philips semiconductors product specification damper diode BY329X-1700S fast, high-voltage features symbol quick reference data ? low forward volt drop v r = 1700 v ? fast switching ? soft recovery characteristic v f 1.5 v ? high thermal cycling performance ? isolated mounting tab i f(peak) = 6 a i fsm 60 a t rr 170 ns general description pinning sod113 glass-passivated double diffused pin description rectifier diode featuring low forward voltage drop, fast reverse recovery 1 cathode and soft recovery characteristic. the device is intended for use in tv 2 anode receivers and pc monitors. tab isolated the by329x series is supplied in the conventional leaded sod113 package. limiting values limiting values in accordance with the absolute maximum system (iec 134). symbol parameter conditions min. max. unit v rsm peak non repetitive reverse - 1700 v voltage v rrm peak repetitive reverse voltage - 1700 v v rwm crest working reverse voltage - 1300 v i f(peak) peak working forward current f = 16 khz - 6 a f = 64 khz - 6 a i frm peak repetitive forward current t = 25 m s; d = 0.5; t hs 91 ?c - 14 a i f(rms) rms forward current - 10 a i fsm peak non-repetitive forward t = 10 ms - 60 a current sinusoidal; t j = 150 ?c prior to surge; with reapplied v rwm(max) t stg storage temperature -40 150 ?c t j operating junction temperature - 150 ?c isolation limiting value & characteristic t hs = 25 ?c unless otherwise specified symbol parameter conditions min. typ. max. unit v isol r.m.s. isolation voltage from f = 50-60 hz; sinusoidal - 2500 v both terminals to external waveform; heatsink r.h. 65% ; clean and dustfree c isol capacitance from both terminals f = 1 mhz - 10 - pf to external heatsink k a 12 12 case september 1998 1 rev 1.200
philips semiconductors product specification damper diode BY329X-1700S fast, high-voltage thermal resistances symbol parameter conditions min. typ. max. unit r th j-hs thermal resistance junction to with heatsink compound - - 4.8 k/w heatsink without heatsink compound - - 5.9 k/w r th j-a thermal resistance junction to in free air. - 55 - k/w ambient static characteristics t j = 25 ?c unless otherwise stated symbol parameter conditions min. typ. max. unit v f forward voltage i f = 6.5 a - 1.35 1.65 v i f = 6.5 a; t j = 125 ?c - 1.2 1.5 v i r reverse current v r = v rwmmax - - 250 m a v r = v rwmmax ; t j = 125 ?c - - 1.0 ma dynamic characteristics t j = 25 ?c unless otherwise stated symbol parameter conditions min. typ. max. unit v fr forward recovery voltage i f = 6.5 ; di f /dt = 50 a/ m s - 30 40 v t fr forward recovery time i f = 6.5 a; di f /dt = 50 a/ m s; v f = 5 v - 300 320 ns t rr reverse recovery time i f = 1 a; -di f /dt = 50 a/ m s; v r 3 30 v - 130 170 ns q s reverse recovery charge i f = 2 a; -di f /dt = 20 a/ m s; v r 3 30 v - 0.7 1.0 m c fig.1. definition of vfr and tfr fig.2. definition of t rr and q s time time v f v fr v f i f 10% 5v tfr 100% time di dt f i r i f trr 25% qs september 1998 2 rev 1.200
philips semiconductors product specification damper diode BY329X-1700S fast, high-voltage fig.3. basic horizontal deflection circuit. fig.4. maximum allowable pulse width t p versus line frequency; basic horizontal deflection circuit. fig.5. by329-1500s typical and maximum forward characteristic i f = f(v f ); parameter t j fig.6. transient thermal impedance z th = f(t p ) line output transformer vcc d1 ly cs cf deflection transistor 0 0.5 1 1.5 2 0 10 20 30 vf / v if / a by329s17 tj = 125 c tj = 25 c typ max 10 100 1 10 100 by459x-1500 line frequency / khz maximum pulse width / us v time vrrm width tp period t pulse 1us 10us 100us 1ms 10ms 100ms 1s 10s 0.001 0.01 0.1 1 10 by229f pulse width, tp (s) transient thermal impedance, zth j-hs (k/w) d = t p t p t t p t d september 1998 3 rev 1.200
philips semiconductors product specification damper diode BY329X-1700S fast, high-voltage mechanical data dimensions in mm net mass: 2 g fig.7. sod113; the seating plane is electrically isolated from all terminals. notes 1. refer to mounting instructions for f-pack envelopes. 2. epoxy meets ul94 v0 at 1/8". 10.3 max 3.2 3.0 4.6 max 2.9 max 2.8 seating plane 6.4 15.8 max 0.6 2.5 2.54 5.08 12 3 max. not tinned 3 0.5 2.5 0.9 0.7 m 0.4 15.8 max. 19 max. 13.5 min. recesses (2x) 2.5 0.8 max. depth 1.0 (2x) september 1998 4 rev 1.200
|
