19 crystal unit specifications (characteristics) recommended soldering pattern external dimensions (unit: mm) do not connect #2 and #3 to external device. internal connection (unit: mm) #4 #4 #3 #1 #2 #3 #1 0.5 5.5 (0.9) (0.9) 1.9 #2 3.2 2.38 2.54 max. 3.8 max. 8.0 max. 32.768k 571 e 1.3 1.9 1.3 1.9 1.3 4.2 series resistance MC-306 high-density mounting-type smd. photolithography finished allows uniform and stable performance. excellent reliability and environmental capability. item nominal frequency temperature range maximum drive level soldering condition frequency tolerance (standard) peak temperature (frequency) temperature coefficient (frequency) load capacitance series resistance motional capacitance shunt capacitance insulation resistance aging shock resistance symbol f t stg t opr gl t sol ? f/f t a c l r 1 c 1 c 0 ir fa s.r. specifications 32.768 khz 20.000 khz to 165.000 khz -55 c to +125 c -40 c to +85 c 1.0 w max. twice at under +260 c within 10 s or under +230 c within 3 min. 20 x 10 -6 , 50 x 10 -6 50 x 10 -6 , 100 x 10 -6 +25 c 5 c -0.04 x 10 -6 / c 2 max. 6 pf to 50 k ? max. 55 k ? to 10 k ? 1.8 ff typ. 4.0 ff to 0.6 ff 0.9 pf typ. 2.0 pf to 0.6 pf 500 m ? min. 3 x 10 -6 /year max. 5 x 10 -6 /year max. 5 x 10 -6 max. remarks stored as bare product after unpacking ta=+25 c, dl=0.1 w please specify as per below table ta=+25 c 3 c, first year three drops on a hard board from 750 mm or excitation test with 29400 m/s 2 x 0.3 ms x 1/2 sine wave x 3 directions storage temperature operating temperature actual size frequency (khz) series resistance ( ? ) 20 f < 30 55 k ? max. 30 f < 40 45 k ? max. 40 f < 60 20 k ? max. 60 f < 70 15 k ? max. 70 f < 120 12 k ? max. 120 f < 165 10 k ? max. small smd low / medium-frequency crystal unit metal may be exposed on the top of this product. this won't affect any quality, reliability or electrical spec.
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