![]() |
|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
? july 2003 1/17 VND830ASP double channel high side solid state relay (*) per channel n dc short circuit current: 6a n cmos compatible inputs n proportional load current sense n undervoltage and overvoltage shut-down n overvoltage clamp n thermal shut-down n current limitation n very low stand-by power dissipation n protection against: loss of ground and loss of v cc n reverse battery protection (**) description the VND830ASP is a monolithic device made using stmicroelectronics vipower m0-3 technology. it is intended for driving any kind of load with one side connected to ground. active v cc pin voltage clamp protects the device against low energy spikes (see iso7637 transient compatibility table). this device has two channels in high side configuration; each channel has an analog sense output on which the sensing current is proportional (according to a known ratio) to the corresponding load current. built-in thermal shut-down and outputs current limitation protect the chip from over temperature and short circuit. device turns off in case of ground pin disconnection. type r ds(on) i out v cc VND830ASP 60 m w (*) 6 a (*) 36 v (*) 1 10 powerso-10 ? order codes package tube t&r powerso-10 ? VND830ASP VND830ASP13tr logic undervoltage overvoltage overtemp. 1 overtemp. 2 i lim2 pwclamp 2 k i out2 i lim1 pwclamp 1 k i out1 input 1 input 2 gnd v cc output 1 current sense 1 output 2 current sense 2 driver 2 driver 1 v cc clamp ot1 ot2 ot1 ot2 v dslim1 v dslim2 block diagram (**) see application schematic at page 8
2/17 VND830ASP absolute maximum rating connection diagram (top view) symbol parameter value unit v cc dc supply voltage 41 v -v cc reverse supply voltage - 0.3 v -i gnd dc reverse ground pin current - 200 ma i out output current internally limited a i r reverse output current - 6 a i in input current +/- 10 ma v csense current sense maximum voltage -3 +15 v v v esd electrostatic discharge (human body model: r=1.5 w ; c=100pf) - input - current sense - output - v cc 4000 2000 5000 5000 v v v v e max maximum switching energy (l=1.8mh; r l =0 w ; v bat =13.5v; t jstart =150oc; i l =9a) 100 mj p tot power dissipation at t c =25c 74 w t j junction operating temperature internally limited c t c case operating temperature - 40 to 150 c t stg storage temperature - 55 to 150 c current and voltage conventions 1 2 3 4 5 6 7 8 9 10 11 output 2 output 2 n.c. output 1 output 1 ground input2 input1 c.sense1 c.sense2 v cc i s i gnd output2 v cc i out2 v cc v sense2 current sense 1 i sense1 v out2 output1 i out1 current sense 2 i sense2 v sense1 v out1 input2 i in2 input1 i in1 v in2 v in1 ground 3/17 VND830ASP thermal data (*) when mounted on a standard single-sided fr-4 board with 0.5cm 2 of cu (at least 35 m m thick). horizontal mounting and no artificial air flow electrical characteristics (8v 5/17 VND830ASP truth table (per channel) electrical transient requirements conditions input output sense normal operation l h l h 0 nominal overtemperature l h l l 0 v senseh undervoltage l h l l 0 0 overvoltage l h l l 0 0 short circuit to gnd l h h l l l 0 (t j 6/17 VND830ASP figure 1: i out /i sense versus i out figure 2: switching characteristics (resistive load r l =6.5 w ) v out dv out /dt (on) t r 80% 10% t f dv out /dt (off) i sense t t 90% t d(off) input t 90% t d(on) t dsense 0 0.5 1 1.5 2 2.5 3 iout (a) 500 750 1000 1250 1500 1750 2000 2250 iout/isense typical value max tj= -40oc min tj= -40oc max tj=25...150oc min tj=25...150oc 7/17 VND830ASP figure 3: waveforms sense n input n normal operation undervoltage v cc v usd v usdhyst input n overvoltage v cc sense n input n sense n load current n load current n load current n v ov v cc > v ov v cc < v ov short to ground input n load current n sense n load voltage n overtemperature input n sense n t tsd t r t j load current n input n load voltage n sense n load current n 9/17 VND830ASP hsd i/os (input levels compatibility) with the latch-up limit of m c i/os. -v ccpeak /i latchup r prot (v oh m c -v ih -v gnd ) / i ihmax calculation example: for v ccpeak = - 100v and i latchup 3 20ma; v oh m c 3 4.5v 5k w r prot 65k w . recommended r prot value is 10k w. 10/17 VND830ASP high level input current input clamp voltage off state output current -50 -25 0 25 50 75 100 125 150 175 tc (oc) 1 1.5 2 2.5 3 3.5 4 4.5 5 iih (ua) vin=3.25v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 6 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 vicl (v) iin=1ma input high level -50 -25 0 25 50 75 100 125 150 175 tc (oc) 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 vih (v) vcc=13v input hysteresis voltage input low level -50 -25 0 25 50 75 100 125 150 175 tc (oc) 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 vil (v) vcc=13v -50 -25 0 25 50 75 100 125 150 175 tc ( o c ) 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 vhyst (v) vcc=13v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 1 2 3 4 5 6 7 8 il(off1) (ua) off state vcc=13v vin=vout=0v 11/17 VND830ASP overvoltage shutdown turn-on voltage slope turn-off voltage slope i lim vs t case -50 -25 0 25 50 75 100 125 150 175 tc ( oc) 30 32.5 35 37.5 40 42.5 45 47.5 50 vov (v) -50 -25 0 25 50 75 100 125 150 175 tc (o c) 200 250 300 350 400 450 500 550 600 dvout/dt(on) (v/ms) vcc=13v rl=6.5ohm -50 -25 0 25 50 75 100 125 150 175 tc (o c) 0 50 100 150 200 250 300 350 400 450 500 dvout/dt(off) (v/ms) vcc=13v rl=6.5ohm on state resistance vs t case on state resistance vs v cc -50 -25 0 25 50 75 100 125 150 175 tc ( oc) 0 2.5 5 7.5 10 12.5 15 17.5 20 ilim (a) vcc=13v -50 -25 0 25 50 75 100 125 150 175 tc ( o c ) 0 10 20 30 40 50 60 70 80 90 100 ron (mohm) iout=5a vcc=8v & 36v 5 10152025303540 vcc (v) 20 30 40 50 60 70 80 90 100 ron (mohm) iout=5a tc=150oc tc=25oc tc= -40oc 12/17 VND830ASP maximum turn off current versus load inductance a = single pulse at t jstart =150oc b= repetitive pulse at t jstart =100oc c= repetitive pulse at t jstart =125oc conditions: v cc =13.5v values are generated with r l =0 w in case of repetitive pulses, t jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves b and c. v in , i l t demagnetization demagnetization demagnetization 1 10 100 0.1 1 10 100 l(mh) i lmax (a) a b c 13/17 VND830ASP powerso-10 ? pc board r thj-amb vs pcb copper area in open box free air condition powerso-10 ? thermal data layout condition of r th and z th measurements (pcb fr4 area= 58mm x 58mm, pcb thickness=2mm, cu thickness=35 m m, copper areas: from minimum pad lay-out to 8cm 2 ). rthjamb 20 25 30 35 40 45 50 55 0 5 10 15 20 pcb cu heatsink area (cm 2 ) 14/17 VND830ASP thermal fitting model of a double channel hsd in powerso-10 pulse calculation formula thermal parameter area/island (cm 2 )2 4 8 16 r1 (c/w) 0.12 r2 (c/w) 0.5 r3( c/w) 0.7 r4 (c/w) 0.8 r5 (c/w) 13 r6 (c/w) 37 25 20 15 c1 (w.s/c) 0.0006 c2 (w.s/c) 0.0012 c3 (w.s/c) 0.013 c4 (w.s/c) 0.3 c5 (w.s/c) 0.75 c6 (w.s/c) 3 4 6 9 z th d r th d z thtp 1 d C () + = where d t p t = powerso-10 thermal impedance junction ambient single pulse t_amb pd1 c1 r4 c3 c4 r3 r1 r6 r5 r2 c5 c6 c2 pd2 r2 c1 c2 r1 tj_1 tj_2 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zth (c/w) footprint 4 cm 2 8 cm 2 16 cm 2 15/17 VND830ASP dim. mm. inch min. typ max. min. typ. max. a 3.35 3.65 0.132 0.144 a (*) 3.4 3.6 0.134 0.142 a1 0.00 0.10 0.000 0.004 b 0.40 0.60 0.016 0.024 b (*) 0.37 0.53 0.014 0.021 c 0.35 0.55 0.013 0.022 c (*) 0.23 0.32 0.009 0.0126 d 9.40 9.60 0.370 0.378 d1 7.40 7.60 0.291 0.300 e 9.30 9.50 0.366 0.374 e2 7.20 7.60 0.283 300 e2 (*) 7.30 7.50 0.287 0.295 e4 5.90 6.10 0.232 0.240 e4 (*) 5.90 6.30 0.232 0.248 e 1.27 0.050 f 1.25 1.35 0.049 0.053 f (*) 1.20 1.40 0.047 0.055 h 13.80 14.40 0.543 0.567 h (*) 13.85 14.35 0.545 0.565 h 0.50 0.002 l 1.20 1.80 0.047 0.070 l (*) 0.80 1.10 0.031 0.043 a 0o 8o 0o 8o a (*) 2o 8o 2o 8o powerso-10 ? mechanical data (*) muar only poa p013p detail "a" plane seating a l a1 f a1 h a d d1 = = = = e4 0.10 a c a b b detail "a" seating plane e2 10 1 eb he 0.25 p095a 16/17 VND830ASP powerso-10 ? suggested pad layout 1 tape and reel shipment (suffix 13tr) reel dimensions all dimensions are in mm. base q.ty 600 bulk q.ty 600 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 24.4 n (min) 60 t (max) 30.4 tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 24 tape hole spacing p0 ( 0.1) 4 component spacing p 24 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 11.5 compartment depth k (max) 6.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed 6.30 10.8 - 11 14.6 - 14.9 9.5 1 2 3 4 5 1.27 0.67 - 0.73 0. 54 - 0.6 10 9 8 7 6 b a c all dimensions are in mm. base q.ty bulk q.ty tube length ( 0.5) a b c ( 0.1) casablanca 50 1000 532 10.4 16.4 0.8 muar 50 1000 532 4.9 17.2 0.8 tube shipment (no suffix) c a b muar casablanca 17/17 VND830ASP information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this p ublication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectron ics products are not authorized for use as critical components in life support devices or systems without express written approval of stmicr oelectronics. the st logo is a trademark of stmicroelectronics ? 2003 stmicroelectronics - printed in italy- all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany - hong kong - india - israel - italy - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com |
Price & Availability of VND830ASP
![]() |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |