agilent HLMP-PB00-N0000, hlmp-pm00-n0000, hlmp-qb00-s0000, hlmp-qm00-s0000 subminiature blue and green ingan led lamps data sheet features ? subminiature flat top package ideal for backlighting and light piping applications ? subminiature dome package nondiffused dome for high brightness ? colors: 468 nm blue, 525 nm green ? ideal for space limited applications ? axial leads ? available with lead configura- tions for surface mount and through hole pc board mounting applications ? consumer ? industrial ? computer peripheral ? communication description flat top package the hlmp-pxxx flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. the flat top lamps are also ideal for use as emitters in light pipe applications. dome package the hlmp-qxxx dome lamps use an untinted, nondiffused lens to provide a high luminous intensity within a narrow radiation pattern. caution: hlmp-xb00 and hlmp-xm00 leds are class 2 esd sensitive. please observe appropriate precautions during handling and processing. refer to agilent application note an-1142 for addi- tional details. lead configurations all these devices are made by encapsulating led chip on axial lead frames to form molded epoxy subminiature lamps. a variety of package configuration options is available. these include special surface mount lead configurations, gull wing, yoke lead, or z-bend. right angle lead bend at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. for more information refer to standard smt and through hole lead bend options for subminiature lamps data sheet.
2 package dimensions ( a) flat top lamps 0.46
0.56 (0.018)
(0.022) 1.40
1.65 (0.055)
(0.065) 0.25 (0.010) max.*
note 2 0.20 (0.008) max. 0.50 (0.020) ref. cathode 1.65
1.91 (0.065)
(0.075) dia. anode 11.68
10.67 (0.460)
(0.420) both sides 1.14
1.40 (0.045)
(0.055) 0.63
0.38 (0.025)
(0.015) 2.21
1.96 (0.087)
(0.077) 0.18
0.23 (0.007)
(0.009) 0.79 (0.031) max. 2.44
1.88 (0.096)
(0.074) 2.08
2.34 (0.082)
(0.092) cathode
stripe notes:
1. all dimensions are in millimeters (inches).
2. protruding support tab is connected to cathode lead. * refer to figure 1 for design concerns.
3 package dimensions b) domed lamps 0.50 (0.020) ref. 0.94
1.24 (0.037)
(0.049) 2.92 (0.115)
max. 0.76
0.89 (0.030)
(0.035) r. 0.63
0.38 (0.025)
(0.015) 2.03 (0.080)
1.78 (0.070) 0.79 (0.031)
0.53 (0.021) 0.46
0.56 (0.018)
(0.022) 0.25 (0.010) max.*
note 2 0.20 (0.008) max. cathode 1.65
1.91 (0.065)
(0.075) dia. anode 11.68
10.67 (0.460)
(0.420) both sides 0.18
0.23 (0.007)
(0.009) 2.08
2.34 (0.082)
(0.092) 2.21
1.96 (0.087)
(0.077) cathode
stripe notes:
1. all dimensions are in millimeters (inches).
2. protruding support tab is connected to cathode lead. * refer to figure 1 for design concerns.
4 figure 1. proper right angle mounting to a pc board to prevent protruding cathode tab from shorting to anode connection. no. anode down. yes. cathode down. cathode
tab device selection guide part number color viewing angle 2 q 1/2 package description package outline HLMP-PB00-N0000 blue 85? flat top, nondiffused, untinted a hlmp-pm00-n0000 green hlmp-qb00-s0000 blue 20? domed, nondiffused, untinted b hlmp-qm00-s0000 green hlmx-xxxx-x x x x x 4 x 4 prod. part number min. iv bin max. iv bin color bin selection packaging option ordering information
5 optical characteristics at t a = 25?c luminous color, intensity peak dominant spectral viewing luminous iv (mcd) @ wavelength wavelength halfwidth angle 2 q 1/2 efficacy i f = 20 ma l peak (nm) l d (nm) dl 1/2 (nm) degrees h v (lm/w) part number min. typ. typ. typ. typ. typ. HLMP-PB00-N0000 25 60 470 468 26 85 70 hlmp-pm00-n0000 25 200 523 525 36 85 500 hlmp-qb00-s0000 160 290 470 468 26 20 70 hlmp-qm00-s0000 160 690 523 525 36 20 500 absolute maximum ratings at t a = 25?c parameter value peak forward current 90 ma dc forward current [1] 30 ma power dissipation 110 mw reverse voltage (i r = 10 m a) 5 v operating temperature range C40?c to +85?c storage temperature range C55?c to +100?c led junction temperature 110?c lead soldering temperature [1.6 mm (0.063 in.) from body] 260?c for 5 seconds smt reflow soldering temperatures convective reflow 235?c peak, above 183?c for 90 seconds vapor phase reflow 215?c for 3 minutes note: 1. derate linearly as shown in figure 5. electrical characteristics at t a = 25?c forward voltage reverse breakdown capacitance c (pf), thermal resistance v f (volts) @ i f = 20 ma v r (volts) @ i r = 100 m av f = 0, f = 1 mhz r q j-pin (?c/w) part number typ. max. min. typ. typ. HLMP-PB00-N0000 3.7 4.1 5 52 170 hlmp-pm00-n0000 3.7 4.1 5 52 170 hlmp-qb00-s0000 3.7 4.1 5 52 170 hlmp-qm00-s0000 3.7 4.1 5 52 170
6 figure 4. relative luminous intensity vs. dc forward current. figure 2. relative intensity vs. wavelength. figure 3. forward current vs. forward voltage. relative intensity 380 0 wavelength ?nm 0.6 0.4 480 630 780 0.2 0.1 0.3 0.5 1.0 430 580 730 0.7 0.8 0.9 green blue 530 680 i f ?forward current ?ma 0 0 v f ?forward voltage ?v 3 30 20 12 5 10 5 15 25 35 4 figure 6. relative luminous intensity vs. angular displacement for hlmp-qxxx. figure 5. maximum forward current vs. ambient temperature. derating based on t j max = 110?c. figure 7. relative luminous intensity vs. angular displacement for hlmp-pxxx. relative intensity 0 angle ?degrees 0.8 0.6 0.5 0.7 0.2 -90 0.1 0.3 0.4 -80 -70 -60 -50 -40 -20 -10 0 -30 10 20 30 40 50 60 70 80 90 0.9 1.0 relative intensity 0 angle ?degrees 0.8 0.6 0.5 0.7 0.2 -90 0.1 0.3 0.4 -80 -70 -60 -50 -40 -20 -10 0 -30 10 20 30 40 50 60 70 80 90 0.9 1.0 relative intensity 0 0 dc forward current ?ma 25 1.4 0.8 515 35 0.4 0.2 0.6 1.2 1.6 10 20 30 1.0 maximum forward current ?ma 0 0 ambient temperature ?? 40 80 30 25 20 15 10 20 60 100 r q j-a = 550?/w 5 35 r q j-a = 400?/w
7 intensity bin limits bin min. max. n2550 p4080 q 63 125 r 100 200 s 160 320 t 250 500 u 400 800 v 630 1250 w 1000 2000 x 1600 3200 y 2500 5000 color bin limits package bin min. max. blue 0 full distribution 1 460 464 2 464 468 3 468 472 4 472 476 5 476 480 6 480 484 green 0 full distribution 3 520 525 4 525 530 5 530 535 6 535 540 mechanical option 00 straight leads, bulk packaging, quantity of 500 parts 11 gull wing leads, 12 mm tape on 7 in. dia. reel, 1500 parts per reel 12 gull wing lead, bulk packaging, quantity of 500 parts 14 gull wing leads, 12 mm tape on 13 in. dia. reel, 6000 parts per reel 21 yoke leads, 12 mm tape on 7 in. dia. reel, 1500 parts per reel 22 yoke leads, bulk packaging, quantity of 500 parts 24 yoke leads, 12 mm tape on 13 in. dia. reel, 6000 parts per reel 31 z-bend leads, 12 mm tape on 7 in. dia. reel, 1500 parts per reel 32 z-bend leads, bulk packaging, quantity of 500 parts 34 z-bend leads, 12 mm tape on 13 in. dia. reel, 6000 parts per reel note: all categories are established for classification of products. products may not be available in all categories. please contact your local agilent representative for further clarification/information. tolerance of each bin limit = 2 nm.
www.semiconductor.agilent.com data subject to change. copyright ? 2001 agilent technologies, inc. october 31, 2001 obsoletes 5988-0703en 5988-4572en
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