ec ? 6 ms eral mode, 4.5v v cc 5.5v a15 t wl ? 15 ms wral mode, 4.5v v cc 5.5v a16 ? endurance 1m ? cycles 25c, v cc = 5.0v, (note 2) note 1: this parameter is periodically sampled and not 100% tested. 2: this application is not tested but ensured by characterization. for endurance estimates in a specific application, please consult the total endurance? model which may be obtained from www.microchip.com.
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 4 ? 2004 microchip technology inc. figure 1-1: synchronous data timing table 1-3: instruction set for x 16 organization (93xx76b or 93xx76c with org = 1) table 1-4: instruction set for x 8 organization (93xx76a or 93xx76c with org = 0) instruction sb opcode address data in data out req. clk cycles read 1 10 x a8 a7 a6 a5 a4 a3 a2 a1 a0 ? d15 ? d0 29 ewen 1 00 1 1xxxxxxxx ? high-z 13 erase 1 11 x a8 a7 a6 a5 a4 a3 a2 a1 a0 ? (rdy/bsy )13 eral 1 00 1 0xxxxxxxx ? (rdy/bsy )13 write 1 01 x a8 a7 a6 a5 a4 a3 a2 a1 a0 d15 ? d0 (rdy/bsy )29 wral 1 00 0 1xxxxxxxxd15 ? d0(rdy/bsy )29 ewds 1 00 0 0xxxxxxxx ? high-z 13 instruction sb opcode address data in data out req. clk cycles read 1 10 x a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 ? d7 ? d0 22 ewen 1 00 1 1xxxxxxxxx ? high-z 14 erase 1 11 x a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 ? (rdy/bsy )14 eral 1 00 1 0xxxxxxxxx ? (rdy/bsy )14 write 1 01 x a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 d7 ? d0 (rdy/bsy )22 wral 1 00 0 1xxxxxxxxxd7 ? d0(rdy/bsy )22 ewds 1 00 0 0xxxxxxxxx ? high-z 14 cs v ih v il v ih v il v ih v il v oh v ol v oh v ol clk di do (read) do (program) t css t dis t ckh t ckl t dih t pd t csh t pd t cz status valid t sv t cz note: t sv is relative to cs.
? 2004 microchip technology inc. ds21796d-page 5 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c 2.0 functional description when the org* pin is connected to v cc , the (x16) organization is selected. when it is connected to ground, the (x8) organization is selected. instructions, addresses and write data are clocked into the di pin on the rising edge of the clock (clk). the do pin is normally held in a high-z state except when reading data from the device, or when checking the ready/ busy status during a programming operation. the ready/busy status can be verified during an erase/ write operation by polling the do pin; do low indicates that programming is still in progress, while do high indicates the device is ready. do will enter the high-z state on the falling edge of cs. 2.1 start condition the start bit is detected by the device if cs and di are both high with respect to the positive edge of clk for the first time. before a start condition is detected, cs, clk and di may change in any combination (except to that of a start condition), without resulting in any device operation (read, write, erase, ewen, ewds, eral or wral). as soon as cs is high, the device is no longer in standby mode. an instruction following a start condition will only be executed if the required opcode, address and data bits for any particular instruction are clocked in. 2.2 data in/data out (di/do) it is possible to connect the data in and data out pins together. however, with this configuration it is possible for a ?bus conflict? to occur during the ?dummy zero? that precedes the read operation, if a0 is a logic high- level. under such a condition the voltage level seen at data out is undefined and will depend upon the relative impedances of data out and the signal source driving a0. the higher the current sourcing capability of the driver, the higher the voltage at the data out pin. in order to limit this current, a resistor should be connected between di and do. 2.3 data protection all modes of operation are inhibited when v cc is below a typical voltage of 1.5v for ?93aa? and ?93lc? devices or 3.8v for ?93c? devices. the ewen and ewds commands give additional protection against accidentally programming during normal operation. note: for added protection, an ewds command should be performed after every write operation. after power-up, the device is automatically in the ewds mode. therefore, an ewen instruction must be performed before the initial erase or write instruction can be executed. block diagram memory array data register mode decode logic clock register address decoder address counter output buffer do di org* cs clk v cc v ss *org and pe inputs are not available on pe* a/b devices.
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 6 ? 2004 microchip technology inc. 2.4 erase the erase instruction forces all data bits of the specified address to the logical ?1? state. the rising edge of clk before the last address bit initiates the write cycle. the do pin indicates the ready/busy status of the device if cs is brought high after a minimum of 250 ns low (t csl ). do at logical ?0? indicates that programming is still in progress. do at logical ?1? indicates that the register at the specified address has been erased and the device is ready for another instruction. note: issuing a start bit and then taking cs low will clear the ready/busy status from do. figure 2-1: erase timing cs clk di do t csl check status 1 1 1a n a n -1 a n -2 a0 t sv t cz busy ready high-z t wc high-z
? 2004 microchip technology inc. ds21796d-page 7 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c 2.5 erase all (eral) the erase all ( eral ) instruction will erase the entire memory array to the logical ?1? state. the eral cycle is identical to the erase cycle, except for the different opcode. the eral cycle is completely self-timed. the rising edge of clk before the last data bit initiates the write cycle. clocking of the clk pin is not necessary after the device has entered the eral cycle. the do pin indicates the ready/busy status of the device, if cs is brought high after a minimum of 250 ns low (t csl ). note: issuing a start bit and then taking cs low will clear the ready/busy status from do. v cc must be 4.5v for proper operation of eral. figure 2-2: eral timing cs clk di do t csl check status 100 10x x t sv t cz busy ready high-z t ec high-z
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 8 ? 2004 microchip technology inc. 2.6 erase/write disable and enable (ewds/ewen) the 93xx76a/b/c powers up in the erase/write disable ( ewds ) state. all programming modes must be preceded by an erase/write enable ( ewen ) instruc- tion. once the ewen instruction is executed, program- ming remains enabled until an ewds instruction is executed or v cc is removed from the device. to protect against accidental data disturbance, the ewds instruction can be used to disable all erase/ write functions and should follow all programming operations. execution of a read instruction is independent of both the ewen and ewds instructions. figure 2-3: ewds timing figure 2-4: ewen timing 2.7 read the read instruction outputs the serial data of the addressed memory location on the do pin. a dummy zero bit precedes the 8-bit (if org pin is low or a-version devices) or 16-bit (if org pin is high or b-version devices) output string. the output data bits will toggle on the rising edge of the clk and are stable after the spec- ified time delay (t pd ). sequential read is possible when cs is held high. the memory data will automatically cycle to the next register and output sequentially. figure 2-5: read timing cs clk di 10 000x x t csl 1x cs clk di 00 1 1x t csl cs clk di do 110 an a0 high-z 0dx d0 dx d0 dx d0
? 2004 microchip technology inc. ds21796d-page 9 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c 2.8 write the write instruction is followed by 8 bits (if org is low or a-version devices) or 16 bits (if org pin is high or b-version devices) of data which are written into the specified address. the self-timed auto-erase and programming cycle is initiated by the rising edge of clk on the last data bit. the do pin indicates the ready/busy status of the device, if cs is brought high after a minimum of 250 ns low (t csl ). do at logical ?0? indicates that programming is still in progress. do at logical ?1? indicates that the register at the specified address has been written with the data specified and the device is ready for another instruction. note: issuing a start bit and then taking cs low will clear the ready/busy status from do. figure 2-6: write timings cs clk di do 1 0 1an a0 dx d0 busy ready high-z high-z twc t csl t cz t sv
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 10 ? 2004 microchip technology inc. 2.9 write all (wral) the write all ( wral ) instruction will write the entire memory array with the data specified in the command. the self-timed auto-erase and programming cycle is initiated by the rising edge of clk on the last data bit. clocking of the clk pin is not necessary after the device has entered the wral cycle. the wral command does include an automatic eral cycle for the device. therefore, the wral instruction does not require an eral instruction but the chip must be in the ewen status. the do pin indicates the ready/busy status of the device if cs is brought high after a minimum of 250 ns low (t csl ). note: issuing a start bit and then taking cs low will clear the ready/busy status from do. v cc must be 4.5v for proper operation of wral. figure 2-7: wral timing cs clk di do high-z 1 0 0 01 x x dx d0 high-z busy ready t wl t csl t sv t cz
? 2004 microchip technology inc. ds21796d-page 11 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c 3.0 pin descriptions table 3-1: pin descriptions 3.1 chip select (cs) a high level selects the device; a low level deselects the device and forces it into standby mode. however, a programming cycle which is already in progress will be completed, regardless of the chip select (cs) input signal. if cs is brought low during a program cycle, the device will go into standby mode as soon as the programming cycle is completed. cs must be low for 250 ns minimum (t csl ) between consecutive instructions. if cs is low, the internal control logic is held in a reset status. 3.2 serial clock (clk) the serial clock is used to synchronize the communi- cation between a master device and the 93xx series device. opcodes, address and data bits are clocked in on the positive edge of clk. data bits are also clocked out on the positive edge of clk. clk can be stopped anywhere in the transmission sequence (at high or low-level) and can be continued anytime with respect to clock high time (t ckh ) and clock low time (t ckl ). this gives the controlling master freedom in preparing opcode, address and data. clk is a ?don't care? if cs is low (device deselected). if cs is high, but the start condition has not been detected (di = 0), any number of clock cycles can be received by the device without changing its status (i.e., waiting for a start condition). clk cycles are not required during the self-timed write (i.e., auto erase/write) cycle. after detection of a start condition the specified number of clock cycles (respectively low to high transitions of clk) must be provided. these clock cycles are required to clock in all required opcode, address and data bits before an instruction is executed. clk and di then become don't care inputs waiting for a new start condition to be detected. 3.3 data in (di) data in (di) is used to clock in a start bit, opcode, address and data synchronously with the clk input. 3.4 data out (do) data out (do) is used in the read mode to output data synchronously with the clk input (t pd after the positive edge of clk). this pin also provides ready/busy status informa- tion during erase and write cycles. ready/busy status information is available on the do pin if cs is brought high after being low for minimum chip select low time (t csl ) and an erase or write operation has been initiated. the status signal is not available on do, if cs is held low during the entire erase or write cycle. in this case, do is in the high-z mode. if status is checked after the erase/write cycle, the data line will be high to indicate the device is ready. note: issuing a start bit and then taking cs low will clear the ready/busy status from do. 3.5 organization (org) when the org pin is connected to v cc or logic hi, the (x16) memory organization is selected. when the org pin is tied to v ss or logic lo, the (x8) memory organization is selected. for proper operation, org must be tied to a valid logic level. 93xx76a devices are always x8 organization and 93xx76b devices are always x16 organization. name soic/pdip/msop/ tssop sot-23 function cs 1 5 chip select clk 2 4 serial clock di 3 3 data in do 4 1 data out v ss 5 2 ground org 6 n/a organization / 93xx76c pe 7 n/a program enable v cc 86power supply
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 12 ? 2004 microchip technology inc. 3.6 program enable (pe) this pin allows the user to enable or disable the ability to write data to the memory array. if the pe pin is tied to v cc , the device can be programmed. if the pe pin is tied to v ss , programming will be inhibited. pe is not available on 93xx76a or 93xx76b. on those devices, programming is always enabled. this pin cannot be floated, it must be tied to v cc or v ss .
? 2004 microchip technology inc. ds21796d-page 13 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c 4.0 packaging information 4.1 package marking information legend: xx...x part number t temperature blank commercial i industrial e extended yy year code (last 2 digits of calendar year) except tssop and msop which use only the last 1 digit ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code note : custom marking available. example: 6-lead sot-23 8-lead msop (150 mil) example: xxxxxxt ywwnnn 3l76i 2281l7 xxnn 4el7 xxxxxnnn xxxxxxxx yyww 8-lead pdip 8-lead soic xxxxyyww xxxxxxxx nnn xxxx tyww 8-lead tssop nnn i/p 1l7 93lc76 0228 example: example: i/sn 0228 93lc76 1l7 1l7 l76 i228 example: msop 1st line marking codes device 93aa76c 93lc76c 93c76c std mark 3a76ct 3l76ct 3c76ct pb-free mark ga76ct gl76ct gc76ct t = blank for commercial, ?i? for industrial, ?e? for extended. tssop 1st line marking codes device 93aa76c 93lc76c 93c76c std mark a76c l76c c76c pb-free mark gadc gldc gcdc temperature grade is marked on line 2. sot23 marking codes device 93aa76a 93aa76b 93lc76a 93lc76b 93c76a 93C76B i-temp 4bnn 4lnn 4enn 4pnn 4hnn 4tnn e-temp ? ? 4fnn 4rnn 4jnn 4unn pb-free topside mark is same; pb-free noted only on carton label.
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 14 ? 2004 microchip technology inc. 8-lead plastic micro small outline package (ms) (msop) d a a1 l c (f) a2 e1 e p b n 1 2 dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not .037 ref f footprint (reference) exceed .010" (0.254mm) per side. notes: drawing no. c04-111 *controlling parameter mold draft angle top mold draft angle bottom foot angle lead width lead thickness c b .003 .009 .006 .012 dimension limits overall height molded package thickness molded package width overall length foot length standoff overall width number of pins pitch a l e1 d a1 e a2 .016 .024 .118 bsc .118 bsc .000 .030 .193 typ. .033 min p n units .026 bsc nom 8 inches 0.95 ref - - .009 .016 0.08 0.22 0 0.23 0.40 8 millimeters* 0.65 bsc 0.85 3.00 bsc 3.00 bsc 0.60 4.90 bsc .043 .031 .037 .006 0.40 0.00 0.75 min max nom 1.10 0.80 0.15 0.95 max 8 -- - 15 5 - 15 5 - jedec equivalent: mo-187 0 - 8 5 5 - - 15 15 - - - -
? 2004 microchip technology inc. ds21796d-page 15 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c 6-lead plastic small outline transistor (ot) (sot-23) 10 5 0 10 5 0 mold draft angle bottom 10 5 0 10 5 0 mold draft angle top 0.50 0.43 0.35 .020 .017 .014 b lead width 0.20 0.15 0.09 .008 .006 .004 c lead thickness 10 5 0 10 5 0 foot angle 0.55 0.45 0.35 .022 .018 .014 l foot length 3.10 2.95 2.80 .122 .116 .110 d overall length 1.75 1.63 1.50 .069 .064 .059 e1 molded package width 3.00 2.80 2.60 .118 .110 .102 e overall width 0.15 0.08 0.00 .006 .003 .000 a1 standoff 1.30 1.10 0.90 .051 .043 .035 a2 molded package thickness 1.45 1.18 0.90 .057 .046 .035 a overall height 1.90 .075 p1 outside lead pitch (basic) 0.95 .038 p pitch 6 6 n number of pins max nom min max nom min dimension limits millimeters inches* units 1 d b n e e1 l c a2 a a1 p1 exceed .005" (0.127mm) per side. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not notes: jeita (formerly eiaj) equivalent: sc-74a drawing no. c04-120 *controlling parameter
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 16 ? 2004 microchip technology inc. 8-lead plastic du8-lead plastic small outline (al in-line (p) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 51015 51015 mold draft angle bottom 51015 51015 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic
? 2004 microchip technology inc. ds21796d-page 17 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c 8-lead plastic small outline (sn) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 18 ? 2004 microchip technology inc. 8-lead plastic thin shrink small outline (st) ? 4.4 mm (tssop) 10 5 0 10 5 0 mold draft angle bottom 10 5 0 10 5 0 mold draft angle top 0.30 0.25 0.19 .012 .010 .007 b lead width 0.20 0.15 0.09 .008 .006 .004 c lead thickness 0.70 0.60 0.50 .028 .024 .020 l foot length 3.10 3.00 2.90 .122 .118 .114 d molded package length 4.50 4.40 4.30 .177 .173 .169 e1 molded package width 6.50 6.38 6.25 .256 .251 .246 e overall width 0.15 0.10 0.05 .006 .004 .002 a1 standoff 0.95 0.90 0.85 .037 .035 .033 a2 molded package thickness 1.10 .043 a overall height 0.65 .026 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters* inches units a2 a a1 l c 1 2 d n p b e e1 foot angle 048048 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .005? (0.127mm) per side. jedec equivalent: mo-153 drawing no. c04-086 significant characteristic
? 2004 microchip technology inc. ds21796d-page 19 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c appendix a: revision history revision c corrections to section 1.0, electrical characteristics. section 4.1, 6-lead sot-23 package to ot. revision d corrections to device selection table, table 1-1, table 1-2, section 2.4, section 2.5, section 2.8 and section 2.9. added note to figure 2-7.
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 20 ? 2004 microchip technology inc. notes:
? 2004 microchip technology inc. ds21796d-page 21 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c on-line support microchip provides on-line support on the microchip world wide web site. the web site is used by microchip as a means to make files and information easily available to customers. to view the site, the user must have access to the internet and a web browser, such as netscape ? or microsoft ? internet explorer. files are also available for ftp download from our ftp site. connecting to the microchip internet web site the microchip web site is available at the following url: www.microchip.com the file transfer site is available by using an ftp service to connect to: ftp://ftp.microchip.com the web site and file transfer site provide a variety of services. users may download files for the latest development tools, data sheets, application notes, user's guides, articles and sample programs. a vari- ety of microchip specific business information is also available, including listings of microchip sales offices, distributors and factory representatives. other data available for consideration is: latest microchip press releases technical support section with frequently asked questions design tips device errata job postings microchip consultant program member listing links to other useful web sites related to microchip products conferences for products, development systems, technical information and more listing of seminars and events systems information and upgrade hot line the systems information and upgrade line provides system users a listing of the latest versions of all of microchip's development systems software products. plus, this line provides information on how customers can receive the most current upgrade kits.the hot line numbers are: 1-800-755-2345 for u.s. and most of canada, and 1-480-792-7302 for the rest of the world. 042003
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 22 ? 2004 microchip technology inc. reader response it is our intention to provide you with the best documentation possible to ensure successful use of your microchip prod- uct. if you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please fax your comments to the technical publications manager at (480) 792-4150. please list the following information, and use this outline to provide us with your comments about this document. to : technical publications manager re: reader response total pages sent ________ from: name company address city / state / zip / country telephone: (_______) _________ - _________ application (optional): would you like a reply? y n device: literature number: questions: fax: (______) _________ - _________ ds21796d 93aa76a/b/c, 93lc76a /b/c, 93c76a/b/c 1. what are the best features of this document? 2. how does this document meet your hardware and software development needs? 3. do you find the organization of this document easy to follow? if not, why? 4. what additions to the document do you think would enhance the structure and subject? 5. what deletions from the document could be made without affecting the overall usefulness? 6. is there any incorrect or misleading information (what and where)? 7. how would you improve this document?
? 2004 microchip technology inc. ds21796d-page 23 93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . sales and support device 93aa76a: 8k 1.8v microwire serial eeprom (x8) 93aa76b: 8k 1.8v microwire serial eeprom (x16) 93aa76c: 8k 1.8v microwire serial eeprom w/org 93lc76a: 8k 2.5v microwire serial eeprom (x8) 93lc76b: 8k 2.5v microwire serial eeprom (x16) 93lc76c: 8k 2.5v microwire serial eeprom w/org 93c76a: 8k 5.0v microwire serial eeprom (x8) 93C76B: 8k 5.0v microwire serial eeprom (x16) 93c76c: 8k 5.0v microwire serial eeprom w/org tape & reel: blank = standard pinout t = tape & reel temperature range i = -40c to +85c e = -40c to +125c package ms = plastic msop (micro small outline, 8-lead) ot = sot-23, 6-lead (tape & reel only) p = plastic dip (300 mil body), 8-lead sn = plastic soic (150 mil body), 8-lead st = tssop, 8-lead lead finish: blank = standard 63% / 37% snpb g = pb-free (matte tin - pure sn) examples: a) 93aa76c-i/ms: 8k, 1024x8 or 512x16 serial eeprom, msop package, 1.8v b) 93aa76at-i/ot: 8k, 1024x8 serial eeprom, sot-23 package, tape and reel, 1.8v c) 93aa76ct-i/ms: 8k, 1024x8 or 512x16 serial eeprom, msop package, tape and reel, 1.8v a) 93lc76c-i/ms: 8k, 1024x8 or 512x16 serial eeprom, msop package, 2.5v b) 93lc76bt-i/ot: 8k, 512x16 serial eeprom, sot-23 package, tape and reel, 2.5v c) 93lc76cxt-i/sng: 8k, 1024x8 or 512x16 serial eeprom, soic package, industrial temperature, tape and reel, pb-free finish, 2.5v a) 93c76c-i/ms: 8k, 1024x8 or 512x16 serial eeprom, msop package, 5.0v b) 93c76at-i/ot: 8k, 102 4x8 serial eeprom, sot-23 package, tape and reel, 5.0v part no. x /xx package temperature range device x lead finish x tape & reel data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
93aa76a/b/c, 93lc76a/b/c, 93c76a/b/c ds21796d-page 24 ? 2004 microchip technology inc. notes:
? 2004 microchip technology inc. ds21796d-page 25 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application m eets with your specifications. no representation or warranty is given and no liability is assumed by microchip technol ogy incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of mi crochip?s products as critical components in life support syst ems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or ot herwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , mplab, pic, picmicro, picstart, pro mate and powersmart are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. amplab, filterlab, micro id , mxdev, mxlab, picmaster, seeval, smartshunt and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. application maestro, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, microport, migratable memory, mpasm, mplib, mplink, mpsim, pickit, picdem, picdem.net, pictail, powercal, powerinfo, powermate, powertool, rflab, rfpic, select mode, smartsensor, smarttel and total endurance are trademarks of microchip technology incorporated in the u.s.a. and other countries. serialized quick turn programming (sqtp) is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2004, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip's data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semicondu ctor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are comm itted to continuously improving t he code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona and mountain view, california in october 2003. the company?s quality system processes and procedures are for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
ds21796d-page 26 ? 2004 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: 480-792-7627 web address: http://www.microchip.com atlanta 3780 mansell road, suite 130 alpharetta, ga 30022 tel: 770-640-0034 fax: 770-640-0307 boston 2 lan drive, suite 120 westford, ma 01886 tel: 978-692-3848 fax: 978-692-3821 chicago 333 pierce road, suite 180 itasca, il 60143 tel: 630-285-0071 fax: 630-285-0075 dallas 4570 westgrove drive, suite 160 addison, tx 75001 tel: 972-818-7423 fax: 972-818-2924 detroit tri-atria office building 32255 northwestern highway, suite 190 farmington hills, mi 48334 tel: 248-538-2250 fax: 248-538-2260 kokomo 2767 s. albright road kokomo, in 46902 tel: 765-864-8360 fax: 765-864-8387 los angeles 18201 von karman, suite 1090 irvine, ca 92612 tel: 949-263-1888 fax: 949-263-1338 san jose 1300 terra bella avenue mountain view, ca 94043 tel: 650-215-1444 fax: 650-961-0286 toronto 6285 northam drive, suite 108 mississauga, ontario l4v 1x5, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific australia suite 22, 41 rawson street epping 2121, nsw australia tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing unit 706b wan tai bei hai bldg. no. 6 chaoyangmen bei str. beijing, 100027, china tel: 86-10-85282100 fax: 86-10-85282104 china - chengdu rm. 2401-2402, 24th floor, ming xing financial tower no. 88 tidu street chengdu 610016, china tel: 86-28-86766200 fax: 86-28-86766599 china - fuzhou unit 28f, world trade plaza no. 71 wusi road fuzhou 350001, china tel: 86-591-7503506 fax: 86-591-7503521 china - hong kong sar unit 901-6, tower 2, metroplaza 223 hing fong road kwai fong, n.t., hong kong tel: 852-2401-1200 fax: 852-2401-3431 china - shanghai room 701, bldg. b far east international plaza no. 317 xian xia road shanghai, 200051 tel: 86-21-6275-5700 fax: 86-21-6275-5060 china - shenzhen rm. 1812, 18/f, building a, united plaza no. 5022 binhe road, futian district shenzhen 518033, china tel: 86-755-82901380 fax: 86-755-8295-1393 china - shunde room 401, hongjian building, no. 2 fengxiangnan road, ronggui town, shunde district, foshan city, guangdong 528303, china tel: 86-757-28395507 fax: 86-757-28395571 china - qingdao rm. b505a, fullhope plaza, no. 12 hong kong central rd. qingdao 266071, china tel: 86-532-5027355 fax: 86-532-5027205 india divyasree chambers 1 floor, wing a (a3/a4) no. 11, o?shaugnessey road bangalore, 560 025, india tel: 91-80-2290061 fax: 91-80-2290062 japan benex s-1 6f 3-18-20, shinyokohama kohoku-ku, yokohama-shi kanagawa, 222-0033, japan tel: 81-45-471- 6166 fax: 81-45-471-6122 korea 168-1, youngbo bldg. 3 floor samsung-dong, kangnam-ku seoul, korea 135-882 tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 singapore 200 middle road #07-02 prime centre singapore, 188980 tel: 65-6334-8870 fax: 65-6334-8850 taiwan kaohsiung branch 30f - 1 no. 8 min chuan 2nd road kaohsiung 806, taiwan tel: 886-7-536-4818 fax: 886-7-536-4803 taiwan taiwan branch 11f-3, no. 207 tung hua north road taipei, 105, taiwan tel: 886-2-2717-7175 fax: 886-2-2545-0139 europe austria durisolstrasse 2 a-4600 wels austria tel: 43-7242-2244-399 fax: 43-7242-2244-393 denmark regus business centre lautrup hoj 1-3 ballerup dk-2750 denmark tel: 45-4420-9895 fax: 45-4420-9910 france parc d?activite du moulin de massy 43 rue du saule trapu batiment a - ler etage 91300 massy, france tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany steinheilstrasse 10 d-85737 ismaning, germany tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy via quasimodo, 12 20025 legnano (mi) milan, italy tel: 39-0331-742611 fax: 39-0331-466781 netherlands p. a. de biesbosch 14 nl-5152 sc drunen, netherlands tel: 31-416-690399 fax: 31-416-690340 united kingdom 505 eskdale road winnersh triangle wokingham berkshire, england rg41 5tu tel: 44-118-921-5869 fax: 44-118-921-5820 01/26/04 w orldwide s ales and s ervice

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