mimix broadband?s 10.0-40.0 ghz gaas mmic distributed amplifier has a small signal gain of 23.0 db with a 5.0 db noise figure. this mmic uses mimix broadband?s 0.15 m gaas phemt device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. the chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. this device is well suited for microwave, millimeter-wave wideband military and fiber optic applications. 10.0-40.0 ghz gaas mmic distributed amplifier absolute maximum ratings page 1 of 6 features ultra wide band driver amplifier self bias architecture 23.0 db small signal gain 5.0 db noise figure 100% on-wafer rf, dc and output power testing 100% visual inspection to mil-std-883 method 2010 general description supply voltage (vd) supply current (id) input power (pin) storage temperature (tstg) operating temperature (ta) channel temperature (tch) +6.0 vdc 270 ma +17.0 dbm -65 to +165 o c -55 to mttf table mttf table chip device layout (1) channel temperature affects a device's mttf. it is recommended to keep channel temperature as low as possible for maximum life. 1 frequency range (f ) input return loss (s11) output return loss (s22) small signal gain (s21) gain flatness ( s21) reverse isolation (s12) noise figure (nf) output power for 1 db compression point (p1db) 2 drain bias voltage (vd) supply current (id) (vd=5.0v) electrical characteristics (ambient temperature t = 25 o c) parameter units ghz db db db db db db dbm vdc ma min. 10.0 - - - - - - - - - typ. - 7.0 10.0 23.0 +/-5.0 35.0 5.0 tbd +5.0 190 max. 40.0 - - - - - - - +5.5 230 (2) measured using constant current. 1 d1005-bd mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2007 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. january 2007 - rev 16-jan-07
page 2 of 6 distributed amplifier measurements 10.0-40.0 ghz gaas mmic distributed amplifier d1005-bd xd1005-bd vd=see legend, id=see legend 6 8 10 12 14 16 18 20 22 24 26 28 30 8 1012141618202224262830323436384042444648 frequency (ghz) gain (db) vd=3.0v, id=160 ma vd=4.0v, id=180 ma vd=5.0v, id=190 ma xd1005-bd vd=see legend, id=see legend -70 -60 -50 -40 -30 -20 -10 0 8 1012141618202224262830323436384042444648 frequency (ghz) reverse isolation (db) vd=3.0v, id=160 ma vd=4.0v, id=180 ma vd=5.0v, id=190 ma xd1005-bd vd=see legend, id=see legend -35 -30 -25 -20 -15 -10 -5 0 8 1012141618202224262830323436384042444648 frequency (ghz) input return loss (db) vd=3.0v, id=160 ma vd=4.0v, id=180 ma vd=5.0v, id=190 ma xd1005-bd vd=see legend, id=see legend -35 -30 -25 -20 -15 -10 -5 0 8 1012141618202224262830323436384042444648 frequency (ghz) output return loss (db) vd=3.0v, id=160 ma vd=4.0v, id=180 ma vd=5.0v, id=190 ma mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2007 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. january 2007 - rev 16-jan-07
page 3 of 6 s-parameters 10.0-40.0 ghz gaas mmic distributed amplifier d1005-bd typcial s-parameter data for xd1005-bd vd=5.0 v id=190 ma frequency s11 s11 s21 s21 s12 s12 s22 s22 (ghz) (mag) (ang) (mag) (ang) (mag) (ang) (mag) (ang) 8.0 0.229 -83.96 2.929 -51.89 0.0019 -114.33 0.670 -140.06 9.0 0.310 -88.30 5.960 -92.15 0.0019 -120.63 0.610 -155.98 10.0 0.406 -100.44 10.441 -135.42 0.0035 -124.92 0.525 -168.07 11.0 0.440 -121.85 15.181 174.05 0.0040 -156.95 0.435 -177.18 12.0 0.379 -139.89 17.935 120.94 0.0049 -161.77 0.372 178.85 13.0 0.317 -143.44 19.100 82.07 0.0053 -169.88 0.332 175.41 14.0 0.280 -133.61 20.311 48.64 0.0065 173.66 0.273 173.60 15.0 0.362 -127.07 23.466 11.34 0.0070 159.80 0.262 -179.08 16.0 0.435 -138.34 25.765 -26.27 0.0051 148.04 0.279 173.60 17.0 0.520 -144.03 26.953 -61.57 0.0070 159.39 0.257 179.61 18.0 0.607 -160.43 27.000 -102.19 0.0093 160.45 0.300 -179.24 19.0 0.588 173.99 23.854 -139.22 0.0102 134.55 0.327 158.69 20.0 0.461 155.28 20.012 -167.08 0.0103 116.80 0.264 140.31 22.0 0.234 136.17 17.650 145.59 0.0079 105.99 0.110 127.32 22.0 0.234 136.17 17.650 145.59 0.0079 105.99 0.110 127.32 23.0 0.142 125.24 17.767 121.84 0.0088 113.91 0.053 125.91 24.0 0.089 168.47 19.269 90.92 0.0067 105.04 0.108 -160.48 25.0 0.106 -146.20 19.359 62.94 0.0074 104.90 0.138 -156.23 26.0 0.150 -124.03 19.244 35.51 0.0089 113.90 0.156 -151.63 27.0 0.214 -128.89 18.747 2.26 0.0088 105.69 0.181 -163.96 28.0 0.296 -131.04 18.278 -27.68 0.0107 98.23 0.198 -171.06 29.0 0.393 -140.68 17.353 -59.53 0.0134 103.20 0.220 -172.46 30.0 0.420 -150.70 14.807 -91.79 0.0139 86.31 0.175 -173.03 31.0 0.457 -161.65 12.855 -119.72 0.0135 80.27 0.194 -168.95 32.0 0.458 -172.99 11.054 -143.16 0.0128 72.20 0.208 -165.06 33.0 0.437 -179.67 9.745 -167.65 0.0111 69.61 0.241 -168.28 34.0 0.401 167.51 9.002 171.27 0.0109 65.22 0.260 -174.00 35.0 0.363 161.69 8.918 150.19 0.0118 61.78 0.284 -176.84 36.0 0.268 156.71 9.090 124.67 0.0092 52.31 0.323 174.07 37.0 0.204 156.55 9.480 99.17 0.0095 40.42 0.361 163.77 38.0 0.127 -176.88 10.075 72.86 0.0076 45.83 0.379 151.09 39.0 0.200 -129.17 11.745 38.81 0.0057 41.02 0.452 134.42 40.0 0.352 -131.82 13.740 1.69 0.0072 39.04 0.567 109.82 41.0 0.370 -137.25 15.643 -44.34 0.0023 31.66 0.718 70.75 42.0 0.451 -145.14 13.989 -112.77 0.0056 117.47 0.794 14.99 43.0 0.595 -141.13 9.541 -166.65 0.0037 94.03 0.715 -31.34 44.0 0.675 -147.50 6.009 151.20 0.0065 41.31 0.650 -61.13 45.0 0.775 -160.69 3.840 108.37 0.0051 59.54 0.613 -85.62 46.0 0.778 -167.31 2.831 70.96 0.0041 163.29 0.595 -106.75 47.0 0.774 -178.03 2.641 24.25 0.0088 72.02 0.519 -138.36 48.0 0.808 178.27 1.502 -109.87 0.0058 149.40 0.393 -43.29 mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2007 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. january 2007 - rev 16-jan-07
1 2 3 1.250 (0.049) 0.406 (0.016) 1.500 (0.059) 0.0 0.0 1.070 (0.042) 0.820 (0.032) rf in rf out 1 2 3 vd page 4 of 6 mechanical drawing bias arrangement bypass capacitors - see app n ote [2] (note: engineering designator is 22dsba0423) units: millimeters (inches) bond pad dimensions are shown to center of bond pad. thickness: 0.110 +/- 0.010 (0.004 3 +/- 0.0004), backside is ground, bond pad/backside metallization: gold all bond pads are 0.100 x 0.100 (0.004 x 0.004). bond pad centers are approximately 0.109 (0.004) from the edge of the chip. dicing tolerance: +/- 0.005 (+/- 0.0002). approximate weight: 1.16 3 mg bond pad #1 (rf in) bond pad #2 (rf out) bond pad # 3 ( v d) 10.0-40.0 ghz gaas mmic distributed amplifier d1005-bd mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2007 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. january 2007 - rev 16-jan-07
page 5 of 6 app note [1] biasing ? as shown in the bonding diagram, this device operates using a self-biased architecture and only requires one drain bias. bias is nominally vd=5v, id=190 ma. app note [2] bias arrangement - each dc pad (vd) needs to have dc bypass capacitance (~100-200 pf) as close to the device as possible. additional dc bypass capacitance (~0.01 uf) is also recommended. mttf graphs these numbers were calculated based on accelerated life test information and thermal model analysis received from the fabricati ng foundry. 10.0-40.0 ghz gaas mmic distributed amplifier d1005-bd xd1005-bd vd=5.0 v id=175 ma 1.00e+05 1.00e+06 1.00e+07 1.00e+08 1.00e+09 55 65 75 85 95 105 115 125 backplate temperature (deg c) mttf (hours) xd1005-bd vd=5.0 v id=175 ma 1.00e+00 1.00e+01 1.00e+02 1.00e+03 1.00e+04 55 65 75 85 95 105 115 125 backplate temperature (deg c) fits xd1005-bd vd=5.0 v id=175 ma 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 55 65 75 85 95 105 115 125 backplate temperature (deg c) rth (deg c/w) xd1005-bd vd=5.0 v id=175 ma 100 110 120 130 140 150 160 170 180 190 200 55 65 75 85 95 105 115 125 backplate temperature (deg c) tch (deg c) mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2007 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. january 2007 - rev 16-jan-07
page 6 of 6 handling and assembly information part number for ordering description caution! - mimix broadband mmic products contain gallium arsenide (gaas) which can be hazardous to the human body and the environment. for safety, observe the following procedures: do not ingest. do not alter the form of this product into a gas , powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. observe government laws and company regulations when discarding this product. this product must be discarded in accordance with methods specified by applicable hazardous waste procedures. life support policy - mimix broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the president and general counsel of mimix broadband. as used herein: (1) life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to aff ect its safety or effectiveness. esd - gallium arsenide (gaas) devices are susceptible to electrostatic and mechanical damage. die are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers. die attachment - gaas products from mimix broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable grounding to the circuit. microstrip substrates should be brought as close to the die as possible. the mounting surface should be clean and flat. if using conductive epoxy, recommended epoxies are tanaka ts3332ld, die mat dm6030hk or dm6030hk-pt cured in a nitrogen atmosphere per manufacturer's cure schedule. apply epoxy sparingly to avoid getting any on to the top surface of the die. an epoxy fillet should be visible around the total die periphery. for additional information please see the mimix "epoxy specifications for bare die" application note. if eutectic mounting is preferred, then a fluxless gold-tin (ausn) preform, appr oximately 0.001 2 thick, placed between the die and the attachment surface should be used. a die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. he gold-t in eutectic (80% au 20% sn) has a melting point of approximately 280 oc (note: gold germanium should be avoided). the work station temperature should be 310 oc +/- 10 oc. exposure to these extreme temperatures should be kept to minimum. the collet should be heated, and the die pre-heated to avoid excessive thermal shock. avoidance of air bridges and force impact are critical during placement. wire bonding - windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. the recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize rf port bond inductance. gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for dc bias connections. aluminum wire should be avoided. thermo-compression bonding is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized. bond force, time and ultrasonics are all critical parameters . bonds should be made from the bond pads on the die to the package or substrate. all bonds should be as short as possible. xd1005-bd-000v rohs compliant die packed in vacuum release gel packs XD1005-BD-EV1 xd1005-bd evaluation module 10.0-40.0 ghz gaas mmic distributed amplifier d1005-bd mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2007 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. january 2007 - rev 16-jan-07
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