v1 masw-004240-13170w hmic? sp4t surface mount s ilicon pin diode switch with integrated bias network advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 1 parameter absolute maximum operating temperature -65 o c to +125 o c storage temperature -65 o c to +150 o c junction temperature +175 o c applied forward current +40ma rf incident power +30dbm c.w. mounting temperature +280 o c for 10 seconds features ? operating freq. 10 2ghz or 24 2ghz ? surface mount device ? integrated bias network ? no wire bonds required ? low current consumption +12 ma for on state/0v for off condition ? rugged, glass encapsulated construction ? fully monolithic ? polymer scratch protection ? rohs compliant description the masw-004240-13170w is a surface mount sp4t switch chip with integrated bias network. it utilizes m/a-com technology solutions hmic tm (heterolithic microwave integrated circuit) process, us patent 5,268,310, which allows the incorporation of silicon pe destals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. by using small spacing between elements, this combination of silicon and glass gives hm ic devices low loss and high isolation performance with exceptional repeatability through low millimeter frequencies. patterned gold backside metal allows for manual or re-flow soldering without the need for wire bond connections to the rf and bias ports. the chip may be soldered using 80au/20sn, rohs compliant solders or electr ically conductive silver epoxy. the rf bond pads are labeled j1-j5 and are 375x375m (15x15mils) square. the dc bias bond pads are labeled b2-b5 and are also 375x375m (15x15mils) square. yellow areas denote backside soldering points for bias and rf connections. applications the masw-004240-13170w has been designed for 24ghz automotive radar sensor applications and is also ideally suited for use at 10ghz. the switch is turned on by applying a forward current of +12ma at 4v to the appropriate bias port and is turned off at 0v. the rf bias network has been incorporated into the design for ease of use and space considerations.
v1 masw-004240-13170w hmic? sp4t surface mount s ilicon pin diode switch with integrated bias network advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 2 masw-004240-13170w ( sp4t ) electrical specifications @ t amb = +25 o c parameter frequency port 1 port 2 stimulus minimum typical maximum insertion loss 10ghz & 24ghz j1 j2 12ma @ b2 2.5 3.5db j1 j3 12ma @ b3 2.5 3.5db j1 j4 12ma @ b4 2.5 3.5db j1 j5 12ma @ b5 2.5 3.5db isolation 10ghz & 24ghz j1 j2 12ma @ b2 40db 50 j1 j3 12ma @ b3 40db 50 j1 j4 12ma @ b4 40db 50 j1 j5 12ma @ b5 40db 50 input return loss 10ghz & 24ghz j1 j2 12ma @ b2 14 j1 j3 12ma @ b3 14 j1 j4 12ma @ b4 14 j1 j5 12ma @ b5 14
v1 masw-004240-13170w hmic? sp4t surface mount s ilicon pin diode switch with integrated bias network advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 3 typical input return loss typical insertion loss -5.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0 5 10 15 20 25 30 frequency (ghz) insertion loss (db) typical isolation typical output return loss -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 0 5 10 15 20 25 30 frequency (ghz) input return loss (db) -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 0 5 10 15 20 25 30 frequency (ghz) output return loss (db) -60 -50 -40 -30 -20 -10 0 0 5 10 15 20 25 30 frequency (ghz) isolation (db)
v1 masw-004240-13170w hmic? sp4t surface mount s ilicon pin diode switch with integrated bias network advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 4 masw-004240-13170w schematic driver connections control level ( dc current ) at port condition of rf output b2 b3 b4 b5 j1-j2 j1-j3 j1-j4 j1-j5 -12ma 0v 0v 0v low loss isolation isolation isolation 0v -12ma 0v 0v isolation low loss isolation isolation 0v 0v -12ma 0v isolation isolation low loss isolation 0v 0v 0v -12ma isolation isolation isolation low loss operation of th e masw-004240-13170w operation of the masw-00420-13170w pin diode switch is achieved by simultaneously applying a current of +12ma dc to the bias port of the on arm and 0v to the remaining isolated off arms.
v1 masw-004240-13170w hmic? sp4t surface mount s ilicon pin diode switch with integrated bias network advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 5 chip dimensions and pad locations 1,2,3 notes: 1. backside metallization thickness is.01m. 2. hatched areas indicate backside ohmic gold contacts 3. bond pad centers are referenced from chip center. chip dimensions dim mils millimeters min. max min. max a 132.0 134.0 3.350 3.400 b 128.5 129.0 3.270 3.280 c 4.0 6.0 0.102 0.152 d 67.0 71.0 0.170 0.180 e 14.5 15.0 0.370 0.380 f 43.3 43.7 1.100 1.110 g 28.3 28.7 0.720 0.730 h 9.5 10.0 0.245 0.255 bond pad centers dim mils millimeters x y x y j1 0 -57 0 -1.450 j2 -57 -57 1.450 -1.450 j3 57 57 1.450 1.450 j4 -57 57 -1.450 1.450 j5 -57 -57 -1.450 -0.145 b2 -57 15 1.450 0.380 b3 12 57 0.313 1.450 b4 -12 57 -0.313 1.450 b5 -57 15 -1.450 0.380 r.f. & dc ground
v1 masw-004240-13170w hmic? sp4t surface mount s ilicon pin diode switch with integrated bias network advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 6 die attachment and handling guidelines part number package masw-004240-13170w waffle pack ordering information handling all semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. the use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. bulk handling should insure that abrasion and mechanical shock are minimized. bonding attachment to a circuit board is made simple through the use of surface mount technology. mounting pads are conveniently located on the bottom surface of these devic es and are removed from the active junction locations. these devices are well suited for solder or conductive epoxy attachment onto hard or soft substrates. the use of 60pb/40sn, 80au/20sn or any ro hs lead-free solder is recommended to achieve the lowest series resistance and optimum heat sink. . when soldering these devices a hot gas or oven re-flow process is preferre d. we recommend utilizing a vacuum tip and applying a downward force of 40 - 60 grams to the top surface of the device. when soldering, position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the die. all mounting pads should be heated simultaneously so that the solder under the pads flows at the same time. avoid soldering the pads one at a time as doing so w ould produce an un-equal heat flow and potentially create thermal stress to the chip. solder reflow should not be performed by causing the heat to flow through the top surface of the die. die should be uniformly heated in a re-flow oven. a typical heating profile and handling instructions are provided in application notes , m538 surface mounting instructions and m541 bonding and handling procedures on the ma-com website at www.macomtech.com conductive silver epoxy may also be used for die attachme nt, in lower incident power applications where the average power is <1w. apply a thin controlled amount appr oximately 1- 2 mils thick to minimize ohmic and thermal stresses. take care not to bridge the gap between the chip pads with epoxy. a thin epoxy fillet should be visible around the perimeter of the pads after placement to ens ure full coverage. cure per epoxy per manufacturer?s recommended schedule. typically 150c for 1 hour.
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