super bright round type led lamps ligitek electronics co.,ltd. property of ligitek only LE2042-PF data sheet doc. no : qw0905-LE2042-PF rev. : a date : 25 - jun. - 2007 lead-free parts pb
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. part no. LE2042-PFpage 1/5 package dimensions ligitek electronics co.,ltd. property of ligitek only 25% 75% 100%50% -60 -30 75% 25% 0 50%100% 0 30 60 + - 4.0 1.0min 25.0min 2.54typ 1.5max 0.5 typ 5.2 4.2 3.0
absolute maximum ratings at ta=25 emitted note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) material part no LE2042-PF gaasp/gap orange reverse current @5v storage temperature operating temperature power dissipation peak forward current duty 1/10@10khz forward current parameter 36 viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) peak wave length pnm spectral halfwidth nm forward voltage @20ma(v) white diffused 45 635 lens 2.6 1.720 12 min. min.max. typ. color a 10 ir -40 ~ +85 -40 ~ +100 tstg t opr pd i fp 100 mw 120 ma page 2/5 ratings i f symbol e 30 ma unit ligitek electronics co.,ltd. property of ligitek only part no. LE2042-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( # ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 # fig.4 relative intensity vs. temperature ambient temperature( # ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 # typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 e chip page3/5 fig.6 directivity radiation part no. LE2042-PF
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. page 4/5 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) time(sec) 150 260 c3sec max 100 5 /sec max 50 preheat 2 /sec max 260 120 0 0 25 temp( c) 60 seconds max part no. LE2042-PF
page 5/5 reference standard this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description test condition 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) ligitek electronics co.,ltd. property of ligitek only mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 test item operating life test high temperature storage test reliability test: the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec jis c 7021: b-12 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 low temperature storage test high temperature high humidity test thermal shock test solder resistance test solderability test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. part no. LE2042-PF
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