doc. no : qw0905-la79b-1/gxgx-pf rev. : c date : 30 - oct. - 2006 led array data sheet la79b-1/gxgx-pf ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions part no. la79b-1/gxgx-pfpage 1/5 4.7 0.5 4.0 0.5 8.5 0.5 2.5 5.08 0.5 typ 2.5 0.5 2.54typ + - x g x 3.0x4 g 4.4 20.3 10.7 lg2340-1/f181-pf + - 3.0 5.0 1.0min 28.5min 0.5 typ 2.54typ 1.5max 1.5 3.0
green diffused lens color note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 # i fp pd i f ir tstg t opr symbol typical electrical & optical characteristics (ta=25 # ) material part no gap la79b-1/gxgx-pf green emitted power dissipation storage temperature reverse current @5v operating temperature forward current peak forward current duty 1/10@10khz parameter part no. la79b-1/gxgx-pf ligitek electronics co.,ltd. property of ligitek only typ. luminous intensity @10ma(mcd) spectral halfwidth $% nm peak wave length % pnm forward voltage @20ma(v) 565 30 2.6 max. min. 1.7 min. 8.020 viewing angle 2 & 1/2 (deg) 80 mw 100 -40 ~ +100 -40 ~ +85 10 # # ' a absolute maximum ratings 120 30 g ma ma unit page 2/5
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( # ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 # fig.4 relative intensity vs. temperature ambient temperature( # ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 # typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. la79b-1/gxgx-pf3/5
dip soldering preheat: 120 ! c max preheat time: 120seconds max ramp-up 2 ! c/sec(max) ramp-down:-5 ! c/sec(max) solder bath:260 ! c max dipping time:3 seconds max distance:2mm min(from solder joint to case) note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 25 ( 0 ( 0 time(sec) 250 2 ! /sec max preheat 100 200 temp( ! c) 120 ( 260 ( 260 ! c3sec max 5 ! /sec max page 4/5 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 ! c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) ligitek electronics co.,ltd. property of ligitek only 120 seconds max part no. la79b-1/gxgx-pf
the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. solder resistance test 1.t.sol=260 # 5 # 2.dwell time= 10 1sec. solderability test 1.t.sol=230 # 5 # 2.dwell time=5 1sec thermal shock test 1.ta=105 # 5 # &-40 # 5 # (10min) (10min) 2.total 10 cycles high temperature high humidity test 1.ta=65 ligitek electronics co.,ltd. property of ligitek only 5/5 part no. la79b-1/gxgx-pf
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