03/11/2003 reliability report for ds1963s dallas semiconductor 4401 south beltwood parkway dallas, tx 75244-3292 prepared by: ken wendel reliability engineering manager dallas semiconductor 4401 south beltwood pkwy. dallas, tx 75244-3292 email : ken.wendel@dalsemi.com ph: 972-371-3726 fax: 972-371-6016 mbl: 214-435-6610
conclusion: ds1963s the following qualification successfully meets the quality and reliability standards required of all dallas semiconductor products and processes: module description: a description of this module can be found in the product data sheet. you can find the product data sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm.* reliability derating: a module device consists of one or more ic's in a single, upward integrated, package. this package is assembled to include batteries, crystals, and other piece parts that make up the configuration of the module. because of either the complexity of the package or the included piece parts, standard high temperature reliability testing is not possible. therefore, in order to determine the reliability of module products, the reliability of each of the piece parts is individually determined, then summed to determine the reliability of the integrated module product. if there are "n" significant components in the module then: fr (module) = fr (1) + fr (2) + fr (3) + ..... + fr (n) fr (module) = failure rate of module fr(n) = failure rate of the nth component failure rates are reported in fits (failures in time) or mttf (mean time to failure). the fit rate is related to mttf by: mttf = 1/fr note: mttf is frequently used interchangeably with mtbf. the calculated failure rate for this module/assembly is: the parameters used to calculate the module failure rate are as follows: cf: 60% ea: 0.7 b: 0 tu: 25 vu: 5.5 c volts in addition, dallas semiconductor's continuous reliability monitor program ensures that all outgoing product will continue to meet maxim's quality and reliability standards. the current status of the reliability monitor program can be viewed at http://www.maxim-ic.com/techsupport /dsreliability.html.* module device: quantity: mttf (yrs): fits: 5.6 20404 ds2421 1 6 20404 totals:
the reliability data follows. a the start of this data is the module assembly information. this is a description of the module. the next section is the detailed reliability data for each stress found in the qualification / monitor. if there are additional processes or assemblies used as part of this report, a description of each will follow which includes the respective reliability data for that process/ assembly. the reliability data section includes the latest data available. * some proprietary products may be excepted from this requirement. assembly site: dallas body size: 0 pin count: 2 package type: ibutton f50 w/bump lead frame: printed crt brd; fr4 assembly information: lead finsh: mold compound: fp4323, dexter hysol die attach: underfill fp4527, dexter hysol bond wire / size: al / 1.25 mil moisture sensitivity (jedec j-std20a) flammability: ul 94-v0 9939 9939 to date code range: qualification vehicle: ds1963s mechanical life description readpoint condition quantity fails date code 30 200g, 1/2 sine, 6 ms 50 0 mechanical shock cys 9939 9 10g or 0.06", 5hz-2khz, x y z axis 50 0 vibration, variable f hrs 9939 0 total: storage life description readpoint condition quantity fails date code 1144 25 c 22 0 storage life hrs 9939 1000 85 c 77 0 storage life hrs 9939 0 total: temperature cycle description readpoint condition quantity fails date code 1000 -40 to 85c 77 3 temp cycle cys 9939 3 total: unbiased moisture resistance description readpoint condition quantity fails date code 959 85 c/85% r.h. 77 0 moisture soak hrs 9939 0 total:
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